Technical Program Manager (TPM), SiP - Korea
Seoul, Seoul-si, Korea (Republic of)
Operations and Supply Chain
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Operations engineering is engaged from the earliest stages of new product introduction (NPI) , engineering builds, ramp up and throughout product lifecycle. The team ensures high quality and high yield, working with module teams to quickly resolve technical and operational issues and interface between vendors and downstream module integrators.
We are looking for a Technical Program Manager (TPM) for SiP Module to be based in Korea.
As the TPM, you will take the lead in driving technical, operational, and quality issues related to System-In-Package (SiP) devices in key Korean OSAT vendors. You will also be the onsite DRI for and act as a liaison between the vendor and global Apple teams, with coverage for SiP manufacturing process, materials, process integration, and product engineering analysis. In addition, occasional support of other Korean OSAT vendors will also be required.
Join Apple, and help us leave the world better than we found it!
Description
- On site – Technical Operations owner for MP readiness of NPI, Ramp, and Sustaining areas of System in Package products
- Approve vendor process flow, process quality control plan (tests, methods, sample sizes, pass /fail criteria), equipment list, and Cosmetic specs (Ensure cosmetic standards are aligned with Module integrators) for MP readiness
- Conduct site quality and process audits for Mass production readiness
- Contribute to mass production release reviews and verify that all we are ready to ramp
- In mass production, lead resolution of device related quality issues in assembly processing, transit, and module integrator
- Set a vision for constant product quality and operational improvement year over year. Set aggressive targets and drive plans to achieve
- Be involved at product concept to ensure products are designed for manufacturing (DFM). Build in constant design improvement for product quality, factory efficiency and product cost
- Manage new process introduction and special projects, such as new machines
- Ensure device vendors are conforming to Apple specs and requirements
- Ensure timely test correlation activities and close test gaps between device, module, and system
- Monitor and report yield, manufacturing metrics (CpK, FMEA etc.). Drive improvement programs as appropriate
- Drive FACA for sensor related returns from integrators, field returns, and EFFA issues. Track, report and close out issues in a timely manner
- Ensure 8D reports and PCNs are maintained accurately
- Raise and balance formal company-wide Quality Alerts
- Organize three-way meetings with device vendors and OSAT vendors to get feedback on downstream issues and to ensure smooth co-working. Assist and arbitrate as needed
- Manage the quality relationship with Korea OSAT vendors. This involves regular face to face reviews, efficient vendor reporting systems and audits
- Ensure qualification and reliability activities at vendors are in line with requirements
- Regularly provide status reporting updates to executives and escalation when needed
- Constant interfacing and collaboration with multiple functional teams across Apple and external suppliers including teams in Supplier Quality, System Quality, Reliability, Device Design, Module Design and NPI project management
Minimum Qualifications
- BS/MS in Engineering or related technical subject area
- Minimum of 5 years experience in Package engineering fields (Process Eng, Process integration engineering, or Product engineering). 10+ years of experience is preferred
- Solid experience and background in module component processes
- Working proficiency of the English language
Key Qualifications
Preferred Qualifications
- Familiarity with Packaging quality systems and in line process quality control. Ability to audit and approve vendor process, process flow and equipment for new devices
- Experience with external vendor, supplier, or foundry management
- Strong technical skills, involving problem solving and issue root causing in a pressured environment
- In-depth understanding of module test, yield, assembly process integration, module packaging issues
- Flexibility: Evening and weekends work will be required
- Solid understanding of semiconductor devices and associated module components
- Interpersonal skills of leadership, project management, communication, teamwork, influencing and negotiation
- Flexibility for within Korea travel (30%) + International Travel (< 5%)
- Strong ability for teamwork and collaboration