Ansys Electronics

Wondering how System and Components Engineering teams in the automotive industry can achieve a more efficient, more performant, and more competitive electric vehicle (EV) powertrain design? Watch this brief product demo video on Ansys ConceptEV, a new bespoke cloud-based design and simulation platform for the design of EV powertrains. Unlike other tools, you can quickly and easily explore a data-driven design space against vehicle requirements and optimize design trade-offs on a shareable platform.

What if you could visualize the hidden forces inside your electronics? #Electromagnetic (EM) simulation lets engineers visualize and optimize the invisible forces within electronic devices. From revealing EM fields to #antenna patterns to accelerating next-gen designs and enhancing sustainability, EM simulation is transformative. - See the Unseen: Visualize EM fields in intricate electronic gadgets such as the #5G smartphone in the animation below - Innovate with Confidence: Validate designs virtually, reducing physical prototypes - Build a Sustainable Future: Design energy-efficient, safer products Join our two upcoming release webinars for the latest updates in our high-frequency #electronics and #electrothermal products: #Ansys 2024 R2 High-Frequency Electronics Update on August 6th: https://ansys.me/4c5sgJL Ansys 2024 R2 Thermal Integrity in the Ansys Electronics Desktop Update on August 8th: https://ansys.me/3WMW35h #hfss #emc #signalintegrity

Is your glass half full or half empty? Ansys Q3D Extractor knows, and it’s faster than ever! The animation below demonstrates the novel capability of Ansys Q3D Extractor, featuring its new CG interpolation frequency sweep which speeds up simulations. Do what Juliano Mologni does and test our new R2 features with a glass of your favorite drink! This demo measures how empty or full a glass of drink is using capacitance. In this simulation which runs in under a minute, we place two electrodes on opposite sides of the glass. As the level of the liquid inside changes, the capacitance between the electrodes varies. This variation is due to the different permittivity properties of the liquid compared to air. By analyzing the capacitance, you too can have a well-measured pour! Make sure to register for our upcoming release webinar on August 6th to learn more about the latest #Ansys R2 updates across our high-frequency #electronics products. Registration link: https://ansys.me/4fsGJ5e #electromagnetics #HFSS

What is new in #Ansys Icepak? Initial meshing can be challenging, particularly with default settings that vary based on the assembly’s complexity, for example in assemblies requiring excessive mesh refinement to capture small and thin objects. Icepak’s new thermal mesh fusion, released in R2, addresses these challenges by automatically dividing complex models into coupled subdomains, enabling successful initial mesh, enhanced refinement control, and improved meshing speeds! Join our Senior Product Manager, Jeff Tharp, on August 8th as he presents the latest capabilities in Ansys #Icepak for enhanced #electrothermal analysis and workflows in Ansys #Electronics Desktop. Register: https://ansys.me/3Wr0OQI #pcb #ThermalManagement

Learn how machine learning can be used in the design of earbuds and how you can address end-to-end design challenges in wireless charging of smartwatches. For more than a decade, many of the world's top 10 consumer electronic device companies have chosen Ansys to develop safer, competitively differentiated, and cost-effective consumer products. Join us at the 2024 IEEE International Symposium - EMI + SIPI, next Wednesday Aug 7 at 3:30 pm, in Room 127B and Thursday Aug 8 at 9:30 am in Room 127C at the Phoenix Convention Center, Phoenix, AZ. See program below. https://ansys.me/3YrR1fV

What is new in #HFSS? Say goodbye to #Antenna array Mayhem: HFSS 2024R2 makes complex arrays easy! Designers often struggle with creating and simulating complex antenna array structures, especially when stacking arrays vertically or incorporating multiple arrays on a single platform. This process can be time-consuming, error-prone, and computationally intensive to the point of making such designs not feasible. Ansys HFSS offers an industry-leading methodology for solving component arrays called the component array domain decomposition method (CADDM), which delivers significant simulation time and memory savings. Antenna array designers have come to rely on the efficiency of CADDM to accurately model finite arrays or to integrate a single finite array on a platform. There are many cases where multiple finite antenna arrays need to be modeled together and - in those cases - the CADDM technology can no longer be leveraged, forcing designers to either use a less efficient solver methodology or forgo the fully coupled analysis of the more complete system. #Ansys HFSS 2024R2 advances innovation in antenna array and communication system designs by extending the CADDM solver methodology beyond a single finite array. In the 24R2 version of HFSS, designers can now define multiple arrays in a single model and still benefit from the use of CADDM, making the solving process faster and more efficient for designs such as a 5x5 patch antenna array with a 14x14 frequency selective surface (FSS) radome in a metallic enclosure, as shown in the animation below. This capability can also be used when incorporating multiple arrays on a platform. By simplifying the process of defining, stacking, incorporating, and simulating multiple antenna arrays, HFSS enhances simulation efficiency for antenna design and placement engineers, reducing the time and effort needed to achieve accurate results. Make sure to catch our very own Principal Product Manager, Sara Louie, on August 6th as she presents the latest Ansys R2 updates for the High Frequency #Electronics products. https://ansys.me/3yupfVn #electromagnetics

System and Components engineers working on the latest electric vehicle (EV) powertrain design are now able to extend their collaboration and make data-driven decisions with a dedicated design and simulation platform. Ansys has recently launched a new cloud-based simulation tool, called Ansys ConceptEV, allowing automotive OEMs and Tier 1s to develop an EV powertrain that is optimized for efficiency, performance, and cost. Click on the link below to get a FREE TRIAL of Ansys ConceptEV: https://ansys.me/4cY6wR3

Ready to revolutionize your approach to zero-emission vehicle design? In the pursuit of zero-emission vehicles, the design of the e-powertrain and its electronic systems encounters numerous challenges. From stringent regulatory requirements to the demand for enhanced performance and efficiency, the landscape is ripe with complexities. Here, simulation emerges as a vital tool, offering a pathway to navigate these challenges with precision and innovation. Our recent white paper by Flavio Calvano, Antonio Camarda, PhD, Antea Maria Perrotta , Marko Luukkainen, Bo Yang, and frederic Bocquet will cover: - Navigating the Transition to Wide-bandgap Semiconductors: Gain insight into the complexities of transitioning from traditional silicon to cutting-edge wide-bandgap semiconductors like silicon carbide (SiC) and gallium nitride (GaN). Discover how advanced simulation methodologies revolutionize design optimization in situations such as mitigating high-level electromagnetic interference (EMI). - Effective EMC/EMI Management Strategies: Uncover the critical importance of meticulous EMC/EMI design in e-powertrains and explore innovative solutions such as common mode chokes (CMCs) and EMI filters to suppress noise and ensure compliance with regulatory standards. - Mastering Complexity in Power Electronics PCBs: Dive deep into the challenges posed by the increasing complexity of #powerelectronics PCBs. Learn how advanced simulation techniques enable precise control over couplings and parasitic loop inductance to prevent signal noise and optimize performance. - Addressing Thermal-related Challenges: Explore the thermal-related challenges encountered in power modules and busbars and discover how sophisticated solvers facilitate accurate prediction of RLCG values, empowering engineers to optimize designs for minimal power losses and reduced emissions. Download our comprehensive white paper now to gain design and simulation insights for overcoming these challenges and accelerating your journey towards a sustainable, emissions-free future. #epowertrain #EMC Design and Validation With Ansys: https://ansys.me/4fyusMO #Ansys #HFSS #Q3Dextractor #Icepak #SIwave #pcb

Learn how machine learning can be used in the design of earbuds and how you can address end-to-end design challenges in wireless charging of smartwatches. For more than a decade, many of the world's top 10 consumer electronic device companies have chosen Ansys to develop safer, competitively differentiated, and cost-effective consumer products. Join us at the 2024 IEEE International Symposium - EMI + SIPI, on Wednesday Aug 7 at 3:30 pm, in Room 127B and on Thursday Aug 8 at 9:30 am in Room 127C at the Phoenix Convention Center, Phoenix, AZ. See program below. https://ansys.me/3WIZuu4

Would you like to learn how you can increase the energy efficiency of your electric aircraft using permanent magnet synchronous motors (PMSMs)? Join Dr. Shi-Uk Chung next Wednesda, July 31, at 10:30AM (PDT) at the AIAA/IEEE Electric Aircraft Technologies Symposium in Las Vegas, NV, and hear how the use of contra-rotating PMSMs result in higher energy efficiency compared with conventional propellers. https://ansys.me/4dfqRB3