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Advanced packaging involves increasingly challenging requirements for heterogeneous integration and chiplet packaging. Needs such as fine pitch interconnects (
The semiconductor industry continues to push for smaller features, more integration, and increased yield. New photoresist chemistries and advances in extreme
The exponential growth in the power electronics market requires efficient devices based on wide bandgap (WBG) semiconductors. The yield of power devices is
The semiconductor industry requires sub-nanometer, 3-dimensional quantitative elemental mapping of materials, nanoscale structures, and devices with high
This project employs a causal Green’s function (CGF) method to model thermal transport in nanoscale semiconductors, overcoming limitations posed by the Fourier
An accurate characterization of how the wireless signal propagates through different environments and frequency bands, is key to developing radio frequency (RF)
Some of the manufacturing difficulties encountered by the heterogeneous integration of modular chips in system-in-package are due to thermal management and
The semiconductor industry is in need of new, high throughput in-line dimensional metrology methods to characterize next generation 3D nanostructures. The
An urgent objective of the microelectronics industry is to mitigate the extreme heat densities generated within devices that are limiting the performance of
Microwave acoustic resonators are widely used to filter signals on multiple frequency bands for mobile communications. To predict filter performance, industry
Fundamental understanding of electron-solid interactions is key to interpreting electron microscopy images for quantitative metrology. Scanning electron
The state of the art for measurement and inspection of the smallest printed features on an integrated circuits (IC) chip is a combination of electron scanning
Ferromagnet-based microelectronic devices play an increasingly important role within the semiconductor ecosystem. Magnetic RAM (MRAM) is already replacing
Precise measurements of thermal properties at the nanoscale are needed to engineer advanced and heterogeneously integrated devices, but measurements at this
A new publication describes METIS, a Metrology Exchange to Innovate in Semiconductors We are seeking comments on the draft publication through February 16, 2024
Electromagnetic (EM) systems use magnetic components such as inductors, isolators, and adaptive filters, but these are currently bulky and difficult to
Advanced bonding and integration physically bring together components, devices, and materials that are produced separately. There are strong economic and
Heat management in semiconductor devices is a crucial problem currently limiting device performance and essentially all progress involving reduction of device
A comprehensive understanding of how current and next-generation materials impact the performance of semiconductor devices is critical to U.S. Semiconductor
Advanced methods to measure the thermal properties of thin films and interfaces are required to understand and improve microelectronic device fabrication
A current lack of 3D characterization tools that meet semiconductor industry needs is hampering manufacturing fidelity and supply chain security. Developing new
NIST Synchrotron beamline characterization of advanced semiconductor materials structure, chemical, electronic, and strain properties has been an ongoing
As devices become smaller, more complex, and more highly integrated, interfaces are increasingly important and limiting. The ability to accurately predict