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The animation below unveils the stresses encountered by a Ball-Grid Array (BGA) during a drop-test, spotlighting LS-DYNA’s multi-scale simulation prowess. As solder joints are often the first to fail in drop-tests, accurately predicting their behavior is paramount. LS-DYNA transcends traditional simulation barriers with multi-scale simulation, offering a nuanced view into both macro and meso-scale geometric details, thus significantly enhancing the reliability analysis in drop-tests. The synchronized two-scale co-simulation technique allows for a seamless, concurrent analysis, making the prediction of solder joint failures more accurate and efficient. Uncover how this breakthrough accelerates the pace towards robust electronics design.