Jeremy Tee

• Collaborate with customers to understand their data analysis and visualization requirements, and design and implement customized solutions to resolve their issues
• Collaborate with sales teams in conducting statistical and analytical demonstrations based on real world customer issues to showcase the value proposition of JMP
• Conduct training sessions for customers and internal teams and maintain technical documentation, user guides, and training materials to support… Tunjukkan lagi

• Collaborate with customers to understand their data analysis and visualization requirements, and design and implement customized solutions to resolve their issues
• Collaborate with sales teams in conducting statistical and analytical demonstrations based on real world customer issues to showcase the value proposition of JMP
• Conduct training sessions for customers and internal teams and maintain technical documentation, user guides, and training materials to support software implementation and usage Tunjukkan kurang

• Pre/Post-Silicon manufacturing debug lead for driving improvements on new cutting edge products
• Drive debug forums and daily task forces to investigate issues to root cause across test development, design, failure analysis, sort and wafer fab teams
• Driving data analytics culture by showcasing best practices in modeling and identifying root cause through analytics

• Driver for Product Probe and Final Test yields, test time and quality improvements through test program optimization and flow eliminations.
• Experienced in developing customized tests to screen customer quality returns.
• Continuous product yield improvement through coordination with wafer fab, probe and test production teams to optimize silicon and identify hardware variations through DMAIC.
• Coordinate with marketing and planning teams to build customer parts and expedite key… Tunjukkan lagi

• Driver for Product Probe and Final Test yields, test time and quality improvements through test program optimization and flow eliminations.
• Experienced in developing customized tests to screen customer quality returns.
• Continuous product yield improvement through coordination with wafer fab, probe and test production teams to optimize silicon and identify hardware variations through DMAIC.
• Coordinate with marketing and planning teams to build customer parts and expedite key production deliveries.
• Lead reviewer in the Technical Review Board (TRB) for in depth review of test programs before release to production.
Key Achivements:
• Technical Excellence Award for resolving a customer quality incident relating to Vstby for US$926k cost avoidance.
• Technical Excellence Award for resolving a customer quality incident related to PLL for US$560k/year cost avoidance.
• Launched 3 New Product Introductions (NPI) to production.
• Champion to drive lookacross best practices for Automotive test screen implementations.
• NXP Malaysia Champion for a Global Workshop on Open/Short test improvements. Tunjukkan kurang

• Lead engineer for phone camera modules, managing 2 junior engineers and 6 technicians through hardware and software improvements, and qualifications.
• Developed a custom Visual Basic script for department tester performance monitoring.
Key Achivements:
• Awarded Quality Innovation Performance (QIP) as a task force lead in improving yields to 99.5% from 80% on hysteresis and color calibration testing.

• Driving factory improvements on 16 & 32-bit microcontroller products through yield, test time reduction, and hardware/software optimization.
• Provide technical support to ensure production material flows uninterrupted through the line.
• Resolving material excursions that may occur in the factory through containments and evaluations.
Key Achievements:
• Qualified a cost savings project for thinner/shorter gold wire for $20k/year savings.
• Technical Excellence Award for… Tunjukkan lagi

• Driving factory improvements on 16 & 32-bit microcontroller products through yield, test time reduction, and hardware/software optimization.
• Provide technical support to ensure production material flows uninterrupted through the line.
• Resolving material excursions that may occur in the factory through containments and evaluations.
Key Achievements:
• Qualified a cost savings project for thinner/shorter gold wire for $20k/year savings.
• Technical Excellence Award for guardbanding Final Test SRAM failures at Probe to achieve >95% benchmark Final Test yields on a product. Tunjukkan kurang