HRP Metals, Inc.

Micron Technology Doubles Down on DRAM Domination with Strategic Acquisition in Taiwan In a strategic move to solidify its position in the booming DRAM market, Micron has acquired three manufacturing facilities from Taiwanese panel maker AUO for NTD 8.1 billion. This acquisition comes on the heels of Micron's unsuccessful bid for an INNOLUX群創光電 plant and signifies Micron's commitment to expanding its DRAM production, particularly for AI applications. The acquired facilities, located in Tainan and Taichung, will primarily focus on front-end wafer testing and support Micron's existing DRAM production facilities in Taiwan. This move is seen as a response to the growing influence of Chinese LCD manufacturers and allows AUO to optimize its assets and financial structure. #Micron #DRAM #Semiconductors #Taiwan #AI #HBM #Acquisitions #Manufacturing

Black Myth: Wukong Ignites Hardware Sales Frenzy in China With over 10 million copies sold in just four days on Steam alone, Black Myth: Wukong has generated over NT$12.8 billion (approximately USD$400 million) in revenue. This remarkable success of China's debut AAA game has not only captivated gamers worldwide but also sparked a surge in demand for high-end PC hardware. The game's stunning graphics and demanding system requirements have pushed players to upgrade their RAM and graphics cards. Players are upgrading to at least 32GB of RAM and high-end graphics cards, some costing over NT$10,000 (approximately USD$314), to meet the game's demands. Industry experts predict a positive impact on companies like ADATA Industrial, Kingston Technology, Teamgroup, GIGABYTE, ASUS, and MSI as gamers seek to experience the game's full potential. #gaming #China #videogames #BlackMythWukong #Steam #RAM

Samsung Electronics's Power Play: Shrinking Chips by 17% with Backside Power Delivery (BSPDN) "By applying BSPDN to its 2nm chips, Samsung is expected to improve the product’s performance and power efficiency by 8% and 15%, respectively," states Lee Sungjae, vice president of the Foundry PDK Development Team at Samsung. This technology, while not new – Intel Corporation is already ahead with its "PowerVia" – allows for smaller, more efficient chips by relocating power rails to the back of the wafer. This frees up valuable space on the chip surface, traditionally occupied by power lines, for improved performance and power efficiency. Samsung also plans to incorporate its second-generation Gate-All-Around (GAA) technology in its 3nm and 2nm processes, further boosting performance and efficiency. Samsung plans to implement BSPDN in its 2nm chips by 2027. Intel plans to launch its 2nm chips with PowerVia in 2024, and TSMC aims to integrate its Super PowerRail architecture in 2026. #Samsung #PowerVia #Intel #TSM

Intel Corporation Postpones Key Event Amidst Financial Woes Intel, facing financial challenges, has chosen to postpone its major technical event, Innovation 2024, originally slated for late September. This decision follows recent announcements of a 15% workforce reduction and over 20% capital expenditure cuts for 2024. The postponement, confirmed by Intel on the event website, highlights the company's focus on cost-cutting measures.  While Intel plans to hold smaller, targeted events throughout 2024, the delay of Innovation 2024 raises concerns about the launch schedule for upcoming products, including Panther Lake and Clearwater Forest processors. The event, previously a platform for unveiling advancements like the 4nm Meteor Lake chip in 2023, is now shrouded in uncertainty, with no clear timeline for its return. The postponement also denies Intel a significant opportunity to address the public regarding a damaging CPU bug affecting its 13th and 14th Gen Core desktop chips. This issue, caused by excessive voltage leading to irreversible CPU degradation, has prompted Intel to extend warranties on affected models. The lack of a platform to address this issue directly could further damage consumer trust. #Intel

Is a Transatlantic Tech Rift Coming for Your Car? The US is considering banning Chinese software in Level 3 and above autonomous vehicles, signaling a potential widening of the technological divide between the US and China, according to Bloomberg. This move, aimed at addressing national security concerns, could have significant implications for automakers operating in both countries. The proposed regulation would require verification that software used in connected and autonomous vehicles is not developed by entities deemed national security threats. While the immediate impact is expected to be limited due to the nascent stage of L3+ autonomy, the long-term effects on the global automotive industry could be substantial. Automakers are already forging alliances and making strategic acquisitions to navigate this evolving landscape, with Volkswagen partnering with Chinese companies like Horizon Robotics and XPENG while simultaneously collaborating with European giants Bosch and Mobileye. This potential ban comes at a time when China is actively promoting its own automotive technology advancements. Mercedes-Benz AG recently received approval for L4 autonomous driving pilot tests in Beijing, and Tesla's Model Y was added to a provincial procurement list, highlighting China's openness to foreign EV manufacturers. The US move raises questions about the future of companies like Tesla operating in China, as their autonomous driving technology could face increased scrutiny. #automotiveindustry #China #US #Tesla #Volkswagen

The U.S. government is contemplating new trade sanctions targeting China's access to cutting-edge AI chip technology. A key aspect of this potential action involves restricting the sale of NVIDIA's HGX-H20 AI GPUs to China. This move, if implemented, could lead to a substantial financial impact on NVIDIA, with estimated revenue losses reaching $12 billion. Although NVIDIA specifically designed the HGX-H20 GPU for the Chinese market with reduced performance to comply with existing export regulations, it remains a powerful AI chip. Its computational power, coupled with ample memory and bandwidth, make it competitive against entry-level AI chips currently available. The crux of the issue lies in the widespread adoption of NVIDIA's CUDA computing platform by Chinese AI companies. This reliance makes transitioning to alternative platforms, such as Huawei's Ascend chips, a complex and expensive undertaking. The HGX-H20, despite its lower performance compared to NVIDIA's flagship H100 GPU, maintains full compatibility with the CUDA platform, making it a preferred choice in China. Despite existing controls, Chinese companies still acquire advanced GPUs through intermediaries and cloud services, prompting the U.S. to consider stricter measures. The potential ban could extend to other Asian countries and overseas Chinese companies, though effective implementation poses challenges. This follows a trend of tightened export controls on AI chips, including NVIDIA's A100/H100 and AMD's MI250/300 series, with manufacturers like NVIDIA adapting by developing compliant products. #AI #semiconductors #technology #geopolitics #China #USA #NVIDIA #exports #chipshortage #investing

TSMC's Q2 earnings report showed net profit reaching NT$247.85 billion (US$7.6 billion), a 36.3% year-on-year increase. Driven by stronger-than-anticipated demand for premium smartphones and AI devices, Taiwan Semiconductor Manufacturing Co (TSMC) has revised its projected revenue growth for 2024 to exceed 25%. This significant increase from their April estimate of 21-24% signals a booming market for cutting-edge 3nm and 5nm chips. TSMC’s growth is set to dwarf the global foundry industry's projected 10% rise. The company attributes this success to increased demand for AI-powered devices and high-end smartphones, leading to higher utilization of their advanced manufacturing processes. To meet this surge in demand, TSMC has increased its capital expenditure budget to between US$30 billion and US$32 billion, with 80% dedicated to advanced technologies. While 3nm and 5nm capacity are expected to remain tight through 2025, TSMC anticipates record revenue for Q3, fueled by continued strong demand. #TSMC #Semiconductor

US Invests Big in GlobalWafers: Ending 20-Year Drought in Domestic Chip Production #GlobalWafers, the world's third-largest silicon wafer supplier, plans to build a 12-inch silicon wafer fab in Texas and another in Missouri to produce leading-edge chips. These fabs will supply US chip designers with domestic wafer capacity for AI applications and silicon photonics devices. The Texas facility, set to begin production next year, signifies a major step towards US semiconductor independence. GlobalWafers has already secured long-term supply agreements with US customers, including GlobalFoundries Inc, ensuring the utilization of approximately 80% of the planned capacity at both facilities. A US$400 million grant from the Department of Commerce, part of the CHIPS and Science Act, represents approximately 10% of GlobalWafers' total investment of less than US$4.8 billion in these projects. This funding is crucial for enhancing the competitiveness of US fabs, as manufacturing costs in the US tend to be significantly higher than in Taiwan. #semiconductors #manufacturing #USeconomy #CHIPSact #supplychain #technology #investment #GlobalWafers #AI #siliconwafers

TSMC Embraces Panel-Level Packaging: Is This the Future of Moore's Law? TSMC Chairman C.C. Wei confirms that Fan-Out Panel-Level Packaging (FOPLP) is a key focus, with potential breakthroughs expected within three years. This strategic move comes as die sizes continue to grow by 5-10%, putting pressure on traditional wafer-level packaging capacity. By transitioning to panel-level packaging, TSMC aims to enhance cost-effectiveness and potentially extend the lifespan of Moore's Law. Industry insiders suggest that converting to panel-level packaging offers a more economical solution compared to wafer-level packaging. TSMC is also exploring glass substrate technologies, mirroring Intel's ambitious roadmap for advanced packaging. The company's existing expertise in Fan-Out packaging, evident in its InFO technology used in Apple's A10 processor, provides a strong foundation. Future adoption by major players like NVIDIA and AMD could solidify FOPLP's position as a crucial element in the evolution of high-performance computing. #TSMC #MooreLaw #Semiconductors #FOPLP #Technology #Innovation #HPC #NVIDIA #AMD #InFO #GlassSubstrates

China's "Big Fund" Injects Billions into Domestic Chipmaking Supply Chain With a committed investment of CNY 2.155 billion, China’s National Integrated Circuit Industry Investment Fund Phase II ("Big Fund" Phase II) recently acquired a 24.77% stake in Chongqing Xinlian Microelectronics Co., Ltd. (XLMEC), a leading specialty process wafer fabrication plant. This investment, alongside a CNY 1.5 billion investment in Taiyuan Jinke Silicon Material Technology Co., Ltd. ("Jinke Silicon Material"), signals China's aggressive strategy to bolster its domestic semiconductor industry, particularly in the upstream supply chain. The "Big Fund" Phase II has prioritized investments in semiconductor equipment and materials industries, evident in its recent acquisitions. XLMEC, a key player in China's Western region's integrated circuit industry, aims to establish a 12-inch advanced specialty integrated circuit process line with a planned capacity of 40,000 wafers per month. Similarly, Jinke Silicon Material, a joint venture with significant investment from the "Big Fund," will focus on the production of 300mm silicon wafers, aiming for a capacity of 600,000 wafers per month for crystal pulling and 200,000 wafers per month for slicing, grinding, and polishing. #semiconductors #China #investment #supplychain #chipmaking #technology #manufacturing #wafers #integratedcircuits #XLMEC #JinkeSiliconMaterial