JEDEC

Discover the Future of Automotive Electronics: Join us at the JEDEC Automotive Electronics Forum in Santa Clara, CA on Thursday, September 19, 2024 for an impressive lineup of influential speakers covering a diverse range of innovative topics related to automotive electronics. Attendance is free, but advance registration is required and space is limited.

Upcoming activities for JEDEC's JC-15 Committee for Thermal Characterization Techniques for Semiconductor Packages include the evolution of standards that cover the provision of electronic thermal models in neutral file formats (e.g. JEP181, JEP30 T101), as well as the review and improvement of several key standards previously developed by the committee.  JC-15 welcomes interested companies to join JEDEC and participate.

Join us at FMS 2024 on Thursday, August 8 at the Santa Clara Convention Center at 9:45am for a conference session highlighting JEDEC standards and how they enable and address the future of AI, cloud, and automotive applications, featuring speakers from Meta, Micron, Samsung and Synopsys. View the agenda and link to FMS registration:

Today, JEDEC announced plans for upcoming DDR5 MRDIMM and LPDDR6 CAMM standards designed to propel High-Performance Computing and AI. The new MRDIMM and CAMM for LPDDR6 are set to revolutionize the industry with unparalleled bandwidth and memory capacity. For more details: https://lnkd.in/eFp57aKG

New JEDEC publication available for free download: JEP198: Guideline for Reverse Bias Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices, developed by JEDEC’s JC-70.1 Gallium Nitride Subcommittee. JEP198 presents guidelines for evaluating the Time Dependent Breakdown (TDB) reliability of GaN power transistors. It is applicable to planar enhancement-mode, depletion-mode, GaN integrated power solutions, and cascode GaN power transistors.

JEDEC is pleased to announce that the JC-14.7 Subcommittee has expanded its scope to include standards for radio frequency (RF) technologies. The subcommittee is set to meet on Friday, April 19th, 2024 near Dallas, Texas, the day after the International Reliability Physics Symposium (IRPS).  Industry stakeholders are encouraged to participate, and interested companies are invited to contact the JEDEC office to join the association and engage with JC-14.7. For more information:

JEDEC is proud to be an Allied Association Partner for #CES2024. Are you attending? Be the first to find out about the future of tech and ground-breaking new technology from more than 1300 exhibitors!   Register here: 

JEDEC is pleased to announce the publication of JESD318: Compression Attached Memory Module (CAMM2) Common Standard. This groundbreaking standard defines the electrical and mechanical requirements for both DDR5 SDRAM CAMM2s and LPDDR5/5X SDRAM CAMM2s in a single, comprehensive document, and is available for free download from the JEDEC website.

In an extraordinary leap forward for the chiplet industry, the groundbreaking collaboration between the Open Compute Project Foundation (OCP) and JEDEC is set to usher in a new era of innovation. By merging the capabilities and open standards of OCP’s Chiplet Data Extensible Markup Language (CDXML) and JEDEC’s JEP30 PartModel Guidelines, this partnership, initiated in late 2022, promises to revolutionize chiplet design, manufacturing and integration. The result will be a unified structure that supports both chiplets and general electronic parts within the overarching purview of JEDEC. Visit the JEDEC website for more information on JEP30 PartModel Guidelines: https://lnkd.in/ekZTwvhD