Semiconductor Engineering's latest Low Power-High Performance newsletter https://lnkd.in/g4Zxmknq #CPU #semiconductor #analog #powerdelivery #voltagedrop #CFD #HBM3E #2nm #eVTOL #lowpower Fraunhofer IIS, Division Engineering of Adaptive Systems EAS Quadric Mixel, Inc. Arm Cadence Design Systems Ansys Synopsys Inc Rambus Siemens EDA (Siemens Digital Industries Software)
Semiconductor Engineering
Online Audio and Video Media
Silicon Valley, CA 85,302 followers
Deep insights for the tech industry
About us
Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations and standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors, as well as insights into the market dynamics that make it all possible. The goal of this site is to provide useful, independently developed content through targeted monthly newsletters, weekly updates, timely news alerts, videos, independent research, and a portal that serves as a forum for exchanging ideas and answering questions.
- Website
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http://semiengineering.com
External link for Semiconductor Engineering
- Industry
- Online Audio and Video Media
- Company size
- 2-10 employees
- Headquarters
- Silicon Valley, CA
- Type
- Self-Owned
- Founded
- 2013
Locations
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Primary
Silicon Valley, CA, US
Employees at Semiconductor Engineering
Updates
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Semiconductor Engineering's latest Manufacturing, Packaging & Materials newsletter https://lnkd.in/dzVNEGqh #semiconductor #advancedpackaging #IGZO #fabs ASE Global Tignis D2S, Inc. United Microelectronics Corporation (UMC) Promex Industries Inc. Lam Research Amkor Technology, Inc. Synopsys Inc Brewer Science SEMI
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New technical papers recently added to Semiconductor Engineering’s library: https://lnkd.in/g9pbbyFH #semiconductor #3nm #NANDflash #sustainability #HBM #deeplearning #2Dmaterials #cryogenicFETs #nanosheets TU Dortmund University, Academia Sinica, Taiwan National Taiwan University Jaehoon Jeong Yunjeong Shin Samsung Electronics Kyungpook National University Yun-Chih Chen Tei-Wei Kuo Wojciech (Wojtek) Osowiecki Lam Research Martyn Coogans Saravanapriyan Sriraman Rakesh Ranjan David Fried Yu-Ju Lu Chalmers University of Technology ZeroPoint Technologies Qi Shao Angelos Arelakis Per Stenstrom Pohang University of Science and Technology Korea University Noh Kyung Mi Yonsei University, Korea Advanced Institute of Science and Technology (KAIST), KIST(Korea Institute of Science and Technology) RWTH Aachen University, Forschungszentrum Jülich, National Institute for Materials Science AMO GmbH #graphene Eike Icking
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Researchers and engineers are working on increasingly secure processes in the EDA workflow, but they add to the cost. By Adam Kovac. https://lnkd.in/gDD-98GJ #hardwaresecurity #semiconductor #EDA Suhail Saif Ansys Mike Borza Synopsys Inc Andy Nightingale Arteris David Selasi Koblah University of Florida Rob Knoth Cadence Design Systems
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Indium-based oxide semiconductors can boost performance and reduce resistance losses. By Katherine Derbyshire. https://lnkd.in/gxY9zGyA #semiconductor #IGZO #computeinmemory #indiumgalliumzincoxide imec Purdue University KAIST National University of Singapore Tsinghua University Jie Zhang Zhuocheng Zhang Zehao Lin Sonu Hooda Chun-Kuei Chen Manohar Lal Jee Eun Yang Samsung Electronics Sumi Lee Yizhi Zhang Haiyan Wang Peide Ye Subhali Subhechha Stefan Cosemans Attilio Belmonte Nouredine Rassoul Shamin Houshmand Sharifi Peter Debacker Diederik Verkest Romain Delhougne Gouri Sankar Kar
Reasons To Know IGZO
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News this week: China imports $26B in equipment; TSMC’s 5.5G buy; 3.5D; robots in fabs; foundry revenue up; NY-Japan partnerships; cooling tools; 4nm 3D X-ray imaging; Emerson’s device authentication deal and more. https://lnkd.in/eUvE98Xm #semiconductor SEMI #advancedpackaging TSMC AMD ZT Systems KoMiCo Technology Inc. Mitsubishi Electric Wolfspeed JEDEC onsemi Amkor Technology, Inc. Center for Strategic and International Studies (CSIS) Cadence Design Systems Infineon Technologies Xperi Inc. NY CREATES Micron Technology #hardwaresecurity Fabric Cryptography Alexander Bulekov Everspin Technologies Defense Advanced Research Projects Agency (DARPA) NI (National Instruments) Siemens Digital Industries Software xMEMS LiquidStack USC Viterbi School of Engineering A.F.J. Levi
Chip Industry Week In Review
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As vulnerabilities become more widespread and better known, industry standards will have to keep up. (Part 2 of series). By Adam Kovac. https://lnkd.in/gDGbprJm The hardware security ecosystem is young and relatively small but could see a major boom in the coming years. As companies begin to acknowledge how vulnerable their hardware is, industry standards are being set, but must leave room for engineers to experiment. As part of an effort to determine the best way forward, Semiconductor Engineering sat down with a panel of experts at the Design Automation Conference in San Francisco, which included Andreas Kuehlmann of Cycuity; Serge Leef head of secure microelectronics at Microsoft; Lee Harrison director of Tessent automotive IC solutions at Siemens EDA (Siemens Digital Industries Software); Pavani Jella president hardware security EDA solutions at Silicon Assurance (on behalf of IEEE P3164); Warren Savage at the University of Maryland’s Applied Research Lab for Intelligence and Security and is currently the Principal Investigator of the Independent Verification and Validation (IV&V) team for the Defense Advanced Research Projects Agency (Defense Advanced Research Projects Agency (DARPA)) AISS program; Maarten Bron director at Riscure/Keysight Technologies; Marc Witteman at Riscure/Keysight; Mike Borza, scientist at Synopsys Inc; Farimah Farahmandi, Wally Rhines Endowed Professor in Hardware Security and Assistant Professor at the University of Florida and co-founder of Caspia Technologies™; and Mark M. Tehranipoor, chair of the ECE department at University of Florida, founder of Caspia Technologies. #hardwaresecurity #cybersecurity #semiconductor
Hardware Security Set To Grow Quickly
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Special Report: 3.5D: The Great Compromise https://lnkd.in/gf8X4hbC Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC. #chiplets #3DIC #semiconductor #glasssubstrates #advancedpackaging Marc Swinnen Ansys William Chen ASE Global Arm Javier DeLaCruz TAEJOONG SONG Samsung Electronics Samsung Semiconductor Intel Corporation Kevin O'Buckley Promex Industries Inc. Dave Fromm Sutirtha Kabir Synopsys Inc Amkor Technology, Inc. Ruben Fuentes Keith Lanier David Park Tignis Dick Otte #HBM
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Special Report: Different types of robots with greater precision and mobility are beginning to be deployed in semiconductor manufacturing, where they are proving both reliable and cost-efficient. By Gregory Haley. https://lnkd.in/gYxtpKGx #robotics #fabs #semiconductor #cobots #semiconductormanufacturing Marco da Silva Boston Dynamics United Microelectronics Corporation (UMC) Adrien Plouffe GlobalFoundries Amkor Technology, Inc. Amkor Technology Korea Lam Research C-Hawk Technology Int'l Christian Felkel KUKA Mike Mathews Brewer Science Teradyne Aske Bach Lassen Joel Warner Samsung Semiconductor #smartmanufacturing
Increasing Roles For Robotics In Fabs
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Why Small Fab And Assembly Houses Are Thriving https://lnkd.in/ekwjamfb Megafabs churning out the most advanced processors are not the only game in town. By Bryon Moyer. #semiconductor #fabs #200mm #300mm Dave Fromm Promex Industries Inc. Ryan Zrno JST Tim Brosnihan SEMI Analog Devices TSMC C2MI #MEMS #siliconphotonics Infineon Technologies STMicroelectronics Bosch Rogue Valley Microdevices, Inc.
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