“When Ken was at Unisys, he led a team developing a server node controller chip for which my team at Avago performed the design release and virtual manufacturing. Ken is a detail oriented manager who is continuously on-top of both the business and technical aspects of complex engineering programs. He is always very professional and a pleasure to work with.”
Kenneth Reilich
San Diego, California, United States
1K followers
500+ connections
San Diego, California, United States
1K followers
500+ connections
About
Transformational executive team leader with proven expertise and business acumen…
Activity
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The fabless semiconductor model offers numerous advantages, including cost savings, flexibility, and a focus on core competencies. Intraratio's…
The fabless semiconductor model offers numerous advantages, including cost savings, flexibility, and a focus on core competencies. Intraratio's…
Liked by Kenneth Reilich
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Security is a top priority at Intraratio. 🛡️ Intraratio's solutions are deployed within your on-premise or #cloud networks and are fully controlled…
Security is a top priority at Intraratio. 🛡️ Intraratio's solutions are deployed within your on-premise or #cloud networks and are fully controlled…
Liked by Kenneth Reilich
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🚀 What a summer! Just wrapped up an incredible MBA product management internship at Nvidia, and my mind is officially blown! 🤯 From diving into…
🚀 What a summer! Just wrapped up an incredible MBA product management internship at Nvidia, and my mind is officially blown! 🤯 From diving into…
Liked by Kenneth Reilich
Experience
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Education
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US Patent 6271048
US Patent Office
An integrated circuit package is processed by a grinding step, a dissolving step, and a disintegrating step. The grinding step grinds an IC-chip completely off of a substrate, and it also grinds a first portion of a filler layer and a first portion of a set of solder balls which attach the IC-chip to the substrate. This leaves a partial filler layer and partial solder balls on the substrate. The dissolving step dissolves the partial filler layer off of the substrate after the grinding step; and…
An integrated circuit package is processed by a grinding step, a dissolving step, and a disintegrating step. The grinding step grinds an IC-chip completely off of a substrate, and it also grinds a first portion of a filler layer and a first portion of a set of solder balls which attach the IC-chip to the substrate. This leaves a partial filler layer and partial solder balls on the substrate. The dissolving step dissolves the partial filler layer off of the substrate after the grinding step; and the disintegration step disintegrates at least part of each partial solder ball by subjecting the partial solder balls on the substrate to ultrasonic vibration after the dissolving step. These steps leave the substrate with small solder mounds that can be easily attached to another IC-chip with another set of solder balls.
Languages
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English
Native or bilingual proficiency
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