“Talented and highly motivated project manager. Detail oriented with the ability to drive complex projects and large cross functional resources. ”
Paul J. Marganski, SSBB
Seymour, Connecticut, United States
2K followers
500+ connections
About
Results-driven professional with broad experience leading commercial projects generating…
Contributions
Activity
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The beauty of oligonucleotide and RNAi therapies are the fact that the treatments are not permanent, but exhibit durable effectiveness as compared to…
The beauty of oligonucleotide and RNAi therapies are the fact that the treatments are not permanent, but exhibit durable effectiveness as compared to…
Posted by Paul J. Marganski, SSBB
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I'm so motivated to get busy working on projects... I feel like Mike Tyson waiting for the bell to ring. Going through the interview process with…
I'm so motivated to get busy working on projects... I feel like Mike Tyson waiting for the bell to ring. Going through the interview process with…
Posted by Paul J. Marganski, SSBB
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Today marks a monumental day for Dianthus: it’s officially been one year since we began publicly trading on Nasdaq under the ticker DNTH! Some…
Today marks a monumental day for Dianthus: it’s officially been one year since we began publicly trading on Nasdaq under the ticker DNTH! Some…
Liked by Paul J. Marganski, SSBB
Experience
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Self-employed
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Education
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University of New Haven
Activities and Societies: American Chemical Society (ACS), American Institute of Chemical Engineers (AIChE) Honors: Awarded AIChE Senior Award Awarded AIChE Student Award - 2 Times
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Licenses & Certifications
Publications
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Semiconductor International Magazine Recognizes SDS and AutoClean Systems for Innovation, Safety, and Industry Impact
Semiconductor International Magazine
From SEMICON West 2009, ATMI, Inc. (Nasdaq:ATMI) announced that Semiconductor International magazine selected ATMI's SDS(r) and AutoClean(r) System solutions as Editors' Choice Best Products for 2009. Winners were disclosed Wednesday morning at an awards breakfast held at the Westin San Francisco Hotel. ATMI, known for innovations in efficiency and safety for semiconductor and life science manufacturing, is the only company to receive two honors this year.
The SDS System is an innovative…From SEMICON West 2009, ATMI, Inc. (Nasdaq:ATMI) announced that Semiconductor International magazine selected ATMI's SDS(r) and AutoClean(r) System solutions as Editors' Choice Best Products for 2009. Winners were disclosed Wednesday morning at an awards breakfast held at the Westin San Francisco Hotel. ATMI, known for innovations in efficiency and safety for semiconductor and life science manufacturing, is the only company to receive two honors this year.
The SDS System is an innovative and patented cylinder technology that provides the safest known method for transport, storage, and use of highly toxic dopant gases. The AutoClean System is an in-situ ion implanter cleaning technology which provides a simpler, safer, and greener method of improving tool efficiency while minimizing the hazardous risks of removing deposited toxic materials.
"The Editors' Choice Best Products awards program acknowledges products, materials, and services that are proven in the manufacturing environment," said Laura Peters, Editor-in-Chief of Semiconductor International (SI). In the evaluation process, SI's editors consider the products based on feedback from actual customers in the field, and only the most highly recommended ones are honored each year.
In accepting the awards for ATMI, Richard Fricke, Senior Director of Implant Technologies, noted his company is celebrating the 15th anniversary of its SDS technology this year. "Those of you in the industry at the time will recall that SDS represented a major breakthrough in safety when it was introduced in 1994. We've continuously improved the technology so it remains a must-have in our customers' fabs," said Fricke. "We're thrilled by this award, not only because it recognizes ATMI's lasting contributions to the industry, but also because it's based on customer feedback." -
ATMI AutoClean® Predictable Process: Extended Source Life. The First and Only In-Situ Implanter Cleaning Process
AVS - Science and Technology of Materials, Interfaces, and Processing
Detailed analytical and physical characterization of materials within ion implanters, both before and after use of XeF2, a novel molecule for the removal of hazardous deposits.
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In-Situ Ion Source Cleaning: Review of Chemical Mechanisms and Evaluation Data at Production Fabs
AIP Conference Proceedings
Since the concept of chemical in-situ ion implanter cleaning was introduced at IIT2006 [1], evaluations of the XeF{sub 2} cleaning technology have taken place or are ongoing at more than 40 production fabs worldwide. Testing has been focused on assessing effects of cleaning in the source arc chamber and extraction regions. In this paper we describe use of the cleaning technology in a production environment and summarize evaluation data showing advantages of the technology for improving ion…
Since the concept of chemical in-situ ion implanter cleaning was introduced at IIT2006 [1], evaluations of the XeF{sub 2} cleaning technology have taken place or are ongoing at more than 40 production fabs worldwide. Testing has been focused on assessing effects of cleaning in the source arc chamber and extraction regions. In this paper we describe use of the cleaning technology in a production environment and summarize evaluation data showing advantages of the technology for improving ion source life, reducing glitching, improving beam auto-tuning and avoiding species cross-contamination. More details of the evaluations are given in several separate papers submitted to this Conference. We have supplemented the fab production data with laboratory experiments designed to investigate the reactivity of XeF{sub 2} and fundamental aspects of the source deposition and cleaning processes. These experiments are summarized here, and more details can be found in separate papers submitted to this Conference.
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Characterizing and abating ion implant process effluents
Micro Magazine
Measurement of dry abatement removal efficiency of toxic substances during Semiconductor processing. In addition, pressure drop across the scrubbing tool is also presented.
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A Vaporizer for Decaborane and Octadecaborane
AIP Conference Proceedings
Delivery vaporizer for Decaborane and Octadecaborane - two promising materials for delivery of Boron ions for semiconductor Ion Implantation.
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Developments in abatement technology for MOCVD processing
Journal of Crystal Growtb
Removal of toxic hydrates from Semiconductor processing using dry adsorbent/chemisorbent materials
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International Conference on Ion Implantation Technology Proceedings
Ion Implant Technology
A small, zero-footprint, passive chemisorption scrubber (Novasafe) has been developed to treat the effluent from ion implanters. Extensive laboratory testing dictated a dual bed unit with a diameter of 10" and a height of 12". Evaluation in a production environment indicated that scrubber lifetime varied with implanter type. The units lasted approximately 6-9 months when servicing high current implanters, and lasted in excess of one year when servicing medium current implanters. The failure…
A small, zero-footprint, passive chemisorption scrubber (Novasafe) has been developed to treat the effluent from ion implanters. Extensive laboratory testing dictated a dual bed unit with a diameter of 10" and a height of 12". Evaluation in a production environment indicated that scrubber lifetime varied with implanter type. The units lasted approximately 6-9 months when servicing high current implanters, and lasted in excess of one year when servicing medium current implanters. The failure mechanism on high current implanters was due to increased pressure drop resulting from solids accumulation.
Patents
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Ventilation gas management systems and processes
Issued US 9,383,064
A ventilation gas management system and process for an enclosure adapted to contain fluid supply vessel(s) and through which ventilation gas is flowed to provide safe operation in the event of leakage of fluid from a vessel. Ventilation gas flow is modulated to accommodate various hazard levels associated with the deployment and operation of such enclosure containing fluid supply vessel(s), e.g., a gas box or gas cabinet in a semiconductor manufacturing facility, thereby achieving reduction in…
A ventilation gas management system and process for an enclosure adapted to contain fluid supply vessel(s) and through which ventilation gas is flowed to provide safe operation in the event of leakage of fluid from a vessel. Ventilation gas flow is modulated to accommodate various hazard levels associated with the deployment and operation of such enclosure containing fluid supply vessel(s), e.g., a gas box or gas cabinet in a semiconductor manufacturing facility, thereby achieving reduction in ventilation gas requirements otherwise required for such deployment and operation.
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Component for solar adsorption refrigeration system and method of making such component
Issued US 9,132,412
An adsorption structure is described that includes at least one adsorbent member formed of an adsorbent material and at least one porous member provided in contact with a portion of the adsorbent member to allow gas to enter and exit the portion of the adsorbent member. Such adsorption structure is usefully employed in adsorbent-based refrigeration systems. A method also is described for producing an adsorbent material, in which a first polymeric material provided having a first density and a…
An adsorption structure is described that includes at least one adsorbent member formed of an adsorbent material and at least one porous member provided in contact with a portion of the adsorbent member to allow gas to enter and exit the portion of the adsorbent member. Such adsorption structure is usefully employed in adsorbent-based refrigeration systems. A method also is described for producing an adsorbent material, in which a first polymeric material provided having a first density and a second polymeric material is provided having a second density, in which the second polymeric material is in contact with the first polymeric material to form a structure. The structure is pyrolyzed to form a porous adsorbent material including a first region corresponding to the first polymeric material and a second region corresponding to the second polymeric material, in which at least one of the pore sizes and the pore distribution differs between the first region and the second region.
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Cleaning of semiconductor processing systems
Issued US 8,603,252
A method and apparatus for cleaning residue from components of semiconductor processing systems used in the fabrication of microelectronic devices. To effectively remove residue, the components are contacted with a gas-phase reactive material for sufficient time and under sufficient conditions to at least partially remove the residue. When the residue and the material from which the components are constructed are different, the gas-phase reactive material is selectively reactive with the…
A method and apparatus for cleaning residue from components of semiconductor processing systems used in the fabrication of microelectronic devices. To effectively remove residue, the components are contacted with a gas-phase reactive material for sufficient time and under sufficient conditions to at least partially remove the residue. When the residue and the material from which the components are constructed are different, the gas-phase reactive material is selectively reactive with the residue and minimally reactive with the materials from which the components of the ion implanter are constructed. When the residue and the material from which the components are constructed is the same, then the gas-phase reactive material may be reactive with both the residue and the component part. Particularly preferred gas-phase reactive materials utilized comprise gaseous compounds such as XeF.sub.2, XeF.sub.4, XeF.sub.6, NF.sub.3, IF.sub.5, IF.sub.7, SF.sub.6, C.sub.2F.sub.6, F.sub.2, CF.sub.4, KrF.sub.2, Cl.sub.2, HCl, ClF.sub.3, ClO.sub.2, N.sub.2F.sub.4, N.sub.2F.sub.2, N.sub.3F, NFH.sub.2, NH.sub.2F, HOBr, Br.sub.2, C.sub.3F.sub.8, C.sub.4F.sub.8, C.sub.5F.sub.8, CHF.sub.3, CH.sub.2F.sub.2, CH.sub.3F, COF.sub.2, HF, C.sub.2HF.sub.5, C.sub.2H.sub.2F.sub.4, C.sub.2H.sub.3F.sub.3, C.sub.2H.sub.4F.sub.2, C.sub.2H.sub.5F, C.sub.3F.sub.6, and organochlorides such as COCl.sub.2, CCl.sub.4, CHCl.sub.3, CH.sub.2Cl.sub.2 and CH.sub.3Cl.
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Component for solar adsorption refrigeration system and method of making such component
Issued US 8,539,781
An adsorption structure is described that includes at least one adsorbent member formed of an adsorbent material and at least one porous member provided in contact with a portion of the adsorbent member to allow gas to enter and exit the portion of the adsorbent member. Such adsorption structure is usefully employed in adsorbent-based refrigeration systems. A method also is described for producing an adsorbent material, in which a first polymeric material is provided having a first density and…
An adsorption structure is described that includes at least one adsorbent member formed of an adsorbent material and at least one porous member provided in contact with a portion of the adsorbent member to allow gas to enter and exit the portion of the adsorbent member. Such adsorption structure is usefully employed in adsorbent-based refrigeration systems. A method also is described for producing an adsorbent material, in which a first polymeric material is provided having a first density and a second polymeric material is provided having a second density, in which the second polymeric material is in contact with the first polymeric material to form a structure. The structure is pyrolyzed to form a porous adsorbent material including a first region corresponding to the first polymeric material and a second region corresponding to the second polymeric material, in which at least one of the pore sizes and the pore distribution differs between the first region and the second region.
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Fluid storage and dispensing vessels having colorimetrically verifiable leak-tightness and method of making same
Issued US 8,153,434
A fluid storage and dispensing vessel having associated therewith a colorimetric member that is effective to change color in exposure to leakage of a gas contained in the vessel. The colorimetric member may be constituted by a film, e.g., of a shrink-wrap character, that contains or is otherwise associated with a colorimetric agent undergoing color change in exposure to fluid leaking from the vessel. Such shrink-wrap film may be applied to a portion of the vessel susceptible to leakage, or…
A fluid storage and dispensing vessel having associated therewith a colorimetric member that is effective to change color in exposure to leakage of a gas contained in the vessel. The colorimetric member may be constituted by a film, e.g., of a shrink-wrap character, that contains or is otherwise associated with a colorimetric agent undergoing color change in exposure to fluid leaking from the vessel. Such shrink-wrap film may be applied to a portion of the vessel susceptible to leakage, or alternatively to the entire vessel, so that the film is colorimetrically effective to indicate the occurrence of a leakage event by visually perceptible change of color.
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Fluid storage and dispensing vessels having colorimetrically verifiable leak-tightness, and method of making same
Issued US 8,003,391
A fluid storage and dispensing vessel having associated therewith a colorimetric member that is effective to change color in exposure to leakage of a gas contained in the vessel. The colorimetric member may be constituted by a film, e.g., of a shrink-wrap character, that contains or is otherwise associated with a colorimetric agent undergoing color change in exposure to fluid leaking from the vessel. Such shrink-wrap film may be applied to a portion of the vessel susceptible to leakage, or…
A fluid storage and dispensing vessel having associated therewith a colorimetric member that is effective to change color in exposure to leakage of a gas contained in the vessel. The colorimetric member may be constituted by a film, e.g., of a shrink-wrap character, that contains or is otherwise associated with a colorimetric agent undergoing color change in exposure to fluid leaking from the vessel. Such shrink-wrap film may be applied to a portion of the vessel susceptible to leakage, or alternatively to the entire vessel, so that the film is colorimetrically effective to indicate the occurrence of a leakage event by visually perceptible change of color.
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Method and apparatus for the abatement of toxic gas components from a semiconductor manufacturing process effluent stream
Issued US 7,364,603
An apparatus and process for abating at least one acid or hydride gas component or by-product thereof, from an effluent stream deriving from a semiconductor manufacturing process, comprising, a first sorbent bed material having a high capacity sorbent affinity for the acid or hydride gas component, a second and discreet sorbent bed material having a high capture rate sorbent affinity for the same gas component, and a flow path joining the process in gas flow communication with the sorbent bed…
An apparatus and process for abating at least one acid or hydride gas component or by-product thereof, from an effluent stream deriving from a semiconductor manufacturing process, comprising, a first sorbent bed material having a high capacity sorbent affinity for the acid or hydride gas component, a second and discreet sorbent bed material having a high capture rate sorbent affinity for the same gas component, and a flow path joining the process in gas flow communication with the sorbent bed materials such that effluent is flowed through the sorbent beds, to reduce the acid or hydride gas component. The first sorbent bed material preferably comprises basic copper carbonate and the second sorbent bed preferably comprises at least one of, CuO, AgO, CoO, CO.sub.3O.sub.4, ZnO, MnO.sub.2 and mixtures thereof.
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Fluid storage and dispensing vessels having colorimetrically verifiable leak-tightness, and method of making same
Issued US 7,253,002
A chemical storage and dispensing vessel having associated therewith a colorimetric member that is effective to change color in exposure to leakage of a gas contained in the vessel. The colorimetric member may be constituted by a film, e.g., of a shrink-wrap character, that contains or is otherwise associated with a colorimetric agent undergoing color change in exposure to fluid leaking from the vessel. Such shrink-wrap film may be applied to a portion of the vessel susceptible to leakage, or…
A chemical storage and dispensing vessel having associated therewith a colorimetric member that is effective to change color in exposure to leakage of a gas contained in the vessel. The colorimetric member may be constituted by a film, e.g., of a shrink-wrap character, that contains or is otherwise associated with a colorimetric agent undergoing color change in exposure to fluid leaking from the vessel. Such shrink-wrap film may be applied to a portion of the vessel susceptible to leakage, or alternatively to the entire vessel, so that the film is colorimetric effective to indicate the occurrence of a leakage event by visually perceptible change of color.
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INFRARED GAS DETECTION SYSTEMS AND METHODS
Issued US 20080006775
Use of thermopile sensor(s) to determine concentration of bases before and after materis abatement.
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Method and apparatus for the abatement of toxic gas components from a semiconductor manufacturing process effluent stream
Issued US 6,805,728
An apparatus and process for abating at least one acid or hydride gas component or by-product thereof, from an effluent stream deriving from a semiconductor manufacturing process, comprising, a first sorbent bed material having a high capacity sorbent affinity for the acid or hydride gas component, a second and discreet sorbent bed material having a high capture rate sorbent affinity for the same gas component, and a flow path joining the process in gas flow communication with the sorbent bed…
An apparatus and process for abating at least one acid or hydride gas component or by-product thereof, from an effluent stream deriving from a semiconductor manufacturing process, comprising, a first sorbent bed material having a high capacity sorbent affinity for the acid or hydride gas component, a second and discreet sorbent bed material having a high capture rate sorbent affinity for the same gas component, and a flow path joining the process in gas flow communication with the sorbent bed materials such that effluent is flowed through the sorbent beds, to reduce the acid or hydride gas component. The first sorbent bed material preferably comprises basic copper carbonate and the second sorbent bed preferably comprises at least one of, CuO, AgO, CoO, Co.sub.3 O.sub.4, ZnO, MnO.sub.2 and mixtures thereof.
Honors & Awards
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Medtronic Inventor of The Year
Medtronic PLC
Awarded for contributions to the Veriset hemostatic patch project. This included technology development, product spec development, equipment design/fabrication/validation, and process development/validation. Veriset is the world's only fully-synthetic hemostatic patch, for use in surgeries and trauma settings. This product line has produced $100s of millions in new product revenue since its introduction.
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R&D 100 Award
R&D Magazine
For contributions to the AutoClean product for the safe, chemical removal of toxic residues deposited during ion Implantation of Semiconductor wafers
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ATMI Awarded 'Best Achievement' At Global Six Sigma Awards
The Global Six Sigma Summit and Industry Awards
For successful utilization of Six Sigma methodologies in the development of AutoClean, a chemical solution for in-situ cleaning of ion implantation equipment, resulting in significantly improved equipment uptime and reduced maintenance costs.
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R&D 100 Award
Gases and Technologies Magazine
General scientific contributions to materials handling and abatement in the Semiconductor industry
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