Siemens has released a new addition to its #Tessent IC tool that gives designers more insight into hidden failure points in their own designs. Check it out ⬇️ https://bit.ly/3S7zJAW
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Interchip Achieves 3x Faster Verification for Next-Gen Oscillator with Siemens EDA Technology! Key Takeaways: * Interchip designs high-precision, low-power oscillator products. * Verifying these oscillators involves complex challenges like maintaining frequency stability and minimizing noise. * Siemens' Analog FastSPICE (AFS) & Symphony platform helped Interchip achieve 3x faster verification. * AFS provides circuit verification for various circuits with high accuracy and speed. * Symphony is the industry's fastest mixed-signal solution for verifying designs across various levels. #Siemens #Siemenseda #SiemensSoftware #EDA #SiemensDigital #SiemensDigitalIndustries #AnalogDesign #MixedSignal #Verification #AnalogDesign #MixedSignalIC #Oscillators #TimingCircuits #VerificationSolutions #Semiconductor #AnalogFastSPICE #Symphony #TechnologyAdvancement #EngineeringExcellence Read more about how Siemens EDA is enabling faster innovation: [https://lnkd.in/gJH2i6kd)
INTERCHIP achieves 3x faster verification for next-gen clocking oscillator with advanced analog and mixed-signal EDA technology - Semiwiki
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🌟 Join Siemens EDA at DAC 2024 for Exclusive Insights! 🌟 We’re excited to invite you to a series of insightful presentations at the Exhibitor Forum, all happening from 12:00pm - 12:30pm PDT at Level 1 Exhibit Hall. Discover how Siemens EDA is leading the way in semiconductor design and verification with cutting-edge solutions: 🔹 Enabling a New Era of Software Shift Left with Veloce CS (Monday, June 24) Learn how Veloce CS integrates software into every design phase, accelerating product development and reducing risks. Speaker: Vijay Chobisa 🔹 Taking 3D IC Heterogeneous Integration Mainstream (Tuesday, June 25) Explore the challenges and solutions for mainstream 3D IC design, including Siemens EDA's innovative 3D IC Design Kits (3DK). Speaker: Tony Mastroianni 🔹 How AI is Changing Every Aspect of EDA, Starting from Transistor-Level Simulation (Wednesday, June 26) Discover the impact of Verifiable AI on EDA, ensuring trustworthy and efficient design and verification processes. Speaker: Jeff Dyck Don't miss these opportunities to gain valuable insights and connect with industry experts. See you there! https://sie.ag/6v46Ka
Siemens Software at Design Automation Conference (DAC) 2024
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Small measuring tasks, big demands - DEDITEC presents ten new USB and CAN modules in the UC series DEDITEC is expanding its measurement technology portfolio with ten new single measurement modules with interface and I/O module in a compact housing. … LESEN SIE MEHR! #control_technology #measurement_technology #UCSeries #galvanic_isolation #single_measurement_module #deditec #control_technology #sensor_technology #measurement_technology #electrical_technology #electrical_trade #industry40 #innovationlab #hardware #techinnovation #technologytrends #technologysolutions #technologynews
Press release from 2023/12
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Siemens Unveils Tessent Hi-Res Chain: Revolutionizing IC Testing at 5nm and Below A game-changing tool for integrated circuit design and manufacturing teams: • Addresses challenges in advanced technology nodes (5nm and below) • Boosts diagnosis resolution by over 1.5x • Rapidly provides transistor-level isolation for scan chain defects • Reduces need for costly, time-consuming failure analysis cycles • Maintains over 80% accuracy rate in defect isolation This innovation promises to accelerate yield ramp and improve time-to-market for cutting-edge semiconductor products. #Siemens #Siemenseda #SiemensSoftware #EDA #SiemensDigital #SiemensDigitalIndustries #ICDesign #TessentHiResChain #Semiconductors #Innovation #TechAdvancements #YieldRamp #FailureAnalysis #ManufacturingExcellence #TechInnovation #AdvancedManufacturing #ChipDesign #Tessent
Siemens advances integrated circuit test and analysis at 5nm and below - New Electronics
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Unleash the Power of IC Packaging: From Protecting Chips to Revolutionizing Integration! Explore traditional types, advanced techniques, and emerging trends in this electrifying journey. https://bit.ly/3VXO4C3 #PCBdesign #Cadence
IC Packaging Types
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As technology advances, the demand for faster, more power-efficient, and highly robust semiconductor designs increases. Our customers aim to achieve the best PPA but often rely on global derates or margins, which can leave significant performance and power unused. Cadence Design Systems , we are constantly innovating to provide value for our customers. Our Tempus Design Robustness Analysis (DRA) Suite is a cutting-edge solution that addresses the challenges our customers face. The suite uses AI-driven analysis to help customers enhance design-level robustness, resulting in a remarkable 10% boost in PPA compared to conventional, margin-based approaches. What makes me excited about the Tempus DRA Suite is that its aging robustness analysis capability caters to a diverse range of sectors, including automotive, aerospace, consumer electronics, mobile devices, and hyperscale designs. Learn more about our DRA Suite: https://lnkd.in/g9DAPYDC #Innovation #PPA #DesignedWithCadence
Accelerating Advanced-Node Technologies with the Tempus DRA Suite
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𝗖𝗿𝗲𝗮𝘁𝗶𝗻𝗴 𝟯𝗗 𝘀𝗵𝗮𝗽𝗲𝘀 𝗼𝘂𝘁 𝗼𝗳 𝗜𝗖 𝘁𝗲𝗰𝗵𝗻𝗼𝗹𝗼𝗴𝘆 Is it possible to create 3D shapes – from boxes to tubes - out of IC technology, in extremely small form factor? Yes, it is, with Flex-to-rigid (F2R). This high-precision micro-assembly platform makes use of ultra-thin embedded electrical interconnects, that are able to bend (minimum radius: 20-50 μm). F2R was developed to bring complex electronic imaging functionality to the tip of smart catheters and guide wires. It is, however, just as fit for many other applications that make use of multiple electronic components. You won’t believe it until you see it 👀: https://lnkd.in/gprVeQgK
Flex-to-rigid | Philips Engineering Solutions
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🗞 Electronic News! 🗞 This latest innovation in oscilloscope technology introduces a new functionality that significantly enhances the ability of oscilloscopes to isolate events that were previously difficult or impossible to detect using traditional trigger methods. The MXO zone trigger implementation, developed by Rohde & Schwarz, stands out as the fastest in the industry, surpassing competitors by up to 10,000 times in speed. Traditional oscilloscope trigger types, like edge triggering, often pose challenges in setup and may not be adequate for visualizing certain trigger events. In contrast, zone triggering empowers users to define trigger conditions by drawing one or more zone areas directly on the instrument's display. The oscilloscope then evaluates each acquisition against these conditions, displaying only the acquisitions that meet the specified graphical criteria. #electricalengineering #electronics #embedded #embeddedsystems #electrical #computerchips Follow us on LinkedIn to get daily news: HardwareBee - Electronic News and Vendor Directory
New Ultrafast Zone Triggering Feature in Oscilloscopes
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In the rapidly evolving semiconductor industry, traceability is key to ensuring quality and reliability. Keysight’s latest blog post delves into the importance of Design Data Management (DDM) for semiconductor design, highlighting how purpose-built tools can significantly enhance design workflows across various EDA processes. With the semiconductor market’s value reaching new heights, it’s crucial for design teams to adopt scalable and secure DDM solutions to meet complex design requirements and achieve heterogeneous integration. For IC design teams looking to stay ahead in the game, embracing Keysight’s advanced DDM solutions is a strategic move. Don’t miss out on the opportunity to streamline your design collaboration and elevate your product’s quality—explore Keysight’s insights and take your semiconductor design to the next level with Keysight HUB ! #SemiconductorDesign #Traceability #Keysight https://lnkd.in/gBC5hac6
How to Enhance Traceability for Semiconductor Design
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Analog Devices introduces MAXREFDES75 – a groundbreaking 24-bit Weigh Scale with a 16-bit DAC, revolutionizing industrial measurements. Incorporating user-programmable calibration and diverse sensor supply options, this design simplifies the complex world of small-signal measurements. From precise chemical reactions to efficient cargo management, MAXREFDES75 offers unparalleled accuracy across industrial applications. 🔎 Key Features: ✅ 24-bit Range ✅ 16-bit DAC ✅ Ratiometric Measurement ✅ User-Programmable Calibration ✅ Flexible Sensor Supply Options Discover how this reference design provides a customizable approach to measurement and calibration, enhancing versatility in various industrial contexts. Check out Analog Devices' latest innovation and delve into the future of industrial weight scales! For more details, check here: https://lnkd.in/dPXs_h-u #AnalogDevices #Innovation #PrecisionMeasurement #IndustrialTech #MAXREFDES75 #efy #referencedesign
24-Bit Weigh Scale Reference Design - Electronics For You
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