On the eve of SEMICON West 2024, we unveiled two new materials engineering innovations designed to extend copper interconnect wiring to the 2nm node and beyond. As chipmakers continue to shrink features with each technology generation, they must also shrink the copper wires that connect billions of transistors on a chip. While it may seem counterintuitive, smaller is not actually better when it comes to wiring. Read our press release to learn how Applied’s materials engineering breakthroughs are overcoming challenges with next-generation wiring and allowing chipmakers to scale into the “angstrom era.” https://bit.ly/46d1I89
Thanks for sharing the nice video. It helps me to understand further the yield and chip reliabilities impacted by material and process technology. I was involved in some quality claims from system level related to chips internal failure mode which applying CIP process and requiring innovations on materials and processing techniques.
Amazing
Soon we will use additive techniques as well...
Innovative and effective designs Applied Materials team! Eager to see the final results.
Exciting times!
Semiconductors | Photonics | Nanotechnologies | Medical devices | Research and Development | Process Engineering
1moGreat achievement! Of course it's reported in The Semiconductor Newsletter 👀 https://www.linkedin.com/pulse/semiconductors-weekly-update-market-growth-major-cosimo-spagnolo-mslne/