Applied Materials’ Post

On the eve of SEMICON West 2024, we unveiled two new materials engineering innovations designed to extend copper interconnect wiring to the 2nm node and beyond. As chipmakers continue to shrink features with each technology generation, they must also shrink the copper wires that connect billions of transistors on a chip. While it may seem counterintuitive, smaller is not actually better when it comes to wiring. Read our press release to learn how Applied’s materials engineering breakthroughs are overcoming challenges with next-generation wiring and allowing chipmakers to scale into the “angstrom era.” https://bit.ly/46d1I89

Electronic Specifier Ltd's Harry Fowle wrote a great piece on gallium nitride (GaN) and how it offers significant advantages over traditional silicon-based semiconductors like increased switching speeds and faster charging. Although GaN design comes with some challenges, its potential is large enough that the GaN power electronics market could exceed $2B by 2025! Traditionally, compound #semiconductor materials like GaN are difficult to manufacture due to crystal defects, but recent experiments with our MST film have shown promising results. I’m hopeful our progress will help unlock GaN’s full potential! https://bit.ly/3V8fsLZ

Exciting things ahead in the world of electric vehicles (EV) and power electronics 🔌⚡ This IEEE Access article delves into the rapidly expanding EV market, shedding light on the critical role of efficient power electronic systems. Read the full article to discover how advancements in wide bandgap semiconductors, like silicon carbide and gallium nitride, are revolutionizing the industry. https://lnkd.in/eHz2ZkhR

Texas Instruments and Delta Electronics have joined forces to establish a cutting-edge joint research and development lab focused on advancing electric vehicle onboard charging and power systems. The collaboration aims to leverage gallium nitride technologies to drive innovation in the EV industry. The newly inaugurated lab, located in Pingzhen, Taiwan, will serve as a hub for collaborative R&D efforts between TI and Delta. By combining the expertise and resources of both companies, the lab is set to revolutionize the design and performance of EV charging systems, with a focus on enhancing power density, efficiency, and affordability. #electricalengineering #electronics #embedded #embeddedsystems #electrical #computerchips Follow us on LinkedIn to get daily news: HardwareBee - Electronic News and Vendor Directory

Huge boost for electromobility— Bosch is gearing up to produce state-of-the-art silicon carbide chips right here in City of Roseville by 2026 🚙👏⚡ In 2023, Bosch acquired a semiconductor facility in Roseville, which is currently being upgraded. The Roseville facility previously produced standard silicon-based application-specific integrated circuits (ASICs); the facilities now need to be overhauled to handle the much more demanding silicon carbide. Luckily, existing clean room facilities and a specialist workforce in Roseville will allow Bosch to relatively quickly switch over to manufacturing SiC. Learn more: https://lnkd.in/eXVUm8DM 📸 City of Roseville

To protect people and critical equipment, military-grade electronic devices must be designed to function reliably while operating in incredibly harsh environments. Therefore, instead of continuing to use traditional silicon semiconductors, in recent years, electronic device designers have started to use wide band-gap (WBG) materials such as silicon carbide (SiC) to develop the semiconductors required for military device power supplies. In general, WBG materials can operate at much higher voltages, have better thermal characteristics, and can perform switching at much higher frequencies. Learn more about this topic, from our technology partner, Knowles Precision Devices. https://buff.ly/3OPlmzz

Learn How STMicroelectronics Silicon Carbide (SiC) Research Team uses Silvaco TCAD to Analyze the Impact of Surface Defect Dot on Short Circuit Phenomena in SiC Devices   During SiC device switching operations, it is possible that devices could be reaching abnormal overload conditions, which is why some applications require “robustness” specifications (e.g., Short Circuit and UIS tests). In this webinar we will show how the impact of a short circuit of a defect localized in the active area has been investigated by means of TCAD simulations performed with Silvaco software.   WHO SHOULD ATTEND: Semiconductor Device and Process engineers, product managers, and engineering management.   TO REGISTER, CLICK THE LINK BELOW: https://lnkd.in/ga8bHgbn

What role does the emphasis on power saving play in the forecasted growth of the #superjunctionMOSFET market? The super junction MOSFET market is poised for substantial growth fueled by rising reliance on #electricalequipment, #machinery, and a growing emphasis on power conservation. Additionally, the market stands to gain from the surge in the adoption of #electricvehicles (EVs). However, hindrances to growth include the intricate fabrication processes associated with super junction MOSFETs. Key Market Players: Toshiba, STMicroelectronics , Vishay Intertechnology, Inc., Infineon Technologies , Fuji Electric Co., Ltd., Alpha & Omega Semiconductor, IceMOS Technology Corporation , Magnachip Semiconductor, 強茂 PANJIT International Inc. Explore the market overview: https://lnkd.in/dDXzibUu #SuperJunctionMOSFET #MarketExpansion #ElectricalEquipment #PowerSaving #ElectricVehicles #MarketOpportunity #FabricationChallenges #ForecastedGrowth

A big thank you to Ralf Keggenhoff, Global Director of Application Engineering, Semiconductor Business Unit at Littelfuse, for his insightful session at I.S.E.S. EU Power 2024! Session Title: Isolation - A Package Requirement Abstract: Ralf Keggenhoff explored the complexities of achieving higher power throughput in smaller housings while balancing efficiency and cost in power electronics. He highlighted the challenge of increased thermal stress due to higher currents, which can reduce the lifespan of devices. To address this, Ralf discussed the potential of using wide bandgap SiC-MOSFETs instead of silicon-based IGBTs, despite the higher cost. Additionally, he introduced an innovative approach focusing on direct liquid cooling for power semiconductors, circumventing the limitations of insulating substrates for thermal transfer. His presentation underscored the need for innovative solutions to optimize power electronics performance and longevity. Thank you, Ralf, for sharing your expertise and innovative approaches to enhancing power electronics! #ISESEUPower2024

Global Semiconductor Manufacturing Back-End Equipment Market has experienced tremendous growth in recent years and is poised to continue its strong expansion. The Semiconductor Manufacturing Back-End Equipment Market reached a value of USD 53.16 billion in 2022 and is projected to maintain a compound annual growth rate of 9.82% through 2028. The Global Semiconductor Manufacturing Back-End Equipment Market is currently undergoing a period of significant growth, driven by the relentless march of technological advancements that continue to transform industries across the globe. Download Free Sample Report: https://lnkd.in/di9-R3b8 Key Market Players Applied Materials, Inc. Lam Research Corporation ASML Holding N.V. KLA Corporation TOKYO ELECTRON LIMITED Advantest Corporation SCREEN Semiconductor Solutions Co., Ltd. Nikon Corporation Ushio Inc. Hitachi High-Tech Corporation