EETech Group’s Post

Frost & Sullivan's 2nd Annual edition of the Top Trends that will impact the Semiconductor Industry is published. This time, we have identified 11 critical opportunities to navigate a dynamic 2024, including #AI in #R&D, #AI-assisted #Testing, #Beyond Silicon, #Emerging #Packaging #Technologies, #Silicon #Photonics, and #RISC-V, to mention a few. We have discussed the context of the growth, identified opportunities, and highlighted companies that exhibit best practices in response to these trends and are better positioned against the competition to achieve growth. Link to the report: https://lnkd.in/gNnpk2k4 I'm also happy to announce that we have scheduled a briefing session/discussion on this topic for 28th Feb with a panel of experts from Economics to Tech to provide you with quick & extended perspectives. Register for our session: https://lnkd.in/geejguUM Navdeep Saboo Vijay Mathew Rituparna Majumder Kasthuri Jagadeesan Himanshu Mhatre Jeroen Duis Prasad Dhond Eli Roth Eran Rousseau Verena Vogler-Bichelmeir Sudeep Shivalli Lee Flanagin #frostandsullivan #semiconductors #Top11

Resonac has established "Packaging Solution Center" and launched R&D consortiums"JOINT" and "JOINT2" to advance next-generation semiconductor packaging technology. By involving domestic materials and equipment manufacturers, as well as even competitors, they are driving technological development forward. Hidenori Abe(Hidenori Abe), who leads the project from the Electronics Business Headquarters, discusses the importance and challenges of co-creation, emphasizing that the mutual utilization of technology and information through open innovation is essential for developing next-generation semiconductor packaging technologies. For more details, please check here! https://lnkd.in/gnkscs6j *This article was published on January 1, 2023. #Semiconductors #Innovation #Technology #OpenInnovation

SANG HO KANG, Vice President and General Manager of DuPont Semiconductor Technologies, spoke last week at SEMICON® China in the keynote session highlighting the essential link between innovation, digitalization, and sustainability in the semiconductor industry. Learn more about his experience.   #SemiconChina #semiconductorindustry #sustainability #digitalization SEMI

JAPAN'S RESONAC TO OPEN CHIP PACKAGING R&D CENTRE IN US Are you looking to buy or sell used semiconductor equipment? VISIT Moov Technologies Inc. and browse their 4 billion dollars of equipment listings around the world. Japanese chip materials company Resonac plans to establish an R&D center in Silicon Valley by 2025, focusing on advanced semiconductor packaging. This move aligns with the growing importance of packaging in chip technology advancement, as evidenced by the U.S.'s recent $3 billion investment in this area. Resonac, previously known as Showa Denko, specializes in packaging materials and aims to strengthen ties with the U.S., similar to other Japanese chip firms like Rapidus. Thanks again to reuters for the full article with more background and insights click the source link in the comments below 💡 🙏 👇 #semiconductorindustry #technology #computerchips

Reflecting on SEMICON Korea 2024, the profound insights shared by Anand Nambiar, our Chief Commercial Officer, remain as impactful as ever. His keynote wove together our company's storied history with an ambitious vision for the semiconductor industry's future. 📹 We are thrilled to share the keynote highlights, showcasing: • Our drive to boost material quality and production efficiency through data analytics. • The role of predictive models in elevating our standards of quality control to new heights. • The strength of industry collaboration and digital integration in refining R&D and supply chain processes. 📈 Join us in pioneering a data-driven future where innovation thrives on knowledge and collaboration. 🔗 Learn more: https://bit.ly/4clbabT #MerckElectronics #SemiconductorInnovation #DigitalTransformation #SEMICONKorea2024 #DataAnalytics

What Are the #SemiconductorandElectronics Market Insights for Q4 2023? Q4 2023 marked a pivotal moment for the Semiconductor & Electronics industry, where key events like the #Samsung Foundry Forum Japan and Semicon #Europa propelled innovation. These gatherings not only showcased #cuttingedge advancements but also fostered collaboration, ensuring the sector's evolution. The discussions on sustainability and technology at these forums underscored the industry's commitment to a brighter, collaborative, and sustainable future. #SemiconductorInsights #ElectronicsGrowth #InnovationHub #TechAdvancements #IndustryEvents #Q42023Highlights #SamsungFoundryForum #GSEF2023 #SemiconEuropa #TowerSemiconductorSymposium #MEMSWorldSummit #SemiconJapan #FutureTech #CollaborationInTech #SustainabilityInElectronics #DigitalTransformation #TechNetworking #IndustryEvolution #Q4TechTrends #AMR

David Clark, VP of Product Marketing at Amkor Technology, Inc. joined the panel discussion at the OECD Semiconductor Informal Exchange Network event in #Milan to discuss key trends and challenges shaping the evolution of the global semiconductor marketplace. The panel explored topics such as production shifts, market consolidation, the entry and exit of firms, and overall competition dynamics. Panelists delved into the main threats facing #semiconductor companies and the exciting opportunities on the horizon. A particular focus was on the prospects available to new players – both companies and countries – aiming to develop and strengthen their semiconductor ecosystems. David gave an overview of Amkor's investments in the #European semiconductor #ecosystem and how #Amkor brings world-class #OSAT manufacturing capabilities and scale to Europe, offering #AdvancedPackaging solutions like #FlipChip packaging, #HeterogeneousIntegration, power semiconductor modules, and #MEMS & #sensor packaging. The esteemed panel featured insights from: ▶ Marco Luciano CASSIS, President, Analog, Power & Discrete, MEMS and Sensors Group, STMicroelectronics ▶ David Clark, VP, Product Marketing, Amkor Technology ▶ Janine Dobelmann, Head of Government Affairs EU, NXP Semiconductors ▶ Tobias Pröttel, CEO, World Semiconductor Trade Statistics ▶ Boris Metodiev, Director of Semiconductor Manufacturing Analysis, TechInsights ▶ John Neuffer, President and CEO, Semiconductor Industry Association Learn more at https://lnkd.in/e7cPGGGr #semiconductorindustry #semiconductors #semiconductormanufacturing

Looking forward to our keynote talk at #SemiconKorea. We'll focus on the challenges and opportunities with #mulitdie architectures for #chiplet based design, particularly in how best to implement #D2D and #D2M #interconnect. Today's chip makers need to look at the complete picture of organic and advanced packaging options to chose the most optimal approach. #UCIe #BoW #NuLink #PHY Sean Lundy SEMI

In reflection of Polymatech Electronics Hub‘s groundbreaking year in 2023, Founding President Mr. Eswara Rao Nandam shares insights on the company’s resilience and #innovation, emphasizing their commitment to advancing technology and leading transformative #developments in the #semiconductorsector. #electronicsnews #technologynews

David Clark, VP of Product Marketing at Amkor Technology, Inc. joined the panel discussion at the OECD Semiconductor Informal Exchange Network event in #Milan to discuss key trends and challenges shaping the evolution of the global semiconductor marketplace. The panel explored topics such as production shifts, market consolidation, the entry and exit of firms, and overall competition dynamics. Panelists delved into the main threats facing #semiconductor companies and the exciting opportunities on the horizon. A particular focus was on the prospects available to new players – both companies and countries – aiming to develop and strengthen their semiconductor ecosystems. David gave an overview of Amkor's investments in the #European semiconductor #ecosystem and how #Amkor brings world-class #OSAT manufacturing capabilities and scale to Europe, offering #AdvancedPackaging solutions like #FlipChip packaging, #HeterogeneousIntegration, power semiconductor modules, and #MEMS & #sensor packaging. The esteemed panel featured insights from: ▶ Marco Luciano CASSIS, President, Analog, Power & Discrete, MEMS and Sensors Group, STMicroelectronics ▶ David Clark, VP, Product Marketing, Amkor Technology ▶ Janine Dobelmann, Head of Government Affairs EU, NXP Semiconductors ▶ Tobias Pröttel, CEO, World Semiconductor Trade Statistics ▶ Boris Metodiev, Director of Semiconductor Manufacturing Analysis, TechInsights ▶ John Neuffer, President and CEO, Semiconductor Industry Association Learn more at https://lnkd.in/e7cPGGGr #semiconductorindustry #semiconductors #semiconductormanufacturing