Eliyan in the top 10 hottest semi startups of 2024!!! https://lnkd.in/gAjH9Xwz We have a couple key roles open. Let's connect so I can share more info. Join a talented team and learn from great leaders. #JobOpenings #CareerOpportunity #interconnect #UCIe #DietoDie #package #analog #digital #serdes #highspeed #chiplet #semiconductor #manufacturing #techinnovation #startup #siliconvalley #advancedpackaging #distruptiveinnovation #technews #die2die #integratedcircuits #icdesign #ic #ics #chips #semiconductorindustry #semiconductors #tech #technology #BoW #NuLink #multidie #SIP #genai #chiplets #HPC #hyperscalers #Die2Memory #ocp #PHY #AI
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Congratulations to JEDEC on the progress being made toward the next generation DRAM standard, #HBM4. The promise of increased bandwidth and capacity along with lower power consumption make it critical to helping scale the high-performance computing required in the #GenAI era. Eliyan is proud to support and participate in the JEDEC efforts in high bandwidth memories. https://lnkd.in/eh5SWdZ8
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Tune in August 21 to the #HotInterconnects conference. The theme is "Can Interconnects Keep up with AI." We'll be offering our perspective on how new approaches to multi-die D2D and D2M interconnect can address performance and bandwidth challenges of the AI era. Our own Ramin Farjadrad will be speaking at 11AM (Pacific) on Wednesday, August 21. Sign up in link below. #chiplets #NuLink #UMI https://lnkd.in/gkEy-bvX
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We are pleased to welcome Venturetech Alliance LLC, the venture investment firm partnered with TSMC, to our group of investors in Eliyan. With more than $100M raised to date we now have the backing of the world's top foundries and memory suppliers, supporting our vision for highly efficient, high performance and flexible interconnect for multi-die design. #chiplets #AI #semiconductors #3DIC “Eliyan’s technology for interconnect of multi-die architectures addresses many of the key manufacturing challenges in terms of packaging, scalability, and flexibility. From a foundry perspective, we see a significant market opportunity for their technology to be an important enabler in the emerging chiplet ecosystem,” said Kai Tsang, Managing Director at VentureTech Alliance. https://lnkd.in/eUz9Kisc
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Eliyan congratulates the UCIe Consortium on the #UCIe 2.0 release, and is pleased to contribute our expertise to the progress of the UCIe specification, including authoring one of the ECNs in the 2.0 release. Eliyan developed a 32Gbps UCIe #PHY in standard packaging last year, and recently developed a beyond 32Gbps+ UCIe PHY in advanced packaging. Eliyan will continue to offer a range of the highest performance and lowest power PHYs for standards-compliant and customized die-to-die solutions. https://lnkd.in/eTD8xKiq
UCIe Consortium Releases 2.0 Specification Supporting Manageability System Architecture and 3D Packaging
businesswire.com
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Proud to be named to the prestigious EE Times | Electronic Engineering Times Silicon 100, the publication's annual list of the most promising companies in the semiconductor industry. See the complete list here: https://lnkd.in/gwuSJ2fQ Peter Clarke Sally Ward-Foxton Anne-Françoise Pelé Nitin Dahad
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Be sure to register and tune in for the EE Times | Electronic Engineering Times chiplet event this week. Oure own Ramin Farjadrad will be speaking on Wednesday July 24 at 8:50AM Pacific and on a panel that follows. Nitin Dahad Sally Ward-Foxton. Registration is free and there is a great lineup of speakers: https://lnkd.in/g49mhKBZ
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Introducing the first round of sponsors for Hot Interconnects 2024. Thanks to Eliyan Corporation, Arista Networks, Salience Labs, GigaIO, Nutanix, and Lenovo for their support. Join us this August! We are looking forward to an exciting conference. Want to become an IEEE HotI'24 patron: https://hoti.org/sponsors/ Stay tuned for more updates. #hoti #hoti24 #hpc #datacenter #interconnection #smartnic #fpga #conference2024 #sponsorship
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Shaping up to be a great event on all aspects of #interconnect and glad to be on board. Look for more details on keynote presentation by Ramin Farjadrad
Introducing the first round of sponsors for Hot Interconnects 2024. Thanks to Eliyan Corporation, Arista Networks, Salience Labs, GigaIO, Nutanix, and Lenovo for their support. Join us this August! We are looking forward to an exciting conference. Want to become an IEEE HotI'24 patron: https://hoti.org/sponsors/ Stay tuned for more updates. #hoti #hoti24 #hpc #datacenter #interconnection #smartnic #fpga #conference2024 #sponsorship
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Senior Global technical Product Manager: System and Wireless concept engineering from idea to certification and final introduction in market
2moThis is the definition of real high tech... exiting future…congratulations Eliyan.