Eliyan Corporation’s Post

At our current pace five years will pass by in the blink of an eye. Chiplet's are exciting and they will provide an increase of possibilities moving forward. I also am interested to see how 3D packaging and embedded silicon bridges (EMIB) will shape the future packaging landscape. I have to wonder if EMIB's will mature from a interconnect solution to more of a chiplet function with circuit processing capability?

Chiplets 🤝 RISC-V In the words or Danny & Sandy from Grease, they go together like rama lama lama ka dinga da dinga dong....whatever that means. Why? Modularity & Flexibility. For RISC-V, you can add optional instructions based on the application you are targeting, or do away with the instructions you don't need, allowing greater customization for customer needs. For Chiplets, you can create chips using a combination of less advanced nodes for the less performance critical functions with more advanced nodes for the functions that require the greatest performance, increasing flexibility and reducing the impact of limited availability of advanced node manufacturing. Kind of like Pick-n-Mix (for the Brits), or Penny Candy (for the Americans). It's no wonder the exciting news announcement for companies working on these technologies just keeps flowing. No doubt this to continue for the rest of 2024 and beyond. #chiplets #riscv

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