HRP Metals, Inc.’s Post

High numerical aperture (NA) extreme ultraviolet (EUV) lithography represents the next phase for chip production. While it does present its share of challenges, High NA EUV is changing the ecosystem as we know it. Learn more. ⬇

𝗣𝘂𝘀𝗵𝗶𝗻𝗴 𝘁𝗵𝗲 𝗹𝗶𝗺𝗶𝘁𝘀 𝗼𝗳 𝗺𝗶𝗻𝗶𝗮𝘁𝘂𝗿𝗶𝘇𝗮𝘁𝗶𝗼𝗻 Advancements in microelectronics continuously rely on shrinking electronic devices and incorporating novel materials in active regions to achieve ever-higher speeds and new functionalities in device structures. What is our solution? > Precise overlay of multi-layer devices. > Dense patterns with high resolution features and low line edge roughness. > Real-time autofocus enabling sub-micron feature size and consistent uniformity even on corrugated surfaces. Maskless lithography tools like the VPG 300 DI of Heidelberg Instruments have emerged as a transformative technology in microelectronics lithography. Learn more at heidelberg-instruments.com or next week at SEMICON Europa in Munich! Image: Flexible chip film patch, separated from a 150 mm wafer, all layers were exposed with the VPG 300 DI, Courtesy of IMS Chips #flexibleelectronics #printedelectronics #semiconductor #masklesslaserlithography #directwriting

Our projection optics of High-NA-EUV lithography is 7️⃣ times the volume and weight of previous EUV lithography. 🤯 In it we have installed the most precise mirrors in the world.  They ensure that the mask structures are imaged on the wafer – and this in the nanometer range. From 2025 onwards, we will enable the semiconductor industry to realize the next microchip generation with three times more transistors compared to the previous EUV lithography and thus support Moore’s Law beyond 2030. 🚘🧠💻 #highNAEUV #lithography

𝐍𝐚𝐧𝐨-𝐬𝐭𝐫𝐮𝐜𝐭𝐮𝐫𝐞𝐝 𝐬𝐢𝐥𝐢𝐜𝐨𝐧 𝐜𝐡𝐢𝐫𝐩𝐬 𝐟𝐨𝐫 𝐭𝐡𝐞 𝐜𝐚𝐥𝐢𝐛𝐫𝐚𝐭𝐢𝐨𝐧 𝐨𝐟 𝐚𝐮𝐭𝐨𝐦𝐚𝐭𝐞𝐝 𝐨𝐩𝐭𝐢𝐜𝐚𝐥 𝐢𝐧𝐬𝐩𝐞𝐜𝐭𝐢𝐨𝐧 𝐬𝐲𝐬𝐭𝐞𝐦𝐬 Today we follow up on the devices fabricated by our colleague Alessandro at EPFL (École polytechnique fédérale de Lausanne) by e-beam lithography. The samples consist of nano-structured concentric circles etched in silicon called circular chirps. They are the first #semiconductor #calibration samples dedicated to the determination of the transfer function and topography fidelity of #AOI tools and 3D optical confocal microscopes Automated optical inspection (#AOI) is widely used for quality control in semiconductor manufacturing. For high aspect ratio topographies, large measurement deviations can be observed. To investigate the topography fidelity of optical measurement instruments, a semiconductor chirp calibration standard has been developed within this project based on the German National Metrology Institute standards.

Exciting news! 🎉From 2025 onwards, ZEISS, its strategic partner ASML as well as many more contributors enable the #semiconductor industry to realize the next microchip generation with the further development of High-NA-EUV lithography – thus supporting Moore's Law beyond the year 2030. Get ready for advancements in autonomous driving, #AI and everyday digitalization.   Check out ZEISS Semiconductor Manufacturing Technology to find out more!   #ZEISS #Digitalization #Lithography

New horisons in semiconductor industry thanks to ASML and ZEISS Semiconductor Manufacturing Technology.

We bring light into the darkness… 🔦 Here you can see the black light control of the first ZEISS projection optics for the High-NA-EUV lithography. The heart of the lithography machine consists of more than 40,000 parts and weighs around twelve tons. 💙🎉💪 The High-NA-EUV lithography is the further development of EUV lithography. At 0.55, the numerical aperture (NA) for High-NA-EUV lithography is significantly larger than the previous EUV generation's 0.33. This allows up to three times more structures on a microchip. 🔍📏 With that, Moore's Law will continue beyond 2030. 💡 More information about the High-NA-EUV lithography https://lnkd.in/e4XS6FCF 👀 Stay tuned for more content on High-NA-EUV lithography here on our channel! #highNAEUV #lithography

193 Nanometer Immersion Lithography Explained 🐭 While Extreme Ultraviolet (EUV) lithography often steals the spotlight, let’s not forget the incredible impact of 193 nanometer immersion lithography. 🌊 Here’s a quick comparison to highlight its significance: Resolution: Immersion lithography increases the numerical aperture to 1.35 or higher. EUV takes a different approach, using a shorter wavelength of 13.5 nm for higher resolution. 🔍 Productivity: Immersion lithography boosts throughput, processing more wafers per hour. EUV is still catching up in terms of speed and efficiency. ⏱️ Cost: Immersion lithography is more cost-effective and has a well-established infrastructure. EUV requires significant investment and is still in the early stages of widespread adoption. 💰 💡 Why Should You Care? 💡 Proven Technology: Immersion lithography has been a reliable workhorse since the early 2000s, driving advancements in semiconductor manufacturing. 🏭 Innovative Fluids: The use of ultrapure water and other advanced fluids ensures minimal contamination and optimal performance. 💧 Cutting-Edge Optics: Companies like ZEISS Semiconductor Manufacturing Technology have developed new optics systems to support this technology, combining lenses and mirrors for better performance. 🔭 #Semiconductors #Lithography #Innovation #Technology #Productivity

Explore the fascinating world of EUV technology in one of our latest #AdvantestTalksSemi podcast episodes. Discover how Extreme Ultraviolet lithography is revolutionizing semiconductor manufacturing, pushing the boundaries of miniaturization and efficiency. From the intricacies of mask evaluation to the challenges of scaling down to nanometer sizes, get a glimpse into the future of chip fabrication. EUV isn't just a technological leap; it's a gateway to the next era of computing! #EUVTechnology #SemiconductorManufacturing #Nanotech #Advantest #ChipFabrication #TechInnovation #FutureComputing #Semiconductors #AdvantestTalksSemi

So far, we have seen #EBL and contact lithography as a writing strategy to reduce the overall exposure time for patterning. In the paper "Intra-level mix and match lithography with electron beam lithography and i-line stepper combined with resolution enhancement for structures below the CD-limit," Fraunhofer ENAS, Technische Universität Chemnitz and micro resist technology GmbH authors (Christian Helke, Cansu Canpolat Schmidt, Georg Heldt, Sebastian Schermer, Steffen Hartmann, Anja Voigt, Danny Reuter) combine #EBL and #stepper #lithography on the same resist layer using negative tone resist ma-N 1402 (from micro resist technology GmbH), which is both UV and electron sensitive. Their Intra-level Mix & Match approach (ILM&M) reduced writing time by 50%. Read more: https://lnkd.in/eBxye7AA Register for MAEBL 2024: https://www.maebl.org #nano #nanotechnology #nanofabrication #chips #chipsact #ebeam #litho #workforcedevelopment #semicon #semiconductor #semiconductors #lithography Arne Schleunitz