Making waves across the tech world 🌊 Since announcing at #Computex, everyone is excited about our #IntelXeon 6 processors with Efficient-cores. What excites you about this latest generation of processors?
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The video from my talk at OpenUK's #stateofopencon has been published. Have a look to see my thoughts on #opensilicon and how #opentitan helps develop a model for open silicon development we've named the Silicon Commons. https://lnkd.in/d73FkEqP
How the Silicon Commons, developed through OpenTitan, is revolutionizing chip design | Greg Chadwick
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Hardware choices can make or break your project. We dive deep into the challenges of picking the right components, including insights on what hardware solutions are being created by market innovators such as Alif Semiconductor. Ever wondered if there's a chance to jump into this hyped train at reasonable costs? We have answers. And they’re not always pretty. Read full article: https://lnkd.in/eiQBVW2D Why should you care? Because #Matter Protocol could be the tech revolution we’ve been waiting for - or a colossal disappointment. Either way, you deserve to know the truth. #SirinSoftware
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Come to the Supermicro Open Storage Summit to learn how NVIDIA and Supermicro are creating new ways for organizations to work. With NVIDIA DPUs joining CPUs and GPUs as the third pillar of computing, we're unlocking unprecedented application performance and speed. Learn how: https://nvda.ws/448Bv7H
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Come to the Supermicro Open Storage Summit to learn how NVIDIA and Supermicro are creating new ways for organizations to work. With NVIDIA DPUs joining CPUs and GPUs as the third pillar of computing, we're unlocking unprecedented application performance and speed. Learn how: https://nvda.ws/448Bv7H
Open Storage Summit 2023
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Come to the Supermicro Open Storage Summit to learn how NVIDIA and Supermicro are creating new ways for organizations to work. With NVIDIA DPUs joining CPUs and GPUs as the third pillar of computing, we're unlocking unprecedented application performance and speed. Learn how: https://nvda.ws/448Bv7H
Open Storage Summit 2023
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Come to the Supermicro Open Storage Summit to learn how NVIDIA and Supermicro are creating new ways for organizations to work. With NVIDIA DPUs joining CPUs and GPUs as the third pillar of computing, we're unlocking unprecedented application performance and speed. Learn how: https://nvda.ws/448Bv7H
Open Storage Summit 2023
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Come to the Supermicro Open Storage Summit to learn how NVIDIA and Supermicro are creating new ways for organizations to work. With NVIDIA DPUs joining CPUs and GPUs as the third pillar of computing, we're unlocking unprecedented application performance and speed. Learn how: https://nvda.ws/448Bv7H
Open Storage Summit 2023
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Come to the Supermicro Open Storage Summit to learn how NVIDIA and Supermicro are creating new ways for organizations to work. With NVIDIA DPUs joining CPUs and GPUs as the third pillar of computing, we're unlocking unprecedented application performance and speed. Learn how: https://nvda.ws/448Bv7H
Open Storage Summit 2023
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Come to the Supermicro Open Storage Summit to learn how NVIDIA and Supermicro are creating new ways for organizations to work. With NVIDIA DPUs joining CPUs and GPUs as the third pillar of computing, we're unlocking unprecedented application performance and speed. Learn how: https://nvda.ws/448Bv7H
Open Storage Summit 2023
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Financial Cultural Operational and Technical Consultant - Alpha Sense Financial Consulting
1moWhen do you expect to reach parity in terms of ISO yields. Ireland is reporting Intel 4 and 3 aren't ready for primetime. TSMC is at an average weekly ISO of 670. For a 12mm x 12mm die this translates to 120% more good die on 3nm. The process isn't well characterized and the TSMC folks say your at a local maximum They've comprehensively examined the response surface and feel they are near a global maximum and have better control of the E-test parameter and each layers critical dimensions have 6 sigma control. We reckon that you're at 4.2 for the 3nm, and haven't optimized the target CD's especially on the critical gate layer and ultra fine pitch metal layers. Also registration between layers with stacked tolerance is a big limiting factor to better CD's. What's the recovery plan to get economicallly viable utilization and yields. With equipment utilization at sub 50% and yields less than 45% your true over all productivity is less than 25%. TSMC has 90% utilization and approximately 85% yields they are realizing roughly 80% productivity in their 3nm factories. Our models show Foundry losses growing 12% Moreover your transistor density on 3nm is 25 to 30% lower and consumes 2.2x the power/transistor.