Kamil Kanas’ Post

🔓 Unlock the potential of SimScale's electromagnetics simulation tool across diverse industries like automotive, aerospace, consumer products, healthcare, and electronics. Engineers can easily simulate, visualize, and optimize designs in areas such as DC machines, electromagnetic brakes, MEMS, sensors, and more. Learn more: https://hubs.la/Q02h1Qzy0 #electromagnetics #electronics #simulation

#100daysamplifierdesign Day 14 CS amplifier circuit simulation with LTSPICE CS Amplifier with Resistor Load In the simulation of a common source amplifier with a resistive load, the voltage gain was determined to be approximately 20. The gain is calculated as minus GM times Rd, where GM is the transconductance and Rd is the drain resistance. The parameters were set accordingly, including a fixed Rd value of 10 kilo ohms, and the gain was verified through transient and AC analysis simulations. There are Trade-offs for increasing the gain,such as adjusting GM or Rd, but limitations were observed due to decreasing output swing with larger Rd values. To achieve higher gains beyond 30-40 decibels, alternative amplifier topologies like using an active load is suggested for future exploration. CS Amplifier with Current-Source load In the simulation of a common source amplifier with a current source load, the goal was to achieve gain independent of the drain resistance (Rd) by replacing it with a current source. The idea was to utilize a MOSFET in saturation region acting as a current source to maintain a high gain without affecting the output voltage swing. The gain equation was derived as minus GMn, where GMn represents the transconductance of the NMOS transistor. Parameters such as W/L ratios, process parameters, and bias voltages were carefully selected to achieve the desired gain. Through simulation in LTspice, a significant increase in gain was observed compared to the previous resistor load configuration, reaching approximately 136. However, managing the bias voltage for the PMOS transistor posed challenges, as even small variations resulted in significant changes in gain. This difficulty in maintaining the bias voltage highlights a drawback of this topology. CS Amplifier with Diode-Connected Load In the simulation, a CS amplifier with a diode-connected load was analyzed. The diode-connected load eliminates the need for biasing, simplifying the circuit design. The gain of the amplifier was found to be proportional to the square root of the aspect ratios of the transistors. However, increasing the aspect ratio beyond a certain point led to diminishing returns due to the device entering the triode region. Adjustments to the biasing voltage were made to ensure the transistor remained in the saturation region, thus maintaining the desired gain. Despite the advantages of simplified biasing, increasing the aspect ratio also resulted in slower device performance, limiting the practical utility of this configuration for single-stage amplifiers. Nevertheless, the cascading potential of multiple stages remains a promising avenue for achieving higher overall gain.

Accelerating Semiconductor IC design using Ansys simulation Importance of using simulation to address key challenges in semiconductor integrated-circuit (IC) design. Vinayakam Subramanian Ansys Ansys Semiconductors #icdesign #semiconductors #semiconductor #chipdesign #Ansys #simulation #engineering #chiplets #chips #integratedcircuits #multiphysics #powerintegrity #signalintegrity #reliability

Semiconductor chip packages are getting more complex every day, and this complexity brings more challenges in terms of performance, integration and reliability. The shift towards more sustainable products and an increase of demand outside of the classical applications push us to develop new workflows capable of addressing the most common issues in these fields. This LIVE webinar will dive into the latest #SIMULIA solutions for #semiconductors, highlighting workflows such as ECAD Translation into CAE, PCB level modeling, Signal Integrity, Power Integrity and more. I hope you'll join us!

Read what a semiconductor industry customer says about Siemens Embeddable BCI-ROM technology and learn how it enhances thermal design collaboration in the electronics supply chain. Read the news here: https://sie.ag/5teonY Semiconductor manufacturers can now share 3D simulation thermal models easily with their clients, with confidence that internal geometry and details of the IC package that are IP sensitive are protected. This new reduced order modeling approach enables easier, accurate downstream thermal management design studies to be performed by engineers, leveraging computational fluid dynamics (CFD) software Simcenter Flotherm, as modern complex multi-die IC packages are integrated into a product. #Semiconductor #Electronics #ThermalAnalysis

Read what a semiconductor industry customer says about Siemens Embeddable BCI-ROM technology and learn how it enhances thermal design collaboration in the electronics supply chain. Read the news here: https://sie.ag/5teonY Semiconductor manufacturers can now share 3D simulation thermal models easily with their clients, with confidence that internal geometry and details of the IC package that are IP sensitive are protected. This new reduced order modeling approach enables easier, accurate downstream thermal management design studies to be performed by engineers, leveraging computational fluid dynamics (CFD) software Simcenter Flotherm, as modern complex multi-die IC packages are integrated into a product. #Semiconductor #Electronics #ThermalAnalysis

Read what a semiconductor industry customer says about Siemens Embeddable BCI-ROM technology and learn how it enhances thermal design collaboration in the electronics supply chain. Read the news here: https://sie.ag/5teonY Semiconductor manufacturers can now share 3D simulation thermal models easily with their clients, with confidence that internal geometry and details of the IC package that are IP sensitive are protected. This new reduced order modeling approach enables easier, accurate downstream thermal management design studies to be performed by engineers, leveraging computational fluid dynamics (CFD) software Simcenter Flotherm, as modern complex multi-die IC packages are integrated into a product. #Semiconductor #Electronics #ThermalAnalysis

Read what a semiconductor industry customer says about Siemens Embeddable BCI-ROM technology and learn how it enhances thermal design collaboration in the electronics supply chain. Read the news here: https://sie.ag/5teonY Semiconductor manufacturers can now share 3D simulation thermal models easily with their clients, with confidence that internal geometry and details of the IC package that are IP sensitive are protected. This new reduced order modeling approach enables easier, accurate downstream thermal management design studies to be performed by engineers, leveraging computational fluid dynamics (CFD) software Simcenter Flotherm, as modern complex multi-die IC packages are integrated into a product. #Semiconductor #Electronics #ThermalAnalysis

Read what a semiconductor industry customer says about Siemens Embeddable BCI-ROM technology and learn how it enhances thermal design collaboration in the electronics supply chain. Read the news here: https://sie.ag/5teonY Semiconductor manufacturers can now share 3D simulation thermal models easily with their clients, with confidence that internal geometry and details of the IC package that are IP sensitive are protected. This new reduced order modeling approach enables easier, accurate downstream thermal management design studies to be performed by engineers, leveraging computational fluid dynamics (CFD) software Simcenter Flotherm, as modern complex multi-die IC packages are integrated into a product. #Semiconductor #Electronics #ThermalAnalysis