Nano Dimension’s Post

𝗖𝗼𝗺𝗯𝗶𝗻𝗶𝗻𝗴 𝗼𝗻𝗲- 𝗮𝗻𝗱 𝗺𝘂𝗹𝘁𝗶𝗽𝗵𝗼𝘁𝗼𝗻 𝗱𝗶𝗿𝗲𝗰𝘁 𝗹𝗮𝘀𝗲𝗿 𝘄𝗿𝗶𝘁𝗶𝗻𝗴 for high throughput and resolution. Despite its unique capacity for three-dimensional fabrication with minimal feature sizes below 100 nm, achieving high throughput with Two-Photon Polymerization (TPP) remains a challenge, when compared to established direct laser writing systems. To unlock the full potential of TPP, we propose a novel approach: the integration of standard lithography techniques with multiphoton lithography. Observe our research results first-hand at the SPIE Advanced Lithography + Patterning (booth 641!). A talk on combined exposures will be held by technical expert Willi Mantei, further talks are provided by our technical experts Matthias Wahl and Jana Chaaban. More info on the 2024 SPIE Advanced Litho program: https://lnkd.in/ehm2KqkR Pictured here are two microlens arrays. The 19x19 microlenses and 14x14 inverted microlenses were patterned with the MPO 100, our TPP-Multi-User Tool for 3D Lithography and 3D Microprinting. The frame around it was exposed using the MLA 150 Maskless Aligner. Learn more about both tools on heidelberg-instruments.com. #3Dmicrofabrication #3Dmicroprinting #onephoton #twophoton #2PP #TPP #microfabrication, #microstructures, #nanoscale, #nanotechnology #highresolution #throughput #laserlithography SPIE, the international society for optics and photonics Optica EPIC - EUROPEAN PHOTONICS INDUSTRY CONSORTIUM

Pictured here are two microlens arrays. The 19x19 microlenses and 14x14 inverted microlenses were patterned with the MPO 100, our TPP-Multi-User Tool for 3D Lithography and 3D Microprinting. The frame around it was exposed using the MLA 150 Maskless Aligner. Learn more about both tools on labindiainstruments.com #LabindiaInstruments #Labindia #LabEfficiency #laboratoryequipment  #InnovativeLabSolutions #TechRevolutionLab #laboratory #LabResearchAdvancements #LabindiaTrustedProducts #3Dmicrofabrication #3Dmicroprinting #onephoton #twophoton #2PP #TPP #microfabrication, #microstructures, #nanoscale, #nanotechnology #highresolution #throughput #laserlithography #InnovateWithLabindia #India #Labindia

Despite its unique capacity for three-dimensional fabrication with minimal feature sizes below 100 nm, achieving high throughput with Two-Photon Polymerization (TPP) remains a challenge, when compared to established direct laser writing systems. To unlock the full potential of TPP, Heidelberg Instruments propose a novel approach: the integration of standard lithography techniques with multiphoton lithography.

Integration of standard #lithography techniques with #multiphoton lithography

1zu1 Prototypen GmbH & Co KG chose a #CT solution because they required accurate measurements of whole 3D components. This includes internal features that are not accessible by tactile and optical methods. After an extensive selection process, they chose the WENZEL exaCT L Computed Tomography System due to its guaranteed measurement #accuracy, impressive surface rendering, and fast scanning capabilities. This investment in the CT system improves the development process and also results in time and cost savings for customers. With a focus on additive manufacturing and other advanced production methods, 1zu1 is at the forefront of technological innovation, ensuring #quality and #reliability throughout the manufacturing process. WENZEL’s exaCT series: EXACTLY ACCURATE😎 Read more about their journey and the impact of our exaCT Technology: https://lnkd.in/eAWxCVEk #ComputedTomography #3DPrinting #MetrologyWorld 🌐

193 Nanometer Immersion Lithography Explained 🐭 While Extreme Ultraviolet (EUV) lithography often steals the spotlight, let’s not forget the incredible impact of 193 nanometer immersion lithography. 🌊 Here’s a quick comparison to highlight its significance: Resolution: Immersion lithography increases the numerical aperture to 1.35 or higher. EUV takes a different approach, using a shorter wavelength of 13.5 nm for higher resolution. 🔍 Productivity: Immersion lithography boosts throughput, processing more wafers per hour. EUV is still catching up in terms of speed and efficiency. ⏱️ Cost: Immersion lithography is more cost-effective and has a well-established infrastructure. EUV requires significant investment and is still in the early stages of widespread adoption. 💰 💡 Why Should You Care? 💡 Proven Technology: Immersion lithography has been a reliable workhorse since the early 2000s, driving advancements in semiconductor manufacturing. 🏭 Innovative Fluids: The use of ultrapure water and other advanced fluids ensures minimal contamination and optimal performance. 💧 Cutting-Edge Optics: Companies like ZEISS Semiconductor Manufacturing Technology have developed new optics systems to support this technology, combining lenses and mirrors for better performance. 🔭 #Semiconductors #Lithography #Innovation #Technology #Productivity

Let us introduce our core technologies: Deep Ultraviolet Lithography SiPhotonIC Technologies offers DUV lithography to scale your project volumes up for a variety of materials and platforms: SOI, LNOI, SiN and many other combinations. We use the Canon FPA-3000 EX6 DUV stepper lithography tool that can transfer patterns with a resolution down to 220-200 nm. It is supported by fully automated robotic spin coaters and mask aligners and can deliver throughput of >50 wafers per hour. This translates to: 👉 very fast patterning and in volume 👉 volumes from few design copies up to several wafers 👉 big images without stitching SiPhotonIC Technologies offers you an established pathway to quickly verify your components first with E-beam lithography and then transfer them to DUV for volume production or choose DUV as your straightforward lithography option from the beggining. Let us know your lithography needs at [email protected]! We are your partner in rapid photonic prototyping. #siliconphotonics #photonicprototyping #rapidphotonicprototyping #SOIprototyping #DUVlithography #EBLlithography

In electron beam lithography (#EBL), patterns larger than a tool's deflection field are divided into multiple fields. These fields must be aligned (and stitched) to each other and should be the correct size and shape. As mentioned last week, the order in which the fields and shapes within the fields are exposed can ultimately impact the lithography fidelity of your pattern. Tool vendors use different calibration routines to ensure proper field shape and stitching. Be sure you understand how to optimize your fields, field ordering, and within-field exposure of shapes from your vendor. 🌎 Register for MAEBL 2024 to learn more about best practices in electron beam lithography: https://www.maebl.org #nano #nanotechnology #nanofabrication #chips #chipsact #ebeam #ebl #electron #workforcedevelopment #semicon #semiconductor #semiconductors #lithography #nanolithography #litho

Great graphical representation of the EUV and other forms of lithography invoked in the semiconductor process

EUV lithography uses a high energy laser to turn a droplet of molten tin into plasma, emitting extreme ultraviolet light that is focused into a beam to print the complex design of circuitry onto a silicon wafer with atomic precision. The dimensions of the chip are achieved at a nanometer level, highlighting the precision and miniaturization involved in the process