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We’re thrilled to share the latest insights from Electronic Design on how Ansys is pushing the boundaries of semiconductor technology! 🚀 In a recent article, "Ansys Adds Another Dimension to the 3D Chip Design Process", discover how #Ansys is revolutionizing the way we approach 3D chip design with NVIDIA Omniverse. 🔍 Highlights from the Article: 💡 The advantages of 3D digital twins when it comes to building chiplet-based designs. 💡 The power-, heat-, and noise-related challenges that chiplets present to engineers. 💡 New capabilities of Ansys’s multiphysics software when connected to Omniverse. This new development is a game-changer for engineers and designers working on the next generation of #semiconductor technologies. Don’t miss out on the chance to see how Ansys is leading the way in 3D chip design innovation! 👉 Read the Full Article: https://ansys.me/3ymmYvn #NVIDIA #multipyhiscs

There's a lot to be said for perfect packages of software running on dedicated hardware. Take Macs, which unlike PCs (and their endless driver issues and incompatibities), have always been packaged as hyper-optimized unions of hardware and software. You can't add your own components and you can't (officially) run MacOS on non-Apple hardware because if you could, that assured compatibility and optimization would go out the window. The pocket-sized AI device #RabbitR1 is another great new example of software and hardware delivered as a single package. The jury's out on how useful it'll actually be, but I commend Rabbit for trying to do something new. And at the very non-pocket-sized end of the spectrum you have the #MillenniumM1, a new supercomputing behemoth from Cadence Design Systems. Dedicated #HPC hardware, optimized to run some very smart, very complex multiphysics simulation software indeed. Good things come in neat HW/SW packages.

It's taken a few years to come, and like many photonics things, it will likely take a few more to mature... But it's here to stay... Cadence unveils a new silicon photonics flow to support TSMC’s Compact Universal Photonic Engine (COUPE) technology: Cadence and TSMC collaborate to develop a design flow for the COUPE 3D photonics process that features the Cadence Integrity 3D-IC platform. The TSMC COUPE technology enables the heterogeneous integration of photonics ICs with electrical ICs while minimizing coupling losses. The developing design flow from Cadence will support TSMC’s COUPE technology and includes the Cadence Spectre X Simulator, Virtuoso Studio, EMX 3D Planar Solver and Pegasus Verification System, enabling joint customers to meet the most demanding system requirements and pave the way for high-performance computing applications. (Read the whole PR below...) https://lnkd.in/gwAaXjMd

Cadence Design Systems today announced Millennium Enterprise Multiphysics Platform Tthe industry’s first hardware/software (HW/SW) accelerated digital twin solution for multiphysics system design and analysis. 𝐊𝐄𝐘 𝐏𝐎𝐈𝐍𝐓𝐒 ✔️ Revolutionary dedicated HW/SW acceleration platform leverages GPU and CPU computing and proprietary software algorithms to deliver up to 100X design impact through accuracy, speed and scale ✔️ GPU-resident solvers dramatically improve the energy efficiency of simulation by 20X over traditional HPC ✔️ Digital twin, AI and HPC technology combine to provide the best multiphysics simulation solution for automotive, A&D, energy, turbomachinery and data center markets ✔️ Innovative generative AI technology further accelerates design and analysis exploration, enabling optimal system solutions through superior design insight • Available for CFD multiphysics analysis today in the cloud or as an on-premises appliance to accommodate customers’ business requirements #cadence #multiphysics #digitaltwin https://lnkd.in/eN-m_b9j

The Siemens EDA tools are ready for Cryogenic CMOS design using Semiwise cryogenic PDK strength compact models.   According to a recent Siemens press release the Siemens’ Analog FastSPICE platform, powered by technology from Siemens’ Analog FastSPICE eXTreme™ platform and the Siemens’ Solido Design Environment were adopted for using the unique Semiwise PDK strength cryogenic compact models. They will be initially deployed by Surecore to develop cryogenic CMOS IP in the framework of the £6.5M Innovate UK Cryogenic CMOS project.   https://lnkd.in/eZcGZ44t   Semiwise has developed unique design strength PDK cryogenic compact models for the GLOBAFOUNDRY 22FDX process. The models cover all aspects of the room temperature 22FDX PDK models including corners, statistics, layout effects. They can be used in the standard analogue and digital CMOS design flows for both design and verification at sign-off. The models are the only PDK strength cryogenic compact models commercially available at this point of time.   The models are develop using a patented Semiwise technology based on single wafer measurements and comprehensive use of TCAD simulations. The measurements are performed by Insize. The TCAD simulations are performed with Sentaurus process (Synopsys) and the compact model extraction is performed with the TCAD-to SPICE Synospsy tool chain.   https://lnkd.in/eTybYJV3   The applications of the cryogenic models and design tools is in the development of CMOS circuits and chip for quantum computing and for cold (77K) CMOS aiming to reduce the power consumption of large data centres.

Amazing innovation in chip design from Siemens who have introduced a multiphysics simulation for 3D IC thermal analysis, a current gap in 3D IC design verification. Chiplet thermal analysis can help improve the design of the chiplets, packaging, PCB, cooling system, overall setup, and the final product. Learn more over on Forbes 👇 #AI #ChipDesign

🔓 Unlock the potential of SimScale's electromagnetics simulation tool across diverse industries like automotive, aerospace, consumer products, healthcare, and electronics. Engineers can easily simulate, visualize, and optimize designs in areas such as DC machines, electromagnetic brakes, MEMS, sensors, and more. Learn more: https://hubs.la/Q02h1Qzy0 #electromagnetics #electronics #simulation

𝗔𝗻𝘀𝘆𝘀, 𝗡𝗩𝗜𝗗𝗜𝗔, 𝗮𝗻𝗱 𝗦𝘂𝗽𝗲𝗿𝗠𝗶𝗰𝗿𝗼 𝗧𝗲𝗮𝗺 𝗨𝗽 𝗼𝗻 𝗦𝗶𝗺𝘂𝗹𝗮𝘁𝗶𝗼𝗻 𝗔𝗰𝗰𝗲𝗹𝗲𝗿𝗮𝘁𝗼𝗿 🚀🔧 Ansys, a leader in multi-physics simulation software, has announced partnership with NVIDIA and Supermicro to revolutionise simulation technology. 𝗔𝗰𝗰𝗲𝗹𝗲𝗿𝗮𝘁𝗶𝗻𝗴 𝗦𝗶𝗺𝘂𝗹𝗮𝘁𝗶𝗼𝗻 𝗦𝗽𝗲𝗲𝗱𝘀 ⏩⚡ The collaboration introduces a turnkey hardware solution that accelerates complex model simulations by up to 1,600x, significantly reducing time-to-market and enhancing efficiency across various industries. This innovation has practical applications in automotive crash testing, aerospace turbine engine design, telecommunications network placement, and pharmaceutical development. 𝗜𝗻𝗻𝗼𝘃𝗮𝘁𝗶𝗼𝗻 𝗶𝗻 𝗔𝗰𝘁𝗶𝗼𝗻 💡🔍 Ansys, NVIDIA, and SuperMicro have developed a flexible, easily integrable solution, replacing CPUs with NVIDIA GPUs to optimise performance. Read more at https://lnkd.in/e-mCvMCx #technews #simulation #nvidia #innovation #engineering #ai

Collaboration optimizes Ansys solutions and AI capabilities, boosts simulation speeds up to 1,600x.  www.ansys.com 5G Antenna simulation using Ansys HFSS to accurately assess performance impact of antenna placement. Ansys is collaborating with Supermicro and NVIDIA to deliver turnkey hardware, enabling unmatched acceleration for Ansys multiphysics simulation solutions. By leveraging the combined power of industry-leading hardware and software, Ansys customers can solve larger, more complex models up to 1,600x faster. When running on Supermicro and NVIDIA technology, Ansys solutions reduce time-to-market and facilitate more robust design exploration for a wide range of applications, including automotive crash testing and external aerodynamics, aerospace gas turbine engines, 5G/6G antennas, and biopharmaceutical development. Getting the most out of multiphysics simulation involves integrating different types of physics solvers with a range of hardware choices, each offering unique pe

Great article by Semiconductor Engineering's Ann Mutschler, "3D-IC Intensifies Demand For Multi-Physics Simulation," on how EDA and IP touch and interact with other areas, specifically the multi-physics domain. New challenges are driving big changes throughout the design flow, from tools to job responsibilities. "Before, it was just reading data sheets. Now, I want to figure out in an analog simulator how the eye diagrams are forming in my transmission from that end to the other end. And for interoperability checking, I want to simulate that Vendor A PHY can talk to Vendor B PHY, which is what we are trying to do in the context of chiplet activities if we ever want to get an open ecosystem. On top of that, you layer things. you create this amount of data traffic, so now look into the thermal aspects, look into the EM aspects depending on which substrate you’re on. You’re adding a whole stack of new complexities, which you can try to simulate all together, even though that is unrealistic." Also part of the discussion were Marc Swinnen of  Ansys, Ashish Darbari of Axiomise, Stephen Slater of Keysight Technologies, Sutirtha Kabir of Synopsys Inc, Alphawave Semi's Letizia Giuliano, as well as John Ferguson and Joseph C. Davis of Siemens Digital Industries Software. #Arteris #NetworkOnChip #SoCIntegrationAutomation #chiplet https://bit.ly/4cyTXMs