Ansys Structures’ Post

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The Ansys Sherlock parts library helps users build their PCB models with high levels of accuracy for structural simulation analysis, including random and harmonic vibration analysis, solder fatigue analysis, plated through hole (PTH) fatigue analysis and more. To access the database navigate to the customer portal > downloads > current release > add-on packages > Sherlock libraries.

Free surface flow with strong surface tension effect and wall adhesion forces is very common in many manufacturing processes, e.g. reflow soldering in IC packaging. In this amination, a cubic droplet deforms under the surface tension with a small contact angle on the solid wall. The liquid droplet is simulated by LS-DYNA ISPG (Incompressible Smoothed Particle Galerkin) method, and it employs a fully implicit Lagrangian particle-based solution of the Navier-Stokes equation for free surface modeling and can be easily coupled with structural analysis in one solver. Typical ISPG applications include: 1) large-scale reflow soldering with thousands of solder balls. With PCB warpage effect, solder defects, e.g. solder bridging can be predicted. 2) adhesive flow, e.g. adhesive forging, metal hemming, structural adhesive bonding, etc. #lsdyna #ANSYS

Ansys Mechanical serves as your one-stop shop for comprehensive engineering solutions. This video highlights the seamless collaboration between Ansys Mechanical and HFSS for advanced wire crimping analysis. 1) All-in-One Solution: Ansys Mechanical integrates effortlessly with HFSS, providing a unified platform for both mechanical and electromagnetic simulations. 2) Streamlined Workflow: A seamless design process with synchronized data and results across Ansys products, eliminating the need for multiple tools and complex integrations. 3) Enhanced Reliability: Simulate both the mechanical stress and electrical performance of wire crimps in one comprehensive environment, ensuring robust and reliable connections. 4) Optimized Designs: Leverage the combined strengths of Ansys Mechanical and HFSS to optimize your wire crimp designs, improving performance and ensuring compliance with industry standards. 54) Time and Cost Savings: Reduce the need for physical prototypes and extensive testing with advanced virtual analysis, all within a single platform. #StructuralEngineering #Simulation #AnsysMechanical #HFSS #EngineeringInnovation

The animation below unveils the stresses encountered by a Ball-Grid Array (BGA) during a drop-test, spotlighting LS-DYNA’s multi-scale simulation prowess. As solder joints are often the first to fail in drop-tests, accurately predicting their behavior is paramount. LS-DYNA transcends traditional simulation barriers with multi-scale simulation, offering a nuanced view into both macro and meso-scale geometric details, thus significantly enhancing the reliability analysis in drop-tests. The synchronized two-scale co-simulation technique allows for a seamless, concurrent analysis, making the prediction of solder joint failures more accurate and efficient. Uncover how this breakthrough accelerates the pace towards robust electronics design.

System-Level analyses using Ansys Sherlock and Ansys Mechanical allow users to assess the reliability of multi-board assemblies within an enclosure subjected to Random Vibration, Mechanical Shock and other loads.

Have you heard of the famous Tacoma Narrows Bridge accident in 1940? The failure was primarily due to aeroelastic flutter, a phenomenon where wind-induced oscillations become self-amplifying. The bridge began to sway and twist in response to the wind, which caused resonance at its natural frequency. This led to increasingly violent oscillations, ultimately causing the bridge to break apart and collapse. If Ansys Mechanical had been used during the creation of the bridge, they could have utlized Fluid-Structure Interaction (FSI) in Mechanical to simulate and analyze the complex interactions between fluid flows and structural components. FSI in bridge design and engineering can predict how wind forces interact with the bridge structure, helping engineers to design shapes and structures that minimize adverse effects like oscillations and vibrations. #structuralengineering #innovation #ANSYS #Mechanicalengineering

Ansys Sherlock can quickly generate high-fidelity models of Chip, Die, and Package-Level components! Users can leverage leading technologies such as Trace Modeling, Trace Mapping, and Trace Reinforcements to model trace and via details. The models can then be exported to Ansys Mechanical to evaluate failure modes such as Trace Cracking, Delamination, and many others.

Join our upcoming joint webinar: "Additive Manufacturing: How to Scale Up with Design for AM" Scale up the use of Additive Manufacturing (AM) in your business in a smart, fast, and cost-efficient manner. Sign up for the webinar we’re joint hosting with Ansys and Dimanex on June 20th. In this webinar, you’ll discover everything about: 1) Quick supply chain analytics 2) (Re)designing parts for Additive Manufacturing (DfAM) 3) AM engineering use cases By the end of the session, you'll know exactly which steps to take next in your AM journey. #AdditiveManufacturing #DfAM #Webinar #Ansys #Engineering https://ansys.me/4coUTC6