The new 2023-2024 Chandra Family Department of Electrical and Computer Engineering (Texas ECE - UT Austin ECE) magazine is here! Learn about the semiconductor boom, quantumania, and the future of cybersecurity. https://adobe.ly/4aNV2iw #TexasEngineering #WhatStartsHere Cockrell School of Engineering, The University of Texas at Austin
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The Future of Displays: Silicon Chips? 🖥 By Dr Daniel Lepkowski (IC Design Engineer) Excerpt below. Please visit www.nscinnovation.com/blog for more Today we’re coming to an interesting juncture in the world of displays. After years of the display roadmap following “bigger is better”, they’re now getting smaller, much smaller. While flat panel displays became better, brighter, and cheaper, one aspect persisted: the displays were always intended to be viewed directly by the human eye. This put a floor on the size of the pixel that made sense to produce. While that pixel is small on the scale of a large device like a TV or phone, pixels in future AR display engines will be much smaller. Making this huge jump without any driving force for intermediate improvements seems unlikely. Clearly, the incumbent approach (i.e. flat panel displays) isn’t going to work. So, we turn to the only other existing technology for manufacturing integrated electronic systems: Silicon integrated circuits.
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We’re excited to be a sponsor of this weekend’s American Society for Engineering Education’s (ASEE) 2024 PreK-12 Engineering Education Teacher Conference and workshop — held this Saturday at Maseeh College of Engineering and Computer Science, Portland State University. And we’re equally excited about the keynote speakers: 💡 Christine Cunningham, education specialist and Senior Vice President for STEM Learning at the Museum of Science in Boston, Massachusetts, who led the creation of a Model for Equity-Oriented Engineering to create the next generation of diverse engineers and problem-solvers. 💡 Lesly Rojas, currently studying Electrical and Computer Engineering and Computer Science at Oregon State University, and a veteran student inventor from the Lemelson-MIT Program's InventTeams and Oregon MESA. There will also be 24 hands-on engineering education sessions for beginners and experienced educators alike, designed to increase and diversify access to STEM. The Lemelson Foundation will be presenting two of those sessions along with InventEd and The Ohio State University's Libby Grace focused on invention education — “Empowering All Students through Invention Education: Supercharging STEM with Real World Problem Solving.” The conference is in partnership with ASEECP12, Portland Metro STEM Partnership, Oregon MESA, and Portland State University. Read more about the workshop here, and about The Lemelson Foundation’s commitment to supporting educators to deliver STEM, engineering, and invention education to all students: https://lnkd.in/eTJy3vnM #STEMEducation #STEM #STEMlearning #invention #inventioneducation #EngineeringEducation #ProfessionalDevelopment #sustainability #invention #educators #DiversityInSTEM #DEI
The Oregonian: Free workshop for Portland teachers brings hands-on learning and fun
oregonlive.com
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Why use an Integrated Design Approach? 📂 By Dr. Daniel Lepkowski (IC Design Engineer) and Dr. SIAU BEN CHIAH (Design Kit Manager) Excerpt below. Please visit www.nscinnovation.com/blog for more In prior blog posts, we’ve talked about why the future of compound semiconductor technologies, especially those that can benefit from CMOS integration must be made via CMOS end-to-end manufacturing. Solutions that attempt to create their own supply chain will struggle to scale to the massive volumes required by consumer technologies. Keeping with our core tenet that CMOS end-to-end manufacturing is a necessity, nsc’s technology and the way we design circuits and systems are adapted to be closely in line with the CMOS design process to maintain compatibility with the CMOS foundry infrastructure. By doing so, we have realized key advantages of the integrated design process beyond the immediate advantages of CMOS and III-V alone. In other words, it is a case where the whole is indeed greater than the sum of its parts.
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Interesting article!
The ghosts of ‘Wintel’: What leaders can learn from the diverging paths that made Microsoft a $3 trillion powerhouse and flatlined Intel
finance.yahoo.com
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Check out my blog post #newblogpost
Presenting at the 26th Annual Colloquium on International Engineering Education in Washington, DC.
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Apple Vision Pro: Gaining Insights into the Future 🚀 By Dr. Eugene Fitzgerald (Co-Founder and Chairman) Excerpt below. Please visit www.nscinnovation.com/blog for more Are phones and watches the ultimate outcome of miniaturization? Will we invent technologies that bring us even closer to our senses and overcome limitations? The Apple Vision Pro offers a potential path to that future. Undoubtedly, in ten years, we will be astonished at how bulky these initial devices were. But for now, the Apple Vision Pro shows us how we can free ourselves from traditional devices. How do we move from the larger Apple Vision Pro to lightweight systems integrated into regular eyeglasses? New chips are being developed to make this possible. How can we eliminate the need for extra battery packs to power AR/VR systems? Once again, new chips are being developed for that purpose. Why are significant chip innovations vital for this future? The answer lies in the limitations humans faced in the past and the ones we face today. In the past, Moore's Law played a significant role in bringing compact computing and memory to our devices. While silicon technology has primarily focused on computing and memory, leading to extensive chip manufacturing infrastructure and technological progress, there are aspects of AR/VR systems that cannot currently be fulfilled by traditional silicon chips. For example, silicon chips cannot emit light. Silicon chips also struggle to meet the frequency and power requirements of high-bandwidth wireless systems. These interfaces between humans and machines still require an integrated circuit-based solution due to strict requirements on performance, manufacturability, and size, which can be best served by certain aspects of silicon chip technology. Therefore, the breakthrough needed for new chips to address the limitations of traditional silicon chips will be the key element driving growth in the semiconductor industry in the coming decades. This "New Silicon" industry will incorporate III-V semiconductors, which are better suited for creating single-chip microdisplays and efficient high-bandwidth 5G/6G technologies. nsc is paving the way for this. As nsc continues to develop these new silicon chips, a lighter and brighter future without bulky devices awaits us!
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Media Artist / Technologist | Building Digital & Physical Experiences | Researching Human Behavior via Code & Engineering | Represented by Kei London Fine Art Agency
My artistic pursuits revolve around the intriguing theme of “The Illusory Perception of Reality". The following article which I will continually update and refine, explores my perspective on how we perceive and interpret the world around us. https://lnkd.in/d8EeEJ2X
What is Perception and Reality: From 6 Constructive Perspectives
https://konnekt.gr
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Silicon Valley Fellow '24| MIT TEX-E Fellow | MS ECE @ UT Austin | Power Electronics and Electric Vehicles | Ex Bajaj Auto Limited | Circle Leader, Lean In | NIT Tiruchirapalli '20
6moDebjyoti Chatterjee I see you in there!