Tda 7053
Tda 7053
Tda 7053
DATA SHEET
Philips Semiconductors
Product specication
TDA7053
The TDA7053 is an integrated class-B stereo power amplifier in a 16-lead dual-in-line (DIL) plastic package. The device, consisting of two BTL amplifiers, is primarily developed for portable audio applications but may also be used in mains-fed applications. Features No external components No switch-ON/OFF clicks Good overall stability Low power consumption Short-circuit-proof. QUICK REFERENCE DATA PARAMETER Supply voltage range Total quiescent current Output power Internal voltage gain Total harmonic distortion PO = 0.1 W RL = RL = 8 ; VP = 6 V PO Gv THD 38 1.2 39 0.2 40 1.0 W dB % CONDITIONS VP Itot SYMBOL 3 MIN. 6 9 TYP. MAX. 18 16 V mA UNIT
PACKAGE OUTLINE 16-lead DIL; plastic (SOT38); SOT38-1; 1996 July 24.
February 1994
Philips Semiconductors
Product specication
TDA7053
February 1994
Philips Semiconductors
Product specication
TDA7053
The information contained within the parentheses refer to the polarity of the loudspeaker terminal to which the output must be connected. FUNCTIONAL DESCRIPTION The TDA7053 is a stereo output amplifier, with an internal gain of 39 dB, which is primarily for use in portable audio applications but may also be used in mains-fed applications. The current trends in portable audio application design is to reduce the number of batteries which results in a reduction of output power when using conventional output stages. The TDA7053 overcomes this problem by using the Bridge-Tied-Load (BTL) principle and is capable of delivering 1.2 W into an 8 load (VP = 6 V). The load can be short-circuited under all input conditions.
February 1994
Philips Semiconductors
Product specication
TDA7053
MAX. V A C C
UNIT
THERMAL RESISTANCE From junction to ambient Power dissipation Assuming: VP = 6 V and RL = 8 : The maximum sinewave dissipation is 1.8 W, therefore Tamb(max.) = 150 (50 x 1.8) = 60 C. Rth j-a 50 K/W
February 1994
Philips Semiconductors
Product specication
TDA7053
UNIT V mA nA dB k mV mV V V W % dB dB dB kHz
2. Ripple rejection measured at the output with RS = 0 and f = 100 Hz to 10 kHz. The ripple voltage (200 mV) is applied to the positive supply rail. 3. RS = 5 k. 4. The noise output voltage (RMS value) is measured with RS = 5 k, unweighted and a bandwidth of 60 Hz to 15 kHz. 5. The noise output voltage (RMS value) is measured with RS = 0 and f = 500 kHz with 5 kHz bandwidth. If RL = 8 and LL = 200 H the noise output current is only 100 nA.
February 1994
Philips Semiconductors
Product specication
TDA7053
Fig.4 Output power as a function of voltage supply (VP); THD = 10%; f = 1 kHz; Tamb = 60 C.
February 1994
Philips Semiconductors
Product specication
TDA7053
February 1994
Philips Semiconductors
Product specication
TDA7053
February 1994
Philips Semiconductors
Product specication
TDA7053
February 1994
10
Philips Semiconductors
Product specication
TDA7053
SOT38-1
D seating plane
ME
A2
A1
c Z e b1 b 16 9 MH w M (e 1)
pin 1 index E
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION
February 1994
11
Philips Semiconductors
Product specication
TDA7053
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
February 1994
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