Electroplating of Cu-Sn Alloys and

ELECTROPLATING OF Cu-Sn ALLOYS AND
COMPOSITIONALLY MODULATED MULTILAYERS OF

Cu-Sn-Zn-Ni ALLOYS ON MILD STEEL SUBSTRATE

by

HARIYANTI

Thesis submitted in fulfillment of the
requirements for the degree of
Master of Science

June 2007

ii
ACKNOWLEDGEMENTS

I would like to take this opportunity to express my sincere gratitude and deep
appreciation to my supervisor, Dr Sunara Purwadaria, for his invaluable insight, timely
advice, and continual guidance. His scientific foresight and excellent knowledge have
been crucial to the accomplishment of this work. I consider myself privileged for having
had the opportunity to conduct research in the field of electroplating of Cu-Sn alloys
under his supervision. Sincere appreciation and gratitude is addressed to Prof. Dr.
Zainal Arifin Ahmad for allocating financial support from Malaysian Mining Chamber for
this project, and making times for constructive discussion. I extend this
acknowledgement to Assoc. Prof. Dr. Khairun Azizi Bt. Mohd. Azizli for her kind
supports as a dean at the School of Materials and Mineral Resources Engineering.

Sincere thanks are given to all dedicated technical staffs, especially Mr. Sahrul,
Ms. Fong and Mr. Rashid for their invaluable technical support, without these my
research works cannot be completed properly as scheduled.

The inspiration and support given by the fellow postgraduate students of School
of Materials and Mineral Resources Engineering have also been much appreciated.

Finally, I wish to express my deep gratitude to my parents, Moch Hari and Pudji
Utami, my older brother Sutrisno, my younger brother Sugeng and Eko Pramono for
their never-ending support, love, encouragement and always provided me the energy
and enthusiasm for completing my work. I would like to dedicate the thesis to them.

iii
TABLE OF CONTENTS

Page

ACKNOWLEDGEMENTS ii
TABLE OF CONTENTS iii
LIST OF TABLES viii
LIST OF FIGURES x
LIST OF ABBREVIATION xvi
LIST OF SYMBOLS xvii
ABSTRAK xix
ABSTRACT xxi

CHAPTER 1 : INTRODUCTION

1
1.1 Research Background

1
1.2 Research Objectives

4
1.3 Research Methodology

6
1.4 Expected Outcomes

14

CHAPTER 2 : LITERATURE REVIEW

15
2.1 Electroplating

15
2.2 Thermodynamic of Electrodeposition

19
2.2.1 Cathodic Processes

19
2.2.2 Anodic Processes

21
2.3 Kinetic and Mechanism of Electrodeposition Process

23
2.3.1 Relationship between Current and Potential

23
2.3.2 Influence of Mass Transport on Electrodic Kinetics

25
2.3.3 Hydrogen Evolution

28
2.3.4 Atomic Aspects of Electrodeposition

29

iv
2.3.5 Growth Mechanism

31
2.3.6 Development of Columnar Microstructure

35
2.4 Electrodeposition of Alloy

36
2.4.1 Structure of Electrodeposited Metal / Alloys

40
2.4.2 Properties of Electrodeposited Metal / Alloys

41
2..4.3 Corrosion of Electrodeposited Alloys

42
2.4.3.1 Corrosion of Coating-Substrate Systems

43
2.4.3.2 Electrochemical Corrosion Test

44
2.4.3.2 Dealloying

45
2.5 Electrodeposition of Copper-Tin Alloys

46
2.5.1 Cyanide System

46
2.5.2 Sulfate System

48
2.5.3 Plating Bath Selection

49
2.5.4 Properties of Copper-Tin Alloys

53
2.6 Electrodeposition of Multilayer

55
2.6.1 Compositionally Modulated Multilayer Alloy Applications

58
CHAPTER 3 : PRELIMINARY EXPERIMENT

62
3.1 Experimental Works

63
3.1.1 Preparation of Electroplating Baths

63
3.1.2 Preparation of Substrate

64
3.1.3 Polarization Measurement

65
3.1.4 Throwing Power Measurement

67
3.1.5 Study The Influence of Bath Composition and Current
Density on The Composition, and The Uniformity of Cu-Sn
Deposits

69
3.1.6 Characterization of Coating

71
3.1.6.1 Sample Preparation

71

v
3.1.6.2 Field Emission Scanning Electron Microscope
(FE-SEM)

72
3.1.6.3 Energy Dispersive X-Ray Spectroscopy

73
3.1.6.4 X-Ray Diffraction

73
3.1.6.5 Microhardness Measurement

75
3.1.6.6 Corrosion Test

77
3.2 Result and Discussion of Preliminary Experiment

78
3.2.1 Introduction

78
3.2.2 Polarization Behavior

78
3.2.3 Throwing Power

84
3.2.4 Coating Composition and Electroplating Efficiency

86
3.2.5 Phase Analysis

89
3.2.6 Physical and Chemical Properties of Deposits

94
3.2.6.1 Surface Morphology

95
3.2.6.2 Coating Thickness Uniformity

99
3.2.6.3 Coating Microhardness

101
3.2.6.4 Corrosion Resistance of Binary Cu-Sn Coatings

102
CHAPTER 4 : PRODUCTION OF QUARTENARY YELLOW AND
WHITE MIRALLOYS AND COMPOSITIONALLY MODULATED
MULTILAYERS COATINGS

107
4.1 Electroplating of Quarternary Cu-Sn-Zn-Ni Alloys 107
4.2 Electrodeposition of Compositionally Modulated Multilayers
Coatings

109
4.3 Characterization of Coating 111
4.3.1 Sample preparation

111
4.3.2 Field Emission Scanning Electron Microscope Observation
(FE-SEM)

111
4.3.3 Energy Dispersive X-Ray Spectroscopy

112
4.3.4 X-Ray Diffraction (XRD)

112

vi
4.3.5 Mechanical Properties Measurements

113
4.3.5.1 Tensile Testing

113
4.3.5.2 Microhardness Measurement 116
4.3.6 Corrosion Test

116
4.4 Results and Discussion

117
4.4.1 Introduction 117
4.4.2 Coating Composition and Cathodic Current Efficiency

117
4.4.3 Phase Analysis

121
4.4.4 Physical and Chemical Properties of Deposits

123
4.4.4.1 Surface Morphology

124
4.4.4.2 Coating Thickness Uniformity

126
4.4.4.3 Influence of the present of Zn and Ni on the
corrosion resistance of Yellow and White
Miralloys Coatings

127
4.4.5 Production of Compositionally Modulated Multilayer
Coating

129
4.4.5.1 Microhardness of Quarternary and CMM
Coatings

133
4.4.5.2 Tensile Test

136
4.4.5.3 Fracture Surface

137
CHAPTER 5 : CONCLUSION AND RECOMMENDATION FOR
FUTURE WORK

140
5.1 Conclusion

140
5.2 Recommendation for Future Work

142
REFERENCES 143

APPENDICES

148
APPENDIX A PotentialpH diagrams at 25C

149
APPENDIX B Calculation on Starting Materials Needed to Prepared
Solution

150

vii
APPENDIX C Phase Diagram

153
APPENDIX D Calculation on Cathodic Current Efficiency

154
APPENDIX E The values of interplanar spacing (d) and the
preference orientation

159
APPENDIX F Results of Vickers Microhardness for Binary,
Quarternary and Multilayer Alloy Coatings

160
APPENDIX G Results of Corrosion Rate of Binary and Quarternary
Alloy Coatings in 2 g/l H
2
SO
4
Solution

162
APPENDIX H Results of Tensile Properties of Quarternary and
Multilayer Alloy Coatings

163
LIST OF PUBLICATIONS

164

viii
LIST OF TABLES

Page

2.1 Standard reduction electrode potentials at 25 C [Gabe, 1978]

37
2.2 Vickers microhardness (HV) for selected metals [Kanani, 2004]

42
3.1 Concentration of dissolving species in the electroplating baths
used for producing binary yellow and white alloys coating

62
used for polarization measurements

65
3.3 Composition of electrolyte for throwing power measurement

68
3.4 Throwing power from bath solution IV at temperature 65 C

84
3.5 The values of interplanar spacing (d) and preference orientation
for binary alloy coatings

92
3.6 Phase identification results in selected coatings

94
3.7 Average thickness of binary copper-tin alloy coating developed at
different electroplating bath and current densities

100
3.8 Corrosion parameters of mild steel, copper and tin which are
obtained from polarization measurement in 2 g/l H
2
SO
4

103
3.9 Corrosion potentials and corrosion current densities of different
copper-tin alloy coatings

106
used for producing quarternary Yellow and White Miralloys
coatings

108
4.2 Electroplating duration and current density applied for multilayer
deposition

109
4.3 The values of interplanar spacing (d) and preference orientation
for quarternary alloy coatings

123
4.4 Thickness distribution of quarternary copper-tin-zinc-nickel
coating

127
4.5 Corrosion rate of binary and quarternary Yellow and White
Miralloy coatings

128
B1 Composition materials needed to prepare the solution for binary
coatings

151

ix
B2 Composition materials needed to prepare the solution for
quarternary coatings

152
D1 Results of cathodic current efficiency for binary copper-tin alloy
coatings

157
D2 Results of cathodic current efficiency for quarternary copper-tin-
zinc-nickel alloy coatings

158
E1 The values of interplanar spacing (d) and the preference
orientation for the reference

159
F1 Results of Vickers microhardness for binary copper-tin alloy
coatings

160
F2 Results of Vickers microhardness for quarternary copper-tin-zinc-
nickel alloy coatings

161
F3 Results of Vickers microhardness for compositionally modulated
multilayer alloy coatings

161
G1 Corrosion rate of binary copper-tin alloy coatings obtained from
polarization in 2 g/l H
2
SO
4
solution

162
G2 Corrosion parameters quarternary white and yellow copper-tin-
zinc-nickel alloy coatings obtained from polarization in 2 g/l H
2
SO
4

solution

162
H1 Tensile properties of quarternary and multilayer alloy coatings

163

x
LIST OF FIGURES

Page

1.1 Proposed research stages for preliminary experiments

7
1.2 Proposed research stages for production of nanometer scale of
Compositionally Modulated Multilayer (CMM)

9
2.1 Component of Electroplating

17
2.2 PotentialpH diagrams for NiH
2
O system at 25C [Pourbaix, 1974]

20
2.3 PotentialpH diagrams for SnH
2
O system at 25C [Pourbaix,
1974]

22
2.4 Plot of log l i l vs

24
2.5 A general qualitative description of the relationship between current
density and potential

26
2.6 Schematic cross-section showing microroughness of cathode, at
peaks (P), supply of electroactive species is relatively rapid over
the short distance from the diffusion boundary, whereas at valley
(V) it is too slow

27
2.7 Discharge site on a growing surface: (1) surface vacancy; (2) ledge
vacancy; (3) ledge kink; (4) ledge; (5) layer nucleous

30
2.8 Growth screw dislocation with a kinked growth ledge

31
2.9 Schematic representation of layer growth (a,b) and the nucleation-
coalescence mechanism (c)

32
2.10 Dependence of crystal growth mode and current density on
overpotential

34
2.11 Schematic cross section (perpendicular to the substrate) of the
columnar deposit

35
2.12 Polarization behavior for co-deposition of metals M
1
and M
2
. (a) M
1

and M
2
having similar E/I curves. (b) M
2
polarizing more than M
1

39
2.13 Unit cells of the three most importance lattices

40
2.14 Schematic illustration of corrosion of coating substrate systems in
the presence of pores. M, metal. (a) More noble coating on less
noble substrate (galvanic corrosion). Increased corrosion of
substrate material with small anodic area and large cathodic area.
(b) Less noble coating on more noble substrate (anodic corrosion).
Cathodic protection of substrate material, coating material
dissolved, large anodic area, small cathodic area.

43

xi
2.15 Current density vs potential curve for a typical metal electrode in
neutral or acid solution. Active and passive regions are indicated
with arrows. E
t1
: transpasive potential due to oxygen evolution on
passive metal; E
t2
: transpasive potential which indicates passive
film dissolution.

44
2.16 PotentialpH diagrams for CuH
2
O system at 25 C [Pourbaix,
1974]

50
2.17 PotentialpH diagrams for ZnH
2
O system at 25 C [Pourbaix,
1974]

51
2.18 The current pulse electroplating of Cu/Ni multilayered composites

56
2.19 Tensile strength vs. copper layer thickness for 90%Ni-l0%Cu
electrodeposited multilayered

60
3.1 Set up of electrochemical cell for polarization measurement

67
3.2 Haring-Blum cell utilized for the determination of the throwing
power

68
3.3 Schematic of the electroplating apparatus for binary Cu-Sn alloy
coating

70
3.4 Manual mounting press model Imptech, series M 10

72
3.5 Scanning Electron Microscope (SEM) model LEO Supra 35 VP

73
3.6 Diffractometer Siemens D5000

75
3.7 Shimadzu micro hardness tester type M

76
3.8 Cathodic polarization curves measured at 65 C for the
electrodeposition of (i) pure copper from solution containing 5 g/l
Cu(CN)
2
, (ii) pure tin from solution containing 45 g/l Na
2
SnO
3
and
(iii) copper-tin alloy from solution containing 5 g/l CuCN
2
, 45 g/l
Na
2
SnO
3
. Each solution contained 12 g/l NaOH and 25 g/l NaCN

79
Cu(CN)
2
2
SnO
3
and
2
, 45 g/l
Na
2
SnO
3

79
Cu(CN)
2
2
SnO
3
and
2
, 45 g/l
Na
2
SnO
3

80

xii
Cu(CN)
2
2
SnO
3
and
2
, 45 g/l
Na
2
SnO
3

80
3.12 Experimental polarization curves measured at 65 C for the
electrodeposition of copper-tin alloys from bath containing 45 g/l
Na
2
SnO
3
, 25 g/l NaCN, 12 g/l NaOH, and different concentrations
of Cu(CN)
2
; (i) 5 g/l, (ii) 10 g/l, (iii) 15 g/l, (iv) 20 g/l

82
3.13 Cathodic polarization curves of coatings produced during first
polarization in the bath solution containing 10 g/l Cu(CN)
2
, 45 g/l
Na
2
SnO
3,
2 g/l NaOH and 25 g/l NaCN at temperature 65
o
C

83
3.14 Cathodic polarization curves of alloy measured at different
temperature 60 C, 65 C, and 70 C in the bath solution containing
20 g/l Cu(CN)
2
, 45 g/l Na
2
SnO
3
, 12 g/l NaOH and 25 g/l NaCN

83
3.15 Copper concentration obtained from EDX analysis on the inner,
middle and outer parts of the cross section of coatings developed
from (a) bath I; (b) bath II; (c) bath III and (d) bath IV

86
3.16 The cross section of a Cu-Sn alloy coating developed in
electroplating bath I at current density 5 mA/cm
2
and its
representative EDX spectra for the inner layer (b), middle layer (c)
and outer layer (d)

87
3.17 Cathodic current efficiency of the binary copper-tin from different
bath and current density

88
3.18 X-ray diffraction patterns of binary coatings obtained from (a) bath
I, current density 4.88 mA/cm
2
; (b) bath II, current density 5.00
mA/cm
2
and (c) bath II, current density 18.36 mA/cm
2

90
3.19 X-ray diffraction patterns of binary coatings obtained from (a) bath
III, current density 5.00 mA/cm
2
; (b) bath III, current density 9.93
mA/cm
2
; (c) bath III, current density 18.76 mA/cm
2
; (d) bath IV,
current density 5.05 mA/cm
2
and (e) bath IV, current density 19.76
mA/cm
2

91
3.20 Phase diagram of copper-tin (Cu-Sn)

93
3.21 SEM micrographs of the copper-tin electrodeposits from bath I at
current densities (a) 4.88 mA/cm
2
; (b) 9.52 mA/cm
2
and (c) 18.76
mA/cm
2

96
3.22 SEM micrographs of the copper-tin electrodeposits from bath II at
2
; (b) 10.34 mA/cm
2
and (c) 18.37
mA/cm
2

97
3.23 SEM micrographs of the copper-tin electrodeposits from bath III at
2
; (b) 9.93 mA/cm
2
; (c) 18.76
mA/cm
2

98

xiii
3.24 SEM micrographs of the copper-tin electrodeposits from bath IV at
2
; (b) 10.09 mA/cm
2
and (c) 19.76
mA/cm
2

99
3.25 Thickness uniformity of binary copper-tin coating produced in
electroplating bath IV at current density 5 mA/cm
2

100
3.26 Cross sectional of the substrates-coating system at higher
magnification (a) taken at the left side and (b) taken at the right side
of coating presented in Figure 3.25

100
3.27 Scanning electron microscope of the diamond indentation tip the
coating produced from the bath III, current density 5 mA/cm
2

101
3.28 Average microhardness of coatings developed in different
electroplating baths at different current densities

101
3.29 Polarization curves of mild steel, pure copper and tin in 2 g/l
solution H
2
SO
4

at 25 C

102
3.30 Polarization curves obtained in 2 g/l solution H
2
SO
4
at 25 C for
binary Cu-Sn alloy coatings developed in the electroplating bath I

104
2
SO
4
at 25 C for
binary Cu-Sn alloy coatings developed in the electroplating bath II

104
2
SO
4
at 25 C for
binary Cu-Sn alloy coatings developed in the electroplating bath III

105
2
SO
4
at 25 C for
binary Cu-Sn alloy coatings developed in the electroplating bath IV

105
4.1 Schematic of the electroplating apparatus for quarternary Cu-Sn-
Zn-Ni alloy coatings

107
4.2 Procedure for CMM electroplating

110
4.3 Shape and dimension of rectangular tension test specimen

113
4.4 Macrograph of coated test specimens

114
4.5 A schematically stress-strain curve showing elastic and plastic
regions

115
4.6 Composition of plating was obtained from a few points across the
plating using EDS analysis from bath solution V

118
4.7 Composition of plating was obtained from a few points across the
plating using EDS analysis from bath solution VI

118
4.8 Composition of coating developed in electroplating bath V at
different current densities

119

xiv
4.9 Composition of coating developed in electroplating bath VI at
different current densities

119
4.10 Cathodic current efficiency of the quarternary copper-tin-zinc-nickel
alloy electroplating in different electroplating baths and current
densities

121
4.11 X-ray diffraction patterns of quarternary coatings obtained from (a)
bath V, current density 10 mA/cm
2
; (b) bath VI, current density 20
mA/cm
2

122
4.12 SEM micrographs of the copper-tin-zinc-nickel electrodeposits from
bath V at current densities (a) 5mA/cm
2
; (b) 10 mA/cm
2
; (c) 20
mA/cm
2
; (d) 25 mA/cm
2
and (e) 30 mA/cm
2

124
4.13 SEM micrographs of the copper-tin-zinc-nickel electrodeposits from
bath solution VI at current densities (a) 5mA/cm
2
; (b) 10 mA/cm
2
;
(c) 20 mA/cm
2
; (d) 25 mA/cm
2
and (e) 30 mA/cm
2

125
4.14 Thickness uniformity of a deposited quarternary copper-tin-zinc-
nickel coating produced from bath VI, current density 20 mA/cm
2

127
4.15 SEM image of coating cross section produced in electroplating bath
VI at current density of 20 mA/cm
2

127
4.16 Polarization behavior of quarternary Yellow and White Miraloy

128
4.17 SEM micrographs of the white/yellow multilayer coating with
thickness layer 1 m (a) view at low magnification (600 X), (b) view
at high magnification (10000 X)

129
4.18 Back scattered image of cross-sectional CMM deposits with sub-
layer thickness of 1 m, (a) at low magnification (600 X), (b) at high
magnification (3000 X)

130
4.19 EDX spectra back-scattered electron images for CMM deposits
with sub-layer thickness of 1 m

131
4.20 The secondary and back-scattered electron images of White and
Yellow miralloy multilayer with thickness layer 500 nm

132
4.21 The secondary electron images of White and Yellow Miralloy
multilayers with thickness layer (a) 310 nm; (b) 107.9 nm; (c) 46.82
nm and (d) 24.66 nm

133
4.22 Microhardness of quarternary Yellow and White Miralloy and CMM
specimens

134
4.23 Vickers microhardness of Yellow-White multilayer as a function of
bilayer thickness d

135
4.24 Comparison of stress-strain curves of white-yellow multilayers with
that of mild steel, white and yellow single layer

137

xv
4.25 The fracture surface of the as-deposited single layer (a) Yellow
Miralloy and (b) White Miralloy

138
4.26 The fracture surface of the as-deposited multilayer White/Yellow
Miralloy with layer thickness of (a) 1000 nm; (b) 500 nm; (c) 300
nm; (d) 100 nm; (e) 50 nm; and (f) 20 nm

139
A1 PotentialpH diagrams for CuCNH
2
O system at 25 C and the
activities of all solute species of (a) 1; (b) 10
-2
; (c) 10
-4
; (d) 10
-6

considering Cu(OH)
2
as a stable species and using the data in
Table 3. HCNO, CNO
-
and (CN)
2
are not considered

149
C1 Phase diagram of copper-zinc (Cu-Zn)

153

xvi
LIST OF ABBREVIATION

at.% : Atom percentage

ASM : American society of metals

ASTM : American standards for testing of materials

BCC : Body center cubic

BSE : Back scattered electron

CCE : Cathodic current efficiency

CMM : Compositionally modulated multilayer

Cu-Sn : Copper Tin

CR : Corrosion rate

DC : Direct current

EDX : Energy dispersive x-ray spectroscopy

FCC : Face center cubic

FESEM : Field Emission scanning electron microscopy

HER : Hydrogen evolution reaction

ICCD : International center diffraction data

Mpa : Mega pascal

nm : Nanometer

SEM : Scanning electron microscope

WE : Working electrode

wt.% : Weight percentage

TP : Throwing power

XRD

: X-ray diffraction
m : Micrometer

xvii
LIST OF SYMBOLS

a : Activity

A : Surface area of electrode

: Transfer coefficient

: Symmetry factor

C
o
: Bullk concentration

: Diffusion coefficient

d : Interplanar spacing

E : Electrode potential

E
o
: Standard electrode potential

: Overpotential

F : Faradays constant

i
:
Current density

i
o

:
Exchange current density

i
L
:
Limiting current density

J
T
: Total flux of ion

J
C
: Convection flux

J
D
: Diffusion flux

J
M
: Migration flux

K : Ratio of distances between the anode and the two cathodes

M : Molecule mass

:
Density

n
:
Number of electron

T
:
Temperature

t
:
Time

t
+
:
Transfer number

xviii
: Angle

M : Ratio of weights of metal deposited for two cathodes

xix
PENYADURAN ALOI Cu-Sn DAN LAPISAN BERBILANG DENGAN
KOMPOSISI TERMODULAT ALLOY Cu-Sn-Zn-Ni PADA SUBSTRAT
KELULI LEMBUT

ABSTRAK

Dua siri eksperimen elektrosaduran telah dijalankan pada substrat keluli lembut pada
suhu 65 C dalam beberapa mandian elektrosaduran di bawah ketumpatan arus
konstan yang berlainan. Tujuan eksperimen siri pertama adalah untuk mengkaji
perilaku proses pemendapan elektro Cu dan Sn dari beberapa mandian sianida
beralkali dan untuk memperoleh syarat elektrosaduran supaya dapat menghasilkan
saduran Miralloys perduaan kuning dan putih. Eksperimen siri kedua melibatkan kajian
eksperimen lapisan berbilang dengan komposisi termodulat yang mengandung lapisan
nano kuarterner Miralloy kuning dan putih secara berselang-seli dengan menggunakan
teknik dua mandian. Kinetik dan sifat elektrosaduran aloi Cu-Sn telah dikaji melalui
pengukuran sifat polarisasi katodik keduanya dalam mandian elektrosaduran yang
berlainan. Pengaruh komposisi mandian dan ketumpatan arus pada komposisi dan
sifat perduaan saduran Cu-Sn aloi pada substrat keluli lembut telah dilakukan
menggunakan mandian elektrosaduran. Keseragaman saduran yang dihasilkan dalam
eksperimen ini diperiksa di bawah FE-SEM, sementara keseragaman komposisi
saduran dan fasa-fasa yang ada dalam saduran masing-masing dikaji dengan EDX
dan XRD. Saduran aloi perduaan Cu-Sn dan kuarterner Cu-Sn-Zn-Ni khususnya
Miralloy kuning dan putih yang tumpat, merekat, berpermukaan halus, dan seragam
dapat dihasilkan pada substrat keluli lembut dengan kadar laju yang tinggi.
Penambahan zink dan nikel dalam saduran tidak banyak merubah sifat-sifat kimia dan
mekanik saduran. Pembentukan saduran lapisan berbilang dengan komposisi
termodulat yang mengandungi lapisan berbilang yang berskala nano telah
meningkatkan kekerasan mikro saduran. Pengenapan lapisan saduran berbilang
dengan ketebalan lapisan <300 nm adalah sangat berarti. Hubungan antara ketebalan

xx
dua lapisan (d
-1/2
,(m)) dan kekerasan mikro saduran (HV) didapat HV =17.37d
-1/2
+
602.66. Kekerasan yang paling tinggi dari saduran lapisan termodulat kerencaman
berbilang yang diperoleh dari eksperimen ini adalah 689.62 HV dan ini dihasilkan dari
saduran lapis berbilang yang mengandungi lapis Miralloy kuning dan putih yang
berselang-seli dengan ketebalan sub-lapisan 20-30 nm. Dari eksperimen ini dapat
dinyatakan bahawa pembentukan saduran aloi Cu-Sn atau Cu-Sn-Zn-Ni terutama
saduran lapisan termodulat memungkinkan aplikasi saduran timah untuk industri
automotif.

xxi
ELECTROPLATING OF Cu-Sn ALLOYS AND COMPOSITIONALLY
MODULATED MULTILAYERS OF Cu-Sn-Zn-Ni ALLOYS ON MILD STEEL
SUBSTRATE

ABSTRACT

Two series of electroplating experiments have been carried out onto mild steel
substrate at 65 C in several electroplating baths under different constant applied
current densities. The objectives of the first series of experiments are to understand the
behavior of electrodeposition of Cu and Sn in the several alkaline cyanide baths and to
explore the electroplating conditions which are appropriate for fabricating binary Yellow
and White Miralloys coatings. The second series of experiments deals with an
experimental study on electroplating of Compositionally Modulated Multilayer (CMM)
consisting of multiple alternate nano-layers of quaternary Yellow and White Miralloys
using dual bath technique (DBT). The kinetics and electrodeposition behavior of Cu-Sn
alloys have been assessed by measuring their cathodic polarization behavior in
selected electroplating baths. The influence of bath composition combined with current
density to the compositions and properties of binary Cu-Sn and quarternary Cu-Sn-Zn-
Ni alloys coatings deposited onto mild steel substrate have been studied in several
electroplating baths. The uniformity of the coatings developed in this experiment is
examined under FE-SEM, while the compositional uniformity of coating and phases
present in the coating are assessed by EDX and XRD respectively. Dense, adherent,
smooth and uniform binary Cu-Sn and quaternary Cu-Sn-Zn-Ni alloys coatings
especially Yellow and White Miralloys, can be deposited with relatively high deposition
rate. Introducing zinc and nickel into the coating does not significantly alter their
chemical and mechanical properties. Formation CMM coatings has significantly
increased the micro-hardness of the coatings. However, fabrication of multilayer
coatings with individual layer thickness < 300 nm are essential. The relationship
between the bilayers thickness (d
-1/2
,(m)) and coating micro hardness (HV) has been

xxii
formulated as HV = 17.37d
-1/2
+ 602.66. The highest hardness of CMM coating
obtained from this experiment is 689.62 HV and this is achieved by fabricating CMM
coating consisting of multiple alternate thin layers of Yellow and White Miralloys with
individual layer thickness of 20-30 nm. This experiment confirms that the formation of
Cu-Sn or Cu-Sn-Zn-Ni alloys coatings especially CMM coating have made the
application of tin for automotive industries feasible.

1
CHAPTER 1
INTRODUCTION

1.1 Research Background
Tin is one of the first metals mined and has been recognized previously as an
important metal in industry. The largest tin mines are mostly in Asia. The most
important ore-supplying countries in the Asia are Indonesia, Malaysia and followed by
China [Habashi, 1997; Malaysian Chamber of Mines, 2006] and only Indonesia and
China after about 1994. Currently, the Malaysian Smelting Corporation (MSC) group is
one of the largest integrated producers of tin metal and tin-based products in the world.
In 2004, the group contributed about 18% of the worlds tin production with a combined
production of 57,270 tons of tin metal from the groups smelting operations in Malaysia
and Indonesia (MSC Annual Report, 2004). Most of the tin consumption in the world is
for producing tin solders, tin coatings, tin compounds and alloys containing tin. Besides
tin metal exhibits unique properties such as low melting point and resistant to
corrosion, tin has also recognized as a green metal (non toxic metal) and therefore tin
is still used as a base metal for producing lead free solders and it also considered as a
proper metal for substituting lead such as for fishing tackles and shot gun bullets. In
ASEAN countries for instance, the major consumption of tin metal is for producing tin
solders, tin cans and pewter. Even though tin is an important metal in industry, the
annual (demand) is still small compared to those of many other metals. It has been
reported that the world production and consumption of tin have not really grown in the
past 20 years, due mainly to the substitution of tin by plastic, paper or aluminum in the
manufacture of cans and other containers, such as plastic tubes for toothpaste and
ointments. Consequently, attempts should be made by Tin Mining and Tin Smelting
Companies to increase or at least to maintain the world tin consumption. This is done
by increasing the role of tin in various applications. One of the possibilities to increase

2
the world tin consumption which is in consideration recently, is to increase the role of
tin in electroplating industries.

Electroplating is widely used for production of new materials that require
specific mechanical, chemical and physical properties. This technique has
demonstrated to be very convenient because of its simplicity and low cost in
comparison with the other method such as sputtering and vapor deposition. Pure tin is
non-toxic, can be electrodeposited as an extremely bright, white and lustrous deposit. It
has excellent resistance to corrosion and easily to be soldered. As mentioned
previously, it is being applied to produce tin cans for food packaging. However, pure tin
is soft and is not practical to be used as coated material for automotive applications.
While the hardness of alloys coatings such as White Miralloy (55%Cu-45%Sn or
55%Cu-30%Sn-15%Zn) and Yellow Miralloy (80%Cu-17.5%Sn-2.5%Zn, 80%Cu-
15%Sn-5%Zn or 85%Cu-15%Sn) are respectively 550 HV and 400 HV. These coating
layers are extremely abrasion resistant and are suitable for automotive application. The
coatings also exhibit other interesting characteristics such as low surface tension, good
sliding ability, high hardness, sufficient ductility, solder ability, low porosity and/or
resistance to corrosion depending on their composition. Such properties have led to
these coating being widely used in industries. For example, because of White Miralloys
exhibit an acceptable contact resistance, it may be used for coating electric connectors.
More over, worn machine parts can be re-electroplated by these alloys to extend their
service live. These may lead to a decrease in the cost of the parts.

Recently, it has been reported that electroplating of Cu-Sn alloys can be
successfully done in laboratories using non cyanide solution e.g. in acid sulfate solution
[Survila, et al. 2004]. Even though co-deposition of such alloys can be done using non-
cyanide baths, most of the industrial tin alloys plating use cyanide solutions because of
the high quality requirement of the coating [Picincu, et al., 2001]. Electrocodeposition in

3
cyanide bath will produced adherent, smooth and uniform coating on both planar and
non planar substrates. Moreover quarternary alloys (e.g. an alloy which contains Cu 50
%wt, Sn 32 %wt, Zn 17 %wt and Ni 1%wt) can be easily electrocodeposited from
cyanide baths [Helton et. al, 1989]. Cyanide is deemed typical of complexing agents
that have been used for long time in providing stable solution. It is still used intensively
in industries such as in gold extraction plants and in electroplating industries as strike
solution. However, extra care has to be performed to avoid fatal accident and to
eliminate environmental problem especially during disposal of cyanide. Despite the fact
that cyanide systems are the most toxic electrolytes known, the technology of waste
disposal treatment on them is well established and has been implemented in industries
for many years.

Multilayers especially compositionally modulated multilayer (CMM) coatings,
consisting of multiple alternate thin layers of alloys, have received increasing attention
recently because of their unique properties. These materials comprised of alternating
layers of different metals and /or alloys are expected to exhibit unusual and enhanced
electrical, optical, magnetic and mechanical properties when the sublayer thickness is
confined to the nanometer scale [Miyake, et al. 2001]. The properties of multilayered
systems depend on bilayer thickness, global thickness and good multilayer formation
[Gomez, et al. 2003]. However, most of the studies of CMM coatings have been
reported for Cu/Ni, Cu/Co-Ni, Cu/Ni-Fe, Au/Co, Pt/Co etc. [Haseeb, et al. 1994; Kanani,
2004]. So far, there is no research has been reported on the production of CMM
coatings consisting of multiple alternate thin layers of Yellow and White Miralloys or
White Miralloy with another metal such as gold, silver, platinum, palladium, etc, in order
to increase the electric conductivity of the coatings.

4
1.2 Research Objectives
The research reported in this thesis relates to a study of electro-codeposition
of Cu-Sn and Cu-Sn-Zn-Ni alloys on mild steel substrate from several cyanide baths.
Its main objective is to find electroplating conditions that are suitable for producing
binary and quarternary Yellow and White Mirralloys. It is also proposed to extend the
research of previous workers [e.g. Helton et. al, 1989; Picincu et al., 2001] by
investigating the possibility to produce CMM coatings consist of multiple alternate thin
layers of Yellow and White Miralloys using a dual baths technique. These multilayer
coatings were expected to be harder than that of White Miralloy, but it is still exhibited
suitable resistant to corrosion.

The study has been focused on the production of coatings and most of
characterization measurements have been proposed to collect additional information
which will be used to obtain range of electroplating conditions in which adherent,
smooth and uniform Yellow and White Miralloys as well as CMM coating can be
produced. It consists of two series of experiments namely Preliminary Experiment and
Production of CMM Consisting of Multiple Alternate Nano-Layers of Yellow and White
Miralloys.

The scopes of the research are as follows:
Part A. Preliminary Experiment
The possibility to electro-codeposition of Cu-Sn alloy coatings onto mild steel substrate
in cyanide baths is studied. The compositions of these plating baths are adopted from
established Cu-Sn alloys plating composition cited in electroplating texts [Gabe, 1974;
Pletcher et al., 1990]. All of the electroplating solutions utilized in this experiment
contain saturated Na
2
SnO
3
. Factors that influence the composition and properties of
binary alloys which are deposited from these plating solutions are observed. The

5
results are used to select the composition of plating baths for depositing quarternary
Cu-Sn-Zn-Ni alloys and compositionally modulated multilayers consisted of multiple
alternate quarternary Yellow and White Miralloys layers on a mild steel substrate. The
research of this part will include :
1. Measurement cathodic polarization behavior of Cu, Sn and Cu-Sn from
selected cyanide solutions.
2. A study on the influence of current density on the composition, phases formed
and uniformity of Cu-Sn deposits produced from several electroplating bath
compositions at 65

C.
3. An assessment on the influence of chemical composition of coatings to their
micro-hardness and corrosion resistance in 2 g/l H
2
SO
4
solution at ambient
temperature.

Part B. Production of Compositionally Modulated Multilayer Consisting of
Multiple Alternate Nano-Layers of Quarternary Yellow and White Miralloys
Since electroplating of quarternary Cu-Sn-Zn-Ni alloys may produce brighter
coatings and multilayers coating is expected to possess outstanding coating properties,
the main objective of this part is to produce multilayer coating consisted of multiple
alternate quarternary Yellow and White Miralloys layers. Consequently, the experiment
must be initiated with the observation of factors that influence the composition and
properties of quarternary alloys deposited from designated prepared plating solutions.
Hence, the main research activities of this part are:
1. Exploring the proper electroplating conditions which are appropriate for
fabricating quarternary Yellow and White Miralloys onto mild steel substrate.
2. Investigating the possibility of production compositionally modulated multilayer
consisting of multiple alternate nano layers of Yellow and White Miralloys on
mild steel substrate using a dual baths method.

6
3. Investigating the influence of the present of Zn and Ni in the coating to the
corrosion resistant of Yellow and White Miralloys.

1.3 Research Methodology
Research activities are conducted following the flow charts presented in
Figure 1.1 and 1.2. It is initiated by selecting the electroplating system that is suitable
for binary and quarternary Cu-Sn-Zn-Ni deposition. High throwing power alkaline
cyanide baths is chosen and its throwing power is remeasured using a conventional
test method in a Haring Blum cell. The polarization curves of Cu, Sn and Cu-Sn alloy
depositions is further measured, both on steel and coated steel specimens. This will
give information the kinetics of Cu, Sn and Cu-Sn alloy deposition. Since Cu and Sn
depositions might not occur with the same rate during alloy electroplating, the
composition of the coating is expected to be influenced by deposition potential/current
density which is a function of total current density and the concentration of electroactive
species in the electroplating bath. Consequently study the influence of bath
composition and current density to the chemical composition of binary Cu-Sn coating
produced is necessary to be considered. The physical and chemical properties of the
coatings are further characterized using SEM and EDX, micro hardness testing
machine and potentiostat. This preliminary experiment is followed by investigating the
influence of current density to the chemical composition of quarternary Cu-Sn-Zn-Ni
coatings developed in selected electroplating baths for depositing Yellow and White
Miralloys. The coatings produced are then subjected to be characterized with the same
characterization procedures applied for binary coatings. The best electroplating bath
compositions and electroplating conditions for depositing quarternary Yellow and White
Miralloys are explored and they will be utilized for producing nanometer scale
compositionally modulated multilayers using a dual baths technique.

7

Figure 1.1: Proposed research stages for preliminary experiments

Plating Baths Selection
In electrodeposition of alloys, the electrolyte and deposition conditions are chosen so
that deposits have uniform composition and properties over the course of the
deposition process. Based on potential-pH equilibrium diagrams for the systems Cu-
H
2
O, Sn-H
2
O, Zn-H
2
O and Ni-H
2
O which are respectively presented in Figure 2.16, 2.3,
2.17 and 2.2, electroplating can be done either in acid or in alkaline solutions. In acid
solution electroplating may be conducted by reducing simple cations (e.g. Cu
2+
, Sn
2+
,
Preparation of
substrate
Selection of plating
bath composition
Preparation of plating
baths
Cathodic polarization
measurement
Macro throwing
power measurement
Study the influence of
bath composition and
current density to the
chemical composition
of binary Cu-Sn
coating produced
Characterization of
coating
XRD analysis
Microhardness
measurement
Corrosion
resistance
SEM and EDX
analysis
Assessment of experimental
results (Mechanism of co-
deposition, electroplating
condition that can produce
proper white & yellow Miralloy)

8
Zn
2+
or Ni
2+
) while in alkaline deposition must be conducted by reducing complex
anions. Electroplating of metal/alloy from simple cation onto non planar metal
substrates tends to produce a non-uniform coating because local deposition current
density at location close to anode will be significantly higher than that at locations far
from the anode. Basically ternary Cu-Sn-Ni alloys can be co-deposit during
electroplating and zinc is not expected to be deposited simultaneously with the alloy
because its deposition potential is too low. Thereby the utilization of alkaline cyanide
solution has been selected for producing quarternary Cu-Sn-Ni-Zn coating for this
experiment.

More uniform deposit can be obtained for the electroplating which is
influenced by mass transfer of cation toward the cathode especially at locations closer
to anode. In contrast electroplating from complex anion in alkaline solution will tends to
produce more uniform coating because the complex anion will migrate away from the
cathode and the rate of migration will be higher at locations closer to anode. More over
electroplating from alkaline solution will have advantages such as: (1) electroplating
bath has higher covering power; (2) more uniform thickness coating can be formed on
non planar substrate; (3) solution is not very corrosive compared to acid solution; (4)
less hydrogen evolution and thus coating will be less brittle compared to that produced
in acid solution. It should be noted that no Cu-Sn-Ni-Zn alloy deposition will occur
except the deposition potential of copper can be lower close to Sn, Zn and Ni. Based
on the potential-pH diagram CuCNH
2
O system (Appendix A) [Lu et. al. 2002], the
deposition potential of copper from alkaline cyanide bath can be suppressed as low as
the deposition potential for zinc and therefore codeposition of Cu, Sn, Zn and Ni can be
done simultaneously in this plating bath.

9

Figure 1.2: Proposed research stages for production of Compositionally Modulated
Multilayer (CMM) coatings consisted of nanometer scale of Yellow and White miralloys.

Selection of Substrate
There are at least two reasons why mild steel is used as a substrate in this alloy plating
experiment;
Preparation of
substrate
Selection of plating
bath composition
Preparation of plating
baths
Electro-codeposition
of Cu-Sn-Zn-Ni
Characterization of
coating
XRD analysis
Microhardness
measurement
Corrosion
resistance
SEM and EDX
analysis
Electroplating study
for Producing
Compositionally
Modulated Multilayer
(CMM) consisting of
Yellow and White
Characterization of
CMM
Microhardness
measurement
SEM and EDX
analyze
Tensile Test
Discussion

10
(1) One of the aims of the electroplating experiment is to prepare alloy plating for
automotive application which most substrate is steel including mild steel,
(2) Alloy plating is more difficult to be implemented on steel rather than on copper
because the equilibrium potential of steel is significantly lower than that of copper.
Therefore, if alloy plating can be successfully done on mild steel, it will be successfully
conducted on copper e.g. for plating electric connector.

Throwing power measurement
Throwing (macrothrowing) power of the electroplating bath is determined
experimentally using a small electroplating cell of special geometrical shape (Haring-
Blum). Two cathodes are placed at markedly different distances from a single anode
and electroplating is carried out. The throwing power is calculated using the following
equation
2 M K
) M K ( 100
power throwing %
+

= (1.3)
where K and M are ratios of distance from the anode and weights of metal deposited
for two cathodes respectively. (K =X
2
/ X
1
, M =W
1
/ W
2
)

Polarization measurement
An alloy deposition process is more complex than that for single metal deposition.
However, an examination of partial polarization curves from alloy deposition and from
single metal deposition under similar condition can help to understand the mechanism
of deposition process of copper-tin alloys. Cathodic polarization behavior for single
metals and alloy deposition processes will be discussed and used to gain qualitative
information on the mass transport and kinetic aspects of binary and quarternary
copper-tin alloys deposition. All of polarization curves are measured in an
electrochemical cell consisted of three electrodes and test solution as its electrolyte.
The measurements are conducted in a slightly stirred solution open to air using a

11
Gamrys potentiostat with the scanning rate of 5 mV/second. Saturated copper
sulphate and graphite electrodes are employed respectively for reference and counter
electrodes.

The influence of the common variables in alloy plating
The independent variables which are current density, agitation, temperature, pH, and
concentration of bath constituents, influence the ratio in which two or more metals are
co-deposited, the physical and chemical characteristics of the coatings, and the rate of
deposition. An appreciable change in any one variable may require an appreciable and
compensating change in another variable or combination of variables in order to
maintain a given plate composition or physical properties, each variable can be
considered with regard to its general effect. In this experiment agitation and
temperature are maintained constant. The concentration of Cu(CN)
2
will be varied
between 5 and 20 g/l in the bath solution while the concentration of Na
2
SnO
3
, NaCN
and NaOH are fixed on 45, 25 and 12 g/l respectievely. The duration time of deposition
(t) are proposed to be 8.5 hours (30600 seconds) for current density 5 mA/cm
2
, 3.5
hours (12600 seconds) for current density 10 mA/cm
2
and 94 minutes (5640 seconds)
for 20 mA/cm
-2
. The composition of electrolyte baths for quarternary deposition of
White and Yellow Miralloys respectively are 20 g/l Cu(CN)
2
, 45 g/l Na
2
SnO
3
, 1 g/l ZnO,
0.03 g/l Nickel acetate, 25 g/l NaCN, and 12 g/l NaOH; and 40 g/l Cu(CN)
2
, 45 g/l
Na
2
SnO
3
, 0.25 g/l ZnO, 0.02 g/l Nickel acetate, 25 g/l NaCN, and 12 g/l NaOH. Zinc
and nickel are co-deposited together with Cu and Sn to promote the development of
corrosion resistant, bright and untarnished coatings. Nickel is added into the
electroplating bath to enhance the inclusion of tin within the plate alloy.
The cathodic current efficiency () is calculated using the following equation
% 100 x
t
w
w
efficiency current Cathodic = (1.4)

12
and the theoretical weight of electrodeposited alloy is expressed in term of Faradays
laws of electrolysis as follows;

+ =
F x n
t x A x i x M
F x n
t x A x i x M
(1)
t
w
Sn
Sn Sn
Cu
Cu Cu

(1.5)
+ +
+ =
F x n
t x A x i x M
F x n
t x A x i x M
F x n
t x A x i x M
F x n
t x A x i x M
(2)
t
w
Ni
Ni Ni
Zn
Zn Zn
Sn
Sn Sn
Cu
Cu Cu

(1.6)
where, w is the weight of electrodeposited alloy (gram), w
t
is the theoretical weight of
electrodeposited alloys (1) is indicated for binary and (2) for quarternary (gram), M
Cu
,
M
Sn
, M
Zn
and M
Ni
are respectively the molecule mass of copper, tin, zinc and nickel
(gram/mol), i
Cu
, i
Sn
, i
Zn
and i
Ni
are respectively the partial current densities of copper, tin,
zinc and nickel (Ampere/cm
2
), A is the surface area of electrode (cm
2
), t is the duration
of deposition process (second), n
Cu,
n
Sn
, n
Zn
and n
Ni
are the numbers of moles electron
needed to reduce a unit mole of CuCN
2
-
, Sn(OH)
6
=
, Zn(CN
4
)
=
and Ni
2+
ions (these are
equal to 1, 4, 2 and 2, respectievley), and F is the Faradays constant (Ampere. sec.
mol
-1
).

Microhardness measurement
Hardness measurements are performed on polished cross section specimens at room
temperature in accordance with ASTM standard E-384 [1999].

Corrosion resistant measurement
Study of the corrosion resistance of coatings is performed by assessing their
polarization behavior in relatively aggressive solution. For this study, coatings with an

13
exposed surface area of approximately 1 cm
2
are prepared. The anodic polarization
measurements are done in 2 g/l H
2
SO
4
solution at room temperature using the same
potentiostat used for cathodic polarization measurement of electrodeposition process.
The measurement method is adopted from that recommended by ASTM standard G-5.
The corrosion rates of coating specimens are determined their cathodic and anodic
polarization curves, while the tendencies to become passive are evaluated with respect
to their anodic polarization behavior.

Electroplating study for producing Compositionally Modulated Multilayer
(CMM) coatings
Electrodeposition of compositionally modulated multilayers (CMM) coatings consisting
of multiple alternate thin layers of Yellow and White Miralloys on a mild steel substrate
is carried out using the dual baths technique. The series of experiments that we have
conducted earlier suggested that the best solutions for depositing Yellow and White
Miralloys are the electroplating bath containing 40 g/l Cu(CN)
2
, 45 g/l Na
2
SnO
3
, 12 g/l
NaOH, 25 g/l NaCN, 0.25 g/l ZnO and 0.02 g/l Ni(CH
3
COO)
2
and that containing 20 g/l
Cu(CN)
2
, 45 g/l Na
2
SnO
3
, 12 g/l NaOH, 25 g/l NaCN, 1 g/l ZnO and 0.03 g/l
Ni(CH
3
COO)
2
respectively. These solutions are used as electroplating baths for
producing CMM coatings which are done under current densities of 20 and 10 mA/cm
2

respectively for depositing thin layer of Yellow and White Miralloys. Depending on the
thickness of individual thin layer, each electroplating process is carried out with
different electroplating time and it is estimated from the results of earlier experiment.
CMM coatings with different thin layer thickness (from 1000 nm down to 20 nm) are
proposed to be deposited on mild steel substrates. The relationships between the
maximum individual layer thickness and its mechanical properties (e.g. micro
hardness) as well as the thickness of individual layer at which the superior properties of
CMM begin to appear will be determined.

14
1.4 Expected Outcomes
The expected outcomes of these experimental works are the electroplating conditions
that are appropriate for producing binary and quarternary Yellow and White Miralloys.
These will be further implemented for automotive and probably also for the electronic
applications. Experimental results are also expected to give additional information in
the kinetics of codeposition of Cu-Sn and the influence of electroplating bath
composition and current density on the coating composition, phases present within the
coating, microhardness and corrosion resistance of the coatings. The possibility to
increase microhardness of coating by producing such the CMM coating has been
expected as the main outcomes of the current experimental works.

15
CHAPTER 2
LITERATURE REVIEW

2.1 Electroplating
Metal finishing is the name given to a wide range of process carried out in
order to modify the surface properties of a metal, e.g. by the deposition of a layer of
another metal alloy, composite, or by formation of an oxide film. The origins of the
industry lay in the desire to enhance the value of metal articles by improving their
appearance, but in modern times the importance of metal finishing for purely decorative
reason has decreased. The trend is now towards surface treatment which will impart
corrosion resistance or particular physical or mechanical properties to the surface (e.g.
electrical conductivity, heat or wear resistance, lubrication or solderability) and hence,
to make possible the use of cheaper substrate metals or plastics covered to give them
essential metallic surface properties. It should be emphasized that not all surface
finishing is carried out using electrochemical methods, but electroplating is still
represents a large portion of the metal finishing industry.

The objective of an electroplating process is to prepare a uniform deposit
which adheres well to the substrates and which has the required mechanical, chemical
and physical properties. Moreover, it is of overriding importance that the deposit
properties meet their specification on all occasions, i.e. the process is both predictable
and reproducible. On the other hand, many metals may (by modification of the bath
and electroplating conditions) be deposited with different properties. It is for this reason
that it is not possible to define a single set of conditions for electroplating of each metal;
the bath, current density, temperature, etc., these will depend to some extent on the
deposit properties required.

16
It is important that the plating bath is stable for a long period of time because
of the importance of the reproducibility of the deposit. It is also necessary that the
quality of deposit is maintained over a range of operating conditions, since some
variations in concentrations and current density are bound to occur, particularly when
different objects are to be plated. Tolerance of the bath to carry over from previous
process liquors or mishandling during operation on the factory floor is an additional
advantage.

The principle components of an electroplating process are shown
schematically in Figure 2.1. The essential components include:
1. An electroplating bath containing a conducting salt and the metal to be plated in a
soluble form, as well as perhaps a buffer and additives.
2. The electronically conducting cathode, i.e. the workpiece to be plated.
3. The anode (also electronically conducting) which may be soluble or insoluble.
4. An inert vessel to contain (1)-(3), typical, e.g. steel, rubber-lined steel,
polypropylene or polyvinylchloride.
5. A direct current source, usually a regulated transformer/rectifier.

Metal electroplating is the process of electrolytically depositing layer of metal,
alloy or metal matrix composite onto a surface. The object to be plated is made as a
cathode/cathodes in an electrolyte bath containing a simple cation (e.g. M
n+
) or a
complex metal ions (e.g. M(CN)
2
-
). So that the example of possible reactions that can
occur at the cathode during a single metal electroplating are:
M
n+
+ne
-
M, (2.1)
or M(CN)
n
(n-1)-
+e M +nCN
-

(2.2)

17

Figure 2.1: Component of Electroplating

Hence, the metal ion may be a simple ion such as hydrated Cu
2+
or it may represent a
metal complex such as [Cu(CN)
2
]
-
. Where possible, the preferred anode reaction is the
dissolution of the same metal to its precursor in solution.
M M
n+
+ne (2.3)
or M +nCN M(CN)
n
(n-1)-
+e (2.4)
In ideal, the electrolysis conditions are controlled in such a way that the current
efficiencies of reaction (2.1 or 2.2) and (2.3 or 2.4) are the same and, hence, the
concentration of M
n+
or metal complex ion in the bath remains constant. In a few cases,
the metal ion has to be added as a solid oxide and then an inert anode is employed;
the main anode reaction is oxygen evolution. For a successful electroplating process,
the correct pretreatment of the cathode and careful selection of the anode material,
plating bath, current density and other electrolysis condition, are essential. By using
proper type of electroplating baths and adjusting its composition as well as
d.c power supply
+
_
Anode
cation transport
Cathode
e
-
e
-
Electroplating tank
Electrolyte, i.e. plating bath (H
2
O + source of M
n+
+
conducting salts + buffer + additives)
anion transport
V
+
Electroplated metal layer
A
18
electroplating parameters such as current density and temperature, following type of
layer may be electroplated:
1. Single metals: the most important are Sn, Cu, Ni, Cr, Zn, Cd, Pb, Ag, Au and Pt.
2. Alloys including: Cu-Zn, Cu-Sn, Pb-Sn, Sn-Ni, Ni-Co, Ni-Cr, Ni-Fe, Cu-Sn-Zn, and
Cu-Sn-Zn-Ni.
3. Composites: i.e metals containing dispersed solid such as PTFE, Al
2
O
3
, WC,
diamond, SiC, Cr
3
C
2
and graphite.
4. Multilayers: including multiple alternate layer of Cu and Ni; Ni and Fe; Cu and Co;
Cu and Ag; Fe and Pt; Zn and Zn-Ni; Ni-P and Ni etc.

The mass of metal w (g) deposited during electroplating may be expressed in terms of
Faradays laws of electrolysis as follows
F n
q M
~
w

= (2.5)
where M
~
is the mol weight of metal (g/mol), q is equal to It (A.sec.) namely as the
electrical charge, n is the moles of electron that gets involve in the half cell reaction per
1 mol metal deposited and (< 1) is the cathode current efficiency for metal
deposition. The majority of electroplating processes are carried out batchwise, at a
constant current density I for a measured time t. The averaged rate of mass deposition
per unit area is then given by:
F An
M
~
I
t A
w
= (2.6)
where the factor M
~
/ n F is the electrochemical equivalent (g/A.sec.) and A is the
surface area (cm
2
or m
2
). This expression can also be written in terms of the useful
current density (i).
F n
M
~
i
t A
w
= (2.7)
19
Thus the rate of deposition depends upon the current density, the molar mass of the
metal M, the number of electrons n per mole of M
n+
and the prevailing current
efficiency.

2.2 Thermodynamic of Electrodeposition
Information contains in potential-pH diagrams is useful in several ways for application
to problem involved in electroplating, for cathodic and anodic processes as well as the
stability of solution.

2.2.1 Cathodic Processes
The desired cathodic reaction in electroplating is ordinarily metal deposition. In
most electroplating processes, dissolved oxygen reduction also occurs at the cathode,
while hydrogen ion reduction is undesirable and may cause coating embrittlement and
produced uneven coating surface. As an example, consider potential-pH equilibrium
diagram for Ni-H
2
O system at 25C (Figure 2.2). Nickel can be deposited from acid and
alkaline solutions. It is obvious, most of nickel electroplating are done from nickel
sulphate solutions open to air because the stability of nickel sulphate solution appears
in wide range of pH. At, say, pH 4.5 and potential (E) =-0.4 Volt, evidently dissolved
oxygen and hydrogen ions can be reduced as well as nickelous ions; however, the
overpotentials required to reduced dissolved oxygen and hydrogen ion at sensible
rates are fortunately considerably higher than that required for nickelous ion reduction,
and this can consequently results in efficiently less than 100 % (e.g. 96 %). Decrease
of pH tends to increase the relative amount of hydrogen ion reduction. Nevertheless,
the acid type of Watts nickel bath operating at pH 2 can give good nickel deposition
even though, somewhat more hydrogen is evolved, because the pH of the solution at
the cathode interface rises, through hydrogen ion reduction and under steady-state
deposition conditions the relative amount of hydrogen ion reduction is not unduly large.
20

Figure 2.2: PotentialpH diagrams for NiH
2
O system at 25 C [Pourbaix, 1974]

On the other hand, increase of pH of the bulk solution beyond about 5 causes
the catholyte under deposition conditions, to contain sufficient nickelous hydroxide
(Ni(OH)
2
), present as positively charged colloidal particles, to lead to co-deposition of
hydroxide with metal; this gives a harder and more brittle deposit that, although suitable
for rather limited purposes, is in general undesirable. The very small Faradic current
required for hydroxide or oxide deposition, due to the small charge/mass ratio of the
colloidal particles, explains why a high pH nickel bath may give almost 100 % cathode
current efficiency and yet yield deposits containing considerable hydroxide.

2.2.2 Anodic Processes
In electrodeposition, it is usually desired to have either (a) an anode of the metal being
deposits that dissolved at near 100 % current efficiency or (b) an anode that is totally
insoluble and that acts merely as an inert basis for oxygen evolution. It is rarely
21
desirable to have an anode that gives mixture of these processes, or that operates
consecutively in the dissolving and the passive state.

For example, nickel dissolves to nickelous ions at unit activity, at potentials more
positive than -0.23 V and at pH less than about 6. At higher pH, solid nickleous
hydroxide is the initial anodic product, and this is converted to higher oxides at higher
anode potentials, under such conditions, passivation of a nickel anode occurs at once.
However, passivation can also occur below pH 6, indeed, as low as pH 0.5 because
the anodic overpotential required to dissolve nickel to nickelous ions at the current
densities required in electrodeposition process is considerable. Thus, if the polarization
raises the anode potential above the broken line extension of the Ni/Ni(OH)
2
line
(Figure 2.2), solid nickleous hydroxide may be formed at low pH, and since there is
good evidence that its formation from the metal is kinetically easier than the formation
of dissolved nicklelous ion, its preferential formation is not surprising, and the tendency
of nickel anodes to passivate is easily understood. In practice, this is remedied by the
incorporation of a little oxide in the nickel anode and/or of chloride in the solution; the
overpotential required for dissolution is thereby much reduced and the potential for
passivation is not reached.

Soluble anode operating in alkaline solution, such as tin and zinc, can also passivate at
high current densities, mainly because the supply of complexing hydroxyl ions in the
solution next to the anode become insufficient, so that insoluble hydroxides or oxides
are formed. In the special case of tin anodes required to dissolve as stannate rather
than stannite, a pseudo-passivation effect of this kind is advantageous; the anode is
first passivated by the formation of stannic oxide at high current density, and
subsequent operation at lower current density enables the stannic oxide to dissolve in
the alkaline solution as stannate while being reformed anodically at the same rate. The
22
potential-pH conditions for these transformations can be seen in the diagram for tin
(Figure 2.3).

Figure 2.3: PotentialpH diagrams for SnH
2

2.3 Kinetic and Mechanism of Electrodeposition Process
2.3.1 Relationship between Current and Potential
In electrodeposition, the basic parameter which causes deposition to occur is the
potential at cathode. For any electrodeposition to take place, a current has to flow
through an electrochemical cell. When a net current flows through an electrochemical
cell, the electrode potential deviates from its equilibrium value. The difference between
the actual electrode potential (E
a
) and the equilibrium potential (E
e
) is the overpotential
(). It can be expressed by
E
a
=E
e
+ (2.8)
Activation overpotential refers to the energy needed to move ions across the interface
between electrolyte and electrode and to build the discharged atom (adatom) into the
23
crystal structure of the cathode deposit. For a single step process the current in an
activation controlled process responds to the electrode potential according to the
Butler-Volmer equation [Bockris and Reddy, 1977]:

=
T R
F n ) (1
exp
T R
F n
exp i i
o
(2.9)

where
=
e
E
T R
F n
exp C k F n i
o
o

In the above equations, k
O
is a rate constant; i
o
is the exchange current density; C is
the concentration of the metal ions at the interface and E, is the equilibrium potential of
the electrode. is the symmetry factor defined in terms of the ratio between distance
across double layer to summit of activation energy and distance across whole double
layer. To describe a multi-step process, must be replaced by an experimental
parameter, , which is called the transfer coefficient. Equation (2.9) retains a form
which emphasizes that the measured current density at certain overpotential is the sum
of the partial cathodic and anodic current densities. When is very low, say, <10 mV
and 5 . 0 = = , a limiting form of current density can be obtained
( ) T R / F i i
o
= (2.10)
Equation (2.10) shows that i depends linearly on . Another limiting form is when <-52
mV and the first term in the Butler-Volmer equation becomes negligible compared with
the second. The equation applying to this region can be written as:
T R 2.303
F
o
i log i log

=

(2.11)
which is known as the cathodic Tafel equation. Similarly, positive overpotentials greater
than 52 mV lead to the anodic Tafel equation. Figure 2.4 shows a log l i l vs curve for
a solution and the exchange current density and transfer coefficients are obtained from
the intercepts and slopes.

24

Figure 2.4: Plot of log l i l vs

2.3.2 Influence of Mass Transport on Electrodic Kinetics
The current-potential relationship defined by equation (2.9), (2.10), and (2.11) is valid
for the case where electrodic process is being controlled by the charges transfer.
Under the condition of mass transport control, the electrode reaction rate is determined
by the diffusion rate of the electroactive species. The concentration of the electroactive
species at the interface between electrode and electrolyte is lower than that in the bulk
solution. The concentration overpotential is expressed as follows:
( ) ) i/i (1 log F n / T R 2.303
L
C
= (2.12)
where i
L
is the limiting current density, which is defined as a current density at the
maximum rate of mass transport of electroactive species through the diffusion layer.
This occurs when the concentration of electroactive species at interface approaches
zero. By referring to first Ficks equation, the limiting current i
L
that is independent of
potential might be written as
25
=
) t 1 (
o
C D F n
i
L
(2.13)
where D is the diffusion coefficient, C
O
is the bulk concentration, and is the diffusion
layer thickness and depends on the diffusion, t
+
is the transfer number of electroactive
specie and convection conditions in the bath. The essence of mass transport is the
quantity . Decreasing can increase i
L
. Stirring the solution will decrease the effective
value of . When the process is a mixed control, the activation and mass-transport
processes always occur in series and they combine to determine the overall rate. A
general qualitative description of the relationship between current density and potential
is shown in Figure 2.5 [Gileadi, 1993]. i
L
is the limiting current density controlled by
mass transport.

Figure 2.5: A general qualitative description of the relationship between current density
and potential [Gileadi, 1993]

26
Diffusion layers are not formed immediately upon the application of potential,
but require several seconds or perhaps a minute, to be formed, depending on the rate
of agitation. On flat electrodes, thickness increase infinitely with time if there is no
convection. At the flat vertical electrodes, is fairly constant over most of the surface,
unless there are local variations in the rate of agitation but it is much smaller near the
leading edge, where the streaming electrolyte first encounters the electrode, and
especially on corners [Gileadi, 1993].

Figure 2.6: Schematic cross-section showing microroughness of cathode, at peaks (P),
supply of electroactive species is relatively rapid over the short distance from the
diffusion boundary, whereas at valley (V) it is too slow [Paunovic and Schlesinger,
1998].

Cathode
Diffusion
layer
BATH
27
The cathode surface is never entirely smooth. If the roughness profile has
dimensions about equal to the thickness of the diffusion layer, or somewhat smaller, its
thickness varies between micropeaks and microvalleys; it cannot follow the contours,
but is smaller over the peaks (Figure 2.6). During deposition, local thickness
differences in the diffusion layer affect a different supply of electroactive species toward
the cathode. On peaks diffusion layer is thin, and supply of ions faster than in
microvalley where there is a thicker diffusion layer.

2.3.3 Hydrogen Evolution
The above elementary discussion of deposition reaction was aimed at giving
the first essentials of how metal is deposited. However, the simultaneous reduction
reaction of two or more electroactive species may occur during electroplating. This
arises from the fact that one sometimes finds that there is less metal deposited than
there should be on the basis of Faradays laws, which requires that the deposition of
one gram equivalent of metal per faraday of electricity passed through the system. In
fact, in some cases, there is almost no deposit at all. In such cases, hydrogen evolution
is occurring. From a technological point of view, however, one seeks to deposit a metal
without wastage of electrical energy on hydrogen evolution. Basically, increases
current density higher than the limiting current density for the deposition of the metal is
due to hydrogen evolution. In aqueous solutions hydrogen will always be evolved if the
total deposition current is made sufficiently high; the hydrogen may come not only from
H
+
(of limited concentration) but also from the water itself. The effects of hydrogen co-
deposition on the crystallography of metal deposition are widespread and rather
complicated. Several starting paths to new effects and mechanisms may be noted,
however. Hydrogen atoms may adsorb more freely on certain crystal planes and block
them so that the metal grows preferentially on others. The development of a preferred
orientation of the deposit crystals can sometimes be ascribed to the preferential
adsorption of hydrogen on certain crystal facets (Bockris and Reddy, 1977). Hydrogen
28
may also permeate into the metal and change its mechanical properties. Finally,
removal of H
+
ions from the diffusion layer near the electrode changes its properties,
too, it makes the solution at interface becomes more alkaline. If the hydrogen reaction
leads to produce a sufficiently alkaline solution at interface, the solubility product of a
hydroxide of the metal ion present will be exceeded, which would cause precipitation
and may be contaminated the coating. Thus, hydrogen co-deposition produces many
things and they are usually destructive. The hydrogen evolution reaction from aqueous
solution can be presented as,
in acid solutions, the overall reaction is
2H
+
+2e H
2
+2H
2
O (2.14)
2H
2
O +2e H
2
+2OH
-
(2.15)
and in alkaline solutions, it is only
2H
2
O +2e H
2
+2OH
-
(2.16)
It should be noted however, in several electroplating cases such as zinc electroplating
in acid bath, hydrogen evolution reaction cannot be avoided.

2.3.4 Atomic Aspects of Electrodeposition
Electrodeposition or electrocrystallization is the process in electroplating
where the incoming metal ions are reduced and then join the metal deposit. The rate of
incoming metal ions is the main factor related to the structure formed. A low rate (low
current, low polarization) favors the growth of existing nuclei, while a high rate (high
current, high polarization) favors the formation of new nuclei. Other factors, which
affect the structure of the deposit, are the surface finish of the base metal, and the
effects of solution additive which are adsorbed onto the cathode surface and inhibit the
growth pattern [Doesburg and Ivey, 2000].

Electrocrystallization has two competing processes: nucleation and grain
growth. If a deposition starts on an electrode surface of a different material, that of the
29
object to be plated, the first step will be the formation of nuclei of the new phase and
their growth into crystals with the characteristic lattice. Then, once the electrode
surface is fully covered by a few atomic layers of this metal, the layer is thickened into
a macroscopic deposit. Nucleation is an improbable event and is achieved at an
electrode surface by the application of a large overpotential. The nuclei, once formed,
grow quite rapidly at comparatively low overpotentials, and in constant-current
operation. The overpotential will decrease substantially once nucleation has occurred.
The growth of the crystals occurs by incorporation of the individual metal atoms into the
crystal lattice [Sun, 1998].
.

Figure 2.7: Discharge site on a growing surface: (1) surface vacancy; (2) ledge
vacancy; (3) ledge kink; (4) ledge; (5) layer nucleous [Gabe, 1978; Pletcher and Walsh,
1990; Paunovic and Schlesinger, 1998; Doesburg and Ivey, 2000]

In general, electrocrystallization is the incorporation of the metal atoms into
the crystal lattice of the cathode during electroplating. There are two main factors,
which determine the type of structure, which is formed. The first is the current density,
which is directly related to the rate of incoming atoms, and the second is the inhibition
of the cathode surface by adsorbed substances. There are various sites on the cathode
surface onto which an atom can become attached. The diff and Ivey, 2000erent types
of sites are identified in Figure 2.7 [Gabe, 1978; Pletcher and Walsh, 1990; Paunovic
and Schlesinger, 1998; Doesburg and Ivey, 2000]. A surface vacancy (1) has minimum
30
energy, but these types of sites are not present in large numbers. Ledge sites (2, 3 and
4) are favorable for growth because they are repeatable steps. Once an adatom (one
neighbor) or adion diffuses to a ledge or ledge kink (where the atom can interact with
three neighbors) and is incorporated into the lattice, the same ledge structure is
present for the next growth step. The nucleation of a new layer (5) requires the most
energy.

Figure 2.8: Growth screw dislocation with a kinked growth ledge

A screw dislocation mechanism of crystal growth was proposed by Doesburg
et al. [2000], and allows growth without the need for nucleation of new layers. In this
manner a screw dislocation with the Burgers vector perpendicular to the crystal face
grows by the ledge mechanism, winding itself up like a spiral staircase (Figure 2.8)
[Gabe, 1978]. The screw dislocation mechanism is a rare case in electroplating and
operates at low current densities and overpotentials, where there is enough time for the
adions or adatoms to diffuse to the growth ledge and the overpotential does not
support the formation of new nuclei. This type of growth has been observed for copper
plated at low current densities from very pure sulfate solutions [Gabe, 1978; Pletcher
and Walsh, 1990; Paunovic and Schlesinger, 1998].

31
2.3.5 Growth Mechanism
According to Paunovic and Schlesinger [1998], there are two basic
mechanisms for formation of coherent deposit: layer growth and three-dimensional
(3D) crystallites growth (or nucleation-coalescence growth). A schematic illustration of
these two mechanisms is given in Figure 2.9. In the layer growth mechanism a crystal
enlarge by a spreading of discrete layer (steps), one after another across the surface.
In this case a growth layer, a step, is a structure component of a coherent deposit.
Steps, or growth layer, are the structural deposition of metals (e.g., columnar crystal,
whiskers, and fiber texture). It can be distinguished among monoatomic steps,
polyatomic microsteps, and polyatomic macrosteps. In general, there is a tendency for
a large number of thin steps to bunch into a system of a few thick steps. Many
monoatomic steps can unite (bunch, coalesce) to form a polyatomic step.

Figure 2.9: Schematic representation of layer growth (a,b) and the nucleation-
coalescence mechanism (c) [Paunovic and Schlesinger, 1998]

In the 3D crystallites growth mechanism the structural components are 3D
crystallites and a coherent deposit is built up as a result of coalescence (joining) of
these crystallites. The growth sequence of electrodeposition via nucleation-
coalescence consist of four stages: (1) formation of isolated nuclei and their growth to
32
TDC (3D crystallites), (2) coalescence of TDC, (3) formation of linked network, and (4)
formation of a continuous deposit.

The structure of the growing layer is determined largely by the relative rates of
electron transfer to form an adatom and diffusion of the adatom across the surface into
a position in the lattice, and the electrolysis conditions, including bath additives which
may radically modify the electrocrystallization process. At low current density, the
surface diffusion is fast compared with electron transfer and the adatom is likely to end
up in a favored site in the lattice. At higher current densities, surface diffusion is no
longer fast compared with electron transfer and further nuclei must form; the layer will
be less ordered [Gabe, 1978; Pletcher and Walsh, 1990]

During the thickening stage a key parameter is the current density. At low
current densities, surface diffusion is fast compared with electron transfer and both the
crystal lattice and structures such as screw dislocations can be well formed. The
predominant orientations of surface planes can also be determined using electron
diffraction. At high current densities, adatoms no longer reach their equilibrium position
in the lattice and nucleation of additional growth centers remains a more frequent
event. Hence the lattice formed will be less ordered and macroscale features, such as
steps, ridges and polycrystalline block growth become more likely. With further
increase in current density, outward growth of the layer becomes of increasing
importance and problems arising from mass transport control in solution can arise, e.g.
dendrites. Once this form of growth commences, it predominates because of the
enhanced rate of mass transport to the tip and the iR drop to the tip is also a minimum
as this is the closest point to the anode. A powdered texture usually results in the
completely mass-transport-controlled potential region.

33
Crystal growth mode is a strong function of overpotential and current density,
as shown in Figure 2.10. Displacement from the equilibrium potential not only results in
increasing current, but also influences the morphology of the deposit. At low
overpotentials, current density is low and crystal growth is epitaxial. Epitaxial growth
occurs when the lattice structure of the deposit is oriented the same direction as
crystals in the substrate.

Figure 2.10: Dependence of crystal growth mode and current density on overpotential
[Gabe, 1978; Pletcher and Walsh,1990]

As overpotential increases, the nature of the deposit changes until the limiting current
is reached and the deposit is powdery. At even higher overpotentials hydrogen
evolution ensues, the pH at the electrode surface becomes increasingly basic, and
oxides or hydroxides may be incorporated into deposit. Since epitaxial deposits exhibit
superior adhesive qualities [Dini, 1993], strike-plating baths are often operated at low
overpotentials and current densities. Cyanide copper strike baths typically operate at
10-30 mA/cm
2
, and copper pyrophosphate baths typically operate at 10-75 mA/cm
2

[Durney, 1984]. For purposes of comparison, copper sulfate plating baths operate at
30-500 mA/cm
2
[Lowenheim, 1978].
34

Carneval and Cusminsky [1981] reinvestigated the influence of current density
on the morphology of copper deposits from cyanide, pyrophosphate, sulfate, chloride,
and citrate electrolytes. They determine the deposit thickness at which the morphology
of the deposit changed from epitaxial to polycrystalline, and observed that as current
density increased, the thickness at which the deposit morphology changed to
polycrystalline decreased. For cyanide deposits, the transition occurred at 8-10 m for
current densities in the 10-30 mA/cm
2
range. They found that the thickness which the
deposit changes to polycrystalline was highest for the smallest anion, Cl
-
, and least for
the largest anion, P
2
O
7
4-
. The effect that the anion has on the morphology of the
deposit was greater at higher current densities than it was at lower current densities.

2.3.6 Development of Columnar Microstructure
The columnar microstructure is perpendicular to the substrate surface, is
shown schematically in Figure 2.11. This microstructure is composed of relatively fine
grains near the substrate but then changes to a columnar microstructure with much
coarser grains at greater distances from the substrate.

Figure 2.11: Schematic cross section (perpendicular to the substrate) of the columnar
deposit [Paunovic and Schlesinger, 1998]

35
The development of the columnar microstructure may be interpreted as the
result of growth competition among adjacent grains. The low-surface-energy grains
grow faster than the high-energy ones. This rapid growth of the low-surface-energy
grains at the expense of the high-energy grains results in an increase in mean grain
size with increased thickness of deposit and the transition from a fine grain size near
the substrate to a coarse, columnar grain size [Paunovic and Schlesinger, 1998].

2.4 Electrodeposition of Alloy
A large proportion of cast or wrought metals are alloys rather than pure
metals. This is because the properties of alloys vary over a wider range than those of
pure metals, and thus alloys can be designed to meet most of the mechanical or
chemical requirements more satisfactorily than pure metals. On the other hand,
electrodeposits are mostly unalloyed and are usually produced and used in a state of
fairly high purity. In fact, a lot of efforts are made to keep the plating baths free of
metallic contamination. This is not because the electrodeposited alloys are not
desirable, but because (1) the closer control required for the alloy deposition
complicates commercial electroplating processes, (2) the properties of the
electrodeposited alloys are not adequately known. Another less important reason is
that, electrodeposited metals, even at high purity, can display broader properties
according to the service requirement, by controlling the plating process [Kanani, 2004].

The most important practical consideration involved in the co-deposition of two
metals is that their deposition potentials should be fairly close together. The importance
of this consideration follows born the well-known fact that the more noble metal
deposits preferentially, frequently to the extent that the less noble metal can not be
deposited at all. Therefore, to simultaneously co-deposit the two metals, conditions
must be such that the deposition potential of the less noble metal can be attained
without employing an excessive current density. Hence, it is necessary to have the
36
potentials of the two metals close together [Gabe, 1978; Paunovic and Schlesinger
1998].

The table of standard electrode potentials, Table 2.1 may serve as a rough
guide for deciding if two metals may be co-deposition from a simple salt solution [Gabe,
1978]. The electrode potentials in Table 2.1 apply only to the equilibrium potentials of
the metals in a solution of their simplest ions with unit concentrations. These potentials
are just theoretically the most positive (most noble) potentials at which the metals can
be deposited. In actual deposition, because of polarization, the deposition potentials
are more negative than the equilibrium potentials.

Table 2.1: Standard reduction electrode potentials at 25 C [Gabe, 1978]

Metal couple E (Volts)
Au
3+
/Au +1.50
Au
+
/Au +1.70
Ag
+
/Ag +0.799
Cu
+
/Cu +0.52
Cu
2+
/Cu +0.337
Bi
3+
/Bi +0.317
Cu
2+
/Cu
+
+0.153
Sn
4+
/Sn
2+
+0.15
Al
3+
/Al - 1.66
Zn
2+
/Zn - 0.763
Fe
2+
/Fe - 0.44
Co
2+
/Co - 0.277
Ni
2+
/Ni - 0.25
Sn
2+
/Sn - 0.136
Pb
2+
/Pb - 0.126

Approximately, the potentials of Table 2.1 represent the potentials of metals in
slightly acid solutions of the simple salts, such as the chloride or sulfate. In solutions of
metals complex ions their potentials are more negative (less noble) than in their
uncomplexed states. Therefore this table can be utilized to derive some conclusions
regarding alloy deposition from acid solutions of simple ions. Metals which are close
together in Table 2.1 should generally be more readily co-deposited than metals which
are widely separated. For example, lead and tin, nickel and tin, copper and bismuth,
37
nickel and cobalt can be readily co-deposited to form alloys, because their potentials
are less than 0.1 volt apart. On the other hand, silver and zinc do not co-deposited
readily because of their potential difference of 1.5 volts apart.

For metals with rather large differences potentials as listed in Table 2.1, their
potential can be brought closer together by (a) increasing the current density, (b)
adjusting the concentration of species in solution, which can be achieved by
introducing complexants and (c) using organic additives to preferentially inhibit the
deposition of the more noble metal. However, these factors are effective only if the
polarization of the more noble metal is increased to a larger extent than is that of the
less noble metal [Zhang and Abys, 2000]. Brenner has listed five types of deposition
system:
(1) Regular solutions under diffusion control. Uncomplexed metal ions and two metals
of widely differing nobility.
(2) Irregular solution under cathode potential control. Static potential affected by
complexing alone; e.g. cyanide bath for copper-zinc alloys.
(3) Equilibrium solutions where at low current densities the bath metal concentrations
give the deposit metal directly; e.g. lead-tin alloys from acid baths.
(4) Anomalous solutions in which the less noble metal deposits preferentially; e.g.
iron, cobalt or nickel.
(5) Induced solutions in which a metal can be co-deposited as an alloy although it will
not deposit singly; e.g. molybdenum or tungsten with iron group metals.

The first three are classed as normal systems in that the proportions of metal deposited
may be estimated on the basis of the polarization curves of the individual metals. If the
two metals have similar polarization curves (Figure 2.12(a)) the deposit weight ratio is
i
1
z
1
/ i
2
z
2
where i
1
and i
2
are the individual current densities and z
1
and z
2
are the
38
respective electro-chemical equivalents. If the degrees of polarization are different
(Figure 2.12(b)) the deposit composition depends upon the potential.

Figure 2.12: Polarization behavior for co-deposition of metals M
1
and M
2
. (a) M
1
and M
2

having similar E/I curves, (b) M
2
polarizing more than M
1
[Gabe, 1978]

At the point intersection i
1
=i
2
and the weight ratio in the deposit must be z
1
/ z
2
, but
below this potential (more positive) the ratio is less while at more negative potential the
ratio is greater. The overall deposition rate (i
1
z
1
+i
2
z
2
) also varies with potential, of
course. In general alloy electrodeposits give corrosion resistances superior to those of
their constituents. This is particularly true for tin-nickel alloys, which are stable in cold
nitric acid and are not tarnished by foodstuffs of a sulphur-staining kind. At present
applications are relatively specialized, but the copper alloys have found wide
application for decorative use in the cosmetic jewellery field where their tarnish
resistance make their substitution for gold realistic. Other alloys having specific
application include cadmium-zinc for protection, iron-zinc for decoration and protection
and nickel-iron for magnetic shielding.

(a) (b)
39
2.4.1 Structure of Electrodeposited Metal / Alloys
In the majority of electrodeposited materials, the atoms are arranged in a
uniform, three-dimensional array. The volume over which this arrangement extends
uniformly is called, when many crystals form a solid material, they are called grains. If
the array of atoms is random, the material is amorphous. However, in materials
considered to be amorphous, there are generally still very small groups of atoms that
possess the same arrangement as crystals.

Most electrodeposits exist in one of three crystal habits (Figure 2.13). The
most common one is face-centered cubic (fcc) in which atoms or atom groups are
located at the corners of a cube and in the center of its faces. Another common crystal
structure is body-centered cubic (bcc) in which atoms or atom groups are located at the
corners of a cube and in its center. Materials less often have the hexagonal structure.
The atomic arrangement of the basal plane of the cube diagonal of the face-centered-
cubic one. The habits only differ in the third atom layer.

Figure 2.13: Unit cells of the three most importance lattices

In many electrodeposits there is a crystal direction that grows faster toward the anode
than the other ones. Grains possessing this direction can also grow sideways and
cover the less favorably oriented ones. They can grow sideways until they encounter
grains of the grains possessing the favorable growth direction. If the grains are not
BCC
FCC HCP
40
randomly oriented, the condition is called a texture. In the case of electrodeposits the
texture is a fiber axis because just as in a wire drawn through a die, the directions
perpendicular to preferred orientation are randomly oriented. When electrodeposits are
annealed, they generally recrystallize, the texture often changes.

2.4.2 Properties of Electrodeposited Metal / Alloys
The properties of metallurgical metals and alloys (cast or wrought) have been
studied comprehensively, and this knowledge has led to extensive and varied uses.
With the growth of technology, electrodeposits are also more and more applied to a
variety of engineering and scientific purposes and, consequently, more interest is
shown in their properties.

Table 2.2: Vickers microhardness (HV) for selected metals [Kanani, 2004]

Manufacturing process
Metal
Metallurgical Electrodeposition
Cadmium 30 50
Chromium 350 1000
Cobalt 200 500
Copper 50 150
Nickel 150 500
Zinc 30 130
Tin 10 10

The properties of electrodeposited metals often differ from those of cast or
wrought metals. The former may have finer grains, higher hardness, better mechanical
properties (tensile strength, ductility and Young's modulus), better electrical and
magnetically properties and better corrosion resistance [Cavallotti et al. 2005]. The
Vickers microhardness value is one of the simplest ways of demonstrating such
differences. From the data in Table 2.2, it will be clear that electrodeposited metal
coatings are uniformly harder than their counterparts prepared by other metallurgical
methods. Electrodeposited chromium is much harder than the metal obtained by
thermal means. Bright nickel is much harder, less ductile and has a higher tensile
41
strength than cast nickel [Kanani, 2004]. The mechanical properties of bulk metals may
be varied considerably by heat treatment or mechanical working. The properties of
electrodeposited metals also may be varied, but this is primarily achieved by altering
the conditions of deposition.

To obtain particular interest from industry, the electroplated alloys must
possess considerably better properties for a given application than pure metal
electrodeposits to compensate for the increased difficulty involved in the operation of
the alloy plating process. However, generally speaking, the properties of
electrodeposited alloys are still not well known. This has led to applications based on
their obvious characteristics. For example, electroplated brass and gold alloys are
utilized because of their color; cobalt nickel alloys are used for their brightness. Many
potential uses of electrodeposited alloys still need to be exploited, but these
applications must await the gathering of more data on the properties of the alloys.

2.4.3 Corrosion of Electrodeposited Alloys
Corrosion, according to the ASM Material Engineering is the chemical or
electrochemical reaction between a material, usually a metal, and its environment that
produces a deterioration of the material and its properties. The major requirements for
good corrosion protection are high corrosion resistance of the coating material, a pore-
free structure, and good adhesion.

2.4.3.1 Corrosion of Coating-Substrate Systems
The corrosion behavior of a coated part (a coating substrate system) is
determined by the corrosion resistance of the coating material in the respective
medium. However, this holds only for absolutely dense coatings that completely
separate the aqueous corrosive medium from the underlying substrate material. In
42
practice, coatings and thin films show pores, pin holes. And other defects after their
deposition, or they may be damaged by scratches or other wear mechanisms. Both
types of defects allow the corrosive medium to contact the substrate material or
interlayers and underlayers.

Figure 2.14: Schematic illustration of corrosion of coating substrate systems in the
presence of pores. M, metal. (a) More noble coating on less noble substrate (galvanic
corrosion). Increased corrosion of substrate material with small anodic area and large
cathodic area. (b) Less noble coating on more noble substrate (anodic corrosion).
Cathodic protection of substrate material, coating material dissolved, large anodic area,
small cathodic area.

The relative corrosion behavior depends on the materials combination, the
coating materials is either more noble or less noble than the substrate material, the
corrosion medium, and the specific conditions [ASM handbook]. The electrochemical
reactions are schematically illustrated in Figure 2.14. In the case of a more noble
coating (Figure 2.14a), the corrosion medium reaches the substrate material, and a
galvanic cell is formed between the anodic substrate material and the cathodic coating
material. This results in strong local corrosion of the substrate.

2.4.3.2 Electrochemical Corrosion Test
Because corrosion of metals in an electrochemical process, electrochemical
measurements are especially suited to it. The corrosion reaction occurs between the
cathodic and anodic parts of a corroding system, resulting in an electric current in the
metal and an ionic current in the electrolyte at the metal-electrolyte interface. The
Coating
Substrate
M
2+
{ O2 + H2O + 2e 2OH
-
}
More noble
Less noble
M1
M2
(a)
Less noble
More noble
O2 M
2+

M2
M1
(b)
O2
43
amount of current produced is a measure of the oxidation or reduction reaction, so it
provided information about the rate of the corrosion process.

Figure 2.15: Current density vs potential curve for a typical metal electrode in neutral or
acid solution. Active and passive regions are indicated with arrows [Wolf et al., 1995].
E
t1
: transpasive potential due to oxygen evolution on passive metal; E
t2
: transpasive
potential which indicates passive film dissolution.

Uniform corrosion of metals may occur as active or passive corrosion. The
corrosion rate and the corrosion mechanism depend on many variables such as the
electrochemistry of the metal surface, the composition and pH of the solution. A very
important variable is the electrochemical potential at the surface of the corroding metal.
Figure 2.15 shows the dependence of the current on the potential for a typical metal
electrode in neutral or acid solution.

At E =E
corr
metal continuously corrodes and the rate of this uniform corrosion
is equal to i
corr
. Curve (1) indicates the polarization behavior of anode process while
curve (2) illustrates the polarization behavior of cathodic process. At E > E
C
the
dissolution rate rises strongly up to i
crit
, the critical current (or critical current density) of
the corroding surface. Around the corresponding potential E
F
the metal surface is
covered with a dense surface layer, mostly an oxide, which prevents a further increase
44
of the active dissolution. At more positive potentials the protective layer grows thicker
and the decrease of the current indicates a very low corrosion rate in this passive state.
The passive corrosion, with a very low passive current density i
P
, extends over a rather
broad potential region until the right hand side where there is oxidation of water (4) and
for some metals transpassive dissolution (3) starts. The figure illustrates clearly the
electrochemical processes at the metal surface to be strongly dependent on the
potential [Wolf et al., 1995].

2.4.3.3 Dealloying
The selective dissolution of one component of an alloy (e.g. Zn from brass, Al from
bronze, Cu from Cu-Au, etc) leads to substantial changes in the composition and
properties of its surfaces. The corrosion process of various alloy systems has been
studied by many researchers and reviewed and summarized by Pickering or a dual-
element alloy system A-B, in the normal alloy content range (not extremely little A or B)
[Ateya et al. 1996]. When selective dissolution occurs, the topmost layers of the alloy
surface are depleted of the active component, and preferentially enriched in the more
noble component of the alloy. Ateya et al. developed phenomena of selective
dissolution, a some of the A atoms dissolve out of the topmost layer of the alloy, the
remaining B atoms lose some of their A nearest neighbors. The extent of this loss
depend on the prevailing potential, kinetic parameters of the dissolution of the A atoms
as well as their mole fraction within the alloy. The remaining B atoms may be only
mildly affected, become weakly bound to the lattice or, at the limit, become adatoms.
The structure of the top most layer becomes defective, to varying degrees, because of
the loss of the A atoms. As the concentration of the active component at the topmost
atom layer decrease, a concentration gradient is established normal to the alloy-
electrolyte interface. It drives the A atom from the nearest stoichiometric sub-surface
layers to diffuse through the developing highly defective noble metal-rich layer towards
the alloy surface and similarly the B atoms into the alloy, to support the reaction. The
45
repetition of this process, with deeper and deeper sub-surface layers, leads to the
gradual and uniform thickening of the resulting noble metal-rich layer, to progressive
depletion of the active metal in the surface region, and to continuous decrease of the
dissolution rate of A with time.

2.5 Electrodeposition of Copper-Tin Alloys

The available information concerning the electrodpeosition of copper-tin alloy is
virtually confined to the literature. Later claims concerning Cu-Sn alloy plating,
however, have been based upon the use of both alkaline cyanide and acid sulfate
electrolytes. Several recent reports on copper-tin cyanide and sulfate electroplating
systems are reviewed in the following [J acky, 1971; Helton et al. 1989; Pincincu et al.
2001]

2.5.1 Cyanide systems
J acky [1971] developed the electroplating of copper-tin-zinc alloy with cyanide
system. The J acky bath was comprised of 2.99-3.59 g/l Cu
+
, 1.35-1.64 g/l Zn
+
, 1.12-
1.49 Sn
4+
g/l, 20.22-23.21 g/l NaCN and 29.95-74.89 g/l Na
2
CO
3
. This bath can be
used for electrodeposition of a bright ternary alloy with composition generally in the
range of 50-60 % wt. copper, 20-30 % wt. tin, 15-25 % wt. zinc, when plated at current
densities of 5-45 ASF, temperature 120-180 F and a pH of between 12.3-12.7 without
the addition of the organic brightener [J acky, 1971]. Product plated with the J acky bath
or its close equivalent was found to encounter severe tarnishing problems as they
underwent a cleaning step prior to soldering.

Another patent gave a cyanide solution for plating an alloy of copper, tin, and
zinc [Helton et al. 1989]. The preferred electroplating bath composition includes a
predetermined amount of copper, tin, and zinc ions, and an effective amount of nickel
46
ions sufficient to promote the plating of corrosion resistant, bright silvery-colored plate
of copper-tin-zinc alloy. Nickel is added to the bath to enhance the inclusion of tin
within the plate alloy and is added at concentration between about 12.0 to 20.0 ppm
(weight/volume). The practical implementation of the bath included 2.99-3.59 g/l Cu
+
,
1.35-2.09 g/l Zn
+
, 1.12-1.49 Sn
4+
g/l, 23.21-26.21 g/l NaCN and 4.49-5.61 g/l NaOH,
plated at current density between 2-10 ASF and temperature 150 F (66 C). The bath
aims at obtaining an alloy of 60-70 % wt. copper, 20-30 % wt. tin and 5-10 % wt. zinc,
by Auger analysis using pure metal standard. The addition of sodium carbonate
appears to be optional. Since sodium carbonate is a by-product of the plating process
and appears in bath during plating. Test plates run as well run on bath composition
having 30 ppm nickel to produce a tarnished brown plate in areas of high current
density.

Copper-tin-zinc alloy codeposition using the chemistry of a commercial
alkaline cyanide system was studies by Pincincu et al. [2001]. The voltammetry, the
deposit composition and the morphology was investigated as a function of the
concentrations of the three metal ions, Cu(I), Zn(II) and Sn(IV) as well as the
concentration of cyanide, hydroxide, carbonate and Copper Glo additive. Over a range
of temperature and current density (or potential), deposits that were adherent, silver in
colour and highly reflecting could be produced and their composition in the range 47-
51% wt. copper, 8-12 % wt. zinc and 38-43 % wt. tin. The desired silver colour required
control of the alloy composition and an acceptable rate of deposition necessitated the
use of a temperature above ambient (333 K). The Copper Glo additive has the role of
improving reflectivity without changing the composition of the alloy.

2.5.2 Sulfate systems
A non-cyanide sulfate copper-tin alloy plating bath has been developed, which has the
advantage of low toxicity and relative ease of handling [Paunovic et al. 1998; Finazzi et
47
al. 2004; Survila et al. 2004). However, the electrolytes investigated have limitations,
such as susceptibility to corrosion, low solubility of copper and tin, bath decomposition
and the need for various additives, for example polyalcohol to improve the bath
properties and result in high quality deposits. Copper-tin plating bath containing sorbitol
as ligand has been developed by Finazzi [2004]. Bright reddish copper-tin
electrodeposited were successfully obtained with the deposit have a maximum of ~3%
of tin and that sorbitol was not incorporated in the deposit. The kinetic studies showed
that copper (II) species control the electrochemical process of the copper-tin deposition
and that this reduction process is controlled by mass transport, with a diffusion
coefficient of 8.1 x 10
-8
cm
2
s
-1
.

Survila et al. [2004] developed co-deposition of copper and tin from Acidic
Sulfate solution containing polyether Laprol 2402C. The electrolytic baths contained
0.01 M CuSO
4
, 0.01 M SnSO
4
, 0.6 M H
2
SO
4
, 50 mg/l of Laprol and various amounts of
potassium halides (Cl
-
, Br
-
, I
-
) to help efficiently control the composition of bronze
coatings. Introducing halide reduces the potential at which the copper and tin co-
deposition begins and narrows the potential range for producing deposits of yellow
bronze that contain 8-10% of tin. The optimum concentration of potassium halide for
controlling the composition of bronze coating decreased in the series I
-
<Br
-
<Cl
-
.

2.5.3 Plating Bath Selection
It has been mentioned previously in Chapter I, in electrodeposition of alloys, the
electrolyte and deposition conditions are chosen so that deposits have uniform
composition and properties over the course of the deposition process. Based on
equilibrium potential-pH diagrams for the systems Cu-H
2
O, Sn-H
2
O, Zn-H
2
O and Ni-
H
2
O which are presented in Figure 2.16, 2.3, 2.17 and 2.2 respectively, electroplating
can be done either in acid or in alkaline solutions. In acid solution electroplating may be
conducted by reducing simple cations (Cu
2+
, Sn
2+
, Zn
2+
, Ni
2+
) while in alkaline
48
deposition must be conducted by reducing complex anions such as HCuO
2
-
, CuO
2
2-
,
HNiO
2
-
, SnO
3
2-
, HZnO
2
-
and ZnO
2
2-
. Electroplating of metal/alloy from simple cation
onto non planar metal substrates tends to produce a non-uniform coating because local
deposition current density at location close to anode will be significantly higher than
that at locations far from the anode. Basically ternary Cu-Sn-Ni alloy can be co-deposit
during electroplating even though it should be done under mass transport control of
copper ion. Zinc is not expected to be deposited simultaneously with the copper
because its deposition potential is too low. It should be noted that no Cu-Sn-Ni-Zn alloy
deposition will occur except the deposition potential of copper can be lower close to Sn,
Zn, and Ni.

Figure 2.16: PotentialpH diagrams for CuH
2

Deposition of copper from alkaline solution is disfavor due to the solubility limit
of copper ions. At pH of about 13 (Figure 2.16), the copper ions appear as HCuO
2
-
and
CuO
2
2-
. Their solubility limits at this pH are <10
-5
mol/L. Electrodeposition of copper
from this solution might resulting copper powder adherence to substrate. As a
49
consequent, it is not convenient to electrodeposit copper from alkaline solution.
Moreover, the equilibrium reduction potentials (E) of those anions at 25 C are
influenced by pH and their relationships may be expressed as follows;
HCuO
2
-
+3H
+
+2 e =Cu +2 H
2
O, E=1.127 0.0886 pH +0.0295 log
2
HCuO
a V (2.17)
CuO
2
2-
+4H
+
+2 e =Cu +2 H
2
O, E=1.515 0.1182 pH +0.0295 log
2
2
CuO
a V (2.18)
These equilibrium reduction potentials are markedly higher than those for HNiO
2
-
,
SnO
3
2-
, HZnO
2
-
and ZnO
2
2-
which can be examined in the equilibrium potential-pH
diagrams Figure 2.2, 2.3 and 2.17, respectively. Therefore, co-deposition of copper
with these ions, especially with zinc cannot be conducted from simple alkaline
solutions. On the other hand, copper cyanide can be dissolved in the presence of
excess cyanide to form cyanocuprate ions Cu(CN)
2
-
, Cu(CN)
3
2-
and Cu(CN)
4
3-
in
alkaline solutions. Since the stability of these species is influenced by pH and potential,
potential-pH diagrams presented in Appendix A are required to discuss their stability
region and their equilibrium reduction potentials.

Figure 2.17: PotentialpH diagrams for ZnH
2
50
As shown in those potential pH diagrams, with increasing CN:Cu mole ratio, the
distribution of copper cyanide species shifts more completely to the highly coordinated
complex (Cu(CN)
4
3-
) at a high cyanide concentration than that at low cyanide
concentration. The equilibrium reduction potential of cyanocuprate ions decreases with
increasing CN:Cu mole ratio. Increasing the pH is similar to increasing free cyanide
concentration. In contrast, increasing temperature results in decreasing stability
constants, therefore the distribution of copper cyanide shift to the lowly coordinate
complexes. Because the reduction potential of cyanocuprate ions can be markedly
lowered, e.g. by adjusting Cu:CN mole ratio in the electroplating bath, deposition of
copper can be simultaneously occur with tin, nickel and even zinc and binary Cu-Sn
and quarternary Cu-Sn-Zn-Ni alloys coatings can be developed in many metal
substrates.
Tin can be deposited from SnO
3
2-
which is dissolved in alkaline solution as
shown in equilibrium potential-pH diagram Figure 2.3. Its solubility increases with
increasing pH. However the solubility of this ion is limited because the more stable
oxide (SnO
2
) might be precipitated. This tin ion is not influenced by the presence of
cyanide ions. The equilibrium potential-pH diagram for the zinc-water system also
exhibits the solubility of both HZnO
2
-
and ZnO
2
2-
ions is increased with increasing pH.
ZnO
2
2-
ions is predominant in very alkaline solution (pH>13).

More uniform deposit can be obtained for the electroplating which is
influenced by mass transfer of cation toward the cathode especially at locations closer
to anode. The rate of mass transfer of the cation may be formulated as follow:
J
T
=J
C
+J
D
+J
M
(mol/cm
2
sec) (2.20)
where J
T
, J
C
, J
D
, and J
M
are total flux of ion, convection flux, diffusion flux and migration
flux, respectively. In contrast electroplating from complex anion from alkaline solution
will tends to produce more uniform coating because the complex anion will migration
51
away from the cathode and the rate of migration will be higher at locations closer to
anode.
J
T
=J
C
+J
D
- J
M+
(mol/cm
2
sec) (2.21)
This phenomenon is also appeared during electroplating using alkaline cyanide
solution. It is also contributed by the presence of cyanide ions that can create the
condition at which the deposition of copper from highly coordinated complex Cu(CN)
4
3-

is disfavor. Electroplating from alkaline solution including alkaline cyanide bath will
have advantages such as (1) electroplating bath has higher covering power; (2) more
uniform thickness coating can be formed on non planar substrate; (3) solution is not
very corrosive compared to acid solution; (4) Mostly hydrogen evolution is more difficult
to from. Therefore the coating is less brittle than that produced in acid solution.
Alkaline cyanide baths have been selected in this research works. Beside those
advantages the utilization of cyanide baths allow the electroplating of quaternary Cu-
Sn-Zn-Ni alloys can be conducted.

2.5.4 Properties of Copper-Tin Alloys
Copper-tin alloys are materials that have good corrosion resistance,
malleability, ductility and solderability. These alloys are used industrially for metal
coating, with the aim of conferring corrosion protection and mechanical properties to
the substrate and therefore the proportions of copper and tin in the alloy are of
fundamental importance in obtaining the desired characteristic [Finazzi et al., 2004].

White Miralloy coatings contain about 55 % of copper and 45 % of tin, or 55 %
of copper, 30 % of tin and 15 % of zinc. Yellow Miralloy coatings as alloy components
on an average contain 80 % of copper, 17.5 % tin and 2.5 % of zinc, or 85 % of copper,
10 % of tin and 5 % of zinc, or 85 % of copper and 15 % tin. Miralloy coatings are
characterized by an excellent thickness distribution even in the case of parts with
52
complex shapes. The coating hardness of Yellow Miraloy and White Miralloy are 400
HV 0.1 and 550 HV 0.1, respectively [http:/www.umicore-galvano.com].

The coating is extremely abrasion-resistant, for this reason Yellow Miralloy
coatings are particularly for coating bearing shells or piston. White Miralloy coatings
exhibit an acceptable contact resistance, for this reason they are used for coating
connectors in the motor industry. The solderability of the coating is good with suitable
fluxes. Furthermore, the coatings are diamagnetic. Therefore connectors for high-
frequency technology provided with Miralloy coatings reach very low intermodulation
values in the mobile radio frequency range. Copper has become the metal of choice to
meet the needs of present and future generation devices. In order to further improve
the intrinsic resistance of copper to EM/SM induced failure, researchers have
attempted to introduce various alloying elements into copper lines.

Copper has become the metal of choice to meet the needs of present and
future generation devices. The copper-tin system has shown significantly higher
electromigration lifetimes and activation energy than pure copper. The continuing
shrink in device size, the copper-tin has generated great interest to create
interconnects with low resistivity and superior electromigration (EM) and stress
migration (SM) lifetimes in comparison to the existing Al or Al-alloy interconnections
[Padhi et.al. 2003]. Hu et al. [1995] studied the impact of addition of Mg, Sn, and Zr on
the EM of sputtered copper lines. They concluded that the drift velocity of copper
increased by addition of Mg, while addition of Sn and Zr resulted in reduction of drift
velocity. Activation energy for EM of copper increased from 0.75 to -1.3 eV with
addition of 1 wt. % Sn, while the resistivity increased to 4.1 mV/cm
2
. Furthermore, due
to the low solid solubility of tin into copper, the copper-tin system is amenable to heat
treatment to produce precipitation of intermetallic phases and segregation of solute
species to grain boundaries, thereby, reducing the aggregate resistivity of the alloy. In
53
addition to improved resistance to EM induced voiding, copper-tin alloy films have
superior resistance to corrosion, which is very desirable in the processing of multilevel
Cu-wiring.

2.6 Electrodeposition of Multilayers
Multilayer alloys are the materials which consist of multiple alternate layers of
at least two suitable metals/alloys. These materials have been found to possess
outstanding properties, such as enhanced tensile strength and microhardness, and
improved wear resistance [Tench et al. 1984, 1991; Ebrahimi et al. 1998; 2001]. The
enhancement is attributed to the unique multilayered structure of these composites,
i.e., the blocking effect of the structure to dislocation glide from one layer to another.
The merit of this structure is that the composition and properties of its component
layers can be adapted individually. Thus, the properties of the composites are
designable and predictable. By choosing suitable combination of the metals and
appropriate processing parameters, the nature of the interface between the layers can
be modified also. Two possible processes can be considered in electrodeposition of
metallic multilayers, single bath and dual bath technique.

The single-bath technique, in these processes only multilayers with elements
capable of being electrodeposited from a one electrolyte containing both elements can
be produced [Haseeb et al. 1992; Roy, 1998; Miyake et al. 2001]. A pure metal and an
alloy of first metal and a second less noble metal are plated successively by changing
the current density, by controlling diffusion near the cathode surface, by changing the
agitation or by a combination of these parameters [Haseeb et al. 1992; NabiRahni et al.
1996]. The deposition potential of the two constituents should be far enough apart
allow the separated deposition of each element. The single bath technique is in fact a
pulsed plating process in which at higher overpotential or current the less noble
54
constituent, and at lower overpotential or current the more noble constituent are
deposited [Haseeb et al. 1992].

Lashmore and Dariel [1988] prepared Ni/Cu multilayered coatings from single
nickel sulfamate electrolyte with added copper content. Their processing was based on
the disparity in standard potentials of nickel and copper, which is given in Table 2.1.
According to this table, E
o
Cu
++
/Cu, =+0.34 V, and E
o
, Ni
++
/Ni =-0.25 V. There is a
potential gap between Cu and Ni, and Cu is a more noble element than Ni. If the
cathode potential is between +0.34 V and -0.25 V, only copper ions can discharge. If
the cathode potential is more negative than -0.25 V, both copper and nickel can be
deposited. However, if the copper ion concentration is much lower than that of nickel,
and the deposition time is very short, only nickel can be deposited in the latter case.
This is because the copper deposition is controlled by copper ion diffusion from bulk
solution to the vicinity of the cathode surface. Therefore, by controlling the cathode
potential, copper ion concentration, and the deposition time, nickel and copper can be
separately and alternately plated on the same substrate from a single electrolyte. Their
nickel sulfamate electrolyte contained 90 g/l Ni, 0.9 g/L Cu in the form of copper
sulfate, and 30 g/L boric acid at pH ranging from 3 to 3.5.

Figure 2.18: The current pulse electroplating of Cu/Ni multilayered composites.
55
A platinum sheet was used as the anode, and a copper single crystal sheet
was employed as the cathode substrate. The cycle consisted of a short and high
current pulse for depositing the nickel layer, and a long but low current pulse for
depositing the copper layer (Figure 2.18). Between them, a short, zero current pulse
was designed to improve the sharpness of the nickel-copper interface. Copper was
deposited at 0.3 mA/cm
2
and nickel at 12-20 mA/cm
2
current densities. The thickness
of each Cu or Ni layer was about 10 nm. An overall thickness of 15-20 m was
deposited [Lashmore et al. 1988].

The dual-bath technique employs two separate electrolytic plating baths. The
substrate is successively transferred between separate plating baths and each layer is
deposited alternately to laminate the sublayer from the relevant bath. The plated parts
are activated prior to entering the first solution, plated and subsequently rinsed and
activated all again before entering the second solution [Haseeb et al. 1994; Wang
1997]. Interesting results using dual bath technique have recently been published by
Hasseb et al. (1994). They conducted electrodeposition of Cu/Ni compositionally
modulated Multylayer with sublayer thickness in the nanometer range.
Electrodeposition of copper was carried out in a copper sulfate bath (90 g/l CuSO
4
.
5H
2
O and 200 g/l H
2
SO
4
) while nickel was deposited from a nickel sulfamate bath (400
g/l Ni(NH
2
SO
3
)
2
and 30 g/l H
3
BO
3
) both maintained at temperature 30 C. Both copper
and nickel were deposited galvanostatically at a current density of 20 mA/cm
2
and the
thickness of copper and nickel sublayers were kept equal.

In the single bath technique, the type of ion discharging on the cathode
surface is determined by the electrochemical potential and mass transport (ion
diffusion). The major merit of this process is high efficiency, especially for the
deposition of nano-scale multilayers. However, not any two metal combinations can be
deposited in this way because of the requirement of a relatively wide standard
56
electrode potential gap between the two metals. Since co-deposition is not completely
eliminated, the concentration profile at the interface can not be very sharp. Although it
is very efficient in thin layer deposition, this method may not be applicable to thick
layered specimen preparation because the pulse time of the less noble species is
limited by the diffusion of the more noble species. Other difficulties involve the
designing of the electrolyte composition and the maintenance of the concentration ratio
of the two metal ions. These difficulties and limitations prompt us to use another
process in which two metals are deposited alternately from two separate electrolytes.

2.6.1 Compositionally Modulated Multilayer Alloy Applications
Compositionally modulated multilayer alloy are the materials which consist of multiple
alternate layers of at least two suitable metals. These composites have been found to
possess outstanding properties, such as enhanced tensile strength and microhardness,
and improved wear resistance [Tench et al., 1991]. The enhancement is attributed to
the unique multilayered structure of these composites, i.e., the blocking effect of the
structure to dislocation glide from one layer to another. The merit of this structure is
that the composition and properties of its component layers can be adapted
individually. Thus, the properties of the materials are designable and predictable. By
choosing suitable combination of the metals and appropriate processing parameters,
the nature of the interface between the layers can be modified also. Therefore,
mechanical properties of these multilayers can be controlled over a wide range.

Several measurements of mechanical properties of metallic multilayers have
been conducted. These works involved indentation microhardness measurement and
tensile tests [Tench et al., 1991]. A common conclusion made from these tests was
that, as the layer spacing decreases, the tensile strength and microhardness of the
materials increase. The enhancement effect was attributed to the influence of the
57
interfaces of micro-layered structure to dislocation behavior. Two general models were
employed to explain this effect. One is Koehler's modulus theory which indicates that
the interfaces of multilayered structure can offer strong barrier to dislocation glide from
lower modulus metal to higher modulus metal when two moduli differ greatly. He found
a relation for the minimum shear modulus required for dislocation transmission to occur
as,
b a
b a b

8
min
+
(2.22)
where
a
is the shear modulus of material a,
b
is the shear modulus of material b.
Another is the Hall-Petch relation which gives the dependence of the strength on the
layer spacing where the image force increases with decreasing layer spacing. Hall-
Petch relation is expressed as,
Y
=
O
+Kd
-n
(2.23)
where
Y
is the yield strength of materials, d is the thickness of layers,
O
and K are the
constants related to the properties of the materials, n is the exponential which is
typically taken as 0.5. Hall-Petch relation is applicable to most bulk polycrystalline
materials during low-temperature deformation. For multilayer, this relation also gives
reasonably accurate prediction of the dependence of strength on layer spacing.
However, as the layer spacing is reduced below a critical value, the tensile strength of
the composites even decreases with decreasing the layer thickness. This loss in
strength enhancement was attributed to incoherence or misfit dislocation formation at
the layer interfaces.

Tench et al. [1991] studied the tensile strength of Ni/Cu multilayered alloys. A
wide range of copper layer thickness, from 3.20 to 0.01 m, was prepared but the
composition was always controlled at 90%Ni-10%Cu. The total thickness of deposits
was about 50 m. The tensile test data, shown in Figure 2.19 [Tench et al. 1991],
indicated that the tensile strength remained practically constant at about 600 MPa
58
down to a thickness of about 0.4 m, and then increased sharply to about 1300 MPa
for thicknesses in the 0.01 m range. Pure nickel specimens deposited from the same
bath were also tested. The measured tensile strength was always < 400 MPa,
indicating that the multilayered structure yielded a factor of three time improvement.

Figure 2.19: Tensile strength vs. copper layer thickness for 90%Ni-l0%Cu
electrodeposited multilayered [Tench et al. 1991]

Drastic changes in tensile strength, ductility and other mechanical properties
have been reported by a number of researchers. Other, perhaps even more interesting
properties such as magnetic, optical, physical and chemical properties are known to
change as well. Compositionally modulated alloy and/or laminated nanostructures can
be looked upon as new materials because the two alternating metals in the structure
are constantly blocking the formation of the individual structure that each of the two
metals would approach if allowed to form in the pure state [NabiRahni et al. 1996].
Some of the most promising compositionally modulated alloy results indicate several
interesting applications:
59
(i) The use of structures with high tensile strength or corrosion resistance in
micromechanics, with such potential applications as biocompatible, implantable drug
delivery pumps in medicine;
(ii) Information storage devices using a perpendicular, i.e. out-of-plane orientation of
the magnetization vector to create true vertical recording (for hard discs) also, for
nanomizing chip circuit designs and magnetic thin films;
(iii) Optical devices such as laser mirrors or mirrors for long-wavelength neutrons;
(iv) Implantable micromechanical pumps for monitoring and drug delivery.

Electroplating of Cu-Sn Alloys and

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ELECTROPLATING OF Cu-Sn ALLOYS AND

COMPOSITIONALLY MODULATED MULTILAYERS OF

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