Unipolar Hall Switch - Lo Low Sensitivity: Ordering Code
Unipolar Hall Switch - Lo Low Sensitivity: Ordering Code
Ordering Code
Product Code Temperature Code Package Code Option Code Packing Form Code
US5881 E UA AAA-000 BU
US5881 L UA AAA-000 BU
US5881 E SE AAA-000 RE
US5881 L SE AAA-000 RE
Legend:
Temperature Code: L for Temperature Range -40C to 150C
E for Temperature Range -40C to 85C
Package Code: UA for TO-92(Flat),
92(Flat), SE for TSOT3
Packing Form: RE for Reel, BU for Bulk
Table of Contents
3 Glossary of Terms
MilliTesla (mT), Gauss Units of magnetic flux density:
1mT = 10 Gauss
RoHS Restriction of Hazardous Substances
TSOT Thin Small Outline Transistor (TSOT package) also referred with the Melexis
package code SE
ESD Electro-Static Discharge
BLDC Brush-Less Direct-Current
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximum-
rated conditions for extended periods may affect device reliability.
SE package UA package
7 Magnetic Specifications
DC Operating Parameters T A = 25oC, VDD = 12V (unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Units
Operating Point BOP 15 25 30 mT
Release Point BRP 9.5 20 - mT
Hysteresis BHYST 2 4.3 5.5 mT
Table 4: Magnetic specifications
South pole
The chopper-stabilized amplifier uses switched capacitor technique to suppress the offset generally observed
with Hall sensors and amplifiers. The CMOS
CM technology makes this advanced technique possible
po and
contributes to smaller chip size and lo
ower current consumption than bipolar technology. The
he small chip size is
also an important factor to minimize th
he effect of physical stress.
This combination results in more stablle magnetic characteristics and enables faster and more
m precise design.
The wide operating voltage from 3.5V to 24V, L and E operating temperature range and d low current
consumption make this device especiaally suitable for automotive solid state switch applica
ations.
10 Unique Features
The US5881 exhibits unipolar magnet
agnetic switching characteristics. Therefore, it operates on
nly with one
magnetic pole.
A magnetic hysteresis BHYST keeps BOP and BRP separated by a minimal value. This hysterresis prevents
output oscillation near the switching point.
po
11 Performance Graphs
11.1 Typical Magnetic Switch Points vs 11.2 Magnetic Switch Poiints vs
VDD Temperature
12 Application Informatio
on
13 Application Comments
ts
For proper operation, a 100nF bypass
s capacitor should be placed as close as possible to tthe device between
the VDD and ground pin.
When a weak power supply is used or when the device is intended to be used in noisy envi vironment, it is
recommended that figure 13.3 from the Application Information section is used.
The low-pass filter formed by R1 and C1
C and the zener diode Z1 bypass the disturbances or voltage spikes
occurring on the device supply voltage
age VDD. The diode D1 provides additional reverse volta
tage protection.
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMDs (Surface Mount Devices) and THDs (Through Hole Devices)
EN60749-20
Resistance of plastic- encapsulated SMDs to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMDs (Surface Mount Devices) and THDs (Through Hole Devices)
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification
tests have to be agreed upon with Melexis.
The application of Wave Soldering for SMDs is allowed only after consulting Melexis regarding
assurance of adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For
more information on qualifications of RoHS compliant products (RoHS = European directive on the
Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.aspx
15 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
16 Package Information
16.1 SE Package (TSOT-3L)
0.95 BSC
0.30
0.45
2.90 BSC
1.90 BSC
see note 3
0.15
0.20
- 0.007
0.127 +0.023
0.20
0.891 +/-0.05
3.00+/-0.20
1.65+/-0.10
see note 4
2.5 min
14.5+/-0.5
17 Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing
in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding
the information set forth herein or regarding the freedom of the described devices from patent
infringement. Melexis reserves the right to change specifications and prices at any time and without
notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for
current information. This product is intended for use in normal commercial applications. Applications
requiring extended temperature range, unusual environmental requirements, or high reliability
applications, such as military, medical life-support or life-sustaining equipment are specifically not
recommended without additional processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall
not be liable to recipient or any third party for any damages, including but not limited to personal injury,
property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or
consequential damages, of any kind, in connection with or arising out of the furnishing, performance or
use of the technical data herein. No obligation or liability to recipient or any third party shall arise or
flow out of Melexis rendering of technical or other services.