LM 6172
LM 6172
LM6172 Dual High Speed, Low Power, Low Distortion, Voltage Feedback Amplifiers
Check for Samples: LM6172
1FEATURES DESCRIPTION
2 (Typical Unless Otherwise Noted) The LM6172 is a dual high speed voltage feedback
amplifier. It is unity-gain stable and provides excellent
Easy to Use Voltage Feedback Topology DC and AC performance. With 100MHz unity-gain
High Slew Rate 3000V/s bandwidth, 3000V/s slew rate and 50mA of output
Wide Unity-Gain Bandwidth 100MHz current per channel, the LM6172 offers high
performance in dual amplifiers; yet it only consumes
Low Supply Current 2.3mA/Channel
2.3mA of supply current each channel.
High Output Current 50mA/channel
The LM6172 operates on 15V power supply for
Specified for 15V and 5V Operation systems requiring large voltage swings, such as
ADSL, scanners and ultrasound equipment. It is also
APPLICATIONS specified at 5V power supply for low voltage
Scanner I-to-V Converters applications such as portable video systems.
ADSL/HDSL Drivers The LM6172 is built with TI's advanced VIP III
Multimedia Broadcast Systems (Vertically Integrated PNP) complementary bipolar
process. See the LM6171 datasheet for a single
Video Amplifiers amplifier with these same features.
NTSC, PAL and SECAM Systems
ADC/DAC Buffers
Pulse Amplifiers and Peak Detectors
Connection Diagram
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright 19992013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM6172
SNOS792D MAY 1999 REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human body model, 1.5k in series with 100pF. Machine Model, 200 in series with 100pF.
(4) Continuous short circuit operation can result in exceeding the maximum allowed junction temperature of 150C.
(5) The maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max) TA)/JA. All numbers apply for packages soldered directly into a PC board.
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
(3) Large signal voltage gain is the total output swing divided by the input signal required to produce that swing. For VS = 15V, VOUT =
5V. For VS = 5V, VOUT = 1V.
(4) The open loop output current is the output swing with the 100 load resistor divided by that resistor.
5V DC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TJ = 25C, V+ = +5V, V = 5V, VCM = 0V, and RL = 1 k. Boldface limits
apply at the temperature extremes
Symbol Parameter Conditions Typ LM6172I Units
(1)
Limit
(2)
5V AC Electrical Characteristics
Unless otherwise specified, TJ = 25C, V+ = +5V, V = 5V, VCM = 0V, and RL = 1 k.
Symbol Parameter Conditions LM61722 Units
Typ
(1)
Figure 2. Figure 3.
Figure 4. Figure 5.
Figure 6. Figure 7.
Figure 8. Figure 9.
CMRR PSRR
vs. vs.
Frequency Frequency
PSRR
vs.
Frequency Open-Loop Frequency Response
Figure 42.
APPLICATION NOTES
Another possible source of overshoot and undershoot comes from capacitive load at the output. Please see
DRIVING CAPACITIVE LOADS for more detail.
Figure 44. The LM6172 Driving a 510pF Load with a 30 Isolation Resistor
Figure 45. The LM6172 Driving a 220 pF Load with a 50 Isolation Resistor
LAYOUT CONSIDERATION
USING PROBES
Active (FET) probes are ideal for taking high frequency measurements because they have wide bandwidth, high
input impedance and low input capacitance. However, the probe ground leads provide a long ground loop that
will produce errors in measurement. Instead, the probes can be grounded directly by removing the ground leads
and probe jackets and using scope probe jacks.
TERMINATION
In high frequency applications, reflections occur if signals are not properly terminated. Figure 48 shows a
properly terminated signal while Figure 49 shows an improperly terminated signal.
To minimize reflection, coaxial cable with matching characteristic impedance to the signal source should be
used. The other end of the cable should be terminated with the same value terminator or resistor. For the
commonly used cables, RG59 has 75 characteristic impedance, and RG58 has 50 characteristic impedance.
POWER DISSIPATION
The maximum power allowed to dissipate in a device is defined as:
PD = (TJ(max) TA)/JA
Where
PD is the power dissipation in a device
TJ(max) is the maximum junction temperature
TA is the ambient temperature
JA is the thermal resistance of a particular package
For example, for the LM6172 in a SOIC-8 package, the maximum power dissipation at 25C ambient
temperature is 780mW.
Thermal resistance, JA, depends on parameters such as die size, package size and package material. The
smaller the die size and package, the higher JA becomes. The 8-pin DIP package has a lower thermal
resistance (95C/W) than that of 8-pin SO (160C/W). Therefore, for higher dissipation capability, use an 8-
pin DIP package.
The total power dissipated in a device can be calculated as: PD = PQ + PL (2)
PQ is the quiescent power dissipated in a device with no load connected at the output. PL is the power dissipated
in the device with a load connected at the output; it is not the power dissipated by the load.
Furthermore,
PQ = supply current x total supply voltage with no load
PL = output current x (voltage difference between supply voltage and output voltage of the same supply)
For example, the total power dissipated by the LM6172 with VS = 15V and both channels swinging output
voltage of 10V into 1k is
PD = PQ + PL
= 2[(2.3mA)(30V)] + 2[(10mA)(15V 10V)]
= 138mW + 100mW
= 238mW
Application Circuits
REVISION HISTORY
www.ti.com 27-Jul-2016
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 27-Jul-2016
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Mar-2013
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Mar-2013
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2016, Texas Instruments Incorporated