Hyperlynx Thermal User Manual: Software Version 9.1A
Hyperlynx Thermal User Manual: Software Version 9.1A
User Manual
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Table of Contents
Chapter 1
Getting Started with HyperLynx Thermal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
HyperLynx Thermal Basics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Starting HyperLynx Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
HyperLynx Thermal Tutorial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Creating a New Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Preparing a Board for Thermal Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Performing Thermal Analysis and Reviewing the Results . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Tips on using HyperLynx Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Chapter 2
Importing Designs and Power Files. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
The Expedition PCB and BoardStation XE Interfaces to HyperLynx Thermal . . . . . . . . . . 19
Setting up the Expedition PCB Interface to HyperLynx Thermal . . . . . . . . . . . . . . . . . . . 19
Importing a Design from Expedition PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Back Annotating Thermal Actuals to CES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Importing a Design using the IDF Interface Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Importing a Power File . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Chapter 3
Library Names, Units, and Files . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Component Naming Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Package Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Part Name Suffixes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Prefixes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Microprocessors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Units. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Conversion of Units . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Files . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Chapter 4
Critical Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Metal Volume Fraction in Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Air Flow / Temperature at Boundary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Power Dissipation Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Pin Dimensions / Component Height . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
THETAjc - Junction to Casing Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
THETAsa - Sink to Air Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Chapter 5
Advanced Modeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Decreasing the Thermal Output of a Component . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Relocating Overheated Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Conduction Pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Heat Sink. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Thermal Screw . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Heat pipe . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Modeling a Chip or MCM on the Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Modeling Daughter Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Modeling Parallel Daughter Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Modeling Perpendicular Daughter Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Metal Core or Thick Ground Plane in Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Metal Strips on the Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
An-isotropic Wiring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Adjacent Board or Wall Effects. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Chapter 6
Industry Tips . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Avionic/Space Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Closed System. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Air Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Component Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Board Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Others . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Computer/Instrumentation Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Heat Sink or Chip Fan. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Adjacent Boards/Walls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Short-Cut for Large Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Telecom/Industrial-Control Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Natural Convective Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Power Supplies / Automotive Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
High Current Traces on the Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Chapter 7
Background on Thermal Modeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Heat Transfer Background. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Conduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Convection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Radiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Heat Transfer On Electronic Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Reliability Background . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Interfacing a HyperLynx Thermal file into RELEX Reliability Software . . . . . . . . . . . . . 53
Chapter 8
Troubleshooting and Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Chapter 9
Program Specifications and Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Package types supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Types of air flow supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Chapter 10
HyperLynx Thermal Menus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
File Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
View Menu. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Library Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Board Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Placement Menu. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Environment Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Analyze Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Chapter 11
HyperLynx Thermal Dialog Boxes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Board Property Definition Dialog Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Boundary Condition Definition Dialog Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Specifying Boundary Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Component Properties Dialog Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Analysis of Components Placed Outside the Board Outline . . . . . . . . . . . . . . . . . . . . . . . 80
Edit Master Library Dialog Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Edit Material Library Dialog Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Edit Part Dialog Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Edit Working Library Dialog Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Environment Condition Definition Dialog Box. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Local Property Definition Dialog Box. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Power Dissipation Editor Dialog Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Thermal Via Definition Dialog Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Trace Power Density Dialog Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Trace Properties Dialog Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Glossary
Third-Party Information
End-User License Agreement
Use HyperLynx Thermal to analyze board-level thermal problems on placed, partially routed, or
fully routed PCB designs from all popular PCB layout environments.
Temperature profiles, gradients, and excess temperature maps enable you to resolve board and
component overheating early in the design process.
Product Overview
HyperLynx Thermal performs a detailed analysis of the air convection from the pins and the
thermal conduction through component sides, pins and the bottom air gap to the board. Flow
conditions used can be forced or can be by natural convection. The natural convective flow is
always calculated. In all cases, the total flow velocity is the combined result of natural
convective flow and the forced flow.
The board is very important in conducting heat among components and to the air. The heat
transfer properties of the board are evaluated by considering all of the layers of materials across
the board thickness. The layers considered are the copper wires and the base board material
(which may be epoxy or some other, similar, material).
Restriction
This functionality is not available with the HyperLynx Thermal Light licensing option. To
check which version of HyperLynx Thermal you have, select Help > About.
Review all of your components in the Edit Working Library Dialog Box for correct powers and
other entries. Power can be imported from a text file, or entered manually. Now you can run the
analysis and check the results.
Procedure
1. Open HyperLynx Thermal.
2. Choose File > Open and open a board, if you don’t have a board, select Help > Sample
Design.
Note
You can also change Units and Temperature Scale from the File Menu.
3. Choose View > Side > Back Side. Notice that there is another set of components on the
back side of the board.
Note
The View Menu also lets you select different layers in the design.
4. Choose View > Side > Front Side to return to the front view of the board. You can also
click
5. Click . As you move your mouse around the viewing window, the board will rotate
around in 3 dimensions.
Choosing Board > Local Property lets you create areas of greater metal volume (such
as with thermal vias) on a per-layer basis.
13. Click OK.
14. Click the Placement menu. You will notice that this allows for the placement of
components on the board, as well as heat sinks, heat pipes, and screws, which can be
selected from the drop-down box in the toolbar. To move a placed component, click on
the component, hold down the mouse button, and drag the component to a new location.
15. Right-click a component in the board and select Properties. This opens the Component
Properties Dialog Box.
The component reference designator, part name, location, power, and temperature are all
listed in the component information.
You can edit the part model for a component on the fly in the component info section by
clicking Edit this part.
16. From the Component Properties dialog box, click Edit this part. In the Edit part dialog
box, all the dimensions and thermal properties of the component are listed and can be
edited.
17. To close both dialog boxes, click OK.
18. Choose Environment > Condition. This opens the Environment Condition Definition
Dialog Box.
The Environment Condition dialog box lets you set up the environment in which the
board is placed. You can set up whether or not the board is placed in a case, as well as
the surrounding air. You can also set up boundary conditions to simulate other edge-
connected components which might affect the thermal properties of the board, such as a
wedge lock or sink.
19. Click OK.
20. Choose Analyze > Run, to analyze the design. If you are using CARD.INP.HLT, this
step is not necessary because the analysis has already been run.
21. Choose View > Power or click .This view shows the power of each component. All
of the analysis output views are available from the View Menu and the toolbar.
22. Click . This highlights the components that will have a specific refined output in the
.loc file.
23. Click . This shows the component temperature.
24. Click .This shows the excess component temperature - the amount by which the
component is exceeding its maximum temperature.
25. Click . This shows a thermal map of the temperature of the board.
26. Click . This shows the thermal gradients on the board. This view is especially useful
for locating stress points in the board, which can lead to board warpage or cracking.
You have now been familiarized with all of the required setup for performing a thermal analysis
on a board using HyperLynx Thermal.
Related Topics
“Creating a New Board” on page 14
Note
You can add components, heat sinks, thermal screws, and heat pipes from the Placement
Menu. You can place the object anywhere you like or as many times as you like.
5. To add components to the back side of the board, from the View Menu, choose Side >
Back Side and add components.
6. When finished, choose File > SAVE AS, and name your board.
Related Topics
“Preparing a Board for Thermal Analysis” on page 15
Procedure
1. Open the board.
2. Set your Units and temperature Scale from the File menu. For more in depth information
see the “File Menu” on page 59.
Note
The bottom right of the screen shows the x and y coordinates for the location at the tip of
the arrow, the number of components on that side of the board, and the total power
dissipation for this side of the board.
3. Choose Board > Property (or right-click anywhere on the board). This opens the Board
Property Definition Dialog Box. Define the following:
• Maximum board dimensions
• Thickness of layers
• Conductivity of layers
• Metal volume fraction, see “Metal Volume Fraction in Boards” on page 33
• Default component casing limit
• Default component junction limit
Note
You can also specify board information for each layer by choosing a layer from the View
menu (View > Layer > Layer #) and choosing Board > Property. Then choose the layer
you are defining properties for from the Layer pull-down menu in the Board Property
Definition Dialog Box.
4. For each component, right-click to open the Component Properties Dialog Box and
specify component properties. Note that to modify the power dissipation for a placed
component, you must specify an Input power scaling factor.
5. To setup the operating environment, choose Environment > Condition or click .
This opens the Environment Condition Definition Dialog Box.
There are many different set up options for the environment conditions. The important
Parameters are:
Note
Boundary conditions are very important when you are analyzing a sealed (closed) system.
For a sealed system, cooling is usually provided at the edges of the board. Without some
mechanism for dissipating heat, the board will usually reach unacceptably high
temperatures due to ineffective thermal radiation. This is a frequently happened error
when user model a closed system but without addressing where the heat goes away from
the board eventually. The coordinates of the boundary condition sink temperature, and
the thermal resistance all need to be set here. For more information, see “Specifying
Boundary Conditions” on page 78. If you are modeling an open system, you may not
need to specify boundary conditions.
To manually display the temperature at each location on the board, choose View >
Board Temperature or click .
2. To display the power of each component, choose View > Power or click . The color
scale will change to reflect Power.
3. To view the temperature for each component, choose View > Component
Temperature.
4. To view the numerical analysis results, choose Analyze > Numerical output.
Note
For a complete list of analysis options, see “View Menu” on page 61.
For a list of modeling techniques that you can apply to decrease the thermal output of your
board, see “Advanced Modeling” on page 37.
3. Make sure all components are placed inside the board outline. For details regarding what
occurs when components are placed outside the board outline, see Analysis of
Components Placed Outside the Board Outline.
4. Review the Advanced Modeling chapter to see if you handled design variations
correctly.
5. Be sure to glance over the parameters for your main components in the Working
Library, (see the “Edit Working Library Dialog Box” on page 90), to make sure
everything is correct.
• Verify the pin number and dimensions for your hot components.
6. Periodically save your file while working on it.
If you are using Expedition 2007.6 or newer with CES, the exported project will contain new
sections for power dissipation, scaling factor, theta-jc, and temperature limits. HyperLynx
Thermal uses the information in the new sections for back annotation of thermal actuals to CES.
Related Topics
Setting up the Expedition PCB Interface to HyperLynx Thermal
> regsvr32
<install_root>\2009HLT\SDD_HOME\hlt\win32\bin\HLThermoAddinAddin.dll
Procedure
1. From Expedition, open the printed circuit board that you want to translate to HyperLynx
Thermal.
2. Select Analysis > Export to HyperLynx Thermal.
This opens HyperLynx Thermal and loads the exported design.
Results
The interface will create a HLT file in the PCB folder for that particular design. To manually
open the HLT file, open HyperLynx Thermal and select File > Open.
If CES is setup for the exported project, the file will contain power dissipation, scaling factor,
theta-jc (junction to casing thermal resistance), and temperature limits from the iCDB database.
Related Topics
The Expedition PCB and BoardStation XE Interfaces to HyperLynx Thermal
Procedure
1. Start CES:
• From the Start Menu, select Programs > Mentor Graphics SDD > Constraint
Entry > Constraint Editor System. When prompted to open a project, browse to
and select the associated project (PRJ) file. This opens the project and automatically
imports thermal actuals.
• From Expedition PCB or BoardStation XE, select Setup > Constraints. This opens
the CES project for the design and automatically imports thermal actuals.
2. To manual import thermal actuals:
o If you are using the EE2007.7 version of CES, select Data > Actuals > Import
Thermal Data in CES.
o If you are using the EE2007.6 version of CES, select File > Import > Thermal
Actuals.
Results
The CES Output window should display the following message:
HL Thermal actuals side file dated [Day Month Date Time Year] have been imported.
Related Topics
The Expedition PCB and BoardStation XE Interfaces to HyperLynx Thermal
This interface is compatible with any ECAD/MCAD placement software that will export two
IDF files (a board file and a library file). For example, Expedition, Board Station, OrCAD,
Allegro, Pro-E, and CR 5000 all have an IDF output available.
Procedure
1. To initiate the import, select File > Import > IDF Interface. This opens the Import
dialog box.
2. Enter the path for or browse to your IDF Board, the library will be added automatically.
This imports the board information.
3. Optionally, select a HYP File. This imports the stackup, trace, and plane information for
the board. This option also enables the tool to automatically calculate the Metal Volume
Fraction based on the actual copper that is in the board.
4. Click OK.
Result
The design will open in HyperLynx Thermal and a HLT file will be created in the directory
where HyperLynx Thermal resides.
Once you are in HyperLynx Thermal, you want to check briefly for any possible overlapping of
the components due to any possible imperfection of the CAD Interface.
Some parameters needed for thermal analysis but not available in the ECAD placement file may
be still at the default values. Go to Library > Working to review each component and set their
powers (or import the power from ASCII file as shown in the next section of help) before you
run the ANALYSIS for preliminary thermal results. You may edit the thermal resistance and
other parameters such as height, pin dimensions and air gaps etc. at the same time.
Related Topics
Preparing a Board for Thermal Analysis
1. Create a new file using Notepad, TextPad, WordPad or another software that generates
text files that are free of formating.
2. The first line of the text document should read, Component. Click Enter or, you can
leave a space then put your own note following the word Component on this first line.
3. The lines following the Component line should have the component partname followed
by the power dissipation in watts. You have the option to enter a single value for power
dissipation or to specify a 1-D lookup table that defines a temperature, power
relationship.
Each component should have its own line. After you have entered every component,
click Enter. The power of these components will come into the Working Library of this
board when the file is imported.
Note
You can import the power dissipation parameter using the component partname and/or
the reference designator.
COMPONENT
M5M ((20,0.32) (120,2.32))
AXT4 ((20,0.182) (25,0.5))
Each pair of numbers (temperature, power) represents a point in lookup table.
Note
You can not use lookup tables in the Reference or thermal-resist sections of the import
file.
Note
Components of the same part type must have the same power dissipation.
4. You may now enter power by reference designator. The first line following the
partnames should read, Reference. Again, you may add your own comments on the
remainder of this line.
5. Each line after that should contain the reference designator followed by its power in
watts. This information will come into the power factor of each component with respect
to the nominal power stated in the Working Library.
Example 2-2. Power import file without lookup tables for power dissipation
parameter
Component
4077B 100
74150DW 5
7476 2
R1/4W 50
Reference
B1 100
G1 100
K1 100
M1 100
R1 100
RF1 100
Example 2-3. Power import file with lookup tables for power dissipation
parameter
Component
4077B ((100, 0.32) (150, 2.32))
74150DW 5
7476 2
R1/4W ((50,0) (60,10) (75,20))
Reference
B1 100
G1 100
K1 100
M1 100
R1 100
RF1 100
6. Once the text file is complete, choose File > Import > Power & Th-Resist.
7. Locate the file that you created and click Open.
“Units” on page 30
“Files” on page 31
Package Types
Although there could be thousands of components used in your design, there are only a few
hundred component shapes.
DEFAULT
The default shape geometry
CBGA
The ceramic Ball Grid Array
CDIP
Ceramic Dual-In-line Package
CLCC
Ceramic Leadless Chip Carrier
CLDCC
Ceramic Leaded Chip Carrier
CPGA
Ceramic Pin Grid Array
PDIP
Plastic Dual-In-line Package
PLCC
Plastic Leadless Chip Carrier
PPGA
Plastic Pin Grid Array
PQFP
Plastic Quad Flat Pack
Rxxx
Resistor, through hole, xxx Watt
SIP
Single-In-line Package
SO
Small Outline package
TO-xxx
TO package of metal caps
• D or DW
• Small Outline
• FK
• Chip Carrier, Flat Pack
• FN
• PLCC
Prefixes
The names of logic devices all begin with the number 74. To insure uniformity, 74 always
substitutes a prefix of 54.
A single entry represents both the military and commercial versions of each component or
package. This is because both military and commercial packages share the same dimensions and
power dissipation rates.
For standard CMOS components, the symbols are named 4081 without using manufacturer-
specific prefix names.
Microprocessors
For microprocessors or microcomputers, the starting prefix of the component is frequently 68,
80, etc. This is enough information to identify specific microprocessors.
Units
The parameters in the HyperLynx Thermal can be Mixed or SI units, at your option. Watts and
degree C are always used, even though the English units are used elsewhere in the Mixed Unit
situation.
Table 3-1. Parameter Units
Parameter Mixed Units SI Units
Length inch mm
Velocity ft/min mm/s
Pressure atm. mmHg.
Comp. Power Watt Watt
o o
THETA C/Watt C/Watt
Conversion of Units
1F = 5.0/9.0 C
NF = (N-32.0)*5.0/9.0 C
1 mm = 0.03937 inch
1 m/s = 1000 mm/s
1 m/s = 196.8 ft/min
1 mHg = 1000 mmHg
1 mHg = 1.32 atm
1 W/m = 0.001 W/mm
1 W/m = 1.0403 BTU/hrft
1 W/mC = 0.001 W/mmC
1 W/mC = 0.0254 W/inC
Files
For you to check or maintain your files, the following are the suffixes to your file names.
Note
For backwards compatibility, HyperLynx Thermal supports the .INP, .INL, .INB, and
.INT file formats.
There are several parameters that can drastically effect results, please go through each and make
sure they are set correctly.
Note
If you import a HYP file with your board, HyperLynx Thermal will calculate the MVF
for the board based on the actual copper that is in the board.
Related Topics
“Board Property Definition Dialog Box” on page 74
Related Topics
“Boundary Condition Definition Dialog Box” on page 77
Power Dissipation
The power dissipation of two types of components is the most critical. They are the ones with
high power and those of small sizes. The former ones give off much heat and could be very hot,
the latter ones have high power per surface area and also can be very hot. If electronic
simulation is made on the board, the accurate power can be obtained easily. For large boards, it
is reasonable to only find accurate power of components in areas showing high temperatures
through first cut analysis.
You can import the power of components through File > Import > Power & Th-Resist menu
with a text file that you create, see “Importing a Power File” on page 23 or you can manually
enter the estimated maximum power for each part using the Edit Part Dialog Box.
Note
If the power dissipation for a part varies with temperature define the relationship with a
lookup table by clicking Edit Values or using the power import file, see “Importing a
Power File” on page 23. The Thermal analysis engine will then approximate the correct
power based on the operating temperature of the device.
Note
You can not specify different power dissipation values for the same type of part. Each
instance of a particular part may have a different power dissipation. To modify the power
dissipation for an instance of a part, enter an Input power scaling factor for the part. The
actual power dissipation for an instance of a part is equal to the power dissipation
assigned in the part library multiplied by the input power scaling factor that is assigned
for a specific instance of that part.
If HyperLynx Thermal can not find a value for the power dissipation parameter for a part in
CES or the Edit Part dialog box, then power dissipation is calculated using the formula below:
Related Topics
“Importing a Power File” on page 23
The component height is important when strong convection occurs because the air from the free
stream will likely hit on the tall component. In this situation the heat transfer coefficient is high
and the free stream temperature is low.
Related Topics
“Edit Part Dialog Box” on page 85
Related Topics
“Edit Part Dialog Box” on page 85
Related Topics
“Edit Part Dialog Box” on page 85
1. Double-click on the component and drag the mouse to the new location.
2. You may move other components to better locations.
3. When you are finished, re-run the analysis to find the new temperature distribution.
Conduction Pads
One way to help cool a component is to put conduction pads between the component and the
board.
• Go to the Edit Working Library Dialog Box and enter the conductivity of the material
inserted in the gap.
Restriction
This functionality is not available with the HyperLynx Thermal Light licensing option. To
check which version of HyperLynx Thermal you have, select Help > About.
Heat Sink
Another way to help cool a component is to place heat sinks near the component. The term
"heatsink" is used very generally in the electronics industry referring to anything from
wedgelocks to heat spreaders to finned heatsinks. In HyperLynx Thermal, the term "heatsink"
refers only to the finned heatsink.
Note
You must place your heat sink such that it overlaps at least one component.
Related Topics
“Heat Sinks on Top of Components” on page 39
“Heat sink standing alone or with components mounted on the sink” on page 40
For a heat sink, the most important input is the Sink to air thermal resistance at the two specified
air velocities (3ft/s & 10ft/s). These values can be obtained from the manufactures data sheet of
the heat sink, which is a plot of Resistance vs. Air Velocity. Set these two resistances and
HyperLynx PCB Thermal will interpolate or extrapolate for the real operational condition.
Effective height of the heat sink is also very important because the blockage in the flow stream
may affect other parts at surrounding.
1. Class - Must select heat sink, when modeling a heat sink, this controls the part definition
2. Length - Length or dimension in X direction
3. Width - Width or dimension in Y direction
4. Height - The total height of the heat sink alone
5. Number of Pins – Not a relevant number, but use a high number to ensure good contact
6. Pin thermal conductivity, Pin thickness, Pin width, pin Length. Leave as defaults
7. Air gap- should be set to about zero with a conductive material between the heat sink
and the component.
8. Power - should be set to Zero
9. Sink to air thermal resistance @ 3ft/s. - Value taken from heatsink data sheet in degree
C/W
10. Sink to air thermal resistance @ 10ft/s - Taken from data sheet in degree C/W
11. Radiative Emissivity – Not important, leave as default or use .1 for polished metal
Effective height, fraction of (DZ) – A value between 0.0 & 1.0 based upon what type of
heatsink is used. This value estimates the amount of blockage the heatsink will have on the air
stream. A minimum number of 0.5 should be assigned. For full blockage in the airflow
direction, set this to 1.0. For extruded fins aligned with the air flow, set to 0.5.
A heat sink with several components mounted on it, will be modeled by placing a thin fictitious
component on the board, and then place this sink on its top. This fictitious component will have
a power dissipation of the sum of the power of all the components on top of the heat sink.
The above example is that of a heat sink where the component power is rather evenly
distributed. However, if the distribution of power and therefore heat is more concentrated in one
or another region and uneven temperature distribution is expected on the heat sink, two or more
fictitious components should be modeled depending on the distribution of heat and the
estimated territory of each temperature zone. The summation of all the powers of the fictitious
components should be equal to the total power. When you model the original heat sink with
several smaller heat sinks, you must increase the THETAsa of each sink by a factor that is the
inverse of the fraction, which is the area ratio of the small heat sink to the original heat sink. For
example, if the original THETAsa is 2 C/Watt and the small sink is 1/3 of the original area, the
THETAsa of the small one will be 6 C/Watt.
The final result of the heat sink temperature will be the casing temperature of all the
components on it. If you want to know the respective junction temperature, simply hand
calculate the difference of junction to casing temperatures and add onto the casing temperature.
The temperature difference is the component power (in watts) multiplied by the THETAjc.
1. Add the total number of pins for all components that are under the heatsink.
2. Add the total height of the component + heatsink. For example, if there are 8
components are all 1” height and the heatsink is 1”, the height that you should use is 2”.
3. Add the powers of all the components together.
4. Eliminate all of the original 8 components from your board.
5. Place a fictitious component at the location of the heat sink with the same length and
width as the sink but very little height, and the pin number equal to the total number of
pins from #1.
Assign the total power from statement #3 to this component.
6. Design this heat sink with its height equal to the total height minus the height of the
fictitious component. Then place this heat sink on the fictitious component.
7. Run the analysis.
8. You will get an overall temperature of the heatsink. This will be the casing temperature
of each individual component that is touching the heatsink.
The junction temperatures of each original components under the sink, can be evaluated from
junction to casing temperature difference, which is the power multiply the THETAjc.
Thermal Screw
Thermal Screws can be added to the board with the other end links to external heat sinks. The
screws’ specifications, such as size, and sink temperature, must first be entered into the
Working Library.
To place a screw:
1. Class - Must select screw when modeling a thermal screw, this is the part definition
2. Length - Length or dimension in X direction
3. Width - Width or dimension in Y direction
4. Height - The total height of the thermal screw above the board surface
5. Number of Pins – Not a critical number, but use a high number to ensure good contact
with board.
6. Pin thermal conductivity, Pin thickness, Pin width, pin Length, should ensure good
conduction with board occurs.
7. Power - should be set to Zero
8. Thermal resistance across the screw - The thermal resistance of the screw as
calculated by L/kA
9. Radiative Emissivity – Not important, leave as default or use .1 for polished metal
10. Temperature at end – The sink temperature that the screw is attached to.
Heat pipe
To place a heat pipe on the board the heat pipe must first be defined in the working library. The
setting of heat pipe properties is shown at the next section.
Restriction
This functionality is not available with the HyperLynx Thermal Light licensing option. To
check which version of HyperLynx Thermal you have, select Help > About.
The part should be built in the library, then placed in the correct location on the board. The heat
pipe will easily carry the heat to another location.
Parameter definitions (the bold parameters are most critical): Notice that many of the
parameters are not used and grayed out.
1. Select the name of your daughter board from the Component pull down menu.
2. Go to the Placement menu and select Component.
3. Drag the daughter board to the desired location on the mother board and left click the
mouse; this opens the Component Properties dialog box.
4. In the Component Properties dialog box, you must select the Refined output checkbox.
Tip: When the analysis is run, you may look into the numerical output to view detailed
information regarding the daughter board.
5. Enter the following parameter values in the Component Properties dialog box:
a. Class - Must select Daughter Board when modeling a daughter board.
b. Length - Length or dimension of daughter board in X direction
c. Width - Width or dimension of daughter board in Y direction
d. Number of pins - depends on how the daughter board is attached
e. Air gap - distance from top of mother board to bottom of daughter board
f. Power - The sum of the powers of each component on the daughter board
g. Sink to air thermal resistance @ 3ft/s - set to zero
h. Sink to air thermal resistance @ 10ft/s - set to zero
Go to the same BOARD menu and choose the command LOCAL PROPERTY. Go to the first
layer and use the cursor to set a rectangle for this metal strip. Within this rectangular zone, the
metal content becomes, for example, 30% to represent the effects of this metal strip. The
conductivity that you assign in the Board-Local Property menu will override that default
nominal value assigned in the Board-Property menu in that area. You may assign other metal
strips in a similar manner.
An-isotropic Wiring
In a region where most wires are in one direction, you may use the Board > Local Property
menu to set the rectangle for this region. If the wires along the x direction are twice as many as
those in the y direction, set the Kx to Ky ratio to 2, to model the an-isotropic heat conduction.
To determine the wire ratio, you may draw a square on a location of the board and count how
many wire go East-West versus North-South.
Depending upon what type of industry your company deals in, the procedure in modeling might
vary slightly; look over your industry to get a good feel on how to model your case.
Avionic/Space Applications
Avionic and space applications deal mainly with closed systems at high elevations with
variations in air condition and gravity. Specific considerations are:
“Others” on page 48
Closed System
If the board is in a closed system, the only method of heat loss is by conduction and radiation.
The heat loss at the edge of the board must be specified in the Boundary Condition Definition
Dialog Box (Environment > Boundary). If thermal screws are mounted at the board and
attached to heat sinks, it must be specified in the Working Library - Class. For closed systems,
the iteration limit is recommended to set to high in the Environment Condition Definition
Dialog Box (Environment > Condition).
Air Conditions
The pressure of air and gravity are specified in the Environment Condition Definition Dialog
Box (Environment > Condition menu). For a space board, the air pressure and gravity should
both be set to “0”. Air should come from the “Bottom”.
Component Details
The emissivities of components, the air gap, use of conduction pads, and pin dimensions must
be set carefully in the Working Library. It is very important to set the correct pin geometries and
conductivity when dealing with closed systems.
Board Structure
The emissivity of the board is specified in the Environment Condition Definition Dialog Box
(Environment > Condition menu). If the board has a sandwiched aluminum core, please
consider it as the 2nd layers in the Board > Property menu. Usually the Aluminum core can be
the layer 2. If there are metal strips at particular locations on the board, use the Board > Local
Property menu to set it.
Others
The critical parameters stated before, Metal Volume Fraction in Boards, Power, THETAjc -
Junction to Casing Thermal Resistance, etc., should also be specified carefully.
Computer/Instrumentation Applications
The computer and instrumentation industries deal mainly with high power and tight packaging.
Considerations are:
Adjacent Boards/Walls
The spacing needs to be specified. For an adjacent board, the power needs to be specified. For
an adjacent wall, the temperature and emissivity need to be specified. All the inputs are in the
Environment > Condition.
Telecom/Industrial-Control Applications
Telecom and industrial control deal with large component numbers on boards, and closed or
open systems. You need to consider natural convective cooling.
Conduction
Heat is transferred through solids by conduction. The rate of conduction is proportional to the
thermal conductivity of the material and the cross-section of the conduction path, and is
inversely proportional to the length of the path.
The thermal conductivity of materials such as copper and epoxy (prominent materials used in
most PCB designs) are drastically different. When a heat source is present in a subject, all
generated heat per unit of time should leave the subject if a steady state temperature is
maintained in that subject.
Convection
Heat is transferred through fluids by convection. The cooling of a subject by the movement of
air flowing over its surface is of great interest. The heat convection from the subject to the air
flowing over its surface increases as the difference in temperature between the solid surface and
the mean temperature of the air increases.
The hot air wake of hot solids at the upstream also reduces the local heat convection. For this
reason, one subject standing in the flow stream can be cooled easily while another subject
embedded in its hot wakes may not get sufficient cooling. Another factor in convection is the
velocity of the airflow. With high velocities, the convective wash is strong and the cooling
becomes significant.
All of these flow-related effects are represented in a single factor called the heat transfer
coefficient. This factor is usually described in very complicated formulations based on
conditions or circumstances specific to a particular situation.
Radiation
Radiation transfers heat directly, much like the transmission of light. Radiating heat transfer
increases with the temperature difference between two subjects, but transfer is directly related
to the fourth power of the absolute value of the temperature. For this reason, high temperature
subjects usually have significantly greater radiating heat transfer rates than room temperature
subjects. However, if all subjects are not very hot and their conductive and convective heat
transfer rates are small near room temperature, the radiative heat transfer contribution may
become relatively significant, and must be considered.
One very important feature of radiative heat transfer in any subject is its strong dependence
upon the condition of the surface of the material in question. This is known as the emissivity of
the surface. The emissivity of materials such as plastics or ceramics is close to 0.9, while that of
polished metal can be as low as 0.2. On the other hand, a fully oxidized metal surface has a high
emissivity rating of approximately 0.3 to 0.8.
colder than the component. An equilibrium temperature of the component is eventually reached,
such that, the rate of heat generation equals the overall rate at which heat leaves the component.
Heat is conducted in an electronic board through the mixture of metal wire and material of
which the board is made. When many components are found on a board, the heat transfer
interaction between them becomes very complicated. For example, a component with little
power dissipation which is located near a very hot component may receive conducted heat from
the hot component through the board and may release this heat to the air through convection. In
analyzing heat transfer and interaction in PCB’s, it is important to realize that the board also
eventually releases this heat to the air by convection.
On a board, the heat convection of a component is very dependent upon the thermal
characteristics of the components near it and in its upstream area of airflow. If the upstream
components are tall and hot, any components located in the hot wake of that component will be
difficult to cool. Three-dimensional effects such as these have been fully modeled in this
program.
Reliability Background
Two major objectives of electronic designs are the functionality of the system and the reliability
of the operations. Electronic reliability depends upon various factors, but the most influential
one is the I.C. temperature. The component failure rate increases exponentially with the
increase of junction temperatures.
Reliability is a statistical quantity. Its measurements are based upon the failure rate (number of
failures per million hours) for components, or mean time between failure (hours) for a board or
a system analysis indicates where the reliability is a problem; however, thermal analysis reveals
the means to reduce the temperature at the problem locations. You need both to do good design
work. For further details, please review the MIL-HDBK-217E Handbook.
To begin, a RELEX project and a HyperLynx Thermal project should be created, both of which
having the same reference designator names.
1. Run the HyperLynx Thermal analysis so that temperature results are achieved.
2. Open “Windows Explorer” and go to the directory in which your HyperLynx Thermal
file resides.
3. Double click on “XXXXX.out” where “XXXXX” is your HyperLynx Thermal
filename.
Anyone using RELEX version 7.5 or earlier should follow steps 4, 5, and 6
1. Scroll down to a few lines past “Output of Board Analysis” to the line that reads “Side
Ref.Des. Tc(C) …”
2. Place your cursor immediately after the “e” in “Side” and add a space and the word
“Name”
3. Save and close your “XXXXX.out” file
4. Open the RELEX file that corresponds to the HyperLynx Thermal file.
5. Select the “System” tab.
6. Go to “File-Import”
7. At the bottom of the window that pops up, there is a drag menu titled “Files of Type”.
Select “All files”.
8. Go to the directory where your “XXXXX.out” file resides, highlight that file, and click
“Import”.
9. Select “I want to update the selected assembly” from the first group and “Import
reliability prediction information” from the second group”.
10. Click “Next”.
11. From the drag menu, select “Betasoft” and click “Next”.
12. Click “Finish”.
Many users have tested HyperLynx Thermal in the past several years, and we have compiled a
list of the common problems that these users have encountered. It is very likely that you will
find the solution to your particular problem here.
For example, some typical problems include: the component height is negative, the number of
pins is 0.0, or all the parameters are 0.0 etc.
Technical Support
Please contact Mentor Graphics technical support by visiting http://supportnet.mentor.com.
The specifications of HyperLynx Thermal as related to various parameters are described in the
following sections.
The following menus are available from the HyperLynx Thermal application:
File Menu
From the file menu, you can load files, save files, import files, and set the scale of displays and
the units. You also can print from this menu.
View Menu
Library Menu
The Master Library stores the information of all the interested components. The Working
Library only contains the components of the current board. Components can be updated from
the Master to the Working Library or copied from the Working Library to the Master Library.
The Material Library lists the conductivities of many commonly used materials.
Board Menu
This menu lets you specify the detailed structure of the board for your applications.
To assign trace:
1. Select Board > Add Trace. The Trace Power
Density dialog box opens.
2. Enter the Trace power density for power per unit
area on the trace and click OK.
3. A grid over the entire board will appear. Click the
squares to add trace.
Trace Power Density After the Add Trace command is initiated, you may
change to a new power density of trace to assign on the
board.
Placement Menu
Use this menu to place components, heat sinks, screws, and heat pipes on the board.
Note
To place an object on the board, you must define the object in the working library.
Note
To place an object on the back side of the board, change the view so you are looking at
the back side of the board (View > Back Side).
To place a component:
1. Select the Placement > Component menu.
2. Select a component from the pull down working
library on the tool bar.
3. Drag your mouse to the area on the board where
you want your component to be placed.
4. Click to place it.
5. A window will pop up allowing you to assign a
reference designator name up to 5 characters long.
You can also modify the specifications.
Heat Sink Select to place a heat sink on the board.
Environment Menu
Use the Environment menu to define boundary and environment conditions for the board.
Table 10-6. Environment Menu Contents
Menu Item Desciption
Boundary Opens the Boundary Condition Definition Dialog Box.
Use this to define thermal boundary conditions on the
edges of your board.
Condition Opens the Environment Condition Definition Dialog
Box. Use this to define environment conditions for the
board.
Analyze Menu
Use the analyze menu to perform your thermal analysis and review the results.
The following dialog boxes are available from the HyperLynx Thermal application:
The wedge lock is usually connecting between the board edge and the heat sink, which could be
a chase wall or cooling fins etc. This heat sink temperature must be specified.
The wedge lock usually has a thermal resistance. The value of the total thermal resistance of a
wedge lock, Rtotal, could be presented in the form of
DT = Q x Rtotal
The DT is the temperature difference between the edge of the board to the sink; the Q is the total
heat flow rate. Therefore, the Rtotal shall have a unit of C/Watt.
The wedge lock may cover a length along the edge of board, for example S mm. For each unit
length (mm), the thermal resistance shall be higher than the total thermal resistance. This is
because the longer the wedge lock, the larger the cross section of the heat flow and the less the
total thermal resistance. (Resistance is inversely proportional to the cross section but
proportional to the length of heat flow path.) Therefore, the thermal resistance per unit length
Rlength is related with the Rtotal as
Rtotal = Rlength / L
Where the L is the length of the wedge lock along the edge of the board.
Finally, the unit of thermal resistance per unit length along the board is C-mm/Watt, which is
the input in this dialog box.
Restriction
If you have the HyperLynx Thermal Light licensing option, the only component property you
can modify is the Input Power Scaling Factor. To check which version of HyperLynx Thermal
you have, select Help > About.
P = I2*R or P = E*I
Tip: If the power dissipation for a part varies
with temperature, define the relationship with a
lookup table by clicking Edit Values or using
the power import file. See “Importing a Power
File” on page 23. The Thermal analysis engine
will then approximate the correct power based
on the operating temperature of the device.
Note
You can not specify different power
dissipation values for the same type of part.
Each instance of a particular part may have a
different power dissipation. To modify the
power dissipation for an instance of a part,
enter an Input power scaling factor for the part.
The actual power dissipation for an instance of
a part is equal to the power dissipation
assigned in the part library, multiplied by the
input power scaling factor that is assigned for a
specific instance of that part.
Edit Values Opens the Power Dissipation Editor Dialog Box. Use
this to specify the temperature-power relationship for a
part with a lookup table.
Junction to casing thermal Also known as the THETAjc value, this is the thermal
resistance (degC/watt) resistance between the IC junction and the component
casing in degC/Watt. This value is very dependent
upon the testing method used. The present THETAjc
values in the library are derived from the “Semi-Therm
Proceedings”, TI and Signetics DataBooks, etc. If
unknown, set to 0.0. This is not the junction to ambient
resistance.
Environment Conditions Parameters describe the conditions of ambient air and affect modeling
of air temperature distribution, and conductive and convective heat flux to air.
Analysis Parameters affect the iteration process of the solver and the precision of it's final result.
Casing Parameters describe two things - board placement (relative to adjacent boards, airflow,
gravity vector etc.) and thermal parameters of the board environment (power dissipation of
adjacent boards, temperature of the walls, etcetera).
J = ε ∗ σ ∗ Τ4
The Local Property command allows for a detailed evaluation of a finely described board. You
can assign non-homogeneous or an-isotropic local properties to any layer of a board. On each
layer, the local metal volume fraction and the x to y conductivity ratio can be set in arbitrary
rectangles.
As default conditions, the properties of a board are considered to be isotropic (i.e., the same
conductivity in any direction), which is generally a good assumption, considering the traces in
the x direction and in the y direction are of similar amount.
Access: Click Edit Values next to the Power dissipation field of the Edit Part Dialog Box.
Related Topics
“Edit Part Dialog Box” on page 85
Access: Select Board > Thermal Via and select an area on the board.
Air Gap
The gap between the bottom of the package and the board.
Air Pressure
The air pressure, based on a pressure of 1 atmosphere at sea level. This value is expressed in
terms of atmospheres (atm). For satellite use, p is 0.0. A small value can be assigned at high
elevations for avionic electronics.
BGA
Classification for all ball grid array or pin grid array components.
Board Location
To identify if a board is inside of a rack in which both sides face other boards, or at the left of the
rack where the left side faces a wall and the right side faces a board, or at the right of a rack, or a
single board which faces walls at both sides.
Board Placed
The board is placed horizontally or vertically with respect to the gravity. The gravity is vertically
down.
Board Spacing
The distance between this board and the adjacent boards or walls. This is measured from the
surface of this board to the surface of the adjacent board/wall.
Class
The class refers to the specific configuration of a type of package.
DIP-Through hole is made up of components whose pins are located at two opposite sides
and go through the thickness of the board. Any component with pins which appear on all
four sides, or on the bottom of the component, belongs to one of the next several SMD
classes.
SMD Long Leads is for components with pins on four sides, with these long pins stop on
the surface of the board and these pins are exposed to air convection. For SMD classes if
the component is rectangular in shape, the longer sides are normally set as the
North/South sides.
SMD Medium leads is for components similar to SMD Long Leads, but whose pin surfaces
are only partially exposed to the air convection. This includes surface-mount
components with short leads.
SMD Leadless is made up of components whose pins are along the four side but not
exposed, or are only slightly exposed, to air convection. This includes leadless surface-
mount components, and metal-capped, vertically oriented components whose pins are
located on the bottom of the component. This class also includes all surface mount
resistors and capacitors.
SMD Small Outline is made up of surface-mount components whose leads are located on
two opposite sides only.
BGA is for all ball grid array or pin grid array components, whose pins are in the area under
the components.
Screw is for thermal screws, which are attached to the board and a heat sink.
Heat sink is for heat sinks mounted on a component with convective air coolings.
Heat pipe is for all heat pipes.
Daughter Board is for all parallel or perpendicular daughter boards.
Daughter Board
A classification for all parallel or perpendicular daughter boards. In the Library, the class of
daughter board is for a parallel daughter board. A perpendicular daughter board should be
modeled as a component of the total dimension, with power equal to the sum of the powers of the
components on this daughter board. The analysis gives the board temperature under this
component, which is the edge boundary temperature of this perpendicular daughter board. Then,
if needed, a separate analysis can be made to this daughter board with the edge temperature
specified. It surrounding air conditions can be obtained from the Local command.
DIP
DIP is a through hole component, which is made up of components whose pins are located at two
opposite sides and go through the thickness of the board. Any component with pins, which
appear on all four sides, or on the bottom of the component, belongs to one of the other SMD
classes.
Effective Height
This is the effective height of heat sink to the airflow. The value will be a percent in decimal
form with 1 being total blockage and 0 being no blockage. For extruded fins set perpendicular to
the airflow that all the air is blocked, this is the total height. The value will be 100%. If the
extruded fins are parallel to airflow, this value is usually about 50% if wide spacing of fins
occurs. For example, in a pin fin with a staggered array, this is close to 100%. For an in-line
array and parallel to flow, 80% is a good approximation.
Em
This is the surface emissivity of this component, a value between 0.0 and 1.0
Gap
See Air Gap.
Gap Conductivity
When conduction pads or paste are inserted into the gap beneath the component, this is the
conductivity of the conduction pads or paste.
Gravity
Gravity at this location, a value between 0 and 20 can be considered. For space, it is 0. For rocket
launching, it could be as high as 20. Gravity is assumed in vertical downward direction in the
program.
Grid
The screen in which the intersections of mesh lines are identified.
Heat pipe
Classification for all heat pipes.
Heat sink
Classification for all heat sinks mounted on a component with convective air coolings.
Humidity Ratio
The relative humidity, a value between 0.0 and 1.0. Note that 1.0 represents total saturation of
water vapor or steam.
Import
The ability to bring in either the design from your CAD placement software, or the power
dissipation from an external ASCII file by component name and/or reference designator.
default of all components or may be set uniquely to particular components in the “Library-
Working” menu.
Kair
Conductivity of the air.
Kpin
Conductivity of the pin material
Kx/Ky
The ratio of board conductivity in the X direction to that of board conductivity in the Y direction
in a local zone. You can determine a correct setting for this value by imagining that you are
drawing a square on the board at this location. For example, if two times as many wires run in the
East/West direction of this imaginary square than run in the North/South direction, the value
could be 2.0.
Mixed
Mixed units of English and Metric are used. However, the watt and C are always used in all the
cases.
Name of Component
This is the part number of a component. This must be less than 16 alphanumeric characters in
length. You can review the list of all components in the library and see the Component Naming
Guidelines.
Partname
Name of Component with up to 16 alphanumerical characters.
Pin Length
The average length of the pins on the package or component that are exposed to air.
Power Dissipation
The likely heat dissipation rate for this package. If you just interfaced from ECAD, this value
will be a default. You should update from the Master Library to update them, set a new value in
Working Library, or import a text file through “File-Import” menu.
Radiative Emissivity
The averaged emissivity of the component, a value between 0 and 1.
Rotation
The nominal orientation of a package in the Working Library has the long side in the X direction
and the shorter one in Y direction. To rotate allows for a 90-degree turn.
Screw
Thermal screws attached to the board and connected to an external heat sink.
SI
Standard International Units, similar to Metric Units.
Sink to Air Thermal Resistance
The heat-sink-to-air thermal resistance measured in C/Watt. This value is a function of heat sink
design and of air speed. Usually users enter the values at 3 ft/s and 10 ft/sec air velocities. In the
analysis, the adequate values at local air velocity will be evaluated automatically.
SMD Leadless
Classification for components whose pins are not exposed, or are only slightly exposed, to air
convection. This includes BGA, PGA, leadless surface-mount components, and metal-capped,
vertically oriented components whose pins are located on the bottom of the component. This
class also includes all SMD resistors and capacitors which have their longer sides set to two sides
of the component.
System
This environment parameter indicates whether the system is open to allow for air convection. For
closed (sealed) systems, you should be aware that some cooling boundary conditions should be
set at the edges of the board. If no cooling boundary conditions are set, the board will have only
radiative cooling and will be very hot.
Temperature at end
The temperature set at the other end of the thermal screw.
Temperature Coefficient
On the traces, the electric conductivity varies with the temperature. Therefore, the power is also
changed when the temperature is changed. The temperature coefficient is the one for the electric
resistance or power at constant current as temperature changes.
Thickness of Layer
This is the thickness of this physical layer of the board. Notice that a physical layer can be
several layers of a board.
THETAcb
This value appears in the numerical output when you have a system that is closed on the front
side and the backside. It is the thermal resistance from component to board. This value is
TAIR(C) when there is an open system on at least one side.
THETAjc
The thermal resistance between the IC junction and the component casing in degC/Watt. This
value is very dependent upon the testing method used. The present THETAjc values in the
library are derived from the “Semi-Therm Proceedings”, TI and Signetics DataBooks, etc. If
unknown, set to 0.0. See THETAjc - Junction to Casing Thermal Resistance for more details.
THETAsa
Thermal resistance between sink to air. See THETAsa - Sink to Air Thermal Resistance for more
details.
Trace Thickness
The thickness of the trace. The trace is not a layer; it is an extra skin on the board.
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the world, disputes shall be resolved as follows: excluding conflict of laws rules, this Agreement shall be governed by and
construed under the laws of the State of Oregon, USA, if Customer is located in North or South America, and the laws of Ireland
if Customer is located outside of North or South America. All disputes arising out of or in relation to this Agreement shall be
submitted to the exclusive jurisdiction of the courts of Portland, Oregon when the laws of Oregon apply, or Dublin, Ireland when
the laws of Ireland apply. Notwithstanding the foregoing, all disputes in Asia arising out of or in relation to this Agreement shall
be resolved by arbitration in Singapore before a single arbitrator to be appointed by the chairman of the Singapore International
Arbitration Centre (“SIAC”) to be conducted in the English language, in accordance with the Arbitration Rules of the SIAC in
effect at the time of the dispute, which rules are deemed to be incorporated by reference in this section. This section shall not
restrict Mentor Graphics’ right to bring an action against Customer in the jurisdiction where Customer’s place of business is
located. The United Nations Convention on Contracts for the International Sale of Goods does not apply to this Agreement.
19. SEVERABILITY. If any provision of this Agreement is held by a court of competent jurisdiction to be void, invalid,
unenforceable or illegal, such provision shall be severed from this Agreement and the remaining provisions will remain in full
force and effect.
20. MISCELLANEOUS. This Agreement contains the parties’ entire understanding relating to its subject matter and supersedes all
prior or contemporaneous agreements, including but not limited to any purchase order terms and conditions. Some Software
may contain code distributed under a third party license agreement that may provide additional rights to Customer. Please see
the applicable Software documentation for details. This Agreement may only be modified in writing by authorized
representatives of the parties. Waiver of terms or excuse of breach must be in writing and shall not constitute subsequent
consent, waiver or excuse.