S34ml01g200tfi000 PDF
S34ml01g200tfi000 PDF
S34ML02G2
S34ML04G2
1 Gb, 2 Gb, 4 Gb, 3 V, 4-bit ECC, SLC
NAND Flash Memory for Embedded
Distinctive Characteristics
■ Density ❐ Device Size
❐ 1 Gb / 2 Gb / 4 Gb • 1 Gb: 1 plane per device or 128 Mbyte
■ Architecture • 2 Gb: 2 planes per device or 256 Mbyte
❐ Input / Output Bus Width: 8 bits / 16 bits
• 4 Gb: 2 planes per device or 512 Mbyte
❐ Page size: ■ NAND Flash interface
• ×8: ❐ Open NAND Flash Interface (ONFI) 1.0 compliant
1 Gb: (2048 + 64) bytes; 64-byte spare area ❐ Address, Data, and Commands multiplexed
2 Gb / 4 Gb: (2048 + 128) bytes; 128-byte spare area
■ Supply Voltage
• ×16:
1 Gb: (1024 + 32) words; 32-word spare area ❐ 3.3-V device: VCC = 2.7 V ~ 3.6 V
2 Gb / 4 Gb (1024 + 64) words; 64-word spare area ■ Security
❐ Block size: 64 Pages ❐ One Time Programmable (OTP) area
• ×8: ❐ Serial number (unique ID) (Contact factory for support)
1 Gb: 128 KB+ 4 KB ❐ Hardware program/erase disabled during power transition
2 Gb / 4 Gb: 128 KB + 8 KB
• ×16 ■ Additional features
1 Gb: 64k + 2k words ❐ 2 Gb and 4 Gb parts support Multiplane Program and Erase
2 Gb / 4 Gb: 64k + 4k words commands
❐ Plane size ❐ Supports Copy Back Program
Performance
■ Page Read / Program ❐ 10 Year Data retention (Typ)
❐ Random access: 25 µs (Max) (S34ML01G2) ❐ For one plane structure (1-Gb density)
❐ Random access: 30 µs (Max) (S34ML02G2, S34ML04G2) • Block zero is valid and will be valid for at least 1,000 pro-
❐ Sequential access: 25 ns (Min) gram-erase cycles with ECC
❐ Program time / Multiplane Program time: 300 µs (Typ) ❐ For two plane structures (2-Gb and 4-Gb densities)
• Blocks zero and one are valid and will be valid for at least
■ Block Erase (S34ML01G2)
1,000 program-erase cycles with ECC
❐ Block Erase time: 3 ms (Typ)
■ Package options
■ Block Erase / Multiplane Erase (S34ML02G2, S34ML04G2)
❐ Pb-free and low halogen
❐ Block Erase time: 3.5 ms (Typ)
❐ 48-Pin TSOP 12 × 20 × 1.2 mm
■ Reliability ❐ 63-Ball BGA 9 × 11 × 1 mm
❐ 100,000 Program / Erase cycles (Typ) ❐ 67-Ball BGA 8 × 6.5 × 1 mm (S34ML01G2, S34ML02G2)
(with 4-bit ECC per 528 bytes (×8) or 264 words (×16))
Cypress Semiconductor Corporation • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600
Document Number: 002-00499 Rev. *Q Revised April 13, 2018
S34ML01G2
S34ML02G2
S34ML04G2
Contents
1. General Description..................................................... 4 5.9 Program / Erase Characteristics ................................... 38
1.1 Logic Diagram................................................................ 5 6. Timing Diagrams......................................................... 39
1.2 Connection Diagram ...................................................... 6
6.1 Command Latch Cycle.................................................. 39
1.3 Pin Description............................................................... 8
6.2 Address Latch Cycle ..................................................... 39
1.4 Block Diagram................................................................ 9
6.3 Data Input Cycle Timing................................................ 40
1.5 Array Organization ......................................................... 9
6.4 Data Output Cycle Timing
1.6 Addressing ................................................................... 11
(CLE=L, WE#=H, ALE=L, WP#=H)............................... 40
1.7 Mode Selection ............................................................ 14
6.5 Data Output Cycle Timing
2. Bus Operation ............................................................ 15 (EDO Type, CLE=L, WE#=H, ALE=L) .......................... 41
2.1 Command Input ........................................................... 15 6.6 Page Read Operation ................................................... 41
2.2 Address Input............................................................... 15 6.7 Page Read Operation
2.3 Data Input .................................................................... 15 (Interrupted by CE#) ..................................................... 42
2.4 Data Output.................................................................. 15 6.8 Page Read Operation Timing
2.5 Write Protect ................................................................ 15 with CE# Don’t Care ..................................................... 42
2.6 Standby........................................................................ 15 6.9 Page Program Operation .............................................. 43
6.10 Page Program Operation Timing
3. Command Set............................................................. 16
with CE# Don’t Care ..................................................... 43
3.1 Page Read ................................................................... 17 6.11 Page Program Operation
3.2 Page Program.............................................................. 17 with Random Data Input ............................................... 44
3.3 Multiplane Program — 6.12 Random Data Output In a Page ................................... 44
S34ML02G2 and S34ML04G2..................................... 18 6.13 Multiplane Page Program Operation —
3.4 Page Reprogram.......................................................... 18 S34ML02G2 and S34ML04G2 ..................................... 45
3.5 Block Erase.................................................................. 20 6.14 Block Erase Operation .................................................. 46
3.6 Multiplane Block Erase — 6.15 Multiplane Block Erase —
S34ML02G2 and S34ML04G2..................................... 20 S34ML02G2 and S34ML04G2 ..................................... 46
3.7 Copy Back Program..................................................... 21 6.16 Copy Back Read with Optional Data Readout .............. 47
3.8 Read Status Register................................................... 22 6.17 Copy Back Program Operation
3.9 Read Status Enhanced — With Random Data Input............................................... 47
S34ML02G2 and S34ML04G2..................................... 22 6.18 Multiplane Copy Back Program —
3.10 Read Status Register Field Definition .......................... 22 S34ML02G2 and S34ML04G2 ..................................... 48
3.11 Reset............................................................................ 23 6.19 Read Status Register Timing ........................................ 49
3.12 Read Cache ................................................................. 23 6.20 Read Status Enhanced Timing ..................................... 49
3.13 Cache Program............................................................ 24 6.21 Reset Operation Timing ................................................ 49
3.14 Multiplane Cache Program — 6.22 Read Cache .................................................................. 50
S34ML02G2 and S34ML04G2..................................... 25 6.23 Cache Program............................................................. 52
3.15 Read ID........................................................................ 26 6.24 Multiplane Cache Program —
3.16 Read ID2...................................................................... 28 S34ML02G2 and S34ML04G2 ..................................... 53
3.17 Read ONFI Signature .................................................. 28 6.25 Read ID Operation Timing ............................................ 55
3.18 Read Parameter Page ................................................. 29 6.26 Read ID2 Operation Timing .......................................... 55
3.19 Read Unique ID (Contact Factory)............................... 31 6.27 Read ONFI Signature Timing........................................ 56
3.20 One-Time Programmable (OTP) Entry ........................ 32 6.28 Read Parameter Page Timing ...................................... 56
4. Signal Descriptions ................................................... 33 6.29 Read Unique ID Timing (Contact Factory).................... 56
4.1 Data Protection and Power On / Off Sequence ........... 33 6.30 OTP Entry Timing ......................................................... 57
4.2 Ready/Busy.................................................................. 33 6.31 Power On and Data Protection Timing ......................... 57
4.3 Write Protect Operation ............................................... 34 6.32 WP# Handling............................................................... 57
5. Electrical Characteristics .......................................... 35 7. Physical Interface ....................................................... 58
5.1 Valid Blocks ................................................................. 35 7.1 Physical Diagram .......................................................... 58
5.2 Absolute Maximum Ratings ......................................... 35 8. System Interface ......................................................... 61
5.3 Recommended Operating Conditions.......................... 35
5.4 AC Test Conditions ...................................................... 35 9. Error Management ...................................................... 62
5.5 AC Characteristics ....................................................... 36 9.1 System Bad Block Replacement................................... 62
5.6 DC Characteristics ....................................................... 37 9.2 Bad Block Management................................................ 63
5.7 Pin Capacitance........................................................... 38 10. Ordering Information .................................................. 64
5.8 Thermal Resistance ..................................................... 38
1. General Description
The S34ML01G2, S34ML02G2, and S34ML04G2 series is offered with a 3.3-V VCC power supply, and with x8 or x16 I/O interface.
Its NAND cell provides the most cost-effective solution for the solid state mass storage market. The memory is divided into blocks
that can be erased independently so it is possible to preserve valid data while old data is erased. The page size for x8 is (2048 +
spare) bytes; for x16 (1024 + spare) words.
To extend the lifetime of NAND flash devices, the implementation of an ECC is mandatory.
The chip supports CE# don't care function. This function allows the direct download of the code from the NAND flash memory device
by a microcontroller, since the CE# transitions do not stop the read operation.
The devices have a Read Cache feature that improves the read throughput for large files. During cache reading, the devices load
the data in a cache register while the previous data is transferred to the I/O buffers to be read.
Like all other 2-kB page NAND flash devices, a program operation typically writes 2 KB (×8) or 1 kword (×16) in 300 µs and an erase
operation can typically be performed in 3 ms (S34ML01G2) on a 128-kB block (×8) or 64k-word block (×16). In addition, thanks to
multiplane architecture, it is possible to program two pages at a time (one per plane) or to erase two blocks at a time (again, one per
plane). The multiplane architecture allows program time to be reduced by 40% and erase time to be reduced by 50%.
In multiplane operations, data in the page can be read out at 25 ns cycle time per byte. The I/O pins serve as the ports for command
and address input as well as data input/output. This interface allows a reduced pin count and easy migration towards different
densities, without any rearrangement of the footprint.
Commands, Data, and Addresses are asynchronously introduced using CE#, WE#, ALE, and CLE control pins.
The on-chip Program/Erase Controller automates all read, program, and erase functions including pulse repetition, where required,
and internal verification and margining of data. A WP# pin is available to provide hardware protection against program and erase
operations.
The output pin R/B# (open drain buffer) signals the status of the device during each operation. It identifies if the program/erase/read
controller is currently active. The use of an open-drain output allows the Ready/Busy pins from several memories to connect to a
single pull-up resistor. In a system with multiple memories the
R/B# pins can be connected all together to provide a global status signal.
The Reprogram function allows the optimization of defective block management — when a Page Program operation fails the data
can be directly programmed in another page inside the same array section without the time consuming serial data insertion phase.
Multiplane Copy Back is also supported. Data read out after Copy Back Read (both for single and multiplane cases) is allowed.
In addition, Cache Program and Multiplane Cache Program operations improve the programing throughput by programing data
using the cache register.
The devices provide two innovative features: Page Reprogram and Multiplane Page Reprogram. The Page Reprogram re-programs
one page. Normally, this operation is performed after a failed Page Program operation. Similarly, the Multiplane Page Reprogram
re-programs two pages in parallel, one per plane. The first page must be in the first plane while the second page must be in the
second plane. The Multiplane Page Reprogram operation is performed after a failed Multiplane Page Program operation. The Page
Reprogram and Multiplane Page Reprogram guarantee improved performance, since data insertion can be omitted during
re-program operations.
The devices are available in the TSOP48 (12 x 20 mm) package and come with the following security features:
OTP (one time programmable) area, which is a restricted access area where sensitive data/code can be stored permanently.
Serial number (unique identifier), which allows the devices to be uniquely identified. Contact factory for support of this feature.
These security features are subject to an NDA (non-disclosure agreement) and are, therefore, not described in the datasheet. For
more details about them, contact your nearest sales office.
CE# I/O0~I/O7
WE#
RE# R/B#
ALE
CLE
WP#
VSS
Table 2. Signal Names
Signal Description
I/O7 - I/O0 (×8)
Data Input / Outputs
I/O8 - I/O15 (×16)
CLE Command Latch Enable
ALE Address Latch Enable
CE# Chip Enable
RE# Read Enable
WE# Write Enable
WP# Write Protect
R/B# Read/Busy
VCC Power Supply
VSS Ground
NC Not Connected
Note
1. These pins should be connected to power supply or ground (as designated) following the ONFI specification, however they might not be bonded internally.
A1 A2 A9 A10
NC NC NC NC
B1 B9 B10
NC NC NC
C3 C4 C5 C6 C7 C8
D3 D4 D5 D6 D7 D8
E3 E4 E5 E6 E7 E8
NC NC NC NC NC NC
F3 F4 F5 F6 F7 F8
NC NC NC NC VSS (1) NC
G3 G4 G5 G6 G7 G8
NC VCC (1) NC NC NC NC
H3 H4 H5 H6 H7 H8
NC I/O0 NC NC NC Vcc
J3 J4 J5 J6 J7 J8
NC I/O1 NC VCC I/O5 I/O7
K3 K4 K5 K6 K7 K8
VSS I/O2 I/O3 I/O4 I/O6 VSS
L1 L2 L9 L10
NC NC NC NC
M1 M2 M9 M10
NC NC NC NC
Note
2. These pins should be connected to power supply or ground (as designated) following the ONFI specification, however they might not be bonded internally.
A1 A2 A9 A10
NC NC NC NC
B1 B9 B10
NC NC NC
C3 C4 C5 C6 C7 C8
D3 D4 D5 D6 D7 D8
E3 E4 E5 E6 E7 E8
NC NC NC NC NC NC
F3 F4 F5 F6 F7 F8
NC NC NC NC VSS NC
G3 G4 G5 G6 G7 G8
H3 H4 H5 H6 H7 H8
I/O8 I/O0 I/O10 I/O12 I/O14 Vcc
J3 J4 J5 J6 J7 J8
I/O9 I/O1 I/O11 VCC I/O5 I/O7
K3 K4 K5 K6 K7 K8
VSS I/O2 I/O3 I/O4 I/O6 VSS
L1 L2 L9 L10
NC NC NC NC
M1 M2 M9 M10
NC NC NC NC
A2 A3 A6 A7 A8
NC NC NC NC NC
B1 B2 B3 B4 B5 B6 B7 B8
C1 C2 C3 C4 C5 C6 C7 C8
NC NC RE# CLE NC NC NC NC
D2 D3 D4 D5 D6 D7
NC NC NC NC NC NC
E2 E3 E4 E5 E6 E7
NC NC NC NC NC NC
F2 F3 F4 F5 F6 F7
NC NC NC NC NC NC
G2 G3 G4 G5 G6 G7
NC I/O0 NC NC NC VCC
H1 H2 H3 H4 H5 H6 H7 H8
NC NC I/O1 NC VCC I/O5 I/O7 NC
J1 J2 J3 J4 J5 J6 J7 J8
NC VSS I/O2 I/O3 I/O4 I/O6 VSS NC
K1 K2 K3 K6 K7 K8
NC NC NC NC NC NC
Notes
3. A 0.1 µF capacitor should be connected between the VCC Supply Voltage pin and the VSS Ground pin to decouple the current surges from the power supply. The PCB
track widths must be sufficient to carry the currents required during program and erase operations.
4. An internal voltage detector disables all functions whenever VCC is below 1.8V to protect the device from any involuntary program/erase during power transitions.
Program Erase X
Controller
1024 Mbit + 32 Mbit (1 Gb Device)
HV Generation D
2048 Mbit + 128 Mbit (2 Gb Device)
E
4096 Mbit + 256 Mbit (4 Gb Device) C
O
ALE D
CLE E
NAND Flash R
WE#
Memory Array
CE# Command
WP# Interface
Logic
RE#
PAGE Buffer
Y Decoder
Command
Register
I/O Buffer
Data
Register
I/O0~I/O7 (x8)
I/O0~I/O15 (x16)
1022
1023
I/O
Page Buffer [7:0]
1022
1023
I/O 7
Cache Register I/O 0
2048 128 2048 128
Plane 0 Plane 1
I/O 15
Cache Register I/O 0
1024 64 1024 64
Plane 0 Plane 1
1.6 Addressing
1.6.1 S34ML01G2
Table 4. Address Cycle Map — 1 Gb Device
Bus Cycle I/O [15:8] (9) I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7
×8
1st / Col. Add.1 — A0 (CA0) A1 (CA1) A2 (CA2) A3 (CA3) A4 (CA4) A5 (CA5) A6 (CA6) A7 (CA7)
2nd / Col. Add. 2 — A8 (CA8) A9 (CA9) A10 (CA10) A11 (CA11) Low Low Low Low
3rd / Row Add. 1 — A12 (PA0) A13 (PA1) A14 (PA2) A15 (PA3) A16 (PA4) A17 (PA5) A18 (BA0) A19 (BA1)
4th / Row Add. 2 — A20 (BA2) A21 (BA3) A22 (BA4) A23 (BA5) A24 (BA6) A25 (BA7) A26 (BA8) A27 (BA9)
×16
1st / Col. Add.1 Low A0 (CA0) A1 (CA1) A2 (CA2) A3 (CA3) A4 (CA4) A5 (CA5) A6 (CA6) A7 (CA7)
2nd / Col. Add. 2 Low A8 (CA8) A9 (CA9) A10 (CA10) Low Low Low Low Low
3rd / Row Add. 1 Low A11 (PA0) A12 (PA1) A13 (PA2) A14 (PA3) A15 (PA4) A16 (PA5) A17 (BA0) A18 (BA1)
4th / Row Add. 2 Low A19 (BA2) A20 (BA3) A21 (BA4) A22 (BA5) A23 (BA6) A24 (BA7) A25 (BA8) A26 (BA9)
Notes
5. CAx = Column Address bit.
6. PAx = Page Address bit.
7. BAx = Block Address bit.
8. Block address concatenated with page address = actual page address, also known as the row address.
9. I/O[15:8] are not used during the addressing sequence and should be driven Low.
1.6.2 S34ML02G2
Table 5. Address Cycle Map — 2 Gb Device
I/O [15:8]
Bus Cycle I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7
(15)
×8
1st / Col. Add.1 — A0 (CA0) A1 (CA1) A2 (CA2) A3 (CA3) A4 (CA4) A5 (CA5) A6 (CA6) A7 (CA7)
2nd / Col. Add. 2 — A8 (CA8) A9 (CA9) A10 (CA10) A11 (CA11) Low Low Low Low
A18
3rd / Row Add. 1 — A12 (PA0) A13 (PA1) A14 (PA2) A15 (PA3) A16 (PA4) A17 (PA5) A19 (BA0)
(PLA0)
4th / Row Add. 2 — A20 (BA1) A21 (BA2) A22 (BA3) A23 (BA4) A24 (BA5) A25 (BA6) A26 (BA7) A27 (BA8)
5th / Row Add. 3 — A28 (BA9) Low Low Low Low Low Low Low
×16
1st / Col. Add.1 Low A0 (CA0) A1 (CA1) A2 (CA2) A3 (CA3) A4 (CA4) A5 (CA5) A6 (CA6) A7 (CA7)
2nd / Col. Add. 2 Low A8 (CA8) A9 (CA9) A10 (CA10) Low Low Low Low Low
A17
3rd / Row Add. 1 Low A11 (PA0) A12 (PA1) A13 (PA2) A14 (PA3) A15 (PA4) A16 (PA5) A18 (BA0)
(PLA0)
4th / Row Add. 2 Low A19 (BA1) A20 (BA2) A21 (BA3) A22 (BA4) A23 (BA5) A24 (BA6) A25 (BA7) A26 (BA8)
5th / Row Add. 3 Low A27 (BA9) Low Low Low Low Low Low Low
Notes
10. CAx = Column Address bit.
11. PAx = Page Address bit.
12. PLA0 = Plane Address bit zero.
13. BAx = Block Address bit.
14. Block address concatenated with page address and plane address = actual page address, also known as the row address.
15. I/O[15:8] are not used during the addressing sequence and should be driven Low.
1.6.3 S34ML04G2
Table 6. Address Cycle Map — 4 Gb Device
I/O [15:8]
Bus Cycle I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7
(21)
×8
1st / Col. Add.1 — A0 (CA0) A1 (CA1) A2 (CA2) A3 (CA3) A4 (CA4) A5 (CA5) A6 (CA6) A7 (CA7)
2nd / Col. Add. 2 — A8 (CA8) A9 (CA9) A10 (CA10) A11 (CA11) Low Low Low Low
A18
3rd / Row Add. 1 — A12 (PA0) A13 (PA1) A14 (PA2) A15 (PA3) A16 (PA4) A17 (PA5) A19 (BA0)
(PLA0)
4th / Row Add. 2 — A20 (BA1) A21 (BA2) A22 (BA3) A23 (BA4) A24 (BA5) A25 (BA6) A26 (BA7) A27 (BA8)
5th / Row Add. 3 — A28 (BA9) A29 (BA10) Low Low Low Low Low Low
×16
1st / Col. Add.1 Low A0 (CA0) A1 (CA1) A2 (CA2) A3 (CA3) A4 (CA4) A5 (CA5) A6 (CA6) A7 (CA7)
2nd / Col. Add. 2 Low A8 (CA8) A9 (CA9) A10 (CA10) Low Low Low Low Low
A17
3rd / Row Add. 1 Low A11 (PA0) A12 (PA1) A13 (PA2) A14 (PA3) A15 (PA4) A16 (PA5) A18 (BA0)
(PLA0)
4th / Row Add. 2 Low A19 (BA1) A20 (BA2) A21 (BA3) A22 (BA4) A23 (BA5) A24 (BA6) A25 (BA7) A26 (BA8)
5th / Row Add. 3 Low A27 (BA9) A28 (BA10) Low Low Low Low Low Low
Notes
16. CAx = Column Address bit.
17. PAx = Page Address bit.
18. PLA0 = Plane Address bit zero.
19. BAx = Block Address bit.
20. Block address concatenated with page address and plane address = actual page address, also known as the row address.
21. I/O[15:8] are not used during the addressing sequence and should be driven Low.
Notes
22. X can be VIL or VIH. High = Logic level high, Low = Logic level low.
23. WP# should be biased to CMOS high or CMOS low for stand-by mode.
24. During Busy Time in Read, RE# must be held high to prevent unintended data out.
2. Bus Operation
There are six standard bus operations that control the device: Command Input, Address Input, Data Input, Data Output, Write
Protect, and Standby. (See Table 7.)
Typically glitches less than 5 ns on Chip Enable, Write Enable, and Read Enable are ignored by the memory and do not affect bus
operations.
2.6 Standby
In Standby, the device is deselected, outputs are disabled, and power consumption is reduced.
3. Command Set
Table 8. Command Set
Acceptable Supported
Command 1st Cycle 2nd Cycle 3rd Cycle 4th Cycle Command on
during Busy S34ML01G2
Page Read 00h 30h No Yes
Page Program 80h 10h No Yes
Random Data Input 85h No Yes
Random Data Output 05h E0h No Yes
Multiplane Program 80h 11h 81h 10h No No
ONFI Multiplane Program 80h 11h 80h 10h No No
Page Reprogram 8Bh 10h No Yes
Multiplane Page Reprogram 8Bh 11h 8Bh 10h No No
Block Erase 60h D0h No Yes
Multiplane Block Erase 60h 60h D0h No No
ONFI Multiplane Block Erase 60h D1h 60h D0h No No
Copy Back Read 00h 35h No Yes
Copy Back Program 85h 10h No Yes
Multiplane Copy Back Program 85h 11h 81h 10h No No
ONFI Multiplane Copy Back Program 85h 11h 85h 10h No No
Special Read For Copy Back 00h 36h No No
Read Status Register 70h Yes Yes
Read Status Enhanced 78h Yes No
Reset FFh Yes Yes
Read Cache 31h No Yes
Read Cache Enhanced 00h 31h No Yes
Read Cache End 3Fh No Yes
Cache Program (End) 80h 10h No Yes
Cache Program (Start) / (Continue) 80h 15h No Yes
Multiplane Cache Program
80h 11h 81h 15h No No
(Start/Continue)
ONFI Multiplane Cache Program
80h 11h 80h 15h No No
(Start/Continue)
Multiplane Cache Program (End) 80h 11h 81h 10h No No
ONFI Multiplane Cache Program (End) 80h 11h 80h 10h No No
Read ID 90h No Yes
Read ID2 30h-65h-00h 30h No Yes
Read ONFI Signature 90h No Yes
Read Parameter Page ECh No Yes
Read Unique ID (Contact Factory) EDh No Yes
One-time Programmable (OTP) Area 29h-17h-04h-1
No Yes
Entry 9h
Cycle Type CMD ADDR ADDR ADDR ADDR ADDR Din Din Din Din CMD
tADL
tWB
tPROG
SR[6]
Page N
A
Cycle Type CMD Dout CMD ADDR ADDR ADDR ADDR ADDR CMD
tWB
tPROG
SR[6]
FAIL !
Page M
On the other hand, if the pattern bound for the target page is different from that of the previous page, data in cycles can be issued
before program confirm ‘10h’, as described in Figure 12.
Figure 12. Page Reprogram with Data Manipulation
As defined for Page
A
Program
Cycle Type CMD ADDR ADDR ADDR ADDR ADDR Din Din Din Din CMD CMD Dout
tADL
tWB
tPROG
SR[6]
FAIL !
Page N
A
Cycle Type CMD ADDR ADDR ADDR ADDR ADDR Din Din Din Din CMD
tADL
tWB
tPROG
SR[6]
Page M
The device supports Random Data Input within a page. The column address of next data, which will be entered, may be changed to
the address which follows the Random Data Input command (85h). Random Data Input may be operated multiple times regardless
of how many times it is done in a page.
The Program Confirm command (10h) initiates the re-programming process. The internal write state controller automatically
executes the algorithms and controls timings necessary for program and verify, thereby freeing the system controller for other tasks.
Once the program process starts, the Read Status Register command may be issued to read the Status Register. The system
controller can detect the completion of a program cycle by monitoring the R/B# output, or the Status bit (I/O6) of the Status Register.
Only the Read Status command and Reset command are valid when programming is in progress. When the Page Program is
complete, the Write Status Bit (I/O0) may be checked. The internal write verify detects only errors for 1’s that are not successfully
programmed to 0’s. The command register remains in Read Status command mode until another valid command is written to the
command register.
The Page Reprogram must be issued in the same plane as the Page Program that failed. In order to program the data to a different
plane, use the Page Program operation instead. The Multiplane Page Reprogram can re-program two pages in parallel, one per
plane. The Multiplane Page Reprogram operation is performed after a failed Multiplane Page Program operation. The command
sequence is very similar to Figure 27 on page 45, except that it requires the Page Reprogram Command (8Bh) instead of 80h and
81h.
If a Page Reprogram operation is interrupted by hardware reset, power failure or other means, the host must ensure that the
interrupted page is not used for further reading or programming operations until the next uninterrupted block erase is complete.
In other words, the Status Register is dynamic; the user is not required to toggle RE# / CE# to update it.
The command register remains in Status Read mode until further commands are issued. Therefore, if the Status Register is read
during a random read cycle, the read command (00h) must be issued before starting read cycles.
Note: The Read Status Register command shall not be used for concurrent operations in multi-die stack configurations (single CE#).
“Read Status Enhanced” shall be used instead.
N Page
0 Pass / Fail Pass / Fail NA NA Pass / Fail Pass: 0
Fail: 1
N - 1 Page
1 NA NA NA NA Pass / Fail Pass: 0
Fail: 1
2 NA NA NA NA NA —
3 NA NA NA NA NA —
4 NA NA NA NA NA —
Internal Data Operation
5 Ready / Busy Ready / Busy Ready / Busy Ready / Busy Ready / Busy Active: 0
Idle: 1
Ready / Busy
6 Ready / Busy Ready / Busy Ready / Busy Ready / Busy Ready / Busy Busy: 0
Ready: 1
3.11 Reset
The Reset feature is executed by writing FFh to the command register. If the device is in the Busy state during random read,
program, or erase mode, the Reset operation will abort these operations. The contents of memory cells being altered are no longer
valid, as the data may be partially programmed or erased. The command register is cleared to wait for the next command, and the
Status Register is cleared to value E0h when WP# is high or value 60h when WP# is low. If the device is already in reset state a new
Reset command will not be accepted by the command register. The R/B# pin transitions to low for tRST after the Reset command is
written. Refer to Figure 38 on page 49 for further details. The Status Register can also be read to determine the status of a Reset
operation.
Note: The Read Cache and Read Cache End commands reset the column counter, thus, when RE# is toggled to output the data of
a given page, the first output data is related to the first byte of the page (column address 00h). Random Data Output command can
be used to switch column address.
3.15 Read ID
The device contains a product identification mode, initiated by writing 90h to the command register, followed by an address input of
00h.
Note: If you want to execute Read Status command (0x70) after Read ID sequence, you should input dummy command (0x00)
before Read Status command (0x70).
For the S34ML02G2 and S34ML04G2 devices, five read cycles sequentially output the manufacturer code (01h), and the device
code and 3rd, 4th, and 5th cycle ID, respectively. For the S34ML01G2 device, four read cycles sequentially output the manufacturer
code (01h), and the device code and 80h, 4th cycle ID, respectively. The command register remains in Read ID mode until further
commands are issued to it. Figure 46 on page 55 shows the operation sequence, while Table 11 to Table 16 explain the byte
meaning.
Table 11. Read ID for Supported Configurations
Density Org VCC 1st 2nd 3rd 4th 5th
1 Gb 01h F1h 80h 1Dh —
2 Gb ×8 01h DAh 90h 95h 46h
4 Gb 01h DCh 90h 95h 56h
3.3 V
1 Gb 01h C1h 80h 5Dh —
2 Gb ×16 01h CAh 90h D5h 46h
4 Gb 01h CCh 90h D5h 56h
3rd ID Data
Table 13. Read ID Byte 3 Description
Description I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0
1 00
2 01
Internal Chip Number
4 10
8 11
2-level cell 00
4-level cell 01
Cell type
8-level cell 10
16-level cell 11
1 00
Number of simultaneously 2 01
programmed pages 4 10
8 11
Interleave program Not supported 0
Between multiple chips Supported 1
Not supported 0
Cache Program
Supported 1
4th ID Data
Table 14. Read ID Byte 4 Description — S34ML01G2
Description I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0
1 kB 00
Page Size 2 kB 01
(without spare area) 4 kB 10
8 kB 11
64 kB 00
Block Size 128 kB 01
(without spare area) 256 kB 10
512 kB 11
Spare Area Size 8 0
(byte / 512 byte) 16 1
45 ns 0 0
25 ns 0 1
Serial Access Time
Reserved 1 0
Reserved 1 1
×8 0
Organization
×16 1
5th ID Data
Table 16. Read ID Byte 5 Description — S34ML02G2 and S34ML04G2
Description I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0
1 bit / 512 bytes 00
2 bit / 512 bytes 01
ECC Level
4 bit / 512 bytes 10
8 bit / 512 bytes 11
1 00
2 01
Plane Number
4 10
8 11
64 Mb 000
128 Mb 001
256 Mb 010
Plane Size
512 Mb 011
(without spare area)
1 Gb 100
2 Gb 101
4 Gb 110
Reserved 0
Note:
1. O” Stands for Optional, “M” for Mandatory.
Note
25. For 32 nm NAND, for a particular condition, if read unique id does not give the correct values, the host must issue a Reset command before the read unique id command.
Issuance of Reset before the read unique id command will provide the correct values and will not output false values.
4. Signal Descriptions
4.1 Data Protection and Power On / Off Sequence
The device is designed to offer protection from any involuntary program/erase during power-transitions. An internal voltage detector
disables all functions whenever VCC is below about 1.8V.
The power-up and power-down sequence is shown in Figure 52 on page 57.
The Ready/Busy signal shall be valid within 100 µs after the power supplies have reached the minimum values (as specified on),
and shall return to one within 5 ms (max).
During this busy time, the device executes the initialization process (cam reading), and dissipates a current ICC0 (30 mA max), in
addition, it disregards all commands excluding Read Status Register (70h).
At the end of this busy time, the device defaults into “read setup”, thus if the user decides to issue a page read command, the 00h
command may be skipped.
The WP# pin provides hardware protection and is recommended to be kept at VIL during power-up and power-down. A recovery time
of minimum 100 µs is required before the internal circuit gets ready for any command sequences as shown in Figure 52 on page 57.
The two-step command sequence for
program/erase provides additional software protection.
4.2 Ready/Busy
The Ready/Busy output provides a method of indicating the completion of a page program, erase, copyback, or read completion.
The R/B# pin is normally high and goes to low when the device is busy (after a reset, read, program, or erase operation). It returns to
high when the internal controller has finished the operation. The pin is an open-drain driver thereby allowing two or more R/B#
outputs to be Or-tied. Because the pull-up resistor value is related to tr (R/B#) and the current drain during busy (ibusy), and output
load capacitance is related to tf, an appropriate value can be obtained with the reference chart shown in Figure 13.
For example, for a particular system with 20 pF of output load, tf from VCC to VOL at 10% to 90% will be 10 ns, whereas for a
particular load of 50 pF, Cypress measured it to be 20 ns as shown in Figure 13.
Figure 13. Ready/Busy Pin Electrical Application
Rp
ibusy
VCC
Ready VCC
R/B# VOH
open drain output VOL : 0.4V, VOH : 2.4V
CL
VOL
Busy
tf tr
GND
300n 3m Legend
2.4 = tr (ns)
= ibusy (mA)
200
200n 2m = tf (ns)
150
1.2
100
100n 0.8 1m
50 0.6
20 20 20 20
tr,tf [s]
1k 2k 3k 4k
Rp (ohm)
Rp value guidence
Vcc (Max.) - VOL (Max.) 3.2V
Rp (min.) = =
I OL + ∑I L 8mA + ∑I L
where I L is the sum of the input currents of all devices tied to the R/B# pin.
Rp(max) is determined by maximum permissible limit of tr.
WE#
I/O[7:0] Valid
WP#
Sequence
> 100 ns Aborted
5. Electrical Characteristics
Notes:
1. Except for the rating “Operating Temperature Range”, stresses above those listed in the table Absolute Maximum Ratings “Absolute Maximum Ratings” may cause
permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating
sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
2. Minimum Voltage may undershoot to -2V during transition and for less than 20 ns during transitions.
3. Maximum Voltage may overshoot to VCC +2.0V during transition and for less than 20 ns during transitions.
5.5 AC Characteristics
Table 23. AC Characteristics
Parameter Symbol Min Max Unit
ALE to RE# delay tAR 10 — ns
ALE hold time tALH 5 — ns
ALE setup time tALS 10 — ns
Address to data loading time tADL 70 — ns
CE# low to RE# low tCR 10 — ns
CE# hold time tCH 5 — ns
CE# high to output High-Z tCHZ — 30 ns
CLE hold time tCLH 5 — ns
CLE to RE# delay tCLR 10 — ns
CLE setup time tCLS 10 — ns
CE# access time tCEA (29) — 25 ns
CE# high to output hold tCOH (28) 15 — ns
CE# high to ALE or CLE don't care tCSD 10 — ns
CE# setup time tCS 20 — ns
Data hold time tDH 5 — ns
Data setup time tDS 10 — ns
Data transfer from cell to register (S34ML01G2) tR — 25 µs
Data transfer from cell to register (S34ML02G2, S34ML04G2) tR — 30 µs
Output High-Z to RE# low tIR 0 — ns
Read cycle time tRC 25 — ns
RE# access time tREA — 20 ns
RE# high hold time tREH 10 — ns
RE# high to output hold tRHOH (28) 15 — ns
RE# high to WE# low tRHW 100 — ns
RE# high to output High-Z tRHZ — 100 ns
RE# low to output hold tRLOH 5 — ns
RE# pulse width tRP 12 — ns
Ready to RE# low tRR 20 — ns
Device resetting time (Read/Program/Erase) tRST — 5/10/500 µs
WE# high to busy tWB — 100 ns
Write cycle time tWC 25 — ns
WE# high hold time tWH 10 — ns
WE# high to RE# low tWHR 60 — ns
WE# high to RE# low for Random Data Output tWHR2 200 — ns
WE# pulse width tWP 12 — ns
Write protect time tWW 100 — ns
Notes
26. The time to Ready depends on the value of the pull-up resistor tied to R/B# pin.
27. If Reset Command (FFh) is written at Ready state, the device goes into Busy for maximum 5 µs.
28. CE# low to high or RE# low to high can be at different times and produce three cases. Depending on which signal comes high first, either tCOH or tRHOH will be met.
29. During data output, tCEA depends partly on tCR (CE# low to RE# low). If tCR exceeds the minimum value specified, then the maximum time for tCEA may also be exceeded
(tCEA = tCR + tREA).
5.6 DC Characteristics
Table 24. DC Characteristics and Operating Conditions
Parameter Symbol Test Conditions Min Typ Max Units
50 per
Power On Current ICC0 FFh command input after power on — — mA
device
tRC = tRC (min)
Sequential Read ICC1 — 15 30 mA
CE# = VIL, Iout = 0 mA
Operating Current Normal — 15 30 mA
Program ICC2
Cache — 15 30 mA
Erase ICC3 — — 15 30 mA
CE#=VIH,
Standby Current, (TTL) ICC4 — — 1 mA
WP#=0V/Vcc
CE# = VCC-0.2,
Standby Current, (CMOS) ICC5 — 10 50 µA
WP# = 0/VCC
Input Leakage Current ILI VIN = 0 to VCC(max) — — ±10 µA
Output Leakage Current ILO VOUT = 0 to VCC(max) — — ±10 µA
Input High Voltage VIH — VCC x 0.8 — VCC + 0.3 V
Input Low Voltage VIL — -0.3 — VCC x 0.2 V
Output High Voltage VOH IOH = -400 µA 2.4 — — V
Output Low Voltage VOL IOL = 2.1 mA — — 0.4 V
Output Low Current (R/B#) IOL(R/B#) VOL = 0.4V 8 10 — mA
Erase and Program Lockout Voltage VLKO — — 1.8 — V
Notes
30. All VCC pins, and VSS pins respectively, are shorted together.
31. Values listed in this table refer to the complete voltage range for VCC and to a single device in case of device stacking.
32. All current measurements are performed with a 0.1 µF capacitor connected between the VCC Supply Voltage pin and the VSS Ground pin.
33. Standby current measurement can be performed after the device has completed the initialization process at power up. Refer to Section 4.1 for more details.
Note
34. For the stacked devices version the Input is 10 pF x [number of stacked chips] and the Input/Output is 10 pF x [number of stacked chips].
Note
35. Test conditions follow standard methods and procedures for measuring thermal impedance in accordance with EIA/JESD51.
Notes
36. Typical program time is defined as the time within which more than 50% of the whole pages are programmed (VCC = 3.3V, 25°C).
37. Copy Back Read and Copy Back Program for a given plane must be between odd address pages or between even address pages for the device to meet the program
time (tPROG) specification. Copy Back Program may not meet this specification when copying from an odd address page (source page) to an even address page (target
page) or from an even address page (source page) to an odd address page (target page).
6. Timing Diagrams
6.1 Command Latch Cycle
Command Input bus operation is used to give a command to the memory device. Commands are accepted with Chip Enable low,
Command Latch Enable High, Address Latch Enable low, and Read Enable High and latched on the rising edge of Write Enable.
Moreover for commands that starts a modify operation (write/ erase) the Write Protect pin must be high.
Figure 15. Command Latch Cycle
tCLS tCLH
CLE
tCS tCH
CE#
tWP
WE#
tALS tALH
ALE
tDS tDH
I/Ox Command
= Don’t Care
CLE
tCS
ALE
= Don’t Care
tCLH
CLE
tCH
CE#
tWC
tALS
ALE
= Don’t Care
tRC
tCHZ
CE#
tREH
tREA tREA tREA tCOH
RE#
tRHZ
tRHZ
tRHOH
I/Ox Dout Dout Dout
tRR
R/B#
Notes
38. Transition is measured at ± 200 mV from steady state voltage with load.
39. This parameter is sampled and not 100% tested.
40. tRHOH starts to be valid when frequency is lower than 33 MHz.
6.5 Data Output Cycle Timing (EDO Type, CLE=L, WE#=H, ALE=L)
Figure 19. Data Output Cycle Timing (EDO)
CE# tCR
tRC tCHZ
RE# tRP tREH tCOH
tRHZ
tREA tREA
tRLOH tRHOH
I/Ox
Dout Dout
tRR
R/B#
= Don’t Care
Notes
41. Transition is measured at ± 200 mV from steady state voltage with load.
42. This parameter is sampled and not 100% tested.
43. tRLOH is valid when frequency is higher than 33 MHz.
44. tRHOH starts to be valid when frequency is lower than 33 MHz.
CLE
tCLR
CE#
tWC
WE# tCSD
tWB
tAR
ALE
tR tRC
tRHZ
RE#
tRR
Note
45. If Status Register polling is used to determine completion of the read operation, the Read Command (00h) must be issued before data can be read from the page buffer.
CLE
tCLR
CE#
tCSD
WE# tCHZ
tCOH
tWB
tAR
ALE
tR tRC
RE#
tRR
R/B#
Busy = Don’t Care
CE#
CLE
ALE
WE#
tRC
RE#
tRR
00h Col. Col. Row Row Row Dout Dout Dout Dout Dout Dout Dout Dout Dout
I/Ox Add. 1 Add. 2 Add. 1 Add. 2 Add. 3 30h N N+1 N+4
N+2 N+3 N+5 M M+1 M+2
tR
R/B#
= Don’t Care (VIH or VIL)
tCR
CE#
tREA
RE#
I/Ox Dout
CLE
CE#
tWC tWC tWC
WE# tADL
tWB tPROG tWHR
ALE
RE#
R/B#
= Don’t Care
Note
46. tADL is the time from the WE# rising edge of final address cycle to the WE# rising edge of first data cycle.
CE#
CLE
ALE
WE#
RE#
Col. Col. Row Row Row Din Din Din Din Din Din
I/Ox 80h Add. 1 Add. 2 Add. 1 Add. 2 Add. 3 M R 10h
N N+1 P P+1
= Don’t Care
tCS tCH
CE#
WE# tWP
CLE
CE#
WE#
tADL tADL tWHR
tWB tPROG
ALE
RE#
R/B#
= Don’t Care
Note
47. tADL is the time from the WE# rising edge of final address cycle to the WE# rising edge of first data cycle.
tCLR
CE#
WE#
RE#
tRR
00h Col. Col. Row Row Row Dout 05h Col. Col. Dout
I/Ox 30h Dout N N +1 E0h Dout M M +1
Add. 1 Add. 2 Add. 1 Add. 2 Add. 3 Add. 1 Add. 2
Column Address Row Address Column Address
R/B#
= Don’t Care
Busy
CE#
tWC
WE#
tWB tDBSY tWB tPROG tWHR
ALE
80h Col. Col. Row Row Row Din Din 11h 81h Col. Col. Row Row Row Din Din 10h 70h IO
I/Ox Add1 Add2 Add1 Add2 Add3 N M Add1 Add2 Add1 Add2 Add3 N M
Serial Data 1 up to full page Program Program Confirm Read Staus
Column Address Page Row Address Command
Input Command Data Serial Input (Dummy) Command (True) Command
R/B#
I/O0~7 80h Address & Data Input 11h 81h Address & Data Input 10h 70h
Col Add 1,2 and Row Add 1,2,3 Col Add 1,2 and Row Add 1,2,3
and Data and Data
(Note 48)
A0 ~ A11: Valid A0 ~ A11: Valid
A12 ~ A17: Fixed ‘Low’ A12 ~ A17: Valid
A18: Fixed ‘Low’ A18: Fixed ‘High’
A19 ~ A28: Fixed ‘Low’ A19 ~ A28: Valid
Notes
48. Any command between 11h and 81h is prohibited except 70h, 78h, and FFh.
49. A18 is the plane address bit for ×8 devices. A17 is the plane address bit for ×16 devices.
Cycle Type CMD ADDR ADDR ADDR ADDR ADDR DIN DIN DIN DIN CMD
tADL
DQx 80h C1A C2A R1A R2A R3A D0A D1A ... DnA 11h
tADL
tIPBSY
SR[6]
A
Cycle Type CMD ADDR ADDR ADDR ADDR ADDR DIN DIN DIN DIN CMD
tADL
DQx 80h C1B C2B R1B R2B R3B D0B D1B ... DnB 10h
tADL
tPROG
SR[6]
Notes
50. C1A-C2A Column address for page A. C1A is the least significant byte.
51. R1A-R3A Row address for page A. R1A is the least significant byte.
52. D0A-DnA Data to program for page A.
53. C1B-C2B Column address for page B. C1B is the least significant byte.
54. R1B-R3B Row address for page B. R1B is the least significant byte.
55. D0B-DnB Data to program for page B.
56. The block address bits must be the same except for the bit(s) that select the plane.
CLE
CE#
tWC
WE#
tWB tBERS tWHR
ALE
RE#
I/Ox 60h Row Add1 Row Add2 Row Add3 D0h 70h I/O0
Row Address
R/B# BUSY
Auto Block Erase Erase Command I/O0=0 Successful Erase
Read Status
Setup Command
Command I/O0=1 Error in Erase
= Don’t Care
CLE
CE#
tWC tWC
WE#
tWB tBERS tWHR
ALE
RE#
I/Ox 60h Row Add1 Row Add2 Row Add3 60h Row Add1 Row Add2 Row Add3 D0h 70h I/O0
R/B# Busy
Block Erase Setup Command1 Block Erase Setup Command2 Erase Confirm Command
Read Status Command
R/B# tBERS
Note
57. A18 is the plane address bit for ×8 devices. A17 is the plane address bit for ×16 devices.
CLE
WE#
ALE
RE#
IOx 60h R1 A R2A R3A D1h 60h R1B R2B R3B D0h
t
IEBSY t
SR[6] BERS
Notes
58. R1A-R3A Row address for block on plane 0. R1A is the least significant byte.
59. R1B-R3B Row address for block on plane 1. R1B is the least significant byte.
60. The block address bits must be the same except for the bit(s) that select the plane.
Source Target
00h 35h Data Outputs 85h 10h 70h SR0
I/O Add Inputs Add Inputs
Read Status Register
tR tPROG
(Read Busy time) (Program Busy time)
R/B#
Busy Busy
tR tPROG
(Read Busy time) (Program Busy time)
R/B#
Busy Busy
tDBSY tPROG
R/B#
I/Ox 85h Add. (5 cycles) 11h 81h Add. (5 cycles) 10h 70h
Col. Add. 1, 2 and Row Add. 1, 2, 3 Col. Add. 1, 2 and Row Add. 1, 2, 3
1 Destination Address (Note 62)
Destination Address
Plane 0 Plane 1
Source Page
Source Page
Notes
61. Copy Back Program operation is allowed only within the same memory plane.
62. Any command between 11h and 81h is prohibited except 70h, 78h, and FFh.
63. A18 is the plane address bit for ×8 devices. A17 is the plane address bit for ×16 devices.
WE#
ALE
RE#
IOx 85h C1 A C2 A R1A R2A R3A 11h 85h C1B C2B R1B R2 B R3B 10h
t IPBSY t PROG
SR[6]
A
Notes
64. C1A-C2A Column address for page A. C1A is the least significant byte.
65. R1A-R3A Row address for page A. R1A is the least significant byte.
66. C1B-C2B Column address for page B. C1B is the least significant byte.
67. R1B-R3B Row address for page B. R1B is the least significant byte.
68. The block address bits must be the same except for the bit(s) that select the plane.
tCS
CE#
tCH
tWP
WE# tCEA tCHZ
tCOH
tWHR
RE#
tRHZ
tDH tREA
tDS tIR
tRHOH
I/Ox 70h Status Output
= Don’t Care
CLE
tWHR
WE#
ALE
RE#
tAR
I/O0-7 78h R1 R2 R3 SR
WE#
ALE
CLE
RE#
I/O7:0 FF
t RST
R/B#
CLE
ALE tWC
RE#
tRR tRR
Col. Col. Row Row Row Dout Dout Dout Dout
I/Ox 00h Add 1 Add 2 Add 1 Add 2 Add 3 30h 31h
0 1
Dout 31h
0 1
Page N Page N + 1
Column Address 00h Page Address N Col. Add. 0 Col. Add. 0
tCBSYR tCBSYR
tR
R/B#
5
1 2 3 4
A
CE#
CLE
ALE
WE# tWB
tRC tWB tRC
RE#
tRR tRR
Dout Dout Dout Dout
I/Ox Dout 31h
0 1
Dout 3Fh
0 1
Dout
Page N + 2 Page N + 3
Col. Add. 0 Col. Add. 0
tCBSYR tCBSYR
R/B#
5 6 7 8 9
= Don’t Care
1 3 5 7
Cell Array
Page N
Page N + 1
Page N + 2
Page N + 3
Figure 40. “Sequential” Read Cache Timing, Start (and Continuation) of Cache Operation
As defined for
Read
Figure 41. “Random” Read Cache Timing, Start (and Continuation) of Cache Operation
As defined A
for Read
Cycle Type CMD CMD ADDR ADDR ADDR ADDR ADDR CMD Dout Dout Dout
Page N
I/Ox 30h 00h C1 C2 R1 R2 R3 31h D0 ... Dn
SR[6] tCBSYR
CLE
CE#
tWC tWC
WE#
tWB
ALE
RE#
Col. Col. Row. Row. Row. Din Din Col. Col. Row. Row. Row. Din Din
80h 15h 80h 15h
I/Ox Add1 Add2 Add1 Add2 Add3 N M Add1 Add2 Add1 Add2 Add3 N M
Column Address Row Address Column Address Row Address
R/B#
tCBSYW tCBSYW
1
CLE
CE#
tWC
WE#
ALE
RE#
tADL
Col. Col. Row. Row. Row. Din Din
I/Ox 80h Add1 Add2 Add1 Add2 Add3 N M 10h 70h Status
Column Address Row Address
R/B#
1 tPROG
80h Address Input Data Input 11h 81h Address Input Data Input 15h
A0~A11: Valid A0~A11: Valid
A12~A17: Fixed ‘Low’ A12~A17: Valid
A18: Fixed ‘Low’ A18: Fixed ‘High’
A19~A28: Fixed ‘Low’ tDBSY A19~A28: Valid tCBSYW
RY/BY#
Return to 1 1
Repeat a max of 63 times
Command Input
80h Address Input Data Input 11h 81h Address Input Data Input 10h
A0~A11: Valid A0~A11: Valid
A12~A17: Fixed ‘Low’ A12~A17: Valid
A18: Fixed ‘Low’ A18: Fixed ‘High’
A19~A28: Fixed ‘Low’ tDBSY A19~A28: Valid tPROG
RY/BY#
1
CLE
CE#
tWB tWC
WE#
ALE tWB
I/Ox 80h Col. Col. Row Row Row Din Din 11h 81h Col. Col. Row Row Row Din Din 15h
Add1 Add2 Add1 Add2 Add3 N M Add1 Add2 Add1 Add2 Add3 N M
Column Address Row Address Column Address Row Address
R/B#
1
tDBSY tCBSYW
CLE
CE#
tWB tWC
WE#
ALE
RE#
Col. Col. Row Row Row Col. Col. Row Row Row
I/Ox 80h Add1 Add2 Add1 Add2 Add3
Din
N
Din
M
11h 81h Add1 Add2 Add1 Add2 Add3
Din
N
Din
M
10h 70h Status
R/B#
1 tDBSY tPROG
Notes
69. Read Status Register (70h) is used in the figure. Read Status Enhanced (78h) can be also used.
70. A18 is the plane address bit for ×8 devices. A17 is the plane address bit for ×16 devices.
80h Address Input Data Input 11h 80h Address Input Data Input 15h
tDBSY tCBSYW
RY/BY#
Return to 1 1
Repeat a max of 63 times
Command Input
80h Address Input Data Input 11h 80h Address Input Data Input 10h
CLE
CE#
tWB tWC
WE#
ALE tWB
IOx 80h Col. Col. Row Row Row Din Din 11h 80h Col. Col. Row Row Row Din Din 15h
Add1 Add2 Add1 Add2 Add3 N M Add1 Add2 Add1 Add2 Add3 N M
Column Address Row Address Column Address Row Address
R/B#
1
tDBSY tCBSYW
CLE
CE#
tWB tWC
WE#
ALE
RE#
80h Col. Col. Row Row Row Din Din 11h 80h Col. Col. Row Row Row Din Din 10h Status
IOx N Add1 Add2 Add1 Add2 Add3 N 70h
Add1 Add2 Add1 Add2 Add3 M M
Column Address Row Address Column Address Row Address
R/B#
1 tDBSY tPROG
Notes
71. The block address bits must be the same except for the bit(s) that select the plane.
72. Read Status register (70h) is used in the figure. Read Status Enhanced (78h) can be also used.
CLE
CE#
WE#
tWHR
tAR
ALE
tREA
RE#
1 Gb Device
90h 00h 01h F1h 80h 1Dh
I/Ox
2 Gb Device
90h 00h 01h DAh 90h 95h 46h
I/Ox
4 Gb Device
I/Ox 90
09h 00h 01h DCh 90h 95h 56h
Read ID Address 1 Maker Device 3rd Cycle 4th Cycle 5th Cycle
Command Cycle Code Code
CLE
CE#
WE#
tR
ALE
RE#
I/Ox 30h 65h 00h 00h 02h 02h 00h 30h ID2 Data ID2 Data ID2 Data ID2 Data ID2 Data
Read ID2 4 Cycle Address Read ID2 1st Cycle 2nd Cycle 3rd Cycle 4th Cycle 5th Cycle
Commands Confirm
Command
R/B#
(Note 73)
Busy
Notes
73. 4-cycle address is shown for the S34ML01G2. For S34ML02G2 and S34ML04G2, insert an additional address cycle of 00h.
74. If Status Register polling is used to determine completion of the Read ID2 operation, the Read Command (00h) must be issued before ID2 data can be read from the flash.
CLE
WE#
ALE
RE# t WHR
tREA
CLE
WE#
ALE
RE#
tR
R/B#
Note
75. If Status Register polling is used to determine completion of the read operation, the Read Command (00h) must be issued before data can be read from the page buffer.
CLE
WE#
ALE
RE#
tR
R/B#
CLE
WE#
ALE
Vcc(min) Vcc(min)
VTH VTH
VCC
0V
don’t don’t
care care
CE VIH
Note
76. VTH = 1.8 Volts.
WP# WP#
R/B# R/B#
WP# WP#
R/B# R/B#
7. Physical Interface
7.1 Physical Diagram
7.1.1 48-Pin Thin Small Outline Package (TSOP1)
Figure 55. TS/TSR 48 — 48-lead Plastic Thin Small Outline, 12 x 20 mm, Package Outline
NOTES:
PACKAGE TS/TSR 48
JEDEC MO-142 (D) DD 1. DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORM TO ANSI Y14.5M-1994).
SYMBOL MIN NOM MAX
2. PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
A --- --- 1.20
3. PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN): INK OR LASER MARK.
A1 0.05 --- 0.15
4. TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS
A2 0.95 1.00 1.05
DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE LEADS
b1 0.17 0.20 0.23 ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
b 0.17 0.22 0.27 5. DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD
PROTRUSION ON E IS 0.15mm PER SIDE AND ON D1 IS 0.25mm PER SIDE.
c1 0.10 --- 0.16
6. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR
c 0.10 --- 0.21
PROTRUSION SHALL BE 0.08mm TOTAL IN EXCESS OF b DIMENSION AT MAX.
D 19.80 20.00 20.20 MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON LOWER RADIUS OR THE
FOOT. MINIMUM SPACE BETWEEN PROTRUSION AND AN ADJACENT LEAD TO BE 0.07mm.
D1 18.30 18.40 18.50
7. THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN
E 11.90 12.00 12.10
0.10mm AND 0.25mm FROM THE LEAD TIP.
e 0.50 BASIC
8. LEAD COPLANARITY SHALL BE WITHIN 0.10mm AS MEASURED FROM
L 0.50 0.60 0.70 THE SEATING PLANE.
O 0˚ --- 8 9. DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
R 0.08 --- 0.20
N 48
5006 \ f16-038 \ 6.5.13
NOTES:
PACKAGE VBM 063
1. DIMENSIONING AND TOLERANCING METHODS PER
JEDEC M0-207(M) ASME Y14.5M-1994.
11.00 mm x 9.00 mm NOM 2. ALL DIMENSIONS ARE IN MILLIMETERS.
PACKAGE 3. BALL POSITION DESIGNATION PER JEP95, SECTION
SYMBOL MIN NOM MAX NOTE 3, SPP-020.
A --- --- 1.00 PROFILE 4. e REPRESENTS THE SOLDER BALL GRID PITCH.
A1 0.25 --- --- BALL HEIGHT 5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE
"D" DIRECTION.
D 11.00 BSC. BODY SIZE
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
E 9.00 BSC. BODY SIZE "E" DIRECTION.
D1 8.80 BSC. MATRIX FOOTPRINT n IS THE TOTAL NUMBER OF POPULATED SOLDER
E1 7.20 BSC. MATRIX FOOTPRINT BALL POSITIONS FOR MATRIX SIZE MD X ME.
MD 12 MATRIX SIZE D DIRECTION 6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
ME 10 MATRIX SIZE E DIRECTION
7 “SD” AND “SE” ARE MEASURED WITH RESPECT TO DATUMS
n 63 BALL COUNT A AND B AND DEFINE THE POSITION OF THE CENTER
b 0.40 0.45 0.50 BALL DIAMETER SOLDER BALL IN THE OUTER ROW.
eE 0.80 BSC. BALL PITCH WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW “SD” OR “SE” = 0.
eD 0.80 BSC. BALL PITCH
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
SD 0.40 BSC. SOLDER BALL PLACEMENT THE OUTER ROW, “SD” = eD/2 AND “SE” = eE/2.
SE 0.40 BSC. SOLDER BALL PLACEMENT 8. "+" INDICATES THE THEORETICAL CENTER OF
A3-A8,B2-B8,C1,C2,C9,C10 DEPOPULATED SOLDER BALLS DEPOPULATED BALLS.
D1,D2,D9,D10,E1,E2,E9,E10 9 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
F1,F2,F9,F10,G1,G2,G9,G10 MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
H1,H2,H9,H10,J1,J2,J9,J10
K1,K2,K9,K10
L3-L8,M3-M8
NOTES:
PACKAGE VBT 067
1. DIMENSIONING AND TOLERANCING METHODS PER
JEDEC N/A ASME Y14.5M-1994.
NOTE
DXE 8.00 mm x 6.50 mm 2. ALL DIMENSIONS ARE IN MILLIMETERS.
PACKAGE 3. BALL POSITION DESIGNATION PER JEP95, SECTION 3,
SYMBOL MIN NOM MAX SPP-020.
A --- --- 1.00 PROFILE 4. e REPRESENTS THE SOLDER BALL GRID PITCH.
A1 0.22 --- --- BALL HEIGHT 5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.
D 8.00 BSC BODY SIZE SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.
E 6.50 BSC BODY SIZE n IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
D1 7.20 BSC MATRIX FOOTPRINT
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
E1 5.60 BSC MATRIX FOOTPRINT DIAMETER IN A PLANE PARALLEL TO DATUM C.
MD 10 MATRIX SIZE D DIRECTION 7 “SD” AND “SE” ARE MEASURED WITH RESPECT TO DATUMS
ME 8 MATRIX SIZE E DIRECTION A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
n 67 BALL COUNT
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
Øb 0.41 0.46 0.51 BALL DIAMETER OUTER ROW, “SD” OR “SE” = 0.
eE 0.80 BSC BALL PITCH WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
eD 0.80 BSC BALL PITCH OUTER ROW, “SD” = eD/2 AND “SE” = eE/2.
SD 0.40 BSC SOLDER BALL PLACEMENT 8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
SE 0.40 BSC SOLDER BALL PLACEMENT
9 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
A1,D1,E1,F1,G1 DEPOPULATED SOLDER BALLS MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
A4,K4,A5,K5
D8,E8,F8,G8
8. System Interface
To simplify system interface, CE# may be unasserted during data loading or sequential data reading as shown in Figure 58. By
operating in this way, it is possible to connect NAND flash to a microprocessor.
Figure 58. Program Operation with CE# Don't Care
CLE
CE#
WE#
ALE
I/Ox 80h St art Add. (5 Cycle) Dat a I nput Data Input 10h
CLE
CE# don’t care
CE#
RE#
ALE
R/B#
tR
WE#
I/Ox 00h St art Add. (5 Cycle) 30h Dat a Out put ( sequent ial)
From the LSB page to MSB page Ex.) Random page program (Optional)
DATA IN : Data (1) Data (64) DATA IN : Data (1) Data (64)
9. Error Management
(78)
Data Data
th th
N page Failure (77) N page
(79)
FFh FFh
Start
Block Address=
Block 0
Increment
Block Address
(81) No
Data Update
=FFh? Bad Block Table
Yes
Last No
Block?
Yes
End
Note
81. Check for FFh at the 1st byte in the spare area of the 1st, 2nd, and last pages.
S34ML 04G 2 00 T F I 00 0
Packing Type
0 = Tray
3 = 13” Tape and Reel
Model Number
00 = Standard Interface / ONFI (×8)
00 = Standard Interface (×16)
01 = ONFI (×16)
Temperature Range
I = Industrial (-40°C to + 85°C)
A = Industrial with AECQ-100 and GT Grade (-40˚C to +85˚C)
V = Industrial Plus (-40°C to + 105°C)
B = Industrial Plus with AECQ-100 and GT Grade (-40˚C to +105˚C)
Materials Set
F = Lead (Pb)-free
H = Lead (Pb)-free and Low Halogen
Package
B = 63-Ball BGA
G = 67-Ball BGA
T = TSOP
Bus Width
00 = ×8 NAND, single die
04 = ×16 NAND, single die
Technology
2 = Cypress NAND Revision 2 (32 nm)
Density
01G = 1 Gb
02G = 2 Gb
04G = 4 Gb
Device Family
S34ML
Cypress SLC NAND Flash Memory for Embedded
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Contact your local sales office to confirm
availability of specific valid combinations and to check on newly released combinations.
Notes
82. BGA package marking omits the leading “S34” and the Packing Type designator from the ordering part number.
83. Contact sales regarding the availability of S34ML02G2 products in A,V and B temperature ranges.
Performance
Package Options: added 67-Ball BGA 8 x 6 x 1 mm
Connection Diagram :Added figure: 67-BGA Contact (Balls Down, Top View)
*F - XILA 11/01/2013 Physical Diagram : Added figure: 67-Ball, Ball Grid Array (BGA)
Ordering Information: Added to ‘Package’
Valid Combinations
Added ‘GH’ to Package Type
Added ‘Unique ID support guaranteed’ to Additional Ordering Options
Global
XILA
*G - 01/06/2014 Upgraded data sheet designation from Preliminary to Full Production
Note the S34ML02G2 is in the Advance Information designation
Ordering Information
XILA
*H - 07/03/2014 Added A, V, B to Temperature Range
Valid Combinations table: added A to Temperature Range of 01G Density
Ordering Information
XILA
*I - 09/05/2014 Valid Combinations table:
added Package Type BH and TF for 01G Density
corrected Package Type for 02G Density
Distinctive Characteristics
Operating Temperature: added Industrial Plus
XILA
*J - 04/17/2015 Read Parameter :Page Updated Note
Read Unique ID (Contact Factory):
Unique ID Data Description (Contact Factory) table: added Note
Ordering Information: Valid Combinations table: updated table
XILA
*K 5030732 12/02/2015 Updated to Cypress template
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