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IPC-6013D

Qualification and
Performance Specification
for Flexible/Rigid-Flexible
Printed Boards

Developed by the Flexible Circuits Performance Specifications


Subcommittee (D-12) of the Flexible Circuits Committee (D-10)
of IPC

Supersedes:
IPC-6013C - December 2013
IPC-6013B - January 2009
IPC-6013A with Amendment 2 -
April 2006 Users of this publication are encouraged to participate in the
IPC-6013A with Amendment 1 -
development of future revisions.
January 2005
IPC-6013A - November 2003
Amendment 1 - December 2005 Contact:
IPC-6013 with
Amendment 1 IPC
Includes:
IPC-6013 - November 1998
Amendment 1 - April 2000
IPC-RF-245 - April 1987
IPC-FC-250A - January 1974
September 2017 IPC-6013D

Table of Contents
1 SCOPE ...................................................................... 1 3.2.6 Base Metallic Plating Depositions and
1.1 Statement of Scope ............................................. 1 Conductive Coatings .......................................... 8
3.2.7 Final Finish Depositions and Coatings –
1.2 Purpose ................................................................ 1
Metallic and Non-Metallic ................................. 8
1.3 Performance Classification, Board Type, and
3.2.8 Polymer Coating (Solder Mask) ...................... 12
Installation Usage ............................................... 1
3.2.9 Fusing Fluids and Fluxes ................................. 12
1.3.1 Classification ....................................................... 1
3.2.10 Marking Inks .................................................... 12
1.3.2 Printed Board Type ............................................. 1
3.2.11 Hole Fill Insulation Material ............................ 12
1.3.3 Installation Uses ................................................. 1
3.2.12 Heatsink Planes, External ................................. 12
1.3.4 Selection for Procurement .................................. 1
3.2.13 Via Protection ................................................... 12
1.3.5 Material, Plating Process and Final Finish ........ 2
3.2.14 Embedded Passive Materials ............................ 12
1.4 Terms and Definitions ........................................ 3
3.3 Visual Examination .......................................... 12
1.4.1 As Agreed Upon Between User and
Supplier (AABUS) ............................................. 3 3.3.1 Profile ................................................................ 12
1.4.2 Button Plating ..................................................... 3 3.3.2 Construction Imperfections .............................. 13
1.4.3 Cover Material .................................................... 3 3.3.3 Plating and Coating Voids in the Hole ............ 17
1.4.4 Target Land (Via Bottom Land) ........................ 4 3.3.4 Lifted Lands ...................................................... 17
1.4.5 Capture Land (Via Top Land) ............................ 4 3.3.5 Marking ............................................................. 17
1.4.6 Microvia .............................................................. 4 3.3.6 Solderability ...................................................... 18
1.4.7 Core ..................................................................... 4 3.3.7 Plating Adhesion ............................................... 18
1.5 Interpretation ....................................................... 4 3.3.8 Edge Board Contact, Junction of Gold
Plate to Solder Finish ....................................... 18
1.6 Presentation ......................................................... 4
3.3.9 Adhesive/Strain Relief ...................................... 19
1.7 Revision Level Changes ..................................... 4
3.3.10 Workmanship .................................................... 19
2 APPLICABLE DOCUMENTS .................................... 4 3.4 Dimensional Requirements .............................. 19
2.1 IPC ...................................................................... 4 3.4.1 Hole Size, Hole Pattern Accuracy and
2.2 Joint Industry Standards ..................................... 6 Pattern Feature Accuracy ................................. 19
2.3 Other Publications .............................................. 6 3.4.2 Annular Ring and Breakout (External) ............ 20
2.3.1 American Society for Testing and Materials ..... 6 3.4.3 Bow and Twist (Individual Rigid or
Stiffener Portions Only) ................................... 22
2.3.2 Underwriters Lab ................................................ 6
3.4.4 Array Sub-Pallets .............................................. 22
2.3.3 National Electrical Manufacturers
Association .......................................................... 6 3.5 Conductor Definition ........................................ 22
2.3.4 American Society for Quality ............................ 6 3.5.1 Conductor Width and Thickness ...................... 23
2.3.5 AMS .................................................................... 7 3.5.2 Conductor Spacing ........................................... 23
2.3.6 American Society of Mechanical Engineers ..... 7 3.5.3 Conductor Imperfections .................................. 23
2.3.7 Federal ................................................................ 7 3.5.4 Conductive Surfaces ......................................... 24
3.6 Structural Integrity ............................................ 26
3 REQUIREMENTS ...................................................... 7
3.6.1 Thermal Stress Testing ..................................... 26
3.1 General ................................................................ 7
3.6.2 Requirements for Microsectioned
3.2 Materials Used in this Specification .................. 7 Coupons or Production Boards ........................ 28
3.2.1 Laminates and Bonding Materials ..................... 7 3.7 Solder Mask Requirements .............................. 42
3.2.2 External Bonding Materials ............................... 7 3.7.1 Solder Mask Coverage ..................................... 42
3.2.3 Other Dielectric Materials .................................. 7 3.7.2 Solder Mask Cure and Adhesion ..................... 42
3.2.4 Metal Foils .......................................................... 7 3.7.3 Solder Mask Thickness .................................... 43
3.2.5 Metal Planes/Cores ............................................. 8 3.8 Electrical Requirements .................................... 43

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IPC-6013D September 2017

3.8.1 Dielectric Withstanding Voltage ....................... 43 APPENDIX A .............................................................. 55


3.8.2 Electrical Continuity and Isolation
Resistance ......................................................... 43 Figures
3.8.3 Circuit/PTH Shorts to Metal Substrates .......... 43
Figure 1-1 Microvia Definition ............................................ 4
3.8.4 Moisture and Insulation Resistance (MIR) ...... 43
Figure 3-1 Transition Zone ............................................... 13
3.9 Cleanliness ........................................................ 44 Figure 3-2 Unacceptable Covercoat Coverage ............... 15
3.9.1 Cleanliness Prior to Solder Mask Figure 3-3 Solder Wicking and Plating Penetration ......... 17
Application ........................................................ 44
Figure 3-4 Annular Ring Measurement (External) ........... 21
3.9.2 Cleanliness After Solder Mask, Solder, or
Figure 3-5 Breakout of 90°° and 180°° ............................ 21
Alternative Surface Coating Application ......... 44
Figure 3-6 Conductor Width Reduction ........................... 21
3.9.3 Cleanliness of Inner Layers After Oxide
Treatment Prior to Lamination ......................... 44 Figure 3-7 Major and Minor Access Holes for Flexible
Printed Boards ................................................ 21
3.10 Special Requirements ....................................... 44
Figure 3-8 Squeeze-Out of Cover Film Adhesive and
3.10.1 Outgassing ........................................................ 44 Ooze-Out of Covercoat .................................. 22
3.10.2 Fungus Resistance ............................................ 44 Figure 3-9 Missing Material or Skips in the Bead of
Adhesive Squeeze-Out at Coverlay Edges .... 22
3.10.3 Vibration ........................................................... 44
Figure 3-10 Unnecessary Copper Between Conductor
3.10.4 Mechanical Shock ............................................ 44 and Nodule of Conductor ............................... 23
3.10.5 Impedance Testing ............................................ 44 Figure 3-11 Isolated Reductions of Conductor
3.10.6 Coefficient of Thermal Expansion (CTE) ........ 44 Thickness ........................................................ 23
3.10.7 Thermal Shock .................................................. 45 Figure 3-12 Rectangular Surface Mount Lands ................. 24
3.10.8 Surface Insulation Resistance Figure 3-13 Round Surface Mount Lands ......................... 24
(As Received) ................................................... 45 Figure 3-14 Printed Board Edge Connector Lands ........... 25
3.10.9 Metal Core (Horizontal Microsection) ............ 45 Figure 3-15 Plated Hole Microsection
3.10.10 Ionic (Resistivity of Solvent Extract) .............. 45 (Grinding/Polishing) Tolerance ........................ 27
Figure 3-16 An Example of Plating to Target Land
3.10.11 Rework Simulation ........................................... 45
Separation ...................................................... 27
3.10.12 Bending Test ..................................................... 45 Figure 3-17 Separation at External Foil ............................. 29
3.10.13 Flexible Endurance ........................................... 46 Figure 3-18 Crack Definition .............................................. 29
3.10.14 Bond Strength (Unsupported Lands) ............... 46 Figure 3-19 Examples of Thermal Zones for Micro-
3.10.15 Bond Strength (Stiffener) ................................. 46 section Evaluation Laminate Attributes .......... 30
3.10.16 Destructive Physical Analysis .......................... 46 Figure 3-20 Measurement for Etchback ............................ 30
3.11 Repair ................................................................ 46 Figure 3-21 Measurement for Dielectric Removal ............. 31

3.11.1 Circuit Repair ................................................... 46 Figure 3-22 Smear Removal Allowance ............................ 31

3.12 Rework .............................................................. 46 Figure 3-23 Measurement Locations for Fluoropolymer


Resin Smear ................................................... 32
4 QUALITY ASSURANCE PROVISIONS .................. 47 Figure 3-24 Negative Etchback .......................................... 33
4.1 General .............................................................. 47 Figure 3-25 Plating Folds/Inclusions – Minimum
Measurement Points ....................................... 33
4.1.1 Qualification ...................................................... 47
Figure 3-26 Annular Ring Measurement (Internal) ............ 33
4.1.2 Sample Test Coupons ....................................... 47
Figure 3-27 Microsection Rotations for Breakout
4.2 Acceptance Testing and Frequency ................. 50 Detection ......................................................... 34
4.2.1 C=0 Zero Acceptance Number Figure 3-28 Comparison of Microsection Rotations .......... 34
Sampling Plan ................................................... 50 Figure 3-29 Example of Non-Conforming Dielectric
4.2.2 Referee Tests ..................................................... 50 Spacing Reduction Due to Breakout at
Microvia Target Land ...................................... 34
4.3 Quality Conformance Testing .......................... 54
Figure 3-30 Surface Copper Wrap Measurement for
4.3.1 Coupon Selection .............................................. 54 Filled Holes ..................................................... 35

5 NOTES ..................................................................... 54 Figure 3-31 Wrap Copper in Type 4 Printed Board


(Acceptable) .................................................... 35
5.1 Ordering Data ................................................... 54
Figure 3-32 Wrap Copper Removed by Excessive
5.2 Superseded Specifications ................................ 54 Sanding/Planarization/Etching (Not
Acceptable) ..................................................... 36

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September 2017 IPC-6013D

Figure 3-33 Copper Cap Thickness ................................... 37 Table 3-4 Surface and Hole Copper Plating Minimum
Requirements for Buried Vias > 2 Layers,
Figure 3-34 Copper Cap Filled Via Height (Bump) ............ 37
and Blind Vias ................................................. 11
Figure 3-35 Copper Cap Depression (Dimple) .................. 37 Table 3-5 Surface and Hole Copper Plating Minimum
Figure 3-36 Copper Cap Plating Voids .............................. 37 Requirements for Microvias (Blind and
Buried) ............................................................ 11
Figure 3-37 Enclosed Inclusion in Copper Cap Plating ..... 37
Table 3-6 Surface and Hole Copper Plating
Figure 3-38 Example of Acceptable Voiding in a
Minimum Requirements for Buried
Copper Filled Microvia .................................... 38 Via Cores (2 Layers) ....................................... 11
Figure 3-39 Example of Acceptable Voiding in a Copper Table 3-7 Covercoat Adhesion ....................................... 16
Filled Microvia without Cap Plating ................ 38
Table 3-8 Solder Wicking/Plating Penetration Limits ..... 16
Figure 3-40 Example of Nonconforming Void in Copper
Table 3-9 Plating and Coating Voids Visual
Filled Microvia ................................................. 38
Examination .................................................... 17
Figure 3-41 Example of Nonconforming Void in
Table 3-10 Edge Board Contact Gap ............................... 19
a Copper Filled Microvia without Cap
Plating ............................................................. 38 Table 3-11 Minimum Etch Annular Ring ........................... 20
Figure 3-42 Microvia Contact Dimension ........................... 38 Table 3-12 Allowable Squeeze-Out of Coverlay
Adhesive and Ooze-Out of Covercoat ........... 22
Figure 3-43 Exclusion of Separations in Microvia Target
Land Contact Dimension ................................ 38 Table 3-13 Minimum Solderable Annular Ring on
Land Area ....................................................... 22
Figure 3-44 Penetration of Microvia Target Land .............. 39
Table 3-14 Conductor Spacing Requirements ................. 23
Figure 3-45 Measurement of Total Copper Thickness
Table 3-15 PTH Integrity after Stress ............................... 28
When Selective Hole Plating is Specified ...... 40
Table 3-16 Cap Plating Requirements ............................. 36
Figure 3-46 Metal Core to PTH ......................................... 41
Table 3-17 Microvia Contact Dimension ........................... 39
Figure 3-47 Measurement of Minimum Dielectric
Table 3-18 Internal Layer Foil Thickness after
Spacing ........................................................... 41
Processing ...................................................... 39
Figure 3-48 Fill Material in Blind/Through Vias When
Table 3-19 External Conductor Thickness
Cap Plating Not Specified .............................. 41 after Plating .................................................... 40
Figure 3-49 Bending Test ................................................... 45 Table 3-20 Solder Mask Adhesion .................................... 43
Tables Table 3-21 Dielectric Withstanding Test Voltages ............ 43
Table 3-22 Insulation Resistance ..................................... 43
Table 1-1 Default Requirements ....................................... 2
Table 4-1 Qualification Testing ....................................... 47
Table 3-1 Internal or External Metal Planes ..................... 8 Table 4-2 C=0 Sampling Plan Per Lot Size ................... 50
Table 3-2 Final Finish and Coating Requirements ........... 9 Table 4-3 Acceptance Testing and Frequency ............... 50
Table 3-3 Surface and Hole Copper Plating Minimum Table 4-4 Quality Conformance Testing ......................... 54
Requirements for Through-Holes ................... 11

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September 2017 IPC-6013D

Qualification and Performance Specification for


Flexible/Rigid-Flexible Printed Boards

1 SCOPE

1.1 Statement of Scope This specification covers qualification and performance requirements of flexible printed boards.
The flexible printed board may be single-sided, double-sided, multilayer, or rigid-flex multilayer. All of these constructions
may or may not include stiffeners, plated-through holes (PTHs), and blind/buried vias.
The flexible or rigid-flex printed board may contain build up High Density Interconnect (HDI) layers. The printed board may
contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conform-
ing to IPC-6017.
The rigid section of the printed board may contain a metal core or external metal heat frame, which may be active or non-
active.
Revision level changes are described in 1.7.

1.2 Purpose The purpose of this specification is to provide requirements for qualification and performance of flexible
printed boards designed to IPC-2221 and IPC-2223.

1.3 Performance Classification, Board Type, and Installation Usage

1.3.1 Classification This specification recognizes that flexible printed boards will be subject to variations in performance
requirements based on end-use. These performance classes (Class 1, Class 2, and Class 3) are defined in IPC-6011.

1.3.2 Printed Board Type Performance requirements are established for the different types of flexible printed boards,
classified as follows:
Type 1 – Single-sided flexible printed boards containing one conductive layer, with or without stiffeners.
Type 2 – Double-sided flexible printed boards containing two conductive layers with PTHs, with or without stiffeners.
Type 3 – Multilayer flexible printed boards containing three or more conductive layers with PTHs, with or without
stiffeners.
Type 4 – Multilayer rigid and flexible material combinations containing three or more conductive layers with PTHs.
Type 5 – Flexible or rigid-flex printed boards containing two or more conductive layers without PTHs.

1.3.3 Installation Uses


Use A – Capable of withstanding flex during installation.
Use B – Capable of withstanding continuous flexing for the number of cycles as specified on the procurement
documentation.
Use C – High temperature environment (over 105 °C [221 °F]).
Use D UL – Recognition. See UL 94 and UL 796F.

1.3.4 Selection for Procurement For procurement purposes, performance class and installation usage shall be specified
in the procurement documentation.
The documentation shall provide sufficient information to the supplier so that the supplier can fabricate the flexible printed
boards and ensure that the user receives the desired product. Information that should be included in the procurement docu-
mentation is to be in accordance with IPC-2611 and IPC-2614.
Note: If the drawing specifies the requirement in words, designators are not required.
The procurement documentation shall specify the thermal stress test method and the number of cycles (in relation to reflow
profiles in IPC-TM-650, Method 2.6.27) to be used to meet the requirement of 3.6.1. Selection shall be from those depicted
in 3.6.1.1, 3.6.1.2, 3.6.1.3 and 3.6.1.4. If not specified (see 5.1), the default shall be per Table 1-1.

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