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BlueNRG-M2

Datasheet

Very low power application processor module for Bluetooth® low energy v5.0

Features
• Bluetooth v5.0 compliant
– Supports master and slave modes
– Multiple roles supported simultaneously
– LE data packet length extension
• Embedded ST BlueNRG-2 BLE SoC
– High performance, ultra-low power Cortex-M0 32-bit based core
– Programmable embedded 256 kB Flash
– 24 kB embedded RAM with data retention
– Up to +8 dBm available output power
– Down to -88 dBm Rx sensitivity
– Up to 96 dB link budget with excellent link reliability
• Embedded BALF-NRG-02D3 integrated matched balun with harmonic filter
• Interfaces:
– 1 x UART, 1 x I2C, 1xSPI, 14 x GPIO, 2 x multifunction timer, 10-bit ADC,
watchdog and RTC, DMA controller, PDM stream processor, SWD debug
interface
• On-board chip antenna (BLUENRG-M2SA) or PCB antenna (BLUENRG-M2SP)
• Small form factor: 11.5 mm x13.5 mm
• Complemented with Bluetooth low energy protocol stack library (GAP, GATT,
SM, L2CAP, LL)
Product status link • AES secutity co-processor
• Bluetooth low energy SDK with a wide range of available profiles
BlueNRG-M2
• Certification
Product label – CE qualified
– FCC, IC modular approval certified
– TYPE qualified
– BQE qualified
• Pre-programmed UART bootloader
• Operating supply voltage: from 1.7 to 3.6 V
• Operating temperature range: -40 °C to 85 °C

Applications
• Internet of Things
• Smart Home
• Building and industrial automation
• Smart Lighting
• Remote and access control
• Fitness, wellness and sports
• Consumer medical
• Security and proximity
• Assisted living
• PC and smart phone peripherals

DS13053 - Rev 2 - July 2019 www.st.com


For further information contact your local STMicroelectronics sales office.
BlueNRG-M2

Description
The BlueNRG-M2 is a Bluetooth® low energy system-on-chip application processor
certified module, compliant with BT specifications v5.0 and BQE qualified. The
BlueNRG-M2 module supports multiple roles simultaneously and can act at the same
time as Bluetooth master and slave device. The BlueNRG-M2 is based on the
BlueNRG-2 system-on-chip and entire Bluetooth low energy stack and protocols are
embedded into module. The BlueNRG-M2 module provides a complete RF platform
in a tiny form factor. Radio, embedded antenna and high frequency oscillators are
integrated to offer a certified solution to optimize the time-to-market of the final
applications. The BlueNRG-M2 can be powered directly with a pair of AAA batteries
or any power source from 1.7 to 3.6 V.

DS13053 - Rev 2 page 2/30


BlueNRG-M2
General description

1 General description

The BlueNRG-M2 is a Bluetooth low energy application processor modules compliant with Bluetooth® v5.0.
The BlueNRG-M2 module has been designed around the ST BlueNRG-2 SoC where its Cortex-M0 core can
execute both Bluetooth protocols and customer application. Optimized memory architecture includes 256 kB of
Flash memory and 24 kB of ultra-low-leakage RAM (with full data retention). A complete power-optimized
Bluetooth stack library provides:
• Master, slave, multiple role support
• GAP: central, peripheral, observer or broadcaster roles
• Simultaneous advertising and scanning
• Capability of being slave of up to two masters simultaneously
• ATT/GATT: client and server
• SM: privacy, authentication and authorization
• L2CAP
• Link Layer: AES-128 encryption and decryption
In the BLUENRG-M2SA module both 32 MHz and 32 kHz crystal oscillators are available. It has been designed to
leverage the BlueNRG-2 integrated DC-DC step down converter in order to achieve the best power consumption
in active mode. It also embeds a high efficiency chip antenna. It can be configured to support both application
processor (host-less) and network processor (hosted) modes.
Being based on the BlueNRG-2 SoC, the BlueNRG-M2 module leverages all tools and documentation of its
ecosystem: development kit, application notes, user manuals, design notes & Tips. A wide set of sample
programs are also available in C source code.
The BlueNRG-M2 module has a wide set of peripherals available for customer applications (1 x UART interface, 1
x SPI interface, 1 x I2C interface, 14 GPIO, 2 x multifunction timer, 10-bit ADC, watchdog & RTC, DMA controller,
PDM stream processor).
The BlueNRG-M2 module enables wireless connectivity into electronic devices, not requiring any RF experience
or expertise for integration into the final product. The BlueNRG-M2 module provides a complete RF application
platform in a tiny form factor (11.5 x 13.5 x 2.0 mm) and being a certified solution optimizes the time to market of
the final applications.
The BlueNRG-M2 module allows applications to meet the tight advisable peak current requirements imposed with
the use of standard coin cell batteries. Optimized results are obtained when the embedded high-efficiency DC-DC
step-down converter is used (BLUENRG-M2SA). Instead, for the BLUENRG-M2SP the best performance in terms
of power consumption is achieved using a 1.8 V DC power supply. The BlueNRG-M2 can be powered directly
with a standard 3 V coin cell battery as with a pair of AAA batteries or any power source from 1.7 to 3.6 V.

DS13053 - Rev 2 page 3/30


BlueNRG-M2
Block diagram

2 Block diagram

Figure 1. HW block diagram for the BlueNRG-M2

DS13053 - Rev 2 page 4/30


BlueNRG-M2
Software architecture

3 Software architecture

3.1 Software development kit

The BlueNRG-M2 module embeds the BlueNRG-2 application processor. Refer to the BlueNRG-2 web page
(http://www.st.com) to get access to:
• BlueNRG-2 datasheet
• development kit
• Application notes
• User manuals
• Tools and software
• Design note and tips
Software and firmware should be configured taking into account the BlueNRG-M2 specific configuration as
described in Section 2 Block diagram.
The BLUENRG-M2SA module has:
• 32 MHz crystal oscillator
• 32 kHz crystal oscillator
• SMPS DC-DC converter
• 10 µH SMPS inductor
The projects provided with the development kit should be customized defining as following:
• HS_SPEED_XTAL=HS_SPEED_XTAL_32MHZ
• LS_SOURCE=LS_SOURCE_EXTERNAL_32KHZ
• SMPS_INDUCTOR=SMPS_INDUCTOR_10uH
The BLUENRG-M2SP module has:
• 32 MHz crystal oscillator
• LDO converter
The projects provided with the development kit should be customized as follows:
• HS_SPEED_XTAL=HS_SPEED_XTAL_32MHZ
• LS_SOURCE=LS_SOURCE_INTERNAL_RO
• SMPS_INDUCTOR=SMPS_INDUCTOR_NONE

3.2 Software structure

There are two possible software architectures:


1. Host-less mode (application processor): customer application runs on the BlueNRG-M2 module. Many
sample projects are available in the development kit

DS13053 - Rev 2 page 5/30


BlueNRG-M2
Software structure

Figure 2. BlueNRG-M2 - BLE application processor

1. Hosted mode (network processor): the module is configured as network module controlled by an external
host connected via SPI or UART. A project named DTM is available in the development kit that configures
the BlueNRG-M2 module as a network module.

Figure 3. BlueNRG-M2 as BLE network processor

DS13053 - Rev 2 page 6/30


BlueNRG-M2
General characteristics

4 General characteristics

4.1 Absolute maximum ratings

Table 1. Absolute maximum ratings

Ratings Min. Typ. Max. Unit

Storage temperature range -40 - +85 °C


Supply voltage, VIN -0.3 - 3.9 V

I/O pin voltage (VIO five-volt tolerant pin) -0.3 - 3.9 V

RF saturation input power - 8 - dBm


VESD-HBM electrostatic discharge voltage ±2.0 kV

4.2 Operating conditions

Table 2. Operating conditions

Ratings Min. Typ. Max. Unit

Storage temperature range -40 - +85 °C


Operating ambient temperature range -40 - +85 °C
Supply voltage, VIN 1.7 3.3 3.6 V

Signals and I/O pin voltage (according supply voltage) 1.7 - 3.6 V
Frequency range 2402 - 2480 MHz

DS13053 - Rev 2 page 7/30


BlueNRG-M2
Electrical specifications

5 Electrical specifications

5.1 Electrical characteristics

Characteristic measured over recommended operating conditions unless otherwise specified. Typical values are
referred to VIN= 3.3 V, 25 °C, SMPS on, XO 32 kHz and 32 MHz.

Table 3. Electrical characteristics for the BLUENRG-M2SA

Symbol Parameter Test conditions Min. Typ. Max. Unit

Reset 5 nA
Standby 0.5 uA
Sleep mode: 32 kHz XO ON (24 kB retention
0.9 μA
RAM)
Active mode 1.89 mA
RX 7.55 mA
TX +8 dBm 14.78 mA
IDD Supply current
TX +4 dBm 10.73 mA
TX +2 dBm 9.27 mA
TX -2 dBm 8.46 mA
TX -5 dBm 7.89 mA
TX -8 dBm 7.45 mA
TX -11 dBm 7.17 mA
TX -14 dBm 7.01 mA

Characteristic measured over recommended operating conditions unless otherwise specified. Typical values are
referred to VIN= 3.3 V, 25 °C, SMPS off, RO 32 kHz and 32 MHz.

DS13053 - Rev 2 page 8/30


BlueNRG-M2
Digital I/O specifications

Table 4. Electrical characteristics for the BLUENRG-M2SP

Symbol Parameter Test conditions Min. Typ. Max. Unit

Reset 5 nA
Standby 0.5 uA
Sleep mode: 32 kHz RO ON (24 kB retention
2.1 μA
RAM)
Active mode 2.75 mA
RX 15 mA
TX +8 dBm 33.9 mA
IDD Supply current
TX +4 dBm 22.6 mA
TX +2 dBm 19.1 mA
TX -2 dBm 16.9 mA
TX -5 dBm 15.6 mA
TX -8 dBm 14.7 mA
TX -11 dBm 14.1 mA
TX -14 dBm 13.7 mA

5.2 Digital I/O specifications

IO pins are directly connected to the embedded state of the art BlueNRG-2 chipset. For more details about the
digital I/O specifications, please refer directly to the BlueNRG-2 datasheet available on www.st.com.

DS13053 - Rev 2 page 9/30


BlueNRG-M2
RF general characteristics

5.3 RF general characteristics

Characteristic measured over recommended operating conditions unless otherwise specified. Typical value are
referred to VIN= 3.3 V, 25 °C, DC/DC on, XO 32 kHz (BLUENRG-M2SA only) and XO 32 MHz.

Table 5. RF general characteristics

Symbol Parameter Test conditions Min. Typ. Max. Unit

FREQ Frequency range 2400 - 2483.5 MHz


FCH Channel spacing - 2 - MHz
RFch RF channel center frequency 2402 - 2480 MHz

Table 6. BLUENRG-M2SA RF characteristics

Symbol Parameter Test conditions Min. Typ. Max. Unit

RPMAX(1) Output power(2) Radiated +5 dBm

RXSENS Sensitivity(2) Conducted -85 dBm

1. PA-Level set to 0x07 and En-High_Power set to 0x01 (corresponding to +8 dBm in conducted mode).
2. Radiated power may be impacted by application board / housing / etc.

Table 7. BLUENRG-M2SP RF characteristics

Symbol Parameter Test conditions Min. Typ. Max. Unit

RPMAX(1) Radiated output power(2) Radiated +7 dBm

RXSENS Sensitivity(2) Conducted -85 dBm

1. PA-Level set to 0x07 and En-High_Power set to 0x01 (corresponding to +8dBm in conducted mode).
2. Radiated power may be impacted by application board / housing / etc.

DS13053 - Rev 2 page 10/30


BlueNRG-M2
Pin assignment

5.4 Pin assignment

Figure 4. Pin connection for the BLUENRG-M2SA

Figure 5. Pin connection for the BLUENRG-M2SP

DS13053 - Rev 2 page 11/30


BlueNRG-M2
Pin assignment

Table 8. Pin connection

Function
Pin # Name
Mode “000” Mode “001” Mode “100” Mode “010”

1 ADC2 ADC input 2


2 ADC1 ADC input 1
3 DIO4 GPIO4 UART_RXD I2C2_CLK PWM0
4 DIO5 GPIO5 UART_TXD I2C2_DAT PWM1
5 VIN Power Supply
6 ANATEST0/DIO14 GPIO14 I2C1_CLK SPI_CLK ADC_DAT

7 DIO7/BOOT (1) GPIO7 UART_CTS I2C2_DAT PDM_CLK

8 GND Ground
9 DIO6 GPIO6 UART_RTS I2C2_CLK PDM_DAT
10 DIO8 GPIO8 UART_TXD SPI_CLK PDM_DAT
11 DIO11 GPIO11 UART-RXD SPI_CS1

12 DIO9 GPIO9 SWCLK SPI_IN(2)

13 DIO10 GPIO10 SWDIO SPI_out(3)


14 ANATEST1 Anatest1
15 DIO0 GPIO0 UART_CTS SPI_CLK
16 DIO2 GPIO2 PWM0 SPI_OUT PDM_CLK
17 DIO3 GPIO3 PWM1 SPI_IN ADC_CLK
18 DIO1 GPIO1 UART_RTS SPI_CS1 PDM_DAT
19 RESETN Reset

20 DIO12 GPIO12 (4) I2C1_CLK

21(5) GND Ground

22(5) N.C. Leave unconnected

23(5) N.C. Leave unconnected

1. The pin DIO7/BOOT is monitored by bootloader after power-up or hardware reset and it should be low to prevent unwanted
bootloader activation.
2. The function SPI_IN indicates that the pin is always an input when configured for SPI. Thus in case of SPI master role, it
acts as MISO pin. In case of SPI slave role, this pin act as MOSI
3. The function SPI_OUT indicates that the pin is always an output when configured for SPI. Thus in case of SPI master role, it
acts as MOSI pin. In case of SPI slave role, this pin act as MISO.
4. DI012 can only be general purpose input pins (not output), or I2C1 clock pin.
5. BLUENRG-M2SA only.

DS13053 - Rev 2 page 12/30


BlueNRG-M2
Hardware design

6 Hardware design

Note: • All unused pins should be left floating; do not ground


• All GND pins must be well grounded
• The area around the module should be free of any ground planes, power planes, trace routings, or metal
for 6 mm from the module antenna position, in all directions.
• Traces should not be routed underneath the module

6.1 Reset circuitry

The BlueNRG-M2 module requires an external reset circuitry to ensure proper operation at power-on. Refer to the
"Reset management" section of the BlueNRG-2 datasheet for details.

Figure 6. Reset circuitry

If reset pin is controlled by an external host, RC circuit on the RESETn line is not required.

6.2 Debug interface

The BlueNRG-M2 embeds the ARM serial wire debug (SWD) port. It is two pin (clock and single bi-directional
data) debug interface, providing all the debug functionality plus real time access to system memory without halting
the processor or requiring any target resident code

Table 9. Debug interface

Pin functionality Module PIN Pin description

SWCLK 12 SWD clock signal


SWDIO 13 SWD data signal

For more information refer to the BlueNRG-2 technical documentation (https://www.st.com).

DS13053 - Rev 2 page 13/30


BlueNRG-M2
Reflow soldering

6.3 Reflow soldering

The BlueNRG-M2 is a high temperature strength surface mount Bluetooth® module supplied on a 23-pin
(BLUENRG-M2SA) or 20 pin (BLUENRG-M2SP), 4-layer PCB. The final assembly recommended reflow profiles
are indicated here below.
Soldering phase has to be executed with care: in order to avoid undesired melting phenomenon, particular
attention has to be taken on the set up of the peak temperature.
Here are some suggestions for the temperature profile based on the following recommendations.

Table 10. Soldering profile

Profile feature PB-free assembly

Average ramp up rate (TSMAX to Tp) 3°C/ s max.

Preheat
temperature min (TS min.) 150 °C
200 °C
temperature max (TS max.)
60-100 s
time (tS min to tS max.) (tS)

Time maintained above:


Temperature TL 217 °C
60-70 s
Time tL

Peak temperature (TP) 245 (-0) °C

Time within 5 °C of peak temperature (TP -5°) min. 30 s

Ramp down rate 6 °C/s


Time from 25 °C to peak temperature 8 minutes max.

Figure 7. Soldering profiles

DS13053 - Rev 2 page 14/30


BlueNRG-M2
Regulatory compliance

7 Regulatory compliance

7.1 FCC certification

This module has been tested and found to comply with the FCC part 15 rules. These limits are designed to
provide reasonable protection against harmful interference in approved installations. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications.
However, there is no guarantee that interference may not occur in a particular installation.
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
1. this device may not cause harmful interference
2. this device must accept any interference received, including interference that may cause undesired
operation
Modifications or changes to this equipment not expressly approved by STMicroelectronics may render void the
user's authority to operate this equipment.
Modular approval
FCC ID: S9NBNRGM2SA & S9NBNRGM2SP
In accordance with FCC part 15, the BLUENRG-M2SA and BLUENRG-M2SP is listed as a modular transmitter
device.
This module is evaluated for stand-alone use only. Finished products incorporating multiple transmitters must
comply with collocation and RF exposure requirements in accordance with FCC multi-transmitter product
procedures. Collocated transmitters operating in portable RF Exposure conditions (e.g. <20 cm from persons
including but not limited to body worn and hand held devices) may require separate approval.

7.1.1 Labeling instructions


When the BLUENRG-M2SA and BLUENRG-M2SP are integrated into the final product, the OEM must ensure
that the FCC labeling requirements are satisfied. A statement must be included on the exterior of the final product
which indicates the product includes a certified module. The label should state the following (or similar wording
that conveys the same meaning):
Contains FCC ID: S9NBNRGM2SA & S9NBNRGM2SP
OR
This product contains FCC ID: S9NBNRGM2SA & S9NBNRGM2SP
The OEM must include the following statements on the exterior of the final product unless the product is too small
(e.g. less than 4 x 4 inches):
This device complies with part 15 of the FCC rules. Operation is subjected to the following two conditions:
1. this device may not cause harmful interference and
2. this device must accept any interference received, including any interference that may cause undesired
operations.

7.1.2 Product manual instructions


This section applies to OEM final products containing the BlueNRG-M2 module, subjected to FCC compliance.
The final product manual must contain the following statement (or a similar statement that conveys the same
meaning):
Note: Changes or modifications not expressly approved by the party responsible for compliance could void the user's
authority to operate the equipment. (Part. 15.21)
In the case where an OEM seeks Class B (residential) limits for the final product, the following statement must be
included in the final product manual:
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part
15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this equipment does

DS13053 - Rev 2 page 15/30


BlueNRG-M2
IC certification

cause harmful interference to radio or television reception, which can be determined by turning the equipment
off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna
• Increase the separation between the equipment and receiver
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected
• Consult the dealer or an experienced radio/TV technician for help
In the case where an OEM seeks the lesser category of a Class A digital device for the final product, the following
statement must be included in the final product manual:
Note: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part
15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate
radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause
harmful interference in which case the user will be required to correct the interference at his expense.

7.2 IC certification

This device contains license-exempt transmitter(s)/receiver(s) that comply with innovation, science and economic
development Canada’s license-exempt RSS(s). Operation is subjected to the following two conditions:
1. this device may not cause interference
and
1. this device must accept any interference, including interference that may cause undesired operations of the
device.
In addition, in accordance with RSS-102 clause 2.6, the RF exposure compliance distance of the BlueNRG-M2 is
set equal to 15 mm.
Modular approval
IC: 8976C-BNRGM2SA and 8976C-BNRGM2SP
In accordance with IC RSS-247, the BlueNRG-M2 is listed as a modular transmitter device.
This module is evaluated for stand-alone use only. Finished products incorporating multiple transmitters must
comply with collocation and RF exposure requirements in accordance with IC multi-transmitter product
procedures. Collocated transmitters operating in portable RF Exposure conditions (e.g. <20 cm from persons
including but not limited to body worn and hand held devices) may require separate approval.

7.2.1 Labeling instructions


When the BlueNRG-M2 is integrated into the final product, the OEM must ensure that the IC labeling
requirements are satisfied. A statement must be included on the exterior of the final product which indicates that
the product includes a certified module. The label should state the following (or similar wording that conveys the
same meaning):
Contains IC: 8976C-BNRGM2SA and 8976C-BNRGM2SP
or
this product contains IC: 8976C-BNRGM2SA and 8976C-BNRGM2SP
The OEM must include the following statements on the exterior of the final product unless the product is too small
(e.g. less than 4 x 4 inches).

7.3 CE certification

The BlueNRG-M2 module has been certified according to the following certification rules:
• EN 300 328 V 2.1.1 (2016-11)(1)
• ETSI EN 301 489-17 V3.1.1 (2017-02)(2)
• ETSI EN 301 489-1 V2.1.1 (2017-02)(3)
• EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2:2013(4)
• EN 62311:2008

DS13053 - Rev 2 page 16/30


BlueNRG-M2
TYPE certification

1. ETSI EN 300 328 V 2.1.1 (2016 11): “electromagnetic compatibility and radio spectrum Matters (ERM); Wideband
transmission systems; data transmission equipment operating in the 2.4 GHZ ISM band and using wideband modulation
techniques; harmonized EN covering essential requirements under article 3.2 of the R&TTE directive”.
2. ETSI EN 301 489-17 V 3.1.1 (2017 02): “electromagnetic compatibility and radio spectrum matters (ERM); electromagnetic
compatibility (EMC) standard for radio equipment and services; part 17: specific condition for 2.4 GHz wideband
transmission systems and 5 GHz high performance RLAN equipment”.
3. ETSI EN 301 489-1 V2.1.1 (2017 02): “electromagnetic compatibility and radio spectrum matters (ERM); electromagnetic
compatibility (EMC) standard for radio equipment and services; part 1: common technical requirements.
4. EN60950-1:2006 +A11:2009+A1:2010+A12:2011+A2:2013: “Information technology equipment - safety

The module is provided by CE marking:

The module has obtained the RED certificate:


• 0051-RED-0092 (BLUENRG-M2SA)
• 0051-RED-0098 (BLUENRG-M2SP)
The Certificate of Conformity is available / downloadable at the following web page: www.ST.com.
The certified module production firmware release is: 2.X
For additional information please refer to: STMicroelectronics Via C. Olivetti 2, Agrate Brianza 20864 (ITALY).

7.4 TYPE certification

The BlueNRG-M2 module has been tested according to following TYPE certification rules:
• Type of specified radio equipment
– Radio equipment according to certification ordinance article 2-1-9
• Sophisticated low power radio data communication system in 2.4 GHz band.
• Class of emissions, assigned frequency, and antenna power
– F1D 2402 - 2480 MHz channel separation 2 MHz/40 channel, 0.005 W
• Certification number:
– 006-000725 (BLUENRG-M2SA)
– 006-000726 (BLUENRG-M2SP)

7.5 Bluetooth certification

The module with embedded stack and profile has been qualified in accordance with SIG qualification rules:
• Declaration ID: D043965
• Qualified design ID: 121363
• Product type: End Product
• Core spec version: 5.0
• Product description: Bluetooth low energy v5.0 module

DS13053 - Rev 2 page 17/30


BlueNRG-M2
Package information

8 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

8.1 BLUENRG-M2SA package information

Figure 8. BLUENRG-M2SA package outline

DS13053 - Rev 2 page 18/30


BlueNRG-M2
BLUENRG-M2SA package information

Table 11. BLUENRG-M2SA mechanical data

mm
Symbol
Min. Typ. Max.

A 2.1 2.3 2.5


A1 0.7 0.8 0.9
A2 1.4 1.5 1.6
D 11.5
E 13.5
F 1
G 1.46
dia 0.7
Pad size X,Y (on bottom side) 0.6x1
e-pitch 1.27 tol.+/-0.025

Figure 9. BLUENRG-M2SA recommended footprint

DS13053 - Rev 2 page 19/30


BlueNRG-M2
BLUENRG-M2SP package information

8.2 BLUENRG-M2SP package information

Figure 10. BLUENRG-M2SP package outline

DS13053 - Rev 2 page 20/30


BlueNRG-M2
BLUENRG-M2SP package information

Table 12. BLUENRG-M2SP mechanical data

mm
Symbol
Min. Typ. Max.

A 2.1 2.3 2.5


A1 0.7 0.8 0.9
A2 1.4 1.5 1.6
D 11.5
E 13.5
F 1
G 1.46
dia 0.7
Pad size X,Y (on bottom side) 0.6x1
e-pitch 1.27 tol.+/-0.025

Figure 11. BLUENRG-M2SP recommended footprint

DS13053 - Rev 2 page 21/30


BlueNRG-M2
BlueNRG-M2 packing information

8.3 BlueNRG-M2 packing information

Figure 12. BlueNRG-M2 tape outline

Figure 13. BlueNRG-M2 tape dimension outline

DS13053 - Rev 2 page 22/30


BlueNRG-M2
BlueNRG-M2 packing information

Figure 14. BlueNRG-M2 reel outline

Table 13. BlueNRG-M2 reel mechanical data

Reel
Dimensions
Min. Max.

A 328 332
B 1.5
C 12.8 13.5
D 20.2
G 24.4 26.4
N 100 103
T 26.4 30.4

DS13053 - Rev 2 page 23/30


BlueNRG-M2
Traceability

9 Traceability

Each module is univocally identified by serial number stored in a 2D data matrix laser marked on the top side
(shield) of the module itself.
Each module bulk is identified by a bulk ID.
Bulk ID and module 2D data matrix are linked by a reciprocal traceability link. The module 2D data matrix traces
the lot number of any raw material used according to following rules:

Table 14. Traceability information

Letter Meaning

HA Reserved
YWW Year and week number
E Reserved
LL Lot sequence number
XX Lot sub-sequence number
0000 Serial number

DS13053 - Rev 2 page 24/30


BlueNRG-M2

Revision history

Table 15. Document revision history

Date Version Changes

26-Jun-2019 1 Initial release.


Updated features in cover page, Figure 4. Pin connection for the BLUENRG-
24-Jul-2019 2 M2SA and Figure 6. Reset circuitry.
Added Section 8.3 BlueNRG-M2 packing information

DS13053 - Rev 2 page 25/30


BlueNRG-M2
Contents

Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
3 Software architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 Software development kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2 Software structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

4 General characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.2 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

5 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.1 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.2 Digital I/O specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.3 RF general characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.4 Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

6 Hardware design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13


6.1 Reset circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.2 Debug interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.3 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

7 Regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15


7.1 FCC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7.1.1 Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

7.1.2 Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

7.2 IC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.2.1 Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

7.3 CE certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.4 TYPE certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.5 Bluetooth certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

8 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18


8.1 BLUENRG-M2SA package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.2 BLUENRG-M2SP package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

DS13053 - Rev 2 page 26/30


BlueNRG-M2
Contents

8.3 BlueNRG-M2 packing information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

9 Traceability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

DS13053 - Rev 2 page 27/30


BlueNRG-M2
List of tables

List of tables
Table 1. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 2. Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 3. Electrical characteristics for the BLUENRG-M2SA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 4. Electrical characteristics for the BLUENRG-M2SP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 5. RF general characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 6. BLUENRG-M2SA RF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 7. BLUENRG-M2SP RF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 8. Pin connection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 9. Debug interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 10. Soldering profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 11. BLUENRG-M2SA mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 12. BLUENRG-M2SP mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 13. BlueNRG-M2 reel mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 14. Traceability information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 15. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

DS13053 - Rev 2 page 28/30


BlueNRG-M2
List of figures

List of figures
Figure 1. HW block diagram for the BlueNRG-M2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 2. BlueNRG-M2 - BLE application processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. BlueNRG-M2 as BLE network processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. Pin connection for the BLUENRG-M2SA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 5. Pin connection for the BLUENRG-M2SP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 6. Reset circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. Soldering profiles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 8. BLUENRG-M2SA package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 9. BLUENRG-M2SA recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 10. BLUENRG-M2SP package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 11. BLUENRG-M2SP recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 12. BlueNRG-M2 tape outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 13. BlueNRG-M2 tape dimension outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 14. BlueNRG-M2 reel outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

DS13053 - Rev 2 page 29/30


BlueNRG-M2

IMPORTANT NOTICE – PLEASE READ CAREFULLY


STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service
names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2019 STMicroelectronics – All rights reserved

DS13053 - Rev 2 page 30/30


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Authorized Distributor

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