About PCB HERO

About Us
Profile
PCB HERO was founded in 2003. We specialize in high-speed PCB design, PCB
fabrication and assembly. We are the largest high-speed PCB design center in China with
500 PCB layout engineers. We provide 2-64 layers PCB fabrication for prototype and
mass production. We have the first quickturn SMT & assembly factory in China. PCB
layout, PCB fabrication and PCB assembly in one stop service. 
During the past eleven years, we have built long term partnership with Intel,
Cisco, Huawei, ZTE, Ericsson, Panasonic, Lenovo, Haier, Marvell, LSI, TI, Freescale,
etc. 
Our headquarters are located in Shenzhen. We have branches in San Jose, Osaka,
Yokohama, Beijing, Shanghai, Chengdu, Xi'an, Guangzhou, Wuhan, Fuzhou and
Hangzhou. 
PCB HERO, Your best partner.
★ 2-64 Layers  
★ Total solution: PCB design, PCB fabrication and
★ Prototype , Mass production  
PCBA 
★ HDI, FPC, Rigid-Flex , Metal
★ The largest PCB design center in China, 500 base laminate  
engineers  
★ Quote online, Competitive
★ PCB Library Engineers, Layout Engineers,   price 
EMC Engineers, SI Engineers, QA Engineers 
★ Quick lead time, Delivery on
★ Worldwide sale and service networks:  time 
China: Shenzhen, Beijing, Shanghai, Chengdu,
★ Certificate of ISO9001,
Xi'an,  
ISO14000,UL, ROHS 
Guangzhou, Wuhan, Fuzhou and Hangzhou 
★ Hi-tech enterprise of
USA: San Jose, CA. 
Shenzhen 
JAPAN: Osaka, Yokohama.
★ Member of CPCA
Profile
5/F,Zone A Huameiju Business Center Xinhu Road Bao'an District Shenzhen China Guangdong
Tel:0086-755-2907-2920 Email:[email protected] SKYPE:[email protected]
Advantage
Ⅰ. Focus on your needs  
Clients’ increasing needs fuel our continual growth. Our handling of PCB layout, fabrication, assembly &
material management is driven by constant market pressure to shorten time-to-market, enhance asset
utilization, keep abreast of emerging technologies and master complex process technologies. PCB HERO’s
capabilities and services enable our customers to focus on their core competencies like R & D and sales &
marketing.  
Ⅱ. You benefit from our experience  
Most of PCB HERO's employees have more than 4 years’ experiences in PCB design, SI simulation or EMC
design. We deal with more than 1000 cases per year; You Benefit From Our Experience. 
Ⅲ. Superior technology  
PCB HERO has not only PCB design experts, but also EMC experts and SI experts. This is why our
customers enjoy their partnerships with us. Because we handle layout, fab, assembly, and we all work so
closely together, our layout engineers are experts at DFM (Design For Manufacture) & DFT (Design For
Test). 
Ⅳ. Strict quality assurance system  
PCB HERO has established a complete implementation process for standard PCB design, SI simulation, and
EMC projects, reviewing specifications and checklists for different products through the summarization of its
long-term experience.  
Ⅴ. Save your time 
PCB HERO fully realize the market pressure of our clients. We work 7x16 hours on shifts. Because we’re
capable of handling everything in one streamlined process, all under one roof, you get the benefit of working
with one company and one time-line versus 3 or 4 companies and 3 or 4 timelines. 
Ⅵ. Cost-effective design  
PCB HERO offers turnkey services to clients with competitive prices; We will take the initiative in reducing the
development cost for clients in all design stages, in this way cost-down is achieved.  
Ⅶ. Local service  
We have established our service networks in Beijing, Shanghai, Hangzhou, Shenzhen and Osaka,We plan to
open our office in California in the near future. PCB HERO establishes the clients management systems,
designates a special employee for coordination and communication with clients on their projects, and assigns
the engineers who are familiar with clients’ products to complete the design work. 
Ⅸ. Turnkey solution  
PCB HERO provides turnkey services including PCB layout, PCB fabrication and assembly.
PCB Layout
Introduction
Ⅰ、Advantages  
1. Experienced experts, excellent quality. 
2. Process first, specification guaranteed 
3. Sizable team, considerate service 
4. Independently developed software to enhance design efficiency 
5. Keeping in step withthe up-to-date technology, advancing with the times  
Ⅱ、PCB Layout Business Model 
1. PCB design total solution: including PCB footprint, Netlist import, Placement, Routing,  
Gerber out and DFM checking, etc 
2. Part of PCB design: ranging from PCB Footprint, Database creating, Rules import, Placement,  
Routing, QA & Review to DFM checking and Gerber out 
3. On-site service: work together with your engineers in your office 
4. Consulting and training: provide consulting and training services of PCB design
Physical ParametersInvolved Chipset Scheme

Highest layers:：42 Layers 
Maximum PIN count：69000+ 
Maximum connections：55000+ 
Minimum line width：2.4mil 
Minimum line spacing：2.4mil 
Minimum via：6mil(4mil laser hole)  
Maximum BGA in a single PCB：62 
Maximum BGA PIN spacing：0.4mm 
Maximum BGA PIN count：2597 
Highest speed signal：10G CML Network processor series：IXP2400 IXP2804 IXP2850… 
Intel Sandy Bridge series：Intel Core i7 Extreme Core i5… 
Intel XEON server series：Xeon® E7 Family® 5000 Sequence…  
Marvell series：MX630 FX930 FX950… 
Broadcom Sonet/SDH series：BCM8228 BCM8105 BCM8129… 
Broadcom Gigabit Ethernet switch series：BCM5696 BCM56601 BCM56800…  
QUALCOMM/Spreadtrum/MTK platform：QSC60xx SC88xx SC68xx Mt622x…  
Freescale PowerPC series：MPC8541 MPC8548 MPC8555 MPC8641… 
FPGA DSP series of chips：Virtex-7 Spartan-6 TMS320C5X…
Backplane、High-Speed PCB design、A/D PCB design、HDI/ALIVH/Buried resister/Buried
capacitance、 
Flex PCB/Rigid-Flex Board、ATE
High Speed and High density PCB Design for IT Communication、Computer、Medical、Digital and
cansumer
Flow
Notes: 
Material provide by Clients：chmetic、Netlist、Structural diagrams、Datasheets、Design requirements,
etc. 
Placement、Routing review by PCB HERO：According to Design Spec of PCB HERO, Design
requirements and Checklist 
Output of design data：PCB file、Gerber files、Assembly Files、Stencil files,Structural diagrams, etc.
Cases
Name A Second-Order HDI Cell Phone Board
【TYPE】： TYPEⅢ HDI PCB Design for OMAP4430 Platform

【Difficulty】： There are two 0.4 mm pitch IC in this design with
extreme density. So we have to choose TYPEⅢ HDI PCB design.
This project is a reference designs board of Intel. The quality and
schedule are both very important.
【Solution】： In this project, with the experienced in PCB
design and manufacture, PCB HERO provide many Suggestions to
help customers reduce the restrictions in batch production process. At
the same time, PCB HERO realize the 24 hours continuous work
teamwork between North America and China site. Ensure the
schedule of this project.
【Result】： Finally this project is successful in first prototype. !
Reduce the time to market and earn the good opportunities. This
design become benchmarking of PCB HERO for TYPEⅢ HDI PCB
Design.
10G High speed backplane in 28 layers
【TYPE】： 10G High speed backplane in 28 layers

【Difficulty】： Thousands of 10G high-speed differential pairs in this
backplane. Signal integrity is very important for this design.
【Solution】： With the experienced in PCB design and manufacture for
many years. PCB HERO co-work with the PCB suppliers and connector
suppliers, and communication with customers closely. SI team is involved into
this project. The SI process is Pre-simulation, Constraint driven PCB design,
and Post simulation for verification.
【Result】： The first version of this project was debugged successfully. The !
quality of signal is fulfill with the Spec.
Single board with more than 69000Pins
【TYPE】： Single board with more than 69000Pins

【Difficulty】： Design is quite complicated. There are six ICs with more
than 2600 pins and 48 piece of DDR3 chips. The board is 26 layers with
many High speed signals. The PCB file is more than 356M.
【Solution】： A whole design team include SI engineer is involved
into this project. By using design partition tools and onsite communication,
we finish this design in 2 months. Then spend nearly one month for review
and optimize.
【Result】： Project is very successful by good team work and !
professional Skills.
High-speed backplane for optical network product
【TYPE】： High-speed backplane for optical network product

【Difficulty】： More than 320 differential pairs with 3.125G signal.
And 640+ differential pairs with 3.125G signal. The PCB size is 653 X
418. The Insertion loss is a big problem with long trace. And return loss
is also a problem in case the impedance mismatch. We also considering
the crosstalk and EMI.
【Solution】： Extract Via model and trace model in HFSS. Eye
diagram Simulation with HSPICE.S parameter analysis for Insertion
loss and return loss.
【Result】： Reduce the layer from 32 to 28 with good signal quality. !
It's better for PCB fabrication.
Name PMC (Pic Mezzanine Card)
【Type】： Typical high-speed &high-density HDI board

【Difficulty】： Ⅰ.18 pieces of DDRII chips mounted on both
face and back; 
Ⅱ.High-density placement, strict topology structure and time
sequence relation; 
Ⅲ.Multiple large currents, and strict heat design to meet clients'
requirements;
【Countermeasure】： Ⅰ.Making detailed data analysis to calculate
time sequence; 
Ⅱ.Conducting pre-simulation to determine DDRII' s routing
topology, and delete some unnecessary matching resistance. 
Ⅲ.Conducting post-simulation to assure their time sequence; 
Ⅳ.Reasonable design current routing channels through current
calculating software;  !
Ⅴ.Using HDI design to meet density requirements; 
Ⅵ .Multi-person concurrent design ensures board design progress;
【Result】： Completion time of board design is half of the
customer's estimated time, and the signal quality complies with the
requirements.
Name Switching Board of L3 Core Routing Switch
【Type：】 Typical high-speed board
【Difficulty】： Ⅰ.Using BCM56601 chipset scheme with RLDRAM,
DDRII SDEAM, TCAM; 
Ⅱ.Strict requirement for time sequence; 
Ⅲ.Multiple pairs of 3.12G signals, 48 pairs of 1.25G signals, and each pair
of signal is 13 inches long; 
Ⅳ.Strictly controlled impedance, various kinds of power supplies, 8 kinds
of current above 6 Amperes, a large number of phase lock loops (PLLs); 
Ⅴ.The number of pins on a board is more than 25000, and a large number
of network rules;
【Countermeasure】： Ⅰ.Making detailed data analysis to calculate time
sequence, HSPICE simulates the routing rules of 1.25G signals and 3.125G
signals; 
Ⅱ.Pre-simulation determines the routing topology of RLDRAM,
DDEIISDEAM and TCAM, and post-simulation assures their time
sequence; 
Ⅲ.Reasonably design current routing channels through current calculating
software; 
Ⅳ.Multi-person concurrent design ensures board design process;
【Result】： Completion time of board designs is half of the customer's
estimated time, and the signal quality complies with the requirements.
Name A Second-Order HDI Cell Phone Board
【Type】： Typical high-end consumer electronic product board

【Difficulty】： Ⅰ.Very small, its main board is half the size of a
common cell phone board. 
Ⅱ.Strange shape results in great limits for routing;  
Ⅲ.GSM & WCDMA dual-mode cell phone results in a large radio-
frequency area. 
Ⅳ.Super-thin cell phone solution limits the board thickness; placing the
whole radio-frequency module under the baseband chip results in great
limits in hole drilling on the baseband chip; 
Ⅴ.Originally, ALIVH materials was to be used, but considering cost and
risk reduction, we used second-order buried via scheme, but the routing
requirements were not degrade.
【Countermeasure】： Ⅰ.By discussing with multiple PCB manufacture
partners, we set appropriate design parameters; 
Ⅱ.With RF experts' participation in PCB design, strict design process !
assured signal quality of the board; 
Ⅲ.Careful optimization achieved the best coordination among
requirements of different parties;
【Result】： Design fulfilled according to the plan, successful CAM
and smooth debugging.
Name Notebook mainboard
【Type】： NotebookTypical notebook mainboard
【Difficulty】： Ⅰ.This product adopts an Intel Centrino chip; 
Ⅱ.The North Bridge and the CPU are not in the same side; 
Ⅲ.Features: cross connection of 800MHz FSB bus, 6-layer board, and
small routing layers. 
Ⅳ.It is required to have less routing on the surface layer as this board
will be provided to the third party as a reference board and the board
should be designed strictly according to the "Yellow Book" 
Ⅴ.The coverage rate of ICT should reach 95% (including the single-
point network)
【Countermeasure】： Ⅰ.Thorough research on the characteristics of
pin definitions, comprehensive planning; 
Ⅱ.Properly would lines inside the North Bridge and the CPU; 
Ⅲ.Fully understanding of the key degree of signals, treated them
respectively, and distributed important signals in priority routing !
layers:  
Ⅳ.Upon placement, we considered ICT requirements, and left
necessary space for ICT. Multi-person concurrent design assured the
board design progress;
【Result】： The first version of the demo board was debugged
successfully, so it was very smooth to conduct software debugging.
PCB Fabrication
Introduction
PCB HERO provides 2-64 layers PCB from prototype to mass production. We can provide quick turn
and standard lead time PCB fabrication, including HDI, Rigid board, Rigid Flex board, etc. We provide
high quality PCB with lower overall costs and the best service.

Productivity
Capability Lead time
Item Technical Parameter Layer Prototype Mass prduction Quick
Layer 2-64 Turn
Thickness 0.6-10mm 2L 3-4days 8days 48h
Copper Thickness 0.3-12 oz 4L 5-6days 10days 3days
Min Mechanical Hole 0.1mm 6L 6-7days 12days 3days
Min Laser Hole 0.075mm 8L 8-9days 12days 4days
HDI 1+n+1、2+n+2、3+n+3 10L 10-11days 14days 4days
Max Aspect Ratio 18:1 12L 12days 14days 5days
Max Board Size 610mm*1100mm 14L 14days 16days 6days
Min Width/Space 2.4/2.4mil 16L 14days 16days 6days
Min Outline Tolerance ±0.1mm 18L 14days 18days 6days
Impedance Tolerance ±5% 20L 14days 18days 8days
Min PP Thickness 0.06mm 22L 14days 20days 8days
Bow & Twist ≤0.5% 24L 14days 20days 8days
26L 14days 20days 10days
Materials FR4、High-TG 、Rogers、Nelco、
28L 14days 20days 10days
RCC、PTFE 30L 14days 20days 10days
Surface Finished HASL、HASL Pb Free  32L 14days 20days 10days
Immersion Gold/Tin/Silver  
OSP、Immersion Gold + OSP
Special Capability Gold Finger Plating 、
Peelable、Carbon ink
Facility
!   !   !  
Sheets Cutting Exposure Machine Etching Line
!   !   !  
CNC Drilling Machine-Schmoll PTH Line S/M Printing Machine
!   !   !  
Automatic Optical Inspection Inner Brown Oxide Line Automatic Lamination Machine
!   !   !  
CNC Routing Machine E-Tester Immersion Gold Line
Exhibition
Exhibition
Backplane Data Communication Board

·Layers：28L  ·Layers：18L 
·Thickness：5.0mm  ·Thickness：2.4mm 
·Surface finished：Im-gold  ·Surface finished：Im-gold 
·Min width/space：5/5mil  ·Min width/space：3/3mil 
·Min mechanical hole：0.4mm  ·Min mechanical hole：0.2mm
·Materials：HI-TG FR4
ATE Board RF Board

·Layers：22L  ·Layers：8L 
·Thickness：4.0mm  ·Thickness：1.6mm 
·Surface finished：Im-gold  ·Surface finished：Im-gold 
·Min width/space：5/5mil  ·Min width/space：8/8mil 
·Min mechanical hole：0.35mm  ·Min mechanical hole：0.25mm 
·Materials：FR4 ·Materials：FR4+Rogers hybrid
HDI Board

·Layers：10L  Notebook Board
·Thickness：1.2mm  ·Layers：8L 
·Surface finished：Im-gold  ·Thickness：1.6mm 
·Min width/space：2.4/2.4mil  ·Surface finished：Im-gold 
·Min laser hole：0.1mm  ·Min width/space：4/4mil 
·Min PP thickness :2.2mil  ·Min mechanical hole：0.2mm
·HDI：3+4+3
Rigid-Flex Board

Thick Copper Board
·Layers：12L 
·Layers：2L 
·Surface finished：Im-gold + Selective HASL 
·Thickness：2.0mm 
·Min width/space：4/4mil 
·Surface finished：Im Ag 
·Min mechanical hole：0.25mm 
·Plating hole thickness：80um 
·Special process： 
Blind and Buried via,Peelable ·Copper ：420um（12oz）
Edge Electroplating Board
HDI Board ·Layers：8L 
·Layers：6L  ·Thickness：1.6mm 
·Thickness：1.0mm  ·Surface finished：Im-gold 
·Surface finished：Im-gold  ·Min width/space：5/5mil 
·Min width/space：4/4mil  ·Min mechanical hole：0.2mm 
·Min laser hole：0.1mm  ·Special process： 
·HDI：1+4+1 edge electroplating+ Im-gold
FPC-Production process
FPC Products
Four layer Capacitive touch FPC
Details
Apply：Capacitive touch
Material: ROLLED ANNEAL Copper Foil
Board Thickness:0.05－0.2(mm), custom made.
Base Material Max Copper Thickness:4oZ
Max Gold Thickness:0.125MM
MAX：6 Layer
Max size:5000*240(mm)
Min size:5*5(mm)
Min Track Width:0.1mil
Min Track Space:0.1mil
Min.Hole Size:0.3mm
Min Laser Hole Size:0.1mm
Min PTH Wall Thickness:0.8mil
Surface dispose:Immersion Tin、Immersion Gold、Immersion Silver、OSP
Special Craft:Multi-layer
Camera FPC Circuit Board
Details
Apply：FPC Camera
MAX：6 Layer
Min size:5*5(mm)
Min.Hole Size:0.3mm
Special Craft:Gold Finger
Flexible - phone keypad board
Details
Apply：Phone keypad
MAX：6 Layer
Min size:5*5(mm)
Min.Hole Size:0.3mm
Special Craft:Multi-layer

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About Us

Ⅱ. You benefit from our experience

Ⅳ. Strict quality assurance system

Ⅴ. Save your time

Physical ParametersInvolved Chipset Scheme

【TYPE】： TYPEⅢ HDI PCB Design for OMAP4430 Platform

10G High speed backplane in 28 layers

【TYPE】： 10G High speed backplane in 28 layers

Single board with more than 69000Pins

【TYPE】： Single board with more than 69000Pins

【TYPE】： High-speed backplane for optical network product

Name PMC (Pic Mezzanine Card)

【Type】： Typical high-speed &high-density HDI board

Name Switching Board of L3 Core Routing Switch

Name A Second-Order HDI Cell Phone Board

【Type】： Typical high-end consumer electronic product board

Name Notebook mainboard

 Backplane  Data Communication Board

 ATE Board  RF Board

 HDI Board

 Rigid-Flex Board

Four layer Capacitive touch FPC

Material: ROLLED ANNEAL Copper Foil

Board Thickness:0.05－0.2(mm), custom made.

Base Material Max Copper Thickness:4oZ

Max Gold Thickness:0.125MM

Min Track Width:0.1mil

Min Track Space:0.1mil

Min Laser Hole Size:0.1mm

Min PTH Wall Thickness:0.8mil

Surface dispose:Immersion Tin、Immersion Gold、Immersion Silver、OSP

Material: ROLLED ANNEAL Copper Foil

Board Thickness:0.05－0.2(mm), custom made.

Base Material Max Copper Thickness:4oZ

Max Gold Thickness:0.125MM

Min Track Width:0.1mil

Min Track Space:0.1mil

Min Laser Hole Size:0.1mm

Min PTH Wall Thickness:0.8mil

Surface dispose:Immersion Tin、Immersion Gold、Immersion Silver、OSP

Special Craft:Gold Finger

Material: ROLLED ANNEAL Copper Foil

Board Thickness:0.05－0.2(mm), custom made.

Base Material Max Copper Thickness:4oZ

Max Gold Thickness:0.125MM

Min Track Width:0.1mil

Min Track Space:0.1mil

Min Laser Hole Size:0.1mm

Min PTH Wall Thickness:0.8mil

Surface dispose:Immersion Tin、Immersion Gold、Immersion Silver、OSP

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Ⅱ. You benefit from our experience  

Ⅳ. Strict quality assurance system  

Ⅴ. Save your time 

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