SBB5089Z Data Sheet
SBB5089Z Data Sheet
®
50MHz-6000MHz, Cascadable Amplifier
Product Overview
The SBB5089Z is a high performance InGaP HBT MMIC
amplifier utilizing a Darlington configuration with an active
bias circuitry. The active bias circuitry provides stable
current over temperature and process variations. The
SBB5089Z designed to run directly from a 5V supply, does
not require a dropping resistor as compared to typical
Darlington amplifiers. The SBB5089Z is a high linearity gain 3 Pin SOT-89 Package
block for applications that require small in size with minimal
number of external components. It is internally matched to Key Features
50 Ω at input and output.
• 50 MHz – 6000 MHz
• ±1.1 dB Wideband Flat Gain up to 4000 MHz
• +20.4 dBm P1dB at 1950 MHz
• +5 V Single Fixed Supply
• 1000V, HBM Class 1C Robust ESD
• Patented Thermal Design and Bias Circuitry
• Low Thermal Resistance
Applications
Functional Block Diagram • PA Driver Amplifier
• Cellular, PCS, GSM, UMTS
• Wideband Instrumentation
• Wireless Data, Satellite Terminals
Ordering Information
Top View
Part No. Description
SBB5089Z 1,000 pieces on a 7” reel (standard)
500 – 3500 MHz Evaluation Board
SBB5089Z PCK1
with a 5-piece sample bag
Electrical Specifications
Parameter Conditions (1) Min Typ Max Units
Operational Frequency Range 50 6000 MHz
Gain, Small Signal 850 MHz 19.0 20.5 22.0 dB
1950 MHz 18.3 19.0 21.5 dB
6000 MHz 14.5 15.5 17.5 dB
Input Return Loss 1950 MHz 10 13 dB
Output Return Loss 10 14 dB
Output P1dB 850 MHz 20.5 dBm
1950 MHz 19.0 20.0 dBm
Output IP3 (2) 850 MHz 38.5 dBm
1950 MHz 33.0 35.0 dBm
Bandwidth Minimum 10 dB typical return loss 3000 MHz
Reverse Isolation 1950 MHz 23.3 dB
Noise Figure 3.9 4.9 dB
Device Operating Current, IC Pin 3 60 75 92 mA
Thermal Resistance, θjc Junction to case 69.9 °C/W
Notes:
1. Test conditions unless otherwise noted: VC = +5.0 V, IC = 75 mA, Temp = +25 °C, 50 Ω test system, Tested with Bias Tees
2. POUT = 0 dBm/tone, ∆f = 1 MHz
Top View
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Via holes are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We recommend a 0.35mm
(#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.01”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
Notes:
1. Empty part cavities at the trailing and leading ends are sealed with cover tape. See EIA 481-1-A.
2. Labels are placed on the flange opposite the sprockets in the carrier tape.
Handling Precautions
Parameter Rating Standard
ESD – Human Body Model (HBM) Class 1C ESDA / JEDEC JS-001-2012
Caution!
ESD-Sensitive Device
MSL – Moisture Sensitivity Level Level 3 IPC/JEDEC J-STD-020
Solderability
Compatible with both lead-free (260°C max. reflow temp.) and tin/lead (245°C max. reflow temp.) soldering processes.
Solder profiles available upon request.
Contact plating: NiPdAu
RoHS Compliance
This part is compliant with 2011/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and
Electronic Equipment) as amended by Directive 2015/863/EU.
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations:
Web: www.qorvo.com
Tel: 1-844-890-8163
Email: [email protected]
Important Notice
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INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.
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