Simplex V1
Simplex V1
(Revision J)
Original Instructions
The engine, turbine, or other type of prime mover should be equipped with an
overspeed shutdown device to protect against runaway or damage to the prime
mover with possible personal injury, loss of life, or property damage.
The overspeed shutdown device must be totally independent of the prime mover
control system. An overtemperature or overpressure shutdown device may also
be needed for safety, as appropriate.
Read this entire manual and all other publications pertaining to the work to be performed before
installing, operating, or servicing this equipment. Practice all plant and safety instructions and
precautions. Failure to follow instructions can cause personal injury and/or property damage.
This publication may have been revised or updated since this copy was produced. To verify that
you have the latest revision, be sure to check the Woodward website:
www.woodward.com/pubs/current.pdf
The revision level is shown at the bottom of the front cover after the publication number. The latest
version of most publications is available at:
www.woodward.com/publications
If your publication is not there, please contact your customer service representative to get the
latest copy.
Any unauthorized modifications to or use of this equipment outside its specified mechanical,
electrical, or other operating limits may cause personal injury and/or property damage, including
damage to the equipment. Any such unauthorized modifications: (i) constitute "misuse" and/or
"negligence" within the meaning of the product warranty thereby excluding warranty coverage
for any resulting damage, and (ii) invalidate product certifications or listings.
Woodward Governor Company reserves the right to update any portion of this publication at any time. Information
provided by Woodward Governor Company is believed to be correct and reliable. However, no responsibility is assumed
by Woodward Governor Company unless otherwise expressly undertaken.
© Woodward 2003
All Rights Reserved
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Contents
IOLOCK. When a CPU or I/O module fails, watchdog logic drives it into an
IOLOCK condition where all output circuits and signals are driven to a known
de-energized state as described below. The System MUST be designed such that
IOLOCK and power OFF states will result in a SAFE condition of the controlled
device.
CPU and I/O module failures will drive the module into an IOLOCK state.
CPU failure will assert an IOLOCK signal to all modules and expansion
racks to drive them into an IOLOCK state.
Discrete outputs / relay drivers will be non-active and de-energized.
Analog and actuator outputs will be non-active and de-energized with zero
voltage or zero current.
NOTE: Additional watchdog details and any exceptions to these failure states
are specified in the related CPU or I/O module section of the manual.
Woodward i
MicroNet Simplex & MicroNet Plus Manual 26166V1
Contents
ii Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Contents
Woodward iii
MicroNet Simplex & MicroNet Plus Manual 26166V1
iv Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward v
MicroNet Simplex & MicroNet Plus Manual 26166V1
Figure 9-37—8Ch Voltage Input (0-10 Vdc) Module Block Diagram .................201
Figure 9-38—8 Channel Current Output (4-20 mA) Module ..............................203
Figure 9-39—8Ch Current Output (4-20 mA) Module Configuration..................204
Figure 9-40—Analog Output Wiring for an 8Ch Current Output (4–20 mA)
Module ...........................................................................................205
Figure 9-41—Current Output ( 4–20 mA) Module Block Diagram .....................206
Figure 9-42—8 Channel Current Output (0-1mA) Module .................................207
Figure 9-43—8 Channel Voltage Output (0-5 Vdc) Module ...............................209
Figure 9-44—8Ch Voltage Output (0–5 Vdc) Module Configuration ..................210
Figure 9-45—Analog Output Wiring for an 8Ch Voltage Output (0–5 Vdc)
Module ...........................................................................................212
Figure 9-46—8Ch Voltage Output (0-5 Vdc) Module Block Diagram.................213
Figure 9-47—8 Channel Voltage Output (0-10 Vdc) Module .............................214
Figure 9-48—8 Channel TC (Fail Low) Module..................................................216
Figure 9-49—8Ch TC (Fail Low) Module Configuration .....................................218
Figure 9-50—8Ch TC Input (Fail Low) Module Field Wiring ..............................219
Figure 9-51—Thermocouple Input Block Diagram .............................................220
Figure 9-52—8 Channel TC (Fail High) Module .................................................222
Figure 9-53—8 Channel RTD Input Module (10 ohm) .......................................224
Figure 9-54—8Ch RTD Module Configuration ...................................................225
Figure 9-55—8Ch RTD Input Module Field Wiring.............................................226
Figure 9-56—RTD Input Block Diagram .............................................................227
Figure 9-57—8 Channel RTD Input Module (100 ohm) .....................................229
Figure 9-58—8 Channel RTD Input Module (200 ohm) .....................................231
Figure 9-59—8 Channel RTD Input Module (500 ohm) .....................................233
Figure 9-60—4 Channel MPU/Proximity Module ...............................................235
Figure 9-61—4Ch MPU/Proximity Module .........................................................236
Figure 9-62—MPU and Proximity Probe Interface Wiring ..................................238
Figure 9-63—Digital Speed Sensor Module Block Diagram ..............................239
vi Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward vii
MicroNet Simplex & MicroNet Plus Manual 26166V1
Regulatory Compliance
For LinkNet® regulatory information, please refer to the appropriate
chapter in Volume 2 of this manual.
Marine
American Bureau ABS Rules 2002 SVR 4-2-1/7.3, 4-2-1/7.5.1, 4-9-3/17,
of Shipping: 4-9-7/13, 4-9-2/11.7 & 4-9-4/23
viii Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Special Conditions for Safe Use
This equipment is suitable for use in European Zone 2, Group IIC environments
when installed in an IP54 minimum rated enclosure per self-declaration to EN
60079-15.
CPU modules contain internal energy limited circuits. These circuits have no
external connections and are not affected by module loading.
CPU modules contain single cell primary batteries. These batteries are not to be
charged and are not customer replaceable.
Woodward ix
MicroNet Simplex & MicroNet Plus Manual 26166V1
x Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
2. Avoid the build-up of static electricity on your body by not wearing clothing
made of synthetic materials. Wear cotton or cotton-blend materials as much
as possible because these do not store static electric charges as much as
synthetics.
4. Do not remove the printed circuit board (PCB) from the control cabinet
unless absolutely necessary. If you must remove the PCB from the control
cabinet, follow these precautions:
When replacing a PCB, keep the new PCB in the plastic antistatic
protective bag it comes in until you are ready to install it. Immediately
after removing the old PCB from the control cabinet, place it in the
antistatic protective bag.
Woodward xi
MicroNet Simplex & MicroNet Plus Manual 26166V1
xii Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Chapter 1.
General Information
1.1—Introduction
The MicroNet™ Plus and MicroNet Simplex controls are a 32-bit microprocessor-
based digital controllers that are programmable for many types of applications in
the control of:
Gas and Steam Turbines
Gas and Diesel Engines
Hydro Turbines
The MicroNet Controls family provides a flexible system to control any prime
mover and its associated processes such as high speed control functions,
system sequencing, auxiliary system control, surge control, monitoring and
alarming, and station control. The MicroNet platform is available in simplex,
redundant, and triple modular redundant (TMR) configurations. This manual
covers only simplex and redundant based control configurations. Please refer to
manual 26167 for TMR-based control configurations.
Dedicated inputs and outputs (I/O) are available onboard for key control signals
while distributed I/O can be used for other less critical parameters.
Communications with the MicroNet platform are available to program and service
the control as well as to interface with other systems (Plant DCS, HMI, etc.).
Application code is generated by use of Woodward’s GAP program or
Woodward’s Ladder Logic programming environment. A service interface allows
the user to view and tune system variables. Several tools are available to provide
this interface (see Engineering and Service Access). Communication protocols
such as TCP/IP, OPC, Modbus® *, and other current designs are included so that
the user can correctly interface the control to existing or new plant level systems.
*—Modbus is a trademark of Schneider Automation Inc.
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MicroNet Simplex & MicroNet Plus Manual 26166V1
Chapter 2.
MicroNet™ Plus Systems
The MicroNet Plus chassis offers both simplex (single CPU) and redundant (dual
CPU) operation with up to 14 VME slots per chassis. The system may be
expanded using copper or fiber cables to multiple chassis to accommodate
additional system I/O requirements.
MicroNet Plus
MicroNet 14 or 8 VME Slot Chassis
Dual CPU's for redundant operation
Single CPU for simplex operation
Motorola PowerPC CPU5200/
CPU5200L
Simplex or Redundant I/O modules
Simplex or Redundant Power
Redundant smart fans
1 2
P FAULT
1 3 5 7
DA/STAT
2 4 6 8
LA1
LA2
LA3
+24V*
+24V
LA4
LA5
LA6
LA7
LA8
Main Rack 1 2
Rack #1 Rack #2
RTN-2 3 4
RTN-2 5
7
6
2 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
In a redundant system, there are two CPU modules, running the same application
program, receiving power from the same pins on the VME backplane, and with access
to the I/O modules over the same VME bus. The CPU modules communicate their
health to each other over the VME bus, and arbitrate for control of the bus. The CPU
which is in slot 1 and in good “health” first, gains control of the I/O modules, and is
called the System Controller or SYSCON. The other CPU is then the backup or
STANDBY CPU. The SYSCON sends all necessary state information to the backup
CPU, allowing it to take control of the I/O modules if the SYSCON fails.
The following conditions will cause a failover from the SYSCON CPU to the backup
STANDBY CPU:
Failure of the on board CPU module power supplies
Failure of the processor core, including the processor, RAM, flash, oscillator,
etc.
Failure of communications between the processor and the FPGA
A watchdog timeout between the CPU module and the FPGA. This would
mean that one of the devices did not respond to the other device, within a
prescribed amount of time.
A reset of the SYSCON CPU, caused by the front panel or remote Resets
An application requested failover
An application stop
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MicroNet Simplex & MicroNet Plus Manual 26166V1
The second level is wiring two external input devices to two separate I/O modules.
See Figure 2-4. In the event of a failure in one of the sensors, connections, cables,
FTMs, or I/ O modules, a valid input is still available.
4 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
This process can be expanded for triplicated inputs. With triplicated inputs,
redundant inputs are available if an input fails. It is also possible to determine
which input is not valid when using triplicated inputs.
2.1.5—Redundant Outputs
Redundancy can be added to the outputs as well. Additional external relays can be
used to prevent a faulted output from affecting the external device. For discrete
outputs, this would require four relays for each output. For the actuator outputs, a
dual coil actuator can be used. The dual coils will allow one coil to operate the
actuator in the event of a failure.
The value of redundancy is dependent on the ability of the application to detect the
failure. For analog and actuator outputs, current and/or voltage readback is
provided. For discrete outputs, fault detection requires sensing the relay contact
state.
Start-up
Load and start the application on each CPU using AppManager.
If the CPUs are started within 20 seconds of each other they will boot in the
“Redundant” mode.
If the CPUs are not started within 20 seconds of each other the first CPU
started will become the master and the second CPU will have to re-sync to
the running CPU.
If the applications are not the same and both CPUs are started together,
CPU1 (located in slot A1) will be the SYSCON and the backup CPU will be
failed.
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MicroNet Simplex & MicroNet Plus Manual 26166V1
Normal Operation (Redundant)
Normally the CPUs will be powered up together and will start running the
application within the 20 second window.
The first CPU to start running the application will remove the WATCHDOG (as
indicated by the red LED on the CPU) and become the SYSCON (as
indicated by the green LED on the CPU).
When the second CPU starts running the application the SYSCON control will
go to CPU1 (located in slot A1).
Both CPUs will establish communication and CPU2 will temporarily become
SYSCON (as indicated by the green LED on the CPU) to do a diagnostic test
to ensure it can drive the VME bus.
This diagnostic test will switch the SYSCON between both CPU1 and CPU2
three times before proceeding.
After this diagnostics test is completed, the CPUs will determine if the GAP
application on both CPUs is the same.
If they have the EXACT same application CPU1 (located in slot A1) will be
SYSCON and initialize the I/O.
CPU2 will wait at a rendezvous point for the SYSCON CPU to be ready.
When the SYSCON CPU is ready it will turn out IO_LOCK (as indicated by
the LED on the CPU) and start running the GAP application.
After the SYSCON starts running the real-time code, the CPUs will start
sharing data.
If the SYSCON CPU fails, the Backup CPU will take over running the GAP
application and the I/O.
If the CPUs do not have the same application, CPU1 (located in slot A1) will
become the SYSCON and start up in the SIMPLEX mode (see section Only
One CPU) with the Backup failed flag set to TRUE. (see picture of
CHAS_STAT block)
The MicroNet Plus chassis offers both simplex (single CPU) and redundant (dual
CPU) operation with up to 14 VME slots per chassis. The system may be
expanded to use multiple chassis to accommodate additional system I/O
requirements.
6 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
CPU1
2-Slot 2-Slot
CPU1
2-Slot
MicroNet Plus 2-Slot
MicroNet Plus
Single CPU for simplex operation PS
- Main CPU rack
PS PS
- Main CPU rack
PS
RTN
RTN
PS PS PS PS
- Expansion rack - Expansion rack
- Single Remote RTN - Single Remote RTN
2-Slot 2-Slot
MicroNet Plus
RTN
PS PS
- Expansion rack
- Single Remote RTN
PS1 A1 PS2
FAN_4 FAN_6
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MicroNet Simplex & MicroNet Plus Manual 26166V1
The second level is wiring two external input devices to two separate I/O modules.
See Figure 2-8. In the event of a failure in one of the sensors, connections, cables,
FTMs, or I/ O modules, a valid input is still available.
8 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
This process can be expanded for triplicated inputs. With triplicated inputs,
redundant inputs are available if an input fails. It is also possible to determine
which input is not valid when using triplicated inputs.
2.3.5—Redundant Outputs
Redundancy can be added to the outputs as well. Additional external relays can be
used to prevent a faulted output from affecting the external device. For discrete
outputs, this would require four relays for each output. For the actuator outputs, a
dual coil actuator can be used. The dual coils will allow one coil to operate the
actuator in the event of a failure.
The value of redundancy is dependent on the ability of the application to detect the
failure. For analog and actuator outputs, current and/or voltage readback is
provided. For discrete outputs, fault detection requires sensing the relay contact
state.
Woodward 9
MicroNet Simplex & MicroNet Plus Manual 26166V1
Expansion Chassis Notes: The GAP application may also define expansion
chassis by using the Remote Real Time Network (Remote RTN) module in slot A1
of each expansion chassis.
CPU5200 based systems require that the expansion chassis use the Remote
RTN module in slot A1. The CPU5200 in the main chassis controls the
expansion chassis through its redundant RTN port connections to the Remote
RTN module.
2.5—Module Replacement
Chapter 15 contains Installation and Replacement procedures for VME Modules,
power supplies, relay boxes, and other devices. Individual CPU and I/O module
sections in Chapters 6 through 9 are an additional reference for installation and
replacement information.
Sections 5.2 and 5.4 contain additional details for power supply installation and
replacement. Note that power must be removed from the power supply input
before a module is removed or inserted.
Live insertion and removal of the CPU5200 and Remote RTN modules
is allowed in a MicroNet Plus chassis. These modules should be
reset immediately before removing them from the chassis. This
RESET notifies the module that it will be removed and provides a graceful
! MODULE failover to another healthy CPU or Remote RTN module if available.
BEFORE REMOVAL
10 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Example of MicroNet Plus fault information available from the CHASSIS14 status
block.
Woodward 11
Micro
oNet Simplex
x & MicroNett Plus Manual 26166V1
Chapte
C er 3.
Mic
croNet™
™ Simp
plex Sys
stems
3.1—MicroNett Simplex
x
The MicroNet™
M Coontrols familyy is developed d around the VME
V chassis and
a a CPU
module that goes innto the first acctive slot of the VME chasssis. All I/O mod
dules plug
into th
he remaining slots
s of the VM ME chassis.
The MicroNet
M Simpplex chassis offers
o single CPU
C operationn with up to 12
2 VME slots
per ch
hassis. The syystem may be e expanded too use multiple chassis to
accommmodate addiitional system m I/O requirem nt CPU options are
ments. Differen
availa
able that provide a variety of
o system features.
oNet Simplex
Micro x Configuratiions
Syste
em Config Main and
a Expansion
n rack configu
urations
Main Rack Opttional Exp #1 Optional Exxp #2
Simplex (CPU5 5200) Single
e CPU Sing
gle RTN Single RTN
Simplex (Pentiium, Motorola x040)
x Single
e CPU --- ---
Simplex (Pentiium, Motorola x040)
x Single
e CPU + Main XCVR
X Remmote XCVR Remote XCV VR
Systtem Diagra
ams—Micro
oNet Simp
plex
MicroNet Simplex
S
MicroN
Net 12 or 6 I/O
O Slot Chassiis
Single CPU for simpplex operation
n
PowerrPC CPU5200 0, Pentium, orr
Motoroola x040 CPUU options
Simple
ex or Redundant I/O modules
Simple
ex or Redundant Power
CPU
MAIN XCVR
3-Slot 3-Slo
ot
MicroNet Simplex
S 12 Power Power
MicroNet Sim
mplex 12 Poweer Power
Power Poweer - Main
M rack
Supply Supp
ply - Main rack Supply Supply - Main rack Supp
ply Supply
- Single CPU_
_5200 - Single
S CPU Pentium
m
- Single CPUU_5200 or Motorola x040
A1 A1
RTN
N1 RTN2 XCVR
SW
W FAN_1 FAN_2
SW TBOX FAN_1 FAN_2
RTN-1 and 2 FAN_3 FAN_3
FAN_1 FAN_2 FAN_3
RTN
RMT XCVR
Supply Supp
ply - Expansionn rack - Single RTN - Single XCVR
- Single RTN
N
A1 A1
A1
FAN_1 FAN_2 FAN_1 FAN_2
2
RTN
RMT XCVR
PS A1 PS A1
A1 A1
1 1
FAN_3 FAN_4 FAN_3 FAN_4
4
12 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
The Pentium CPU module offers high processing capability with single Ethernet
and dual RS-232 serial ports. The Pentium CPU operating temperature limits
are 0 to 50 °C.
The Motorola 68040 CPU module offers basic capability and one RS-232 serial
port.
Woodward 13
MicroNet Simplex & MicroNet Plus Manual 26166V1
3.1.4—Redundant Inputs
Two levels of I/O signal redundancy are available. The first involves wiring two
external input devices to two separate input channels. See Figure 3-3. In the event
of a failed sensor or a failure in the connection from the sensor to the control, a
valid input is still available
The second level is wiring two external input devices to two separate I/O modules.
See Figure 3-4. In the event of a failure in one of the sensors, connections, cables,
FTMs, or I/ O modules, a valid input is still available.
This process can be expanded for triplicated inputs. With triplicated inputs,
redundant inputs are available if an input fails. It is also possible to determine
which input is not valid when using triplicated inputs.
3.1.5—Redundant Outputs
Redundancy can be added to the outputs as well. Additional external relays can be
used to prevent a faulted output from affecting the external device. For discrete
outputs, this would require four relays for each output. For the actuator outputs, a
dual coil actuator can be used. The dual coils will allow one coil to operate the
actuator in the event of a failure.
The value of redundancy is dependent on the ability of the application to detect the
failure. For analog and actuator outputs, current and/or voltage readback is provided.
For discrete outputs, fault detection requires sensing the relay contact state.
14 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Expansion Chassis Notes: The GAP application may also define expansion racks by
using either the Remote Real Time Network (Remote RTN) module or the Remote
Transceiver (Remote XCVR) module. The expansion method used (Remote RTN or
Remote XCVR) depends on the CPU being used in the main chassis.
CPU5200 based systems require that the expansion chassis use the Remote
RTN module in slot A1. The CPU5200 in the main chassis controls the
expansion chassis through its redundant RTN port connections to the Remote
RTN module.
Pentium and Motorola x040 based systems require that the expansion chassis
use the Remote XCVR module in slot A1 of the expansion rack. The system
must also have a Main Transceiver (Main XCVR) module in the main chassis
to control the expansion chassis.
3.3—Module Replacement
Chapter 15 contains Installation and Replacement procedures for VME Modules,
power supplies, relay boxes, and other devices. Individual CPU and I/O module
sections in Chapters 6 through 9 are an additional reference for installation and
replacement information.
Sections 5.2 and 5.4 contain additional details for power supply installation and
replacement. Note that power must be removed from the power supply input
before a module is removed or inserted.
Woodward 15
MicroNet Simplex & MicroNet Plus Manual 26166V1
16 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Chapter 4.
Chassis Configurations
The MicroNet Plus 14-slot chassis offers redundant CPU capability and more I/O
slots, as well as improvements in airflow and overall system reliability.
Features:
A total of (14) CPU and I/O slots are available for use
A new 2-slot wide, redundant, load sharing power supply is used
Redundant Smart fans are used for early notification of fan failure
Chassis temperature switches are built into the motherboard and trip at
+65 °C
Redundant, hot-swappable CPUs are supported
Woodward 17
MicroNet Simplex & MicroNet Plus Manual 26166V1
4.1.1—Specification
The MicroNet is designed around a modular 6-slot chassis (block). Each block
consists of a premolded cage with a fan for cooling and a temperature switch for
high temperature detection. The chassis are cooled by forced air, and either a
module or a module blank must be installed in every slot to maintain correct air
flow. The fans run whenever power is applied to the system.
From a module connector standpoint, any I/O module can be installed in any of
the slots designated for I/O modules. However, when the application software is
designed, each module will be assigned to a specific slot and thereafter, the
software will expect that specific I/O module to always be in its designated slot.
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
CPU
2-Slot 2-Slot
Power Power
Supply Supply
For simplex systems, CPU slot A14 can also be used as an I/O module slot.
Live Insertion and removal is supported for field repairability.
CPUs are located under different fan sets to improve reliability, airflow, and
temperature performance.
CPU slots use VME-64 connectors on the CPU module slots for improved
CPU HotSwap capabilities.
18 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Power Supply Slots (PS1, PS2)
A smaller 2-slot wide power supply has been designed for the MicroNet Plus
chassis, thus allowing (2) more slots for I/O. Each power supply is located under
different fan sets for improved reliability. The redundant smart fans are located
above and below each power-supply for improved airflow. Each power supply
provides input failure (AC_FAIL) and output failure (PWR_ALM) fault information
to the CPU slots.
Power supplies are located under different fan sets to improve reliability,
airflow, and temperature performance.
Three different 2-slot wide power supplies are available for use: a low
voltage (24 Vdc input), a high voltage (120 Vac/dc input), and a high voltage
220 Vac input version. Refer to the power-supply section for additional
information.
Woodward 19
MicroNet Simplex & MicroNet Plus Manual 26166V1
Chassis Outline Drawing
The MicroNet Plus 14-slot chassis is physically the same dimensions as the
current MicroNet Simplex 12-slot chassis.
20 Woodward
Manual 26
6166V1 MicroNett Simplex & MicroNet
M Plu
us
4.1.2—Installation
Fig
gure 4-4 show
ws the mountting template and fastenerss to bulkhead
d mount the
ch
hassis. Rack mounting
m is not recommen nded.
4
4.2—Mic roNet Plu
us 8-Slot Chassis
Figure 4-5
5—MicroNet Plus
P 8-Slot I/O
O Chassis
Woodward
d 2
21
MicroNet Simplex & MicroNet Plus Manual 26166V1
The MicroNet Plus 8-slot chassis offers redundant CPU capability and more I/O
slots, as well as improvements in airflow and overall system reliability.
Features:
A total of 8 CPU and I/O slots are available for use
A new 2-slot wide, redundant, load sharing power supply is used
Redundant Smart fans are used for early notification of fan-failure
Chassis temperature switches are built into the motherboard and trip at
+65 °C
Redundant, hot-swappable CPUs are supported
4.2.1—Specification
The MicroNet is designed around a modular 6-slot chassis (block). Each block
consists of a premolded cage with a fan for cooling and a temperature switch for
high temperature detection. The chassis are cooled by forced air, and either a
module or a module blank must be installed in every slot to maintain correct air
flow. The fans run whenever power is applied to the system.
The MicroNet Plus 8-slot chassis is composed of two blocks with a motherboard
inserted in the back of the assembly to make connections between the fans,
switches, power supplies, and control modules. See Figure 4-6. The modules
use the VERSAmodule Eurocard (VME) bus standard for connector specification
and data transfer. Slot-to-slot logic and power connections are made through an
etched-circuit motherboard. I/O connections are made through cables from the
front of the boards to terminal blocks in the cabinet.
From a module connector standpoint, any I/O module can be installed in any of
the slots designated for I/O modules. However, when the application software is
designed, each module will be assigned to a specific slot and thereafter, the
software will expect that specific I/O module to always be in its designated slot.
FAN_1 FAN_2
CPU1
CPU2
I/O
I/O
I/O
I/O
I/O
I/O
2-Slot 2-Slot
Power Power
Supply Supply
PS1 A1 A2 A3 A4 A5 A6 A7 A1
A8 PS2
FAN_3 FAN_4
Power supplies are located under different fan sets to improve reliability,
airflow, and temperature performance.
Three different 2-slot wide power supplies are available for use: a low
voltage (24 Vdc input), a high voltage (120 Vac/dc input), and a high voltage
220 Vac input version. Refer to the power-supply section for additional
information.
Woodward 23
MicroNet Simplex & MicroNet Plus Manual 26166V1
Chassis Overtemp Alarm
The MicroNet Plus 8-slot chassis provides (2) over-temperature switches on the
motherboard. The over-temperature switches will trip at 65C 3C and
communicate this warning to the CPU and GAP application.
24 Woodward
Manual 26
6166V1 MicroNett Simplex & MicroNet
M Plu
us
4.2.2—Installation
Fig
gure 4-8 show
ws the mountting template and fastenerss to bulkhead
d mount the
ch
hassis. Rack mounting
m is not recommen nded.
Figure 4--8—Mounting
g Template off MicroNet Plu
us 8-Slot I/O Chassis
C
4.3—
—Simple
ex 6-Slot I/O
Th
his chassis coontains six sloots for CPU annd I/O module es. Normally, this allows
on
ne CPU modu ule and five I/O
O modules. Inn addition to the
t six CPU – I/O slots, two
po
ower supply positions
p are provided,
p whicch allows for redundant poower input.
Ea
ach power supply module occupies
o thre
ee slots of cha
assis space. The
T total widtth
of the chassis iss therefore tw
welve slots wid
de, when cou unting both po
ower supply
nd I/O slots.
an
4.3.1—Spec
cification
Thhe MicroNet iss designed arround a moduular 6-slot chaassis (block). Each block
co f cooling and a temperatu
onsists of a prremolded cage with a fan for ure switch forr
higgh temperature detection. The chassis are
a cooled byy forced air, and
a either a
mo odule or a moodule blank must
m be installed in every slot to maintain correct air
flo
ow. The fans run
r wheneverr power is app plied to the syystem.
Woodward
d 2
25
MicroNet Simplex & MicroNet Plus Manual 26166V1
From a module connector standpoint, any I/O module can be installed in any of
the slots designated for I/O modules. However, when the application software is
designed, each module will be assigned to a specific slot and thereafter, the
software will expect that specific I/O module to always be in its designated slot.
26 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 27
Micro
oNet Simplex
x & MicroNett Plus Manual 26166V1
4.3.2
2—Installattion
Figure
e 4-11 showss the mounting g template an
nd fasteners to bulkhead mount
m the
chasssis. Rack mou
unting is not recommended d.
Figure 4-1
11—Mounting
g Template off MicroNet 6-S
Slot I/O Chasssis
4.4—
—Simplex 12-Slot I/O (Inputt/Output)
4.4.1
1—Descrip
ption
This chassis
c contaains twelve slo
ots for CPU and I/O (input//output) modu ules.
Normally, this allowws one CPU module
m and eleven
e I/O mo
odules. In add dition to the
12 CPPU – I/O slotss, two power supply
s positio
ons are providded, which allows for
redun
ndant power in nput. Each poower supply module
m occup
pies three slotts of
chasssis space. Wh hen counting power
p supplyy and I/O slotss, the total wid
dth of the
chasssis is 18 slots wide.
ower supply or
If a po o I/O module slot is not occcupied, it mu
ust be filled wiith a
blanking plate (379
99-301) to ma
aintain properr cooling flow through the chassis.
c
28 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
4.4.2—Specification
The MicroNet is designed around a modular 6-slot chassis (block). Each block
consists of a premolded cage with a fan for cooling and a temperature switch for
high temperature detection. The chassis are cooled by forced air, and either a
module or a module blank must be installed in every slot to maintain correct air
flow. The fans run whenever power is applied to the system.
The simplex twelve slot MicroNet control is composed of three blocks with a
motherboard inserted in the back of the assembly to make connections between
the fans, switches, power supplies, and control modules. See Figure 4-13. The
modules use the VERSAmodule Eurocard (VME) bus standard for connector
specification and data transfer. Slot-to-slot logic and power connections are
made through an etched-circuit motherboard. I/O connections are made through
cables from the front of the boards to terminal blocks in the cabinet.
From a module connector standpoint, any I/O module can be installed in any of
the slots designated for I/O modules. However, when the application software is
designed, each module will be assigned to a specific slot and thereafter, the
software will expect that specific I/O module to always be in its designated slot.
Woodward 29
MicroNet Simplex & MicroNet Plus Manual 26166V1
30 Woodward
Manual 26
6166V1 MicroNett Simplex & MicroNet
M Plu
us
4.4.3—Installation
Fig
gure 4-14 sho
ows the moun nting template
e and fastene
ers to bulkhea
ad mount the
ch
hassis. Rack mounting
m is not recommen nded.
Figure 4-14—Mount
4 ting Template
e of MicroNet 12-Slot I/O Chassis
C
Woodward
d 3
31
MicroNet Simplex & MicroNet Plus Manual 26166V1
Chapter 5.
Power Supplies
When redundant power supplies are running, current sharing circuitry balances
the load to reduce heat and improve the reliability of the power supplies. In the
event that on supply needs to be replaced, the recommended method for
changing Power Modules is with the power off (to the module being removed and
the module being inserted). The system will tolerate this “cold swap” method
without failure.
Each main power supply has four LEDs to indicate power supply health (OK,
Input Fault, Overtemperature, and Power Supply Fault). See MicroNet Plus
Power Supply Troubleshooting (Section 5.5) for a description of the LED
indications.
Input power connections are made to the power supply through a plug/header
assembly on the front of the power supply.
For redundant operation, the control can use any combination of power supplies.
The power supplies can only be installed into slots PS1 (power supply #1) and
PS2 (power supply #2). If redundant power supplies are not needed, blanking
plates must be installed in the slots not being used.
The MicroNet Plus main power supplies must have the input power
removed before installing or removing.
This equipment is suitable for use in Class I, Division 2, Groups A, B,
C, and D or non-hazardous locations only.
Wiring must be in accordance with Class I, Division 2 wiring methods
and in accordance with the authority having jurisdiction.
32 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 33
MicroNet Simplex & MicroNet Plus Manual 26166V1
Main PS (110 Vac/dc Input)
AC input
Operating range: 88 to 132 Vac (47 to 63 Hz)
Nominal input voltage rating: 98 to 120 Vac, as on power supply label
Maximum input current: 13.6 A
Maximum input power: 1250 VA
Input power fuse/breaker rating: 20 A time delay
Maximum output current (24 Vdc): 12.0 A @ 65 °C System Ambient Temp.
Maximum output current (5 Vdc): 28.0 A @ 65 °C, 32A @ 60 °C
Holdup time: 1 cycle @ 120 Vac
DC input
Operating range: 100 to 150 Vdc
Nominal input voltage rating: 111 to 136 Vdc, as on power supply label
Maximum input current: 6A
Maximum input power: 600 W
Input power fuse/breaker rating: 10 A time delay
Note that the control’s power supplies are not equipped with input
power switches. For this reason, some means of disconnecting input
power to each main power supply must be provided for installation
and servicing.
Branch circuit fuses, circuit breakers, and wiring must meet appropriate codes
and authorities having jurisdiction for the specific country (CE, UL, etc). See
Table 5-1 for maximum recommended fuse or breaker ratings. Do not connect
more than one main power supply to any one fuse or circuit breaker. Use only
the wire sizes specified in Table 5-1 which meet local code requirements. Time
delay fuses or circuit breakers must be used to prevent nuisance trips.
34 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Power requirements depend on the number and type of modules supplied for
each system. For a system with a single I/O chassis, size the input power source
according to the rating of the MicroNet Plus power supply to which the source is
connected. Do not size the supply mains for the sum of the MicroNet Plus power
supply ratings when redundant supplies are used. MicroNet Plus supplies are
redundant when installed in the same chassis. Redundant supplies share the
load between them equally, but each must provide for full load in the event that
one of the units is disabled. Table 5-1 gives the maximum overload protection for
supply mains connected to any single or redundant pair of MicroNet Plus main
power supplies. It is not recommended that both MicroNet Plus main power
supplies of a redundant pair be connected to a single source, since failure of that
source would disable the system.
Multiple chassis systems using MicroNet Plus power supplies may have power
supplies of the same model, but in different chassis, connected to the same
source. In this case, each branch to a chassis must have its own overcurrent
protection sized according to Table 5-1, and the power source must be sized for
the sum of the branches.
Not all systems will require the full load capability of the MicroNet Plus power
supply. If not otherwise indicated on a cabinet system nameplate, either use the
MicroNet power supply input ratings for sizing the system’s source or consult
Woodward for determining the minimum source requirements.
Table 5-1 provides each power supply’s holdup time specification, which is the
time the supply will continue to operate within specification after its input power is
interrupted. This information may be useful in specifying uninterruptible power
supply (UPS) systems.
When a cabinet is not supplied with the system, input power connections are
made through a plug/header assembly on the front of each main power supply.
The plug accept wires from 0.5 to 16 mm² (20–6 AWG). For a good connection,
the inserted wires should have the insulation stripped back 11-12 mm (0.45 in).
Torque to 0.5 to 0.6 Nm (0.37 to 0.44 lb-ft).
A green/yellow wire connection of at least the same size as the supply wire must
be used for the PE ground.
System Power-Up
If at any time during this procedure the defined or expected result is not
achieved, begin system troubleshooting.
1. Verify that the entire MicroNet Plus control system has been installed.
2. Turn on the power to one power supply and verify that the power supply’s
green LED is the only power supply LED on.
Woodward 35
MicroNet Simplex & MicroNet Plus Manual 26166V1
3. Turn off the power to the first power supply and turn on the power to the
second power supply (if a second power supply is present) and verify that the
power supply’s green LED is the only power supply LED on.
4. Toggle the CPU’s RESET switch. The CPU’s red Fault and Watchdog LEDs
should turn off, and the green RUN LED should go on. At this time, the CPU is
performing the self-diagnostic and boot-up processes. When the CPU has
completed its diagnostic tests, all red LEDs on the CPU module or I/O modules
should be off, and the control will begin running the application program.
INPUT FAULT LED—This red LED turns on to indicate that the input voltage is
either above or below the specified input range. If this LED is on, check the input
voltage, and correct the problem. Long-term operation with incorrect input
voltages may permanently damage the power supply. Once the input voltage is
within the supply’s input specifications, this LED will turn off. Refer to the power
supply input specifications.
If this LED is turned on, verify that the fans in the power supply chassis are
turning and free of dust and other obstructions, and that the temperature around
the power supply is less than 55 °C. If the power supply is cooled down without
delay, it can recover from this situation without shutting down. This LED will turn
off once the internal power supply heatsink temperature falls below
approximately 90 °C.
POWER SUPPLY FAULT LED—This red LED turns on when one of the supply’s
three power converters has shut down or one or more of the supply levels is
below internally specified levels. If this LED is on, check for a short circuit on
external devices connected to the control’s power supply. When the short circuit
has been removed, the supply will resume normal operation (Note that if the 24 V
or 5 V outputs are shorted, these power converters will be latched OFF and can
only be cleared by removing the shorted condition and removing the input power
for 1 minute (or until the front panel LED’s extinguish)). If no short circuit is found,
reset the supply by removing input power for one minute. If the power supply is
still not functioning after input power has been restored, verify that the supply is
properly seated to the motherboard connector. If the supply is properly seated
but is not working, then replace the supply.
36 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Simplex Power Supply Checks
The following is a troubleshooting guide for checking areas which may present
difficulties. If these checks are made prior to contacting Woodward for technical
assistance, system problems can be more quickly and accurately assessed.
Is the input power within the range of the control’s power supply input?
Is the input power free of switching noise or transient spikes?
Is the power circuit dedicated to the governor only?
Are the control’s supplies indicating that they are OK?
Are the control’s supplies outputting the correct voltage?
Is the CPU Low Vcc LED ON?
When redundant power supplies are running, current sharing circuitry balances
the load to reduce heat and improve the reliability of the power supplies. In the
event that one supply needs replacement, this feature also ensures hot
replacement of the power supplies without disrupting the operation of the control.
Each main power supply has four LEDs to indicate power supply health (OK,
Input Fault, Overtemperature, and Power Supply Fault). See MicroNet Simplex
Power Supply Troubleshooting (Section 5.5) for a description of the LED
indications.
Input power connections are made to the power supply through terminals on the
front of the power supply.
For redundant operation, the control can use any combination of power supplies.
The power supplies can only be installed into slots PA1 (power supply #1) and
PA2 (power supply #2). If redundant power supplies are not needed, blanking
plates (3799-301) must be installed in the slots not being used.
The MicroNet Simplex main power supplies must have the input
power removed before installing or removing.
This equipment is suitable for use in Class I, Division 2, Groups A, B,
C, and D or non-hazardous locations only.
Wiring must be in accordance with Class I, Division 2 wiring methods
and in accordance with the authority having jurisdiction.
Woodward 37
MicroNet Simplex & MicroNet Plus Manual 26166V1
Main PS Simplex (24 Vdc Input) Main PS Simplex (120 Vac/dc Input)
38 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
DC
Operating range: 100 to 150 Vdc
Nominal voltage rating: 111 to 136 Vdc, as on power supply label
Maximum current: 5.3 A
Maximum power: 531 W
Input power fuse/breaker rating: 10 A time delay
Holdup time: 7 ms @ 120 Vdc
High Voltage DC
Operating range: 200 to 300 Vdc
Nominal voltage rating: 223 to 272 Vdc, as on power supply label
Maximum current: 2.7 A
Maximum power: 531 W
Input power fuse/breaker rating: 5 A time delay
Holdup time: 7 ms @ 225 Vdc
Woodward 39
MicroNet Simplex & MicroNet Plus Manual 26166V1
5.4—Installation
Note that the control’s power supplies are not equipped with input
power switches. For this reason, some means of disconnecting input
power to each main power supply must be provided for installation
and servicing. A circuit breaker meeting the above requirements or a
separate switch with appropriate ratings may be used for this
purpose. To avoid nuisance trips, use only time-delay fuses or circuit
breakers.
40 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Branch circuit fuses, circuit breakers, and wiring must meet appropriate codes
and authorities having jurisdiction for the specific country (CE, UL, etc). See
Table 5-2 for maximum recommended fuse or breaker ratings. Do not connect
more than one main power supply to any one fuse or circuit breaker. Use only
the wire sizes specified in Table 5-2 which meet local code requirements. Time
delay fuses or circuit breakers must be used to prevent nuisance trips.
Power requirements depend on the number and type of modules supplied for
each system. For a system with a single I/O chassis, size the input power source
according to the rating of the MicroNet power supply to which the source is
connected. Do not size the supply mains for the sum of the MicroNet power
supply ratings when redundant supplies are used. MicroNet supplies are
redundant when installed in the same chassis. Redundant supplies share the
load between them equally, but each must provide for full load in the event that
one of the units is disabled. Table 5-2 gives the maximum overload protection for
supply mains connected to any single or redundant pair of MicroNet main power
supplies. It is not recommended that both MicroNet main power supplies of a
redundant pair be connected to a single source, since failure of that source would
disable the system.
Multiple chassis systems using MicroNet power supplies may have power
supplies of the same model, but in different chassis, connected to the same
source. In this case, each branch to a chassis must have its own overcurrent
protection sized according to Table 5-2, and the power source must be sized for
the sum of the branches.
Not all systems will require the full load capability of the MicroNet power supply.
If not otherwise indicated on a cabinet system nameplate, either use the
MicroNet power supply input ratings for sizing the system’s source or consult
Woodward for determining the minimum source requirements.
Table 5-2 provides each power supply’s holdup time specification, which is the
time the supply will continue to operate within specification after its input power is
interrupted. This information may be useful in specifying uninterruptible power
supply (UPS) systems.
When a cabinet is not supplied with the system, input power connections are
made through terminals on the front of each main power supply. These terminals
accept wires from 0.5 to 10 mm² (20–8 AWG). For a good connection, the
inserted wires should have the insulation stripped back 8–9 mm (0.33 in). Torque
to 0.5 to 0.6 Nm (0.37 to 0.44 lb-ft).
The 24 Vdc power supply model uses larger copper input terminals to
accommodate the required 10 mm² (8 AWG) wire.
Woodward 41
MicroNet Simplex & MicroNet Plus Manual 26166V1
A green/yellow wire connection of at least the same size as the supply wire must
be used for the PE ground.
5.4.2—System Power-Up
If at any time during this procedure the defined or expected result is not
achieved, begin system troubleshooting.
1. Verify that the entire MicroNet control system has been installed.
2. Turn on the power to one power supply and verify that the power supply’s
green LED is the only power supply LED on.
3. Turn off the power to the first power supply and turn on the power to the
second power supply (if a second power supply is present) and verify that the
power supply’s green LED is the only power supply LED on.
If the system is configured with the 68040 or 68060 CPU, perform step #4. If the
system is configured with the Windows NT CPU, skip step #4 and go to step #5.
4. Toggle the CPU’s RESET switch up, then back to its normal down position.
The CPU’s red Fault and Watchdog LEDs should turn off, and the green
RUN LED should go on. At this time, the CPU is performing the self-
diagnostic and boot-up processes. When the CPU has completed its
diagnostic tests, all red LEDs on the CPU module or I/O modules should be
off, and the control will begin running the application program.
INPUT FAULT LED—This red LED turns on to indicate that the input voltage is
either above or below the specified input range. If this LED is on, check the input
voltage, and correct the problem. Long-term operation with incorrect input
voltages may permanently damage the power supply. Once the input voltage is
within the supply’s input specifications, this LED will turn off. Refer to the power
supply input specifications.
42 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
OVERTEMPERATURE LED—This red LED gives an early warning of a thermal
shutdown. The LED turns on to indicate that the internal power supply
temperature has exceeded approximately 80 °C. If the internal supply
temperature rises to approximately 90 °C, the supply will shut down. Because of
the many variables involved (ambient temperature, load, thermal conductivity
variations), there is no accurate way of predicting the time between the indication
of overtemperature (LED illuminated) and power supply shutdown.
If this LED is turned on, verify that the fan in the power supply chassis is turning
and is free of dust and other obstructions, and that the temperature around the
power supply is less than 55 °C. If the power supply is cooled down without
delay, it can recover from this situation without shutting down. This LED will turn
off once the internal power supply heatsink temperature falls below
approximately 75 °C.
POWER SUPPLY FAULT LED—This red LED turns on when one of the supply’s
four power converters has shut down. If this LED is on, check for a short circuit
on external devices connected to the control’s power supply. When the short
circuit has been removed, the supply will resume normal operation. If no short
circuit is found, reset the supply by removing input power for one minute. If the
power supply is still not functioning after input power has been restored, verify
that the supply is properly seated to the motherboard connector. If the supply is
properly seated but is not working, then replace the supply.
Is the input power within the range of the control’s power supply input?
Is the input power free of switching noise or transient spikes?
Is the power circuit dedicated to the governor only?
Are the control’s supplies indicating that they are OK?
Are the control’s supplies outputting the correct voltage?
Woodward 43
MicroNet Simplex & MicroNet Plus Manual 26166V1
Chapter 6.
CPUs
The CPU5200 Module can operate in both simplex and redundant modes. Every
MicroNet Plus simplex control contains one CPU module located in the first I/O
slot of the MicroNet chassis. A redundant configuration will also have a CPU
located in the CPU2 location (slot 8 or slot 14 depending on which chassis is
used).
This module was designed and rated for –40 to +85 °C operation in the industrial
marketplace.
For CPU module installation and replacement instructions, see the instructions
for installing and replacing the VME module in Chapter 15, Installation and
Service, and Section 9.4.3—Installation.
The CPU module runs the GAP application program. Figure 6-2 is a block
diagram of a CPU module. When the power is applied, the CPU module will
perform diagnostic tests, before running the application program.
The CPU module contains a battery to power the real time clock when power to
the control is off. This battery is not user-replaceable. During normal operation,
on-board circuitry keeps the battery charged. Once the battery is fully charged
(taking a maximum of three days), the battery will continue to run the clock for a
minimum of three months without power to the control. If power is removed from
the CPU module for longer than three months, the real time clock may need to be
reset. The resolution of the real time clock is 10 milliseconds.
44 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
RESET Pushbutton
RUN / RESET LED
Ethernet Ports
1 and 2
VxWorks Debug
Service Port
CAN Port 1
CAN Port 2
MicroNet VMEbus
DDR SDRAM DDR SDRAM CONTROLLER
(high) (low) VME
DATA (Master/Slave) VDB(31:0) DATA VD(31:0)
BUFFERS CDB(15:0)
DPRAM XCVR
ETH1 (4) RJ45 5k x 32
ETH2 10/100 ETHERNET
RTN1 Channels
1.8V 2.5V 3.3V CTRL
RTN2 VCB(11:0) VC(11:0)
XCVR
VMEbus
RS-232 Debug SLAVE
RS-232 Port
(MINI-DIN6F) Bus Isolation
& XCVR Control
ARBITER
LED DRIVER BTO
SYSCON + STANDBY SYSCON CTRL
SYSCON GR YL STANDBY
Low Voltage (LVCC) MOTOROLA XCVR
WGC
P1
IOLOCK Fault FPGA
LVCC RD RD IOLOCK
Module Fault / Code
MPC5200 REDUNDANCY
FAULT RD RD WDOG Watchdog / HealthFault CONTROLLER
WGC
WGC
RS-232/422/485 RS-232 / 422 / 485 HEALTH MONITOR MONITOR
Isol 5V
1.2V 1.5V 1.8V 2.5V 3.3V
coms, CAN
Woodward 45
MicroNet Simplex & MicroNet Plus Manual 26166V1
6.1.2—Module Configuration
Hardware Configuration. The Module Configuration Switch (S2) must be
configured properly for CPU mode (main rack, address 0x000) operation. This
module will be factory configured appropriately.
Network Type
NETWORK
Switch Function
OFF RTN Network 172.20.x.x
ON RTN Network 10.250.x.x
TYPE
Module Config Module Config
ON
Switches S2 Addr Switch Function
0 000 CPU, MAIN CHASSIS
(open) 1 001 RTN, CHASSIS-X1
2 010 RTN, CHASSIS-X2
3 011 RTN, CHASSIS-X3
OFF 1 2 3 4 LSB 4 100 RTN, CHASSIS-X4
*SWITCH POSITIONS SHOWN AT CPU DEFAULTS 5 101 RTN, CHASSIS-X5
6 110 RTN, CHASSIS-X6
7 111 RTN, CHASSIS-X7
The Network Type setting on all CPU and Remote RTN modules in
the system must match for proper system operation.
46 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Network Configuration Utility (AppManager)
Woodward's AppManager software can be used to load Control software (GAP),
monitor diagnostic faults, and configure Network settings. The AppManager utility
can be downloaded from www.woodward.com/ic/software. A PC connection
must be made to Ethernet #1 (ENET1) using a RJ45 Ethernet cable.
Locate the ControlName on the module faceplate and highlight it in
AppManager.
To VIEW the IP address configuration, select menu option CONTROL -
CONTROL INFORMATION. Look for the Ethernet adapter addresses under
the Footprint Description.
To CHANGE the IP address configuration, select menu option CONTROL -
CHANGE NETWORK SETTINGS.
6.1.4—Module Reset
Front Panel Reset Switch. The CPU module has a pushbutton reset switch on
the front panel to reset the module. If a GAP application was successfully running
at the time of reset, the same application will be auto-started and re-initialized.
Woodward 47
MicroNet Simplex & MicroNet Plus Manual 26166V1
CPU1 and CPU2 Remote Reset. Each CPU module will respond to a +24 V
remote reset signal. The chassis provides a terminal-block with inputs RST1+,
RST1–, RST2+, and RST2– for wiring the remote reset signals to each CPU.
Each reset signal is routed to an opto-isolated input on the appropriate CPU that
requires a +24 V signal to cause a reset.
Reset Notes:
Resetting a CPU or Remote RTN module creates a HealthFault that
immediately sets the WDOG light RED.
Any System running with one healthy CPU. Reset detection will also drive
IOLOCK and IORESET to place the Control System, its expansion racks, and
all output signals into a known failsafe condition.
Redundant Systems running with two healthy CPU's. Reset detection on the
SYSCON (System Controller) causes an immediate "Failover" to the other
STANDBY CPU who then becomes the new System Controller. Reset
detection on the STANDBY unit causes a HealthFault that removes it from
STANDBY mode.
The front-panel RUN/RESET led will be RED while reset is held and will turn
GREEN for a few seconds after releasing reset. After turning OFF, it will again
turn GREEN when the operating system starts to boot.
6.1.6—RTN Ports
Two Real Time Network ports (RJ45) are available to provide communications
between the main chassis CPU's and any Remote RTN modules located in an
expansion chassis. The GAP software application defines the expansion racks,
their I/O modules, and the use of these RTN ports (GAP block is RTN).
For redundant systems, up to (2) Remote RTN modules may be installed into
each expansion chassis. When initialized by the main chassis CPU, the Remote
RTN modules will acquire either a SYSCON or STANDBY status. The Remote
RTN module that becomes SYSCON will control the expansion chassis it is
located in. It will synchronize with the STANDBY Remote RTN module and
perform any redundancy functions as necessary. Input and output data from all
I/O modules will be managed appropriately and made available to the GAP
Application running in the main-chassis CPUs.
48 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
For debug use, a null-modem cable and 5450-1065 Serial Adapter cable (PS2M
to DB9F) is required to attach this port to a PC. This port is to be used by trained
Field Service personnel only!
Shielded cable is required when connecting to the Service Port. Using shielded
cable will help ensure the robustness of the serial communications.
Woodward 49
MicroNet Simplex & MicroNet Plus Manual 26166V1
CAN networks must include 120Ω terminations at each end of the trunk line.
Drop cables connecting a device to the trunk line should be as short as possible
and less than 6 meters. It is recommended to design the network to be less than
100 meters with a max cumulative drop length of less than 39 meters.
Network Speed Max Trunk Length Max Trunk Length Max Drop Max Cumulative
(Thick cable) (Thin cable) Length Drop Length
500 Kbps 100 m 100 m 6m 39 m
250 Kbps 250 m 100 m 6m 78 m
125 Kbps 500 m 100 m 6m 156 m
CAN
Valve Valve Device
M12 to 7/8" Drop Cable
5417-1120 TB TB TB
CAN_L
CAN_R
Termination 7/8" Tee
Thick Pigtail Drop
Cable 5417-1116
or Similar
... Termination
MicroNet Resistor (F)F F 1635-1463 F F F Resistor (male)
1635-1465 1635-1464
Plus M F M F
Thick Trunk Cable
M F M F M F
5417-1113 or Similar
EARTH Ground the overall cable
braid at the cabinet exit point
50 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
*Note: Turck and Lumberg can also provide custom length cordsets with
connectors.
Manufacturer part number Website
Belden 3082A DeviceNet Thick Cable–Grey www.belden.com
Belden 3083A DeviceNet Thick Cable–Yellow www.belden.com
Lapp Cable 2710-250 Unitronic DeviceNet Thick www.lappcable.com
Lumberg STL 613 www.lumbergusa.com
Turck Type 575, DeviceNet Thick Cable – Grey www.turck.com
Woodward 51
MicroNet Simplex & MicroNet Plus Manual 26166V1
A table of the CPU fault LED flash codes is shown below:
The CPU5200L Module can operate in both simplex and redundant modes.
Every MicroNet Plus simplex control contains one CPU module located in the
first I/O slot of the MicroNet chassis. A redundant configuration will also have a
CPU located in the CPU2 location (slot 8 or slot 14 depending on which chassis
is used).
This module was designed and rated for –40 to +85 °C operation in the industrial
marketplace.
52 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
For CPU module installation and replacement instructions, see the instructions
for installing and replacing the VME module in Chapter 15, Installation and
Service, and Section 9.4.3—Installation.
The CPU module runs the GAP application program (corresponding GAP block is
CPU_ML5200). Figure 6-7 is a block diagram of a CPU module. When the power
is applied, the CPU module will perform diagnostic tests, before running the
application program.
The CPU module contains a battery to power the real time clock when power to
the control is off. This battery is not user-replaceable. During normal operation,
on-board circuitry keeps the battery charged. Once the battery is fully charged
(taking a maximum of three days), the battery will continue to run the clock for a
minimum of three months without power to the control. If power is removed from
the CPU module for longer than three months, the real time clock may need to be
reset. The resolution of the real time clock is 10 milliseconds.
RESET Pushbutton
RUN / RESET LED
Ethernet Port
VxWorks Debug
Service Port
CAN Port 1
CAN Status LED’s
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MicroNet Simplex & MicroNet Plus Manual 26166V1
MicroNet VMEbus
DDR SDRAM DDR SDRAM CONTROLLER
(high) (low) VME
DATA (Master/Slave) VDB(31:0) DATA VD(31:0)
BUFFERS CDB(15:0)
DPRAM XCVR
ETH1 (1) RJ45 5k x 32
10/100 ETHERNET
Channels
1.8V 2.5V 3.3V CTRL
VCB(11:0) VC(11:0)
XCVR
VMEbus
RS-232 Debug SLAVE
RS-232 Port
(MINI-DIN6F) Bus Isolation
& XCVR Control
ARBITER
LED DRIVER BTO
SYSCON + STANDBY SYSCON CTRL
SYSCON GR YL STANDBY Low Voltage (LVCC) MOTOROLA XCVR
WGC
P1
IOLOCK Fault FPGA
LVCC RD RD IOLOCK
Module Fault / Code
MPC5200 REDUNDANCY
FAULT RD RD WDOG Watchdog / HealthFault CONTROLLER
WGC
WGC
RS-232/422/485 RS-232 / 422 / 485 HEALTH MONITOR MONITOR
MicroNet VMEbus
RTC with 3.3V
Battery
CAN1 (1) CAN Channels 2.5V
(5-pin, male, round) RESET*
CAN LED’s 2.5V 3.3V 3.3V
#1 GR GR
RD RD #2
2.5v
1.5V
LOCAL PWR
MONITOR 1.2V
VME HotSwap
5.0V_FAIL
Front Panel
Isol 5V
1.2V 1.5V 1.8V 2.5V 3.3V
coms, CAN
6.2.2—Module Configuration
Hardware Configuration. The Module Configuration Switch (S2) must be
configured properly for CPU mode (main rack, address 0x000) operation. This
module will be factory configured appropriately.
Network Type
NETWORK
Switch Function
OFF RTN Network 172.20.x.x
ON RTN Network 10.250.x.x
TYPE
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
Network Type. The Network Type setting is factory set OFF to
automatically configure the RTN communication port IP addresses to the
172.20.x.x series.
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MicroNet Simplex & MicroNet Plus Manual 26166V1
6.2.4—Module Reset
Front Panel Reset Switch. The CPU module has a pushbutton reset switch on
the front panel to reset the module. If a GAP application was successfully running
at the time of reset, the same application will be auto-started and
re-initialized.
CPU1 and CPU2 Remote Reset. Each CPU module will respond to a +24 V
remote reset signal. The chassis provides a terminal-block with inputs RST1+,
RST1–, RST2+, and RST2– for wiring the remote reset signals to each CPU.
Each reset signal is routed to an opto-isolated input on the appropriate CPU that
requires a +24 V signal to cause a reset.
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
Reset Notes:
Resetting a CPU or Remote RTN module creates a HealthFault that
immediately sets the WDOG light RED.
Any System running with one healthy CPU. Reset detection will also drive
IOLOCK and IORESET to place the Control System, its expansion racks, and
all output signals into a known failsafe condition.
Redundant Systems running with two healthy CPU's. Reset detection on the
SYSCON (System Controller) causes an immediate "Failover" to the other
STANDBY CPU who then becomes the new System Controller. Reset
detection on the STANDBY unit causes a HealthFault that removes it from
STANDBY mode.
The front-panel RUN/RESET led will be RED while reset is held and will turn
GREEN for a few seconds after releasing reset. After turning OFF, it will again
turn GREEN when the operating system starts to boot.
6.2.6—RTN Ports
Expansion racks and Real Time Network functions are not supported on the
CPU5200L module.
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MicroNet Simplex & MicroNet Plus Manual 26166V1
For debug use, a null-modem cable and 5450-1065 Serial Adapter cable (PS2M
to DB9F) is required to attach this port to a PC. This port is to be used by trained
Field Service personnel only!
Shielded cable is required when connecting to the Service Port. Using shielded
cable will help ensure the robustness of the serial communications.
CAN networks must include 120Ω terminations at each end of the trunk line.
Drop cables connecting a device to the trunk line should be as short as possible
and less than 6 meters. It is recommended to design the network to be less than
100 meters with a max cumulative drop length of less than 39 meters.
Network Speed Max Trunk Length Max Trunk Length Max Drop Max Cumulative
(Thick cable) (Thin cable) Length Drop Length
500 Kbps 100 m 100 m 6m 39 m
250 Kbps 250 m 100 m 6m 78 m
125 Kbps 500 m 100 m 6m 156 m
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
CAN
Valve Valve Device
M12 to 7/8" Drop Cable
5417-1120 TB TB TB
...
CAN_L
Thick Pigtail Drop
CAN_R
Cable 5417-1116
Termination 7/8" Tee or Similar Termination
MicroNet Resistor (F)F F 1635-1463 F F F Resistor (male)
1635-1465 1635-1464
Plus M F M F
Thick Trunk Cable
M F M F M F
5417-1113 or Similar
EARTH Ground the overall cable
braid at the cabinet exit point
*Note: Turck and Lumberg can also provide custom length cordsets with connectors.
Manufacturer part number Website
Belden 3082A DeviceNet Thick Cable–Grey www.belden.com
Belden 3083A DeviceNet Thick Cable–Yellow www.belden.com
Lapp Cable 2710-250 Unitronic DeviceNet Thick www.lappcable.com
Lumberg STL 613 www.lumbergusa.com
Turck Type 575, DeviceNet Thick Cable – Grey www.turck.com
Woodward 59
MicroNet Simplex & MicroNet Plus Manual 26166V1
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
KEYBOARD
MOUSE
ETHERNET
COM 1
COM 2
VGA
Every Simplex MicroNet™ control contains one CPU module located in the first
slot of the MicroNet chassis. The description of the CPU module contained in this
section is the Windows NT® CPU.
For CPU module installation and replacement instructions, see the instructions
for installing and replacing the VME module in Chapter 15, Installation and
Replacement Procedures.
The NT CPU module runs the application program. Figure 6-12 is a block
diagram of the NT CPU Module. It supports Windows NT with real-time
extensions to maintain a rigorous real-time environment. NT functions are not
documented in this manual. Please refer to the applicable Microsoft Windows NT
manual if necessary.
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MicroNet Simplex & MicroNet Plus Manual 26166V1
There is a solid state Hard-Drive (FDOC Fixed Disk on Chip), on the module
which uses the standard Windows file system. The hard-drive has the Windows
NT Operating System with the real-time extensions and the application program.
The CPU has a standard interface to the VME bus to read and write to I/O
modules
Do not plug or unplug any non-isolated device directly into the CPU
during execution of the application. Refer to the NT CPU Interface
Connections section of this chapter for more details on interface
requirements.
The PS/2 ports are non-isolated. A shielded cable and the Video Interface FTM
are required to avoid susceptibility to EMI noise and ground loops related to PC
connections and typical industrial environments. See the Video Interface FTM
section for more details.
1 DATA
2 n/c
3 Signal Common
4 +5 V
5 CLOCK
6 n/c
Shield Chassis GND
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MicroNet Simplex & MicroNet Plus Manual 26166V1
To ensure signal integrity and robust operation of Ethernet devices, an Ethernet
Interface FTM (Field Termination Module) is required when using this port. Its
primary function is to implement EMI shielding and cable shield termination of the
Ethernet cable. Along with the Ethernet Interface FTM, double shielded Ethernet
cables (SSTP) are required for customer installations. See the Ethernet Interface
FTM section for more details.
1 TX+
2 TX-
3 RX+
4 n/c
5 n/c
6 RX-
7 n/c
8 n/c
Shield Chassis GND
These communication ports are non-isolated. Shielded cable and a Serial Port
Isolator/ Converter are required when using this port to avoid susceptibility to EMI
noise and ground loops related to PC connections and typical industrial
environments. The following standard options are available:
RS-232–RS-232 Isolator
RS-232–RS-485 Isolator/Converter
RS-232–RS-422 Isolator/Converter
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
Connector Signal Mnemonic
DB9M Shielded DB9 male
connector
1 DCD
2 RX
3 TX
4 DTR
5 Signal Common
6 DSR
7 RTS
8 CTS
9 RI
Shield Chassis GND
The USB port may be used in the future with a custom interface FTM which
provides EMI shielding, cable shield termination, and power supply isolation of
the USB power bus.
6.3.8—Parallel Port
The parallel port is not currently supported on this CPU due to the lack of driver
support in the operating system.
The parallel port may be used in the future to communicate with many parallel
port devices including printers, Zip drives, and CD-ROMs.
Use of the LPT1 and USB ports is not ALLOWED. CPU FAILURE may
result.
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MicroNet Simplex & MicroNet Plus Manual 26166V1
Connector Signal Mnemonic
DB25F Shielded DB25 female
receptacle (DB25F)
1 /STROBE
2 D0
3 D1
4 D2
5 D3
6 D4
7 D5
8 D6
9 D7
10 D8
11 BUSY
12 PE
13 SEL
14 /AUTOFD
15 /ERROR
16 /INIT
17 /SELIN
18 GND
19 GND
20 GND
21 GND
22 GND
23 GND
24 GND
25 GND
Shield Chassis GND
6.3.9—XVGA Video
The CPU has a standard analog video port which is available for service use.
The video interface supports 24 bit true color modes and is capable of 1280 x
1024 max resolution.
The video port is non-isolated. A shielded cable and the Video Interface FTM are
required to avoid susceptibility to EMI noise and ground loops related to PC
connections and typical industrial environments. See the Video Interface FTM
section for more details.
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
Connector Signal Mnemonic
Connector Shielded high density DB15
female receptacle (HD
DB15F)
1 RED
2 GREEN
3 BLUE
4 DDC.ID2
5 Signal Common
6 Red GND
7 Green GND
8 Blue GND
9 KEY
10 Synch GND
11 DDC.ID0
12 DDC.ID1
13 HSYNC
14 VSYNC
15 DDC.CLK
Shield Chassis GND
6.3.11—Installation
To set the Local IP Address, you must have a local monitor, keyboard, and
mouse. Push Start-Settings-Control Panel and double click the Network icon.
Select Protocols-properties and click the Specify and IP Address box, then enter
valid data on the IP Address, SubNet Mask, and Default Gateway.
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Micro
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x & MicroNett Plus Manual 26166V1
4. Double click the displayed “Name” and connect to the Windows NT
D N CPU by
e
entering the Logon
L of “ServviceUser” with
h the passwoord “ServiceUsser”.
5. A window con nnected to thee Windows NT T CPU will be
e opened. Norrmal file
t
transactions may
m now be performed.
p
Creatte the applicattion.exe and the
t applicatioon.rtss (a matched set) on the
prograamming work kstation by using the GAP™ ™ and Coder. Copy the filee set to the
Windoows NT CPU.
The
T application can be sttarted autommatically uponn power-up ofo the
CPU
C by placing a shortcu
ut to the application.exe in the start-u
up path
on
o the Windoows NT CPU..
6.3.1
12—Transfferring File
es from a Workstation
W n to the NT
T CPU
Transsferring files frrom a worksta
ation to the Windows
W NT CPU
C can be
accommplished with the App Man nager Utility Software.
S
6.3.1
13—MicroP
Panel Service Tool
MicroPanel is a 200-line service tool
t for MicroNet Windowss NT CPU mo odule.
MicroPanel allows access to control variables for monitoriing and tuning
g both
locallyy and remotely through an established Windows
W NT network. See e Figure
4-3.
Figure 6-13
3—MicroPane
el Display Scrreen
68 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
The window title indicates either a local connection or the computer name of the
MicroNet NT CPU to which the MicroPanel is connected.
Display Lines
There are 20 display lines on the left-hand side of the MicroPanel screen.
Button Functions
The buttons on the screen expose all the service functions of the MicroPanel.
With the exception of the ‘Fast’ and ‘Slow’ buttons, all buttons will repeat while
they are held down. The ‘Fast’ and ‘Slow’ buttons have mutually exclusive toggle
functionality.
Navigation Button
The large, diamond shaped button in the center of the screen allows navigation
through the application. Each corner of the button represents a direction of
navigation, up, down, left and right.
Numeric Buttons
The numbers 0 through 9, unary negation, and a decimal point are represented
by the numeric buttons. The ‘0’ and ‘1’ double as ‘NO’ and ‘YES’ buttons and are
labeled appropriately. In addition, the ‘7’ and ‘8’ provide ‘previous’ and ‘next’
alphabetical category functionality in debug mode.
Adjust Buttons
The ‘Fast’ and ‘Slow’ buttons have a special functionality. They operate as
mutually exclusive toggle buttons and select the adjust mode: fast, normal, or
slow. The up and down arrow shaped buttons allow adjustment up or down.
Command Buttons
The ‘Enter’, ‘Exit’ and ‘Serv/Debug’ buttons have specific functionality depending
on the current service mode.
Keyboard
All functions of MicroPanel can be accessed from the keyboard.
Keys Button Functions
Arrow Direction navigation
‘0’ – ‘9’ Numeric
‘0’ and ‘1’ ‘NO’ and ‘YES’
‘7’ and ‘8’ Previous and next alphabetical category
‘Page Up’ and ‘Page Down’ Line up and line down
‘Shift’ Fast toggle
‘Ctrl’ Slow toggle
‘Insert’ and ‘Delete’ Adjust up and adjust down
‘Enter’ Enter command
‘Esc’ Exit command
‘:’ Serv/Debug selection
In addition, the keyboard can be used as the sole means of input into the
Windows NT operating system. See the Windows NT help for more information.
Mouse
All functions of MicroPanel are available to the mouse through the buttons on the
MicroPanel display. Use the mouse cursor and LEFT click to activate the buttons.
Woodward 69
Micro
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x & MicroNett Plus Manual 26166V1
The mouse
m also ha
as special funnctionality wheen used within the display line area.
Left click
c to set the
e currently sellected displayy line and righ
ht click to acce
ess the
Brancch To dialog.
Touch Screen
If your MicroNet CP PU is configuured with a tou
uch screen deevice, all MicrroPanel
functio
onality is available through uch screen emulates
h the touch sccreen. The tou
the mouse
m and all mouse functions are availa able.
Pipes
s
MicroPanel commu unicates with the control application thro
ough named--shared
pipes. If no open pipes
p are available MicroPa anel cannot connect
c and will
w
termin
nate.
Locall Connection n
al connection is a connectiion through th
A loca he memory off the NT opera ating
system
m on the sam me machine. NoN networking g is necessary for a local connection.
c
Multip
ple instances of MicroPane el can be used
d as long as there
t are avaailable
pipes in the control application.
—Local Conn
Figure 6-14— nection Dialog
g Box
70 Woodward
Manual 26
6166V1 MicroNett Simplex & MicroNet
M Plu
us
Do not plu
ug or unplugg any non-isoolated devicee directly into
o the CPU
during exe
ecution of th
he application. Refer to th
he NT CPU In nterface
Connectioons section of
o this chapter for more details
d on intterface
requiremeents.
6.3.14—Installation
In any installatio
on with long cable
c runs, it is possible thhat the local ground
g
co
onnections at either end of the cable are e at different voltages.
v Youu can see thiss
byy grounding a long cable att one end and d measuring the t voltage level between
thee far end of th
he cable and a ground con nnection nearby. You can think t of the
tw
wo ground con t positive and negative connections
nnections as the c o a battery. Iff
of
booth ends of a cable
c shield are
a coupled directly
d to thesse local grounnd
co
onnections, it is possible too establish a ground
g loop, which
w looks ju
ust like an
ele
ectrical short across the teerminals of the e battery. Dep pending on th he particular
loc
cal conditionss, it possible that
t significan
nt and potentia ally hazardou us electrical
cu
urrents could beb flowing on the cable shield. To preve ent these grou und loops, it is
i
reccommended that one end of the cable shield s be tied to its' local ground and the e
othher end be co onnected to itts local ground d through a capacitor.
c Thiss will break
thee ground loop p.
Woodward
d 7
71
MicroNet Simplex & MicroNet Plus Manual 26166V1
The Windows NT CPU has a built in 10/100 BaseT connector on the front of the
CPU. To connect a workstation PC to the Windows NT CPU, connect a cable
from the workstation to the CPU through a network hub. This hub performs a
cross-over function as well as allowing many networked devices to be connected
together.
72 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
ETHERNET #2
KEYBOARD
MOUSE
ETHERNET #1
COM 1
COM 2
VGA
Every Simplex MicroNet control contains one CPU module located in the first slot
of the MicroNet chassis. The description of the CPU module contained in this
chapter is the Windows NT® CPU with Dual Ethernet.
For CPU module installation and replacement instructions, see the instructions
for installing and replacing the VME module in Chapter 15, Installation and
Replacement Procedures.
Woodward 73
MicroNet Simplex & MicroNet Plus Manual 26166V1
The NT CPU module runs the application program. Figure 6-18 is a block
diagram of the NT CPU Module. This module is a standard PC on a VME card. It
supports Windows NT with real-time extensions to maintain a rigorous real-time
environment. NT functions are not re-documented in this manual. Please refer to
the applicable Microsoft Windows NT manual if necessary.
There is a solid state Hard-Drive on the module which uses the standard
Windows file system. The hard-drive has Windows NT Operating System with the
real-time extensions and the Application program. It has a standard interface to
the VME bus to read and write to I/O modules
Do not plug or unplug any non-isolated device directly into the CPU
during execution of the application. Refer to the NT CPU Interface
Connections section of this chapter for more details on interface
requirements.
The PS/2 ports are non-isolated. A shielded cable and the Video Interface FTM
are required to avoid susceptibility to EMI noise and ground loops related to PC
connections and typical industrial environments. See the Video Interface FTM
section for more details.
1 DATA
2 n/c
3 Signal Common
4 +5 V
5 CLOCK
6 n/c
Shield Chassis GND
Woodward 75
MicroNet Simplex & MicroNet Plus Manual 26166V1
To ensure signal integrity and robust operation of Ethernet devices, an Ethernet
Interface FTM (Field Termination Module) is required when using this port. Its
primary function is to implement EMI shielding and cable shield termination of the
Ethernet cable. Along with the Ethernet Interface FTM, double shielded Ethernet
cables (SSTP) are required for customer installations. See the Ethernet Interface
FTM section for more details.
1 TX+
2 TX-
3 RX+
4 n/c
5 n/c
6 RX-
7 n/c
8 n/c
Shield Chassis GND
76 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Connector Signal Mnemonic
Mini-Din 6F Shielded RJ45 female
receptacle
1 TX+
2 TX-
3 RX+
4 n/c
5 n/c
6 RX-
7 n/c
8 n/c
Shield Chassis GND
These communication ports are non-isolated. Shielded cable and a Serial Port
Isolator/ Converter are required when using this port to avoid susceptibility to EMI
noise and ground loops related to PC connections and typical industrial
environments. The following standard options are available:
RS-232–RS-232 Isolator
RS-232–RS-485 Isolator/Converter
RS-232–RS-422 Isolator/Converter
Woodward 77
MicroNet Simplex & MicroNet Plus Manual 26166V1
Connector Signal Mnemonic
DB9M Shielded DB9 male
connector
1 DCD
2 RX
3 TX
4 DTR
5 Signal Common
6 DSR
7 RTS
8 CTS
9 RI
Shield Chassis GND
The USB port may be used in the future with a custom interface FTM which
provides EMI shielding, cable shield termination, and power supply isolation of
the USB power bus.
6.4.9—Parallel Port
The parallel port is not currently supported on this CPU due to the lack of driver
support in the operating system.
The parallel port may be used in the future to communicate with many parallel
port devices including printers, zip drives, and CD-ROMs.
Use of the LPT1 and USB ports is not ALLOWED. CPU failure may
result.
78 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
Connector Signal Mnemonic
DB25F Shielded DB25 female
receptacle (DB25F)
1 /STROBE
2 D0
3 D1
4 D2
5 D3
6 D4
7 D5
8 D6
9 D7
10 D8
11 BUSY
12 PE
13 SEL
14 /AUTOFD
15 /ERROR
16 /INIT
17 /SELIN
18 GND
19 GND
20 GND
21 GND
22 GND
23 GND
24 GND
25 GND
Shield Chassis GND
6.4.10—XVGA Video
The CPU has a standard analog video port which is available for service use.
The video interface supports 24 bit true color modes and is capable of 1280 x
1024 max resolution.
The video port is non-isolated. A shielded cable and the Video Interface FTM are
required to avoid susceptibility to EMI noise and ground loops related to PC
connections and typical industrial environments. See the Video Interface FTM
section for more details.
Woodward 79
MicroNet Simplex & MicroNet Plus Manual 26166V1
Connector Signal Mnemonic
Connector Shielded high density DB15
female receptacle (HD
DB15F)
1 RED
2 GREEN
3 BLUE
4 DDC.ID2
5 Signal Common
6 Red GND
7 Green GND
8 Blue GND
9 KEY
10 Synch GND
11 DDC.ID0
12 DDC.ID1
13 HSYNC
14 VSYNC
15 DDC.CLK
Shield Chassis GND
6.4.12—Installation
To set the Local IP Address, you must have a local monitor, keyboard, and
mouse. Push Start-Settings-Control Panel and double click the Network icon.
Select Protocols-properties and click the Specify and IP Address box, then enter
valid data on the IP Address, SubNet Mask, and Default Gateway.
80 Woodward
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6166V1 MicroNett Simplex & MicroNet
M Plu
us
4. Double clicck the displayyed “Name” and
a connect to o the Windowws NT CPU byy
entering th
he Logon of “S ServiceUser” with the passsword “ServicceUser”.
5. A window connected to o the Windowss NT CPU willl be opened. Normal file
transaction
ns may now be b performed.
Crreate the application.exe and
a the appliccation.rtss (a matched
m set) on the
proogramming workstation
w byy using the GAAP and Codeer. Copy the file set to the
Windows NT CPU.
The applic
cation can bee started auttomatically upon
u power-uup of the
CPU by pllacing a shorrtcut to the application.e
a exe in the sta
art-up path
on the Win
ndows NT CPU.
6.4.13—Tran
nsferring Files
F from a Workstattion to the NT CPU
Trransferring file
es from a worrkstation to the Windows NT
N CPU can be
b
ac
ccomplished withw App Manager Utility Software.
6.4.14—MicrroPanel Se
ervice Tool
MiicroPanel is a 20-line serviice tool for MiicroNet Windo
ows NT CPU module.
MiicroPanel allo
ows access too control varia ables for monitoring and tuning both
loc
cally and remotely throughh an established Windows NT network. See Figure
4-9
9.
Figure 6-19—MicroP
6 Panel Display Screen
Woodward
d 8
81
MicroNet Simplex & MicroNet Plus Manual 26166V1
The window title indicates either a local connection or the computer name of the
MicroNet NT CPU to which the MicroPanel is connected.
Display Lines
There are 20 display lines on the left-hand side of the MicroPanel screen.
Button Functions
The buttons on the screen expose all the service functions of the MicroPanel.
With the exception of the ‘Fast’ and ‘Slow’ buttons, all buttons will repeat while
they are held down. The ‘Fast’ and ‘Slow’ buttons have a mutually exclusive
toggle functionality.
Navigation Button
The large, diamond shaped button in the center of the screen allows navigation
through the application. Each corner of the button represents a direction of
navigation, up, down, left and right.
Numeric Buttons
The numbers 0 through 9, unary negation, and a decimal point are represented
by the numeric buttons. The ‘0’ and ‘1’ double as ‘NO’ and ‘YES’ buttons and are
labeled appropriately. In addition, the ‘7’ and ‘8’ provide ‘previous’ and ‘next’
alphabetical category functionality in debug mode.
Adjust Buttons
The ‘Fast’ and ‘Slow’ buttons have a special functionality. They operate as
mutually exclusive toggle buttons and select the adjust mode: fast, normal, or
slow. The up and down arrow shaped buttons allow adjustment up or down.
Command Buttons
The ‘Enter’, ‘Exit’ and ‘Serv/Debug’ buttons have specific functionality depending
on the current service mode.
Keyboard
All functions of MicroPanel can be accessed from the keyboard.
Keys Button Functions
Arrow Direction navigation
‘0’ – ‘9’ Numeric
‘0’ and ‘1’ ‘NO’ and ‘YES’
‘7’ and ‘8’ Previous and next alphabetical category
‘Page Up’ and ‘Page Down’ Line up and line down
‘Shift’ Fast toggle
‘Ctrl’ Slow toggle
‘Insert’ and ‘Delete’ Adjust up and adjust down
‘Enter’ Enter command
‘Esc’ Exit command
‘:’ Serv/Debug selection
In addition, the keyboard can be used as the sole means of input into the
Windows NT operating system. See the Windows NT help for more information.
Mouse
All functions of MicroPanel are available to the mouse through the buttons on the
MicroPanel display. Use the mouse cursor and right click to activate the buttons.
The mouse also has special functionality when used within the display line area.
Left click to set the currently selected display line and right click to access the
Branch To dialog.
82 Woodward
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6166V1 MicroNett Simplex & MicroNet
M Plu
us
Toouch Screen
If your
y MicroNe et CPU is conffigured with a touch screenn device, all MicroPanel
M
funnctionality is available
a thro
ough the touch e touch screen emulates
h screen. The
thee mouse and all mouse fun nctions are avvailable.
Pipes
MiicroPanel commmunicates with
w the contro ol application through nam
med-shared
pip
pes. If no ope
en pipes are available
a MicrroPanel canno ot connect an
nd will
terrminate.
Se
ee the GAP help for inform
mation on how
w to add pipess to a GAP ap
pplication.
ocal Connecttion
Lo
A local connecttion is a connection througgh the memoryy of the NT operating
sy
ystem on the same
s machine. No networrking is necesssary for a loccal connection
n.
Muultiple instancces of MicroPPanel can be used
u as long as there are available
a
pip
pes in the con ntrol applicatio
on.
Figure 6--20—Local Co
onnection Dia
alog Box
Woodward
d 8
83
Micro
oNet Simplex
x & MicroNett Plus Manual 26166V1
Figure
F 6-21—
—Remote Con
nnection Dialo
og Box
Live
L insertion
n of the NT CPU
C is allowe
ed. It is not recommende
r ed to
plug/
p unplug the monitor, keyboard, or
o mouse du uring execution of
the applicatio
on.
Do
D not plug or
o unplug an ny non-isolateed device directly into th
he CPU
during
d execu
ution of the application.
a R
Refer to the NT
N CPU Interrface
Connections
C section of th
his chapter for
f more deta ails on interfface
requirements
r s.
6.4.1
15—Installa
ation
In anyy installation with
w long cable runs, it is possible
p that the
t local ground
conne ections at eith her end of the ages. You can see this
e cable are at different volta
easilyy by grounding g a long cable e at one end and measurin ng the voltage e level
betwe een the far en nd of the cable e and a grounnd connection n nearby. You u can think
of the
e two ground connections
c a the positive
as e and negativve connection ns of a
batterry. If both end ds of a cable shield
s are couupled directly to these locaal ground
conne ections, it is possible
p to esttablish a grou
und loop, whicch looks just like
l an
electrrical short across the terminals of the ba attery. Depending on the particular
p
local conditions,
c it possible that significant annd potentially hazardous electrical
currennts could be flowing
f on thee cable shieldd. To prevent these
t groundd loops, it is
recommmended thatt one end of the t cable shie eld be tied to its' local ground and the
other end be conne ected to its lo
ocal ground thhrough a capa acitor. This wiill break
the grround loop.
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The Windows NT CPU has a built in 10/100 BaseT connector on the front of the
CPU. To connect a workstation PC to the Windows NT CPU, connect a cable
from the workstation to the CPU through a network hub. This hub performs a
cross-over function as well as allowing many networked devices to be connected
together. (See Chapter 13 for more information.)
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6.5—
—040 CPU
U Module (Motorola 68040)
6.5.1
1—Module Descriptio
on
Figure
e 6-23—040 CPU
C Module
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Every Simplex MicroNet control contains one CPU module located in the first I/O
slot of the MicroNet chassis.
For CPU module installation and replacement instructions, see the instructions
for installing and replacing the VME module in Chapter 15, Installation and
Service.
The CPU module runs the application program. Figure 6-25 is a block diagram of
a CPU module. When the reset switch is toggled to the Run position, the CPU
module will perform diagnostic tests, then run the application program.
The CPU module contains a battery to power the real time clock when power to
the control is off. This battery is not user-replaceable. During normal operation,
on-board circuitry keeps the battery charged. Once the battery is fully charged
(taking a maximum of three days), the battery will continue to run the clock for a
minimum of three months without power to the control. If power is removed from
the CPU module for longer than three months, the real time clock may need to be
reset. The resolution of the real time clock is 10 milliseconds.
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6.5.3—FTM Reference
Refer to Appendix A to determine the appropriate FTM selection for your CPU.
Specific installation and application information can be found in Chapter 13.
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If during diagnostics, a particular test fails, testing stops and a message
identifying the cause of the failure will be displayed. Also, the FAILED LED on the
CPU module will periodically repeat bursts of flashes; the number of flashes in
each burst indicates the test that failed as shown in Table 6-19.
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A failure of any one of the on-line tests results in the I/O lock being asserted and
display of a message as shown in Table 6-21. The message will be displayed on
the Service Panel at the time the error occurs, and it also will go into the Fault
Mode Buffer so that it can be displayed in the Fault Mode.
MESSAGE MEANING
Checksum Error Local RAM Failed
System Error (#) Application RAM Failed (ref. Table 6-23)
EEPROM Fault FPU C0-processor Failed
Math Exception The FPU (Co-processor) has received an illegal instruction
Rate Group Slip (#) Rate group # (number) is scheduled to run and it did not complete
its previous scheduled run.
EEPROM Initialization Fault The CPU attempted to program the EEPROMs during system
initialization and failed, or the EEPROM was detected bad
(EEPROM FAULT). The system is not permitted to run because
the EEPROM data is not current.
Exception Error Vector # An error was detected by the processor. The vector number
indicates which exception the 68040 processor took. For an
explanation of exceptions, refer to page 8-5 of Motorola Manual
M 68040 UM/AD, MC68040 Enhanced 32-bit Microprocessor
Users Manual.
If the application is using the NV_LOG block, the CPU module must
have the large EEPROM option installed.
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NUMBER SYS. FILE MEANING
OPER.
1 CREATE Cannot create task with priority less than one.
2 CREATE Stack size requested is smaller than the minimum size.
3 NEWPID The priority is greater than the maximum allowed.
4 NEWPID The rate group Proctab entry is not free.
5 NEWPID All the Proctab entries are full.
6 GETMEM Tried to get a (zero-byte) block of memory.
7 GETMEM No memory available.
8 GETMEM Not enough memory available for block size requested.
9 FREEMEM Returned a (zero-byte) block of memory.
10 FREEMEM Returned a block of memory outside of heap boundaries.
11 FREEMEM Unable to return the block of memory
12 NEWSEM No semaphores available.
13 SUSPEND Cannot suspend a task that is not current or ready.
14 SCOUNT The semaphore number is invalid.
15 SCOUNT The semaphore number passed in is undefined.
16 SCREATE The initial count is smaller than zero.
17 SIGNAL The semaphore number is invalid.
18 SIGNAL The semaphore number passed in is undefined.
19 SIGNALN The semaphore number is invalid.
20 SIGNALN The semaphore number passed in is undefined.
21 SIGNALN Must signal semaphore one or more times.
22 SRESET The semaphore number is invalid.
23 SRESET The semaphore number passed in is undefined.
24 RESET Must set semaphore to zero or larger.
25 WAIT The semaphore number is invalid.
26 WAIT The semaphore number passed in is undefined.
The ALARMS in Tables 6-24 and 6-25 do not automatically display; they are
stored by the system and to see them, you must use the OPSYS_FAULTS Mode
of the Service Panel.
MESSAGE MEANING
SIO n Configuration Fails A configuration error occurred on Port n of SIO x module.
port x n (1-…) = SIO number
x (1-4) = port number
SIO n Missing SIO n module is not installed.
n (1-…) = SIO number
SIO n Self Test Failed SIO n module failed its self test.
n (1-…) = SIO number
SIO n Initialization Failed SIO n module failed to initialize.
n (1-…) = SIO number
System Alarm # n A numbered system alarm has occurred. The number of the alarm is n
(see Table 20-8, Numbered System Alarms).
Divide by Zero A divide by zero operation was performed.
Real to Int Conversion An Overflow has occurred during a Real-to-integer conversion
Overflow operation.
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NUMBER OPER SYS. MEANING
FILE
1 CLOSE The device number is invalid.
2 C0NTROL The device number is invalid.
3 GETC The device number is invalid.
4 INIT The device number is invalid.
5 OPEN The device number is invalid.
6 PUTC The device number is invalid.
7 READ The device number is invalid.
8 RECVTIM The time passed inn was less than zero.
9 SEND The PID number is invalid.
10 SEND Cannot send message to undefined task.
11 SEND Process has message pending.
12 SENDF The PID number is invalid.
13 SENDF Cannot send message to undefined task.
14 WRITE The device number is invalid.
15 IOERR The function is not implemented for this device.
16 TTYCNTL Baud rate invalid.
17 TTYCNTL Mode (line/char) invalid.
18 TTYCNTL Function invalid.
19 TTYREAD Attempt to read fewer than zero characters.
20 TTYWRITE Attempt to write fewer than zero characters.
21 ICCCNTL Function invalid.
22 ICCINIT Too many SIO modules are defined.
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Chapter 7.
Communication
The Remote RTN module contains a Motorola MPC5200 processor, 128 Mbyte
DDR RAM, 64 MB of flash memory, a Real Time clock, and various
communication peripherals. These peripherals include (2) Real Time Network
ports and (1) service port. This module includes an FPGA to provide VMEbus
master/slave capability, health monitoring, and failover functions necessary for
redundant systems.
Remote RTN modules can support both simplex and redundant systems. Every
RTN expansion chassis contains one Remote RTN module located in the first
slot (CPU1) of the MicroNet chassis. A redundant configuration will also have a
Remote RTN module located in the CPU2 location (slot 8 or slot 14 depending
on the chassis used).
This module was designed and rated for –40 to +85 °C operation in the industrial
marketplace.
For Remote RTN module installation and replacement instructions, see the
instructions for installing and replacing the VME module in Chapter 15,
Installation and Service, and Section 9.4.3—Installation. This module will NOT
automatically re-initialize to a running state after reset, but the main-chassis
CPU application can re-init this module upon request.
Operation
For redundant systems, up to (2) Remote RTN modules may be installed into
each expansion chassis. When initialized by the main chassis CPU, the Remote
RTN modules will acquire either a SYSCON or STANDBY status. The Remote
RTN module that becomes SYSCON will control the expansion chassis it is
located in. It will synchronize with the STANDBY Remote RTN module and
perform any redundancy functions as necessary. Input and output data from all
I/O modules will be managed appropriately and made available to the GAP
Application running in the main-chassis CPUs.
The Remote RTN module communicates with the I/O modules in the expansion
chassis, and also communicates with the CPU modules in the main chassis. Figure 7-3
is a block diagram of a Remote RTN module. When the power is applied, the Remote
RTN module will perform diagnostic tests, before beginning communications.
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System Redundancy options using Remote RTN modules (Full, Partial, and
Simplex)
CPU and Remote RTN modules for Main and Expansion racks
Redundancy Option Main Rack Optional Exp Optional Exp #1…7
#1..7
Full Redundancy Redundant CPU's Redundant RTNs Redundant RTNs
- Partial Redundancy Redundant CPU's Redundant RTNs Single RTN
- Partial Redundancy Redundant CPU's Single RTN Redundant RTNs
- Partial Redundancy Redundant CPU's Single RTN Single RTN
Simplex Single CPU Single RTN Single RTN
NOTE—See Chapters 2 and 3 for additional system diagrams.
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7.1.3—Module Configuration
Network Configuration. No network configuration is required. Only the RTN
ports are active on this module. Ethernet ports (ENET1, ENET2) are disabled on
the Remote RTN module by the Module Config switch (S2) and no IP address
configuration is necessary.
RTN Mode. The Module Config Switch (S2) is factory configured for RTN
mode, expansion rack X1 operation (address 0x001). The Remote RTN
module may be re-configured to as needed to operate as expansion chassis
1-7. Note: RTN mode will disable Ethernet ports 1 and 2.
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The Network Type setting on all CPU and Remote RTN modules in
the system must match for proper system operation.
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7.1.5—Module Reset
Front Panel Reset Switch. The Remote RTN module incorporates a pushbutton
reset switch on the front panel to reset the module. This module will NOT
automatically re-initialize to a running state after reset. The main-chassis CPU
application can re-init this module upon request.
RTN1 and RTN2 Remote Reset. Each Remote RTN module will respond to a
+24 V remote reset signal. The chassis provides a terminal-block with inputs
RST1+, RST1-, RST2+, and RST2- for wiring the remote reset signals to each
RTN. Each reset signal is routed to an opto-isolated input on the appropriate
RTN that requires a +24 V signal to cause a reset.
Reset Notes:
Resetting a CPU or Remote RTN module creates a HealthFault that
immediately sets the WDOG light RED.
Any Expansion chassis running with one healthy RTN. Reset detection will
also drive IOLOCK and IORESET to place the expansion rack and all output
signals into a known failsafe condition.
Any Expansion chassis running with two healthy RTNs. Reset detection on
the SYSCON (System Controller) causes an immediate "Failover" to the
other STANDBY RTN who then becomes the new System Controller for this
chassis. Reset detection on the STANDBY unit causes a HealthFault that
removes it from STANDBY mode.
The front-panel RUN/RESET led will be RED while reset is held and will turn
GREEN for a few seconds after releasing reset. After turning OFF, it will
again turn GREEN when the operating system starts to boot.
7.1.6—RTN Ports
Two Real Time Network ports (RJ45) provide communications between the
expansion chassis Remote RTN modules and the main-chassis CPU modules.
Through these ports, expansion chassis I/O data is made available to the GAP
Application running in the main-chassis CPUs.
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Due to the critical nature of communications with an RTN expansion rack, it is
required to use Woodward approved copper and fiber Ethernet switches for
robust system operation. At the time of this writing, the following hardware part
numbers are approved.
Configuration Notes:
- A combination of approved copper and fiber optic Ethernet switches are
allowed.
- A maximum of 4 switches and 1 fiber cable delay shall be allowed in any
communication path.
- RTN cables from the main CPU rack to the local RTN switch hardware shall be
3m (10' max).
Fiber Optic Expansion: Using fiber optic cables and switches, each
expansion rack may be located up to 2Km away from the main CPU
chassis.
For debug use, a null-modem cable and 5450-1065 Serial Adapter cable (PS2M
to DB9F) is required to attach this port to a PC. This port is to be used by trained
Field Service personnel only!
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MicroNet Simplex & MicroNet Plus Manual 26166V1
Shielded cable is required when connecting to the Remote RTN module’s serial port.
Using shielded cable will help ensure the robustness of the serial communications.
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7.2.2—Module Specification
Parallel Interface: High-speed, differential line drivers
operating at VME transmission rate
Cable Interface: 100 pin metal shell Micro-D connector (2
per module)
7.2.3—Installation
The Main XCVR module can be installed in any slot in the Main Chassis.
No jumpers are used to configure this module.
This Transceiver module has no switches or LEDs.
7.2.4—Troubleshooting
1. If the Main XCVR module is not functioning or not functioning properly, verify
cable connections.
2. If the module is still not functioning properly after verifying the cable
connections, replace the cables connecting to module.
3. If the module is still not functioning properly after replacing cables, replace
the module.
The Remote XCVR module connects to the VME bus of the chassis. The bus
receiver/driver of the Remote Transceiver module interfaces with the VME bus,
exchanging control, data, and address information. The chassis decoder
determines if this chassis is to be accessed, and if so, it activates the
receiver/driver of this chassis' Remote Transceiver module to receive or send
information. Figure 7-11 is a block diagram of the Remote Transceiver module.
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Table 7-1 shows the jumpers on the Remote XCVR module used to configure the
chassis ID.
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MicroNet Simplex & MicroNet Plus Manual 26166V1
7.3.2—Module Specification
Parallel Interface: High-speed, differential line drivers
operating at VME transmission rate
Cable Interface: 100 pin metal shell Micro-D connector (2
per module)
7.3.3—Installation
7.3.4—Troubleshooting
1. If the Remote XCVR module is not functioning or not functioning properly,
verify the cable connections.
2. If the module is still not functioning properly after verifying the cable
connections, replace the cables connecting to module.
3. If the module is still not functioning properly after replacing cables, replace
the module.
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Figure 7-15—Cables
[available in 3 ft (0.9 m) and 10 ft (3 m) lengths]
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7.4.2—Module Specification
Parallel Interface: High-speed, differential line drivers
operating at VME transmission rate
Cable Interface: 100 pin metal shell Micro-D
connector (2 per module)
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Figure 7-17—Termination
7.5—Ethernet Module
7.5.1—Module Description
The MicroNet™ Ethernet module is a 32 bit VME bus module which has been
integrated into the MicroNet product family. The module is designed to fully
support auto-switching 10/100 Base-TX Ethernet connections, but has been
configured to operate at only 10 Mbps for use with legacy products.
The Ethernet module has a VME adapter board attached to allow its use in a
MicroNet chassis. However, this module is not “hot swappable” due to signal
integrity issues on the VME backplane. When inserted into a powered chassis,
the module will interrupt VME bus backplane communications and cause other
Woodward modules and expansion racks to shut down.
On power-up, the Ethernet board runs a series of self-tests that check the board
hardware. After successful completion of the tests, the red FAIL LED will turn
OFF. The self-tests may last 10–20 seconds.
Due to addressing conflicts with the Pentium CPU, this module can
be used only with the Motorola CPU family.
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LED Annunciations
The following LEDs annunciate board failure as well as different functions related
to Ethernet communications. When continuous communications are present, the
RX and TX LEDs will be ON continuously.
10BaseT Ethernet
A 10BaseT RJ45 Ethernet connector is available for system use. This connection
is used for control configuration, data gathering, and networking of multiple
controls. In addition, this port may be relied upon for interfacing TCP/IP
Distributed I/O devices into the control system.
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7.5.2—Module Specifications
Ethernet Features
Industry Standard 6U, VME-32 format
Network interface conforming to the IEEE 802.3 standard
Configured for 10BaseT communication support
Module failure/reset, Link LED, Transmit, Receive, Collision, and 10/100
Mbps LEDs
Supports Woodward communications such as Modbus, GAP Download, and
Tunable Capture/Download.
Electrical Specifications
Voltage: 5.0 Vdc, 5% tolerance
Power: 15.0 W max (13.5 W typical)
Processor: PowerPC 750, 400 MHz
Memory: 64 MB DRAM, 2 MB boot flash, 32 MB
user flash
Bus Interface: 32 bit VME bus
On board I/O: RJ45 10 Mbps Ethernet port
Hardware Configuration: VME address #1 or #2 configuration for
using 2 modules in a system
7.5.3—Installation
VME Address Configuration
The Ethernet module can be configured for an alternate VME address to support
the use of two modules in a MicroNet system. For dual module operation, both
the Woodward GAP and the module DIP switch must be configured properly.
The DIP switch (S2) is located directly behind the RJ45 Ethernet
connector.
NOT USED
NOT USED
VME1
OFF 1 2 3 4 5 6 7 8
VIS-151
*SWITCH POSITIONS SHOWN AT DEFAULTS 02-27-2001
KDW
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RJ45 Ethernet Pin
nout
1 TX+
2 TX-
3 RX X+
4 ----
5 ----
6 RXX-
7 ----
8 ----
Shield Chassiss GND
7.5.4
4—FTM Re
eference
Etherrnet Interface e FTM
To ennsure signal in
ntegrity and ro
obust operatio
on of Etherne
et devices, an
n Ethernet
Interfa
ace FTM (Fie eld Terminatio
on Module) is required wheen interfacing Ethernet
devicees to the CPUU. The FTM’s primary funcction is to implement EMI shielding
s
and cable
c shield te t Ethernet cable. Along with this FTM
ermination of the M, double
shield
ded Ethernet cables
c (SSTPP) are required.
7.5.5
5—Trouble
eshooting
1. If the Ethernet module is no ot functioning or not functio
oning properlyy, verify the
caable connections.
2. If the module is erly after veriffying the cable
s still not funcctioning prope
coonnections, re
eplace the ca ables connecting to module e.
3. If the module is
s still not funcctioning prope
erly after replaacing cables, replace
th
he module.
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7.6—SIO Module
7.6.1—Module Description
The SIO (Serial In/Out) Module interfaces four serial communication ports to the
VME bus.
Figure 7-19 is a block diagram of the SIO module. The module manages four
serial ports. Port A(J1) and port B(J2) are RS-232 ports. Port C(J3) and Port
D(J4) are for RS-232, RS-422, or RS-485 communication protocols. Ports C and
D must be at the same baud rate when using 38.4 Kbaud or 57.6 Kbaud.
The processor on this module is a 68030. It controls the transfer of data between
the ports and the VME bus.
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7.6.2—Module Specification
Ports 1 and 2: RS-232 @ 110–38.4 Kbaud
Ports 3 and 4: RS-232, RS-422, and RS-485 (software
selectable) @ 110–57.6 Kbaud
Software Support: Modbus RTU
Modbus ASCII
Woodward-specific service interface
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7.6.3—Installation
Termination
For RS-422, termination should be located at the receiver when one or more
transmitters are connected to a single receiver. When a single transmitter is
connected to one or more receivers, termination should be at the receiver
farthest from the transmitter. Figure 7-21 is an example.
For RS-485, termination should be at each end of the cable. If termination can't
be located at the end of a cable, put it as close as possible to the ends. Figure
5-17 is an example.
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MicroNet Simplex & MicroNet Plus Manual 26166V1
Termination is accomplished using a three-resistor voltage divider between a
positive voltage and ground. The impedance of the resistor network should be
equal to the characteristic impedance of the cable. This is usually about 100 to
120 Ω. The purpose is to maintain a voltage level between the two differential
lines so that the receiver will be in a stable condition. The differential voltage can
range between 0.2 and 6 V; the maximum voltage between either receiver input
and circuit ground must be less than 10 V. There is one termination resistor
network for each port located on the SIO board. Connection to this resistor
network is made through the 9-pin connectors on pins 6 and 9. See Figure 7-23
for termination and cable connection examples.
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7.6.4—Troubleshooting
1. If the SIO module is not functioning or not functioning properly, verify the
cable connections.
2. If the module is still not functioning properly after verifying the cable
connections, replace the cables connecting to module.
3. If the module is still not functioning properly after replacing cables, replace
the module.
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Chapter 8.
Discrete I/O Modules
8.1—Introduction
There are four types of discrete I/O modules currently available with the
MicroNet™ system. These include the 48/24 Discrete Combo module (48
discrete inputs, 24 discrete outputs), 48Ch DI module, 32Ch DO module, and the
64Ch DO module.
The discrete inputs are optically isolated and accessible through either the 48/12
Discrete FTM or the 24/12 Discrete FTM depending on the configuration. The
discrete outputs are accessible through either the 24/12 Discrete FTM or the two
16Ch Relay Modules or the one 32Ch Relay Module when so configured. See
Figures 8-2 and 8-7 for examples of configurations.
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8.2.2—Module Specification
Discrete Inputs
Number of channels: 48
Update time: 5 ms
Input type: Optically isolated discrete input
(galvanically isolated)
48/24 Discrete FTM
Input thresholds:
Low voltage: 8 Vdc at 1.5 mA = “OFF”
> 16 Vdc at 3 mA = “ON”
High voltage: <29 Vdc at 1.8 mA = “OFF”
>67 Vdc at 4 mA = “ON”
Input current: 4 mA @ 24 Vdc; 2.6–5 mA @ 125 Vdc
External input voltage: 18–32 Vdc (UL and LVD), or 100–150
Vdc (UL) w/ high Voltage FTM
Isolation voltage: 500 Vdc to earth ground, 1000 Vdc to
control common
Time stamping: 1 ms resolution
Isolated 24 Vdc contact supply: 400 mA maximum
For the 24/12 Discrete FTM input specifications, see Chapter 13.
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Discrete Outputs
Number of channels: 24
Update time: 5 ms
For the 24/12 Discrete FTM, 16Ch Relay Module, and the 32Ch Relay Module
output specifications, see Chapter 13.
8.2.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.
There are two different FTM I/O configurations for the 48/12 Discrete Combo
Module.
Configuration 1
Configuration 1 consists of one 24 Vdc or 125 Vdc 48/24 Discrete FTM
connected to the 48/24 Discrete Combo module via two High Density
Analog/Discrete cables. The top connector on the 48/24 Discrete Combo module,
which is labeled J1, connects to J1 on the 48/24 Discrete FTM, and J2 connects
to J2. There are two versions of the FTM, one for 24 Vdc inputs, and one for 125
Vdc inputs. The LVD applies only to the 24 Vdc version. The 24 Vdc 48/24
Discrete FTM handles 24 Vdc input signals and the 125 Vdc 48/24 Discrete FTM
handles 125 Vdc input signals. Either 48/24 Discrete FTM is then connected to
either two 16Ch Relay Modules or one 32Ch Relay Module via a Low Density
Discrete Cable(s) via the third connector. See Figure 8-2 for an example of
configuration.
J1
P1
J2
P1
Low Density
Discrete Cable
P1
J1
P2 P2 P2 OR Low Density
J1 J2 J3 Discrete Cable
24VDC 48/24 Discrete FTM or
P1
J1
P1
P2
J1
J2
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All of the discrete inputs on the module are accessible on the FTM, and the
channels are labeled to correspond to their designation in the application
software (discrete input 1 on the FTM will be discrete input 1 in the application
software).
Discrete Inputs
Each 48/24 Discrete Combo module accepts 48 contact inputs. The 48/24
Discrete FTM may supply contact wetting voltage. Optionally, an external 18–32
Vdc power source or an external 100–150 Vdc power source can be used to
source the circuit wetting voltage. If the 24 Vdc internal power source is used for
contact wetting, a jumper is required between FTM terminals 98 and 99. If an
external power source is used for contact wetting, the external source’s common
must be connected to the FTM’s discrete input common, terminal 49. If 125 Vdc
contact inputs are needed, the High Voltage (125 Vdc) FTM must be used. The
FTM provides a common cage-clamp terminal connection for customer field
wiring. Figures 8-3 and 8-4 illustrate different discrete input wiring configurations
based on the input voltage.
Figure 8-4—Discrete Input Interface Wiring to a 125 Vdc 48/24 Discrete FTM
HIGH VOLTAGE—If the high voltage FTM is being used, and there is
125 Vdc on the FTM terminal blocks, there will be 125 Vdc on the FTM
sub D connectors and on the cable when it is connected to the FTM.
For this reason, any power should be removed from the FTM terminal
blocks before installing the 48/24 Discrete Combo module or the
FTM.
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Configuration Notes:
Refer to Chapter 13 for Discrete Input wiring.
Each 48/24 Discrete I/O module can only accept one input voltage range, 24
Vdc (LVD and UL) or 125 Vdc (UL only).
All contact inputs accept dry contacts.
24 Vdc FTM only—If the internal 24 Vdc is used, a jumper must be added to
tie the internal 24 Vdc to the bussed power terminal blocks (see Figure
6-3).
24 Vdc FTM only—If an external 24 Vdc is used, the common for the
external 24 Vdc must be tied to the discrete input common (see Figure 8-3).
Power for contacts must be supplied by the control’s power supplies, or the
external power supply outputs must be rated to Class II at 30 Vdc or less
and outputs must be fused with appropriately sized fuses (a maximum
current rating of 100 V, where V is the supply’s rated voltage or 5 A,
whichever is less).
High Voltage FTM only—The common for the 125 Vdc must be tied to the
discrete input common (see Figure 8-4).
Discrete Outputs
For the 48/24 Discrete Combo FTM configuration, there are three types of relay
output boxes that can be used. These consist of the 16Ch Relay (Phoenix)
Module, 16Ch Relay Module, and the 32Ch Relay Module (see Chapter 13 for a
description of the available modules). The relay modules connect to the 48/24
Discrete FTM through individual cables and provide a common cage-clamp
terminal connection for customer field wiring. The discrete outputs on the 48/24
Discrete I/O module are non-isolated; the isolation takes place in the relay boxes.
Discrete outputs 9, 10, 11, 12, 21, 22, 23, and 24, drive two relays per output
(see Table 8-1). Internal wiring on the 48/24 Discrete I/O FTM provides this dual
relay functionality. The application software may use these relays for outputs
where extra relay contacts are needed, such as alarm or shutdown outputs.
Figures 8-5 and 8-6 illustrate examples of different discrete output wiring
configurations.
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Configuration Notes
Verify that each set of relay contacts meets the power requirements of the
circuit with which it is being used. Interposing relays are required when the
interfaced circuit demands relay contacts with a higher power rating. If
interposing relays or other inductive loads are required, it is recommended
that interposing relays with surge (inductive kickback) protection be used.
Improper connection could cause serious equipment damage.
Configuration 2
Configuration 2 consist of two 24/12 Discrete FTMs (DIN rail mounted)
connected to the 48/24 Discrete Combo module via two High Density
Analog/Discrete cables. See Figure 8-7 for an example of configuration.
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J1
P1
J2
P1
P2
J1
P2
J1
Both the 48 discrete inputs and 24 discrete outputs are wired to the 24/12
Discrete FTM. An external 24 Vdc source connection to the FTM is required for
discrete input contact sensing and relay coil energizing. For wiring information on
the 24/12 Discrete FTM, see Chapter 13.
Discrete Inputs
Each 24/12 Discrete FTM accepts 24 contact inputs. The 24/12 Discrete FTM
may supply contact wetting voltage. Optionally, an external 18–32 Vdc power
source can be used to source the circuit wetting voltage. If the 24 Vdc internal
power source is used for contact wetting, a jumper is required between FTM
terminals on TB9. If an external power source is used for contact wetting, the
external source’s common must be connected to the FTM’s discrete input
common, terminal 49 (see Figure 8-8).
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Internal External
TB6
Channel 1 1
25
Field Contacts
Channel 2 2
26
48/24
Discrete
Combo TB9
Module
A
Jumper
B (remove for
external Optional
TB8 excitation) External
Excitation
+24VDC 50 NC
24Ret 49
TB10
Cable
91 Ground to
Sheild
DIN rail
92
Configuration Notes:
Refer to Chapter 13 for Discrete Input wiring.
All contact inputs accept dry contacts.
If the internal 24 Vdc is used, a jumper must be added to tie the internal 24
Vdc to the bussed power terminal blocks (see Figure 8-8).
If an external 24 Vdc is used, the common for the external 24 Vdc must be
tied to the discrete input common (see Figure 8-8). Power for contacts must
be supplied by the control’s power supplies, or the external power supply
outputs must be rated to Class II at 30 Vdc or less and outputs must be
fused with appropriately sized fuses (a maximum current rating of 100/V,
where V is the supply’s rated voltage, or 5 A, whichever is less).
Discrete Outputs
The discrete outputs on the 48/24 Discrete I/O module are non-isolated; the
isolation takes place in the 24/12 Discrete FTM. See Chapter 13 for field wiring of
discrete output relays. Figure 8-9 illustrates an example of a discrete output
wiring configuration.
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Configuration Notes
Verify that each set of relay contacts meets the power requirements of the
circuit with which it is being used. Interposing relays are required when the
interfaced circuit demands relay contacts with a higher power rating. If
interposing relays or other inductive loads are required, it is recommended
that interposing relays with surge (inductive kickback) protection be used.
Improper connection could cause serious equipment damage.
8.2.4—FTM Reference
See Chapter 13 for detailed wiring of FTMs. See Appendix A for part number
Cross Reference for modules, FTMs, and cables.
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8.2.5—Troubleshooting
Fault Detection (Module Hardware)
Each 48/24 Discrete Combo module has a red Fault LED that is turned on when
the system is reset. During initialization of a 48/24 Discrete Combo module,
which occurs after every CPU reset, the CPU turns the Fault LED on. The CPU
then tests each 48/24 Discrete Combo module using diagnostic routines built into
the software. If the diagnostic test is not passed, the LED remains on or blinks. If
the test is successful, the LED goes off. If the Fault LED on a 48/24 Discrete
Combo module is illuminated after the diagnostics and initialization have been
run, the module may be faulty or may be located in the wrong slot.
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If during normal control operation all of a chassis’ 48/24 Discrete Combo
modules have Fault LEDs on, check the chassis’ CPU module for a failure. If
during normal control operation only the 48/24 Discrete Combo module’s Fault
LED is on or flashing, insure that it is installed in the correct slot. If it is, then
replace that 48/24 Discrete Combo module. When a module fault is detected, its
outputs should be disabled or de-energized.
Discrete Inputs
If a discrete input is not functioning properly, verify the following:
1. Measure the input voltage on the terminal block. It should be in the range of
16–32 Vdc for the low voltage FTM or 100–150 Vdc for the high voltage
FTM.
2. Check the wiring. If the inputs are reading open, look for a loose connection
on the terminal blocks, disconnected or misconnected cables, or a missing
jumper on the terminal block.
3. Check the application software configuration to ensure that the input is
configured properly.
4. If the other channels on the 48/24 Discrete Combo module are not working
either, check the fuse on the 48/24 Discrete Combo module. See the
instructions in Chapter 15 for replacing the module. This fuse is visible and
can be changed through the bottom of the module. If this fuse is blown, fix
the wiring problem and replace the fuse with another fuse of the same type
and rating.
5. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace the
48/24 Discrete Combo module.
6. If the readings are incorrect on several channels of the 48/24 Discrete
Combo module, corresponding to both cables, replace the 48/24 Discrete
Combo module.
7. If replacing the module does not fix the problem, replace the FTM. See the
instructions in Chapter 15, Installation, for replacing the FTM.
Discrete Outputs
If a discrete output is not functioning properly, verify the following:
1. Check the wiring for a loose connection on the terminal blocks, or
disconnected or misconnected cables.
2. Verify that the current through the relay contacts is not greater than the relay
contact rating.
3. If the other output channels on the 48/24 Discrete Combo module are not
working either, check the fuse on the 48/24 Discrete Combo module. See
the instructions in Chapter 15 for replacing the module. This fuse is visible
and can be changed through the bottom of the module. If this fuse is blown,
fix the wiring problem and replace the fuse with another fuse of the same
type and rating.
4. Check the software configuration to ensure that the output is configured
properly.
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5. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, exchange
the cables at the FTM, so J1 is driving J2 and vice versa. If the problem
moves to a different relay, replace the 48/24 Discrete Combo module. If the
fault stays with the same relay, replace the relay or the relay module. See
instructions for replacing the relay modules in Chapter 15. If replacing the
relay module does not fix the problem, replace the cable between the relay
module and the FTM, or replace the FTM itself. See the instructions in
Chapters 15 for replacing the FTM.
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This module receives discrete signals from 48 separate switches or relay
contacts, and sends this data to the CPU. The inputs are optically isolated from
the balance of the MicroNet™ control circuitry. The module system provides
isolated +24 Vdc power for these external contacts on the 24 Vdc Discrete
Input/Output FTM. The Discrete Input (With LEDs) FTM requires an external
contact wetting power supply.
8.3.2—Module Specification
Number of Channels: 48
Input Type: Optically isolated discrete input
Input Thresholds: < 8 Vdc = "OFF"
> 16 Vdc = "ON"
Input Current: 3 mA @ 24 Vdc
Contact Power: Module provides isolated 24 Vdc, 0.3A
8.3.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.
Each 48Ch DI Module is connected through two low density discrete cables to
two 24 Vdc Discrete Input/Output FTMs or Discrete Input (With LEDs) FTMs. All
I/Os on the module are accessible on the FTMs, and the channels are labeled
sequentially to correspond to their software locations (for example., discrete input
1 on the FTM will be discrete input 1 in the application software). The FTM
plugged into J1 handles channels 1–24, and the FTM plugged into J2 handles
channels 25–48. See Figure 8-12 for system installation configuration.
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J1
P1
J2
P1
P2
J1
24VDC Discrete Input/Output FTM
or
Discrete Input (With LEDS) FTM
P2
J1
24VDC Discrete Input/Output FTM
or
Discrete Input (With LEDS) FTM
Each 48Ch DI Module accepts 48 contact inputs. Contact wetting voltage may be
supplied by the 48Ch DI Module internal power supply. The supply can only
supply 300 mA and therefore should not be used with the Discrete Input (with
LEDs) FTM. If an external power source (18–32 Vdc) is supplied, the Discrete
Input (with LEDs) FTM may be used. Figures 8-13 and 8-14 illustrate different
discrete input wiring configurations based on internal or external power source.
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Internal External
TB1
Channel 1 1
Channel 2 2
Field Contacts
Channel 3 3
Channel 4 4
48Ch DI
Module
24Ret 25 NC
26
+24VDC 54
Internal External
TB1
Channel 1 1
Channel 2 2
Field Contacts
Channel 3 3
Channel 4 4
+
48Ch DI
Power
Module
1.21K Source
Ohms
-
24Ret 25
26
+24VDC 54
Configuration Notes:
Refer to Chapter 13 for Discrete Input wiring.
All contact inputs accept dry contacts.
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8.3.4—FTM Reference
See Chapter 13 for detailed wiring of FTMs. See Appendix A for part number
Cross Reference for modules, FTMs, and cables.
8.3.5—Troubleshooting
Fault Detection (Module Hardware)
Each 48Ch DI module has a red Fault LED that is turned on when the system is
reset. During initialization of a 48Ch DI module, which occurs after every CPU
module reset, the CPU turns the Fault LED on. The CPU module via the VME
bus turns off the Fault LED when the CPU has started execution of the
application program and verified that the board is present.
Figure 8-15 is a block diagram of the Discrete Input module. The module
receives information from as many as 48 field switches and relays. Field wiring is
isolated from the MicroNet circuitry by optical isolators in each channel; the state
of each discrete input is passed through an optoisolator to the buffers. The CPU
then obtains the data for each channel through the VME interface.
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If a discrete input is not functioning properly, verify the following:
1. Measure the input voltage on the terminal block of the FTM. It should be in
the range of 16–32 Vdc.
2. Check the wiring. If the inputs are reading open, look for a loose connection
on the terminal blocks, disconnected or misconnected cables, or a missing
jumper on the terminal block.
3. Check the application software configuration to ensure that the input is
configured properly.
4. If the other channels on the 48 DI module are not working either, check the
fuse on the 48 DI module. See the instructions in Chapter 15 for replacing
the module. This fuse is visible and can be changed through the bottom of
the module. If this fuse is blown, fix the wiring problem and replace the fuse
with another fuse of the same type and rating.
5. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace the
48 DI module.
6. If replacing the module does not fix the problem, replace the FTM. See the
instructions in Chapter 15 for replacing the FTM.
8.4.2—Module Specification
Number of channels: 32
Update time: 5 ms
Output Type: Open drain drivers, intended for use
with Woodward relay interface modules.
Fault Detection Readback: Output channel status, relay status is
not available
System Faults: Outputs are turned off if
communications with the CPU is lost.
For the 16Ch Relay Module and the 32Ch Relay Module output specifications,
see Chapter 13.
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8.4.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.
This module receives digital data from the CPU and generates 32 non-isolated
relay driver signals. All discrete output modules in the system interface to one or
more Woodward Relay Modules, each with 16 or 32 relays. The contacts of
these relays then connect to the field wiring.
A separate 24 Vdc power source must be provided for the relays; this module
does not furnish this power. A section of a multi-output Main Power Supply can
be used, or power from a single-output Main Power Supply can be used, as long
as sufficient current is available.
Each 32Ch DO Module is connected through one low density discrete cable to a
32Ch Relay module or a 16Ch Relay module daisy chained to a second 16Ch
Relay module with another low density cable. See Figure 8-17 for system
installation configuration.
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J1
P1
P2 P2
P1
P2
J2
J1
J1 J1
Figures 8-18 and 8-19 illustrate examples different discrete output wiring
configurations.
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Configuration Notes
Verify that each set of relay contacts meets the power requirements of the
circuit with which it is being used. Interposing relays are required when the
interfaced circuit demands relay contacts with a higher power rating. If
interposing relays or other inductive loads are required, it is recommended
that interposing relays with surge (inductive kickback) protection be used.
Improper connection could cause serious equipment damage.
8.4.4—FTM Reference
See Chapter 13 for detailed wiring of relay modules. See Appendix A for part
number Cross Reference for modules, FTMs, and cables.
8.4.5—Troubleshooting
Figure 8-20 is a block diagram of the 32-Channel Discrete Output module. The
CPU sends the address of this module and the address and state of the channel
to be output to this module. This information is received by the VME interface
and passed to the latches. The latch associated with the channel to be output
stores the information and passes it to the drivers. The driver for that channel
then energizes or de-energizes the relay for that channel.
Each channel has a readback buffer that indicates the status of the output driver
(not the relay). The CPU compares this status to the value written to the channel
and generates a fault signal if these two values are different. The relay module
power is turned off if communications with the CPU are lost or a fault is detected.
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RELAY
POWER TO
ENABLE WOODWARD
RELAY
CHANNELS MODULE
1-32
LATCHES DRIVERS
VME
VME
INTER-
BUS
FACE
BUFFERS
FAULT
LED
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The MicroNet control can provide discrete outputs to the prime mover from field
wiring. Each of this type Discrete Output (DO) module can individually control 64
outputs according to commands from the CPU module. These modules have no
potentiometers and require no calibration. A module may be replaced with
another module of the same part number without any adjustment. There are
several different FTM I/O configurations for the 64Ch DO Module. The module
can be connected to two 32Ch Relay Module, four 16Ch Relay Modules, or a
combination of the two types (see Chapter 13 for additional information on the
relay modules).
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8.5.2—Module Specification
Number of channels: 64
Update time: 5 ms
Output Type: Open drain drivers, intended for use
with Woodward relay interface modules.
Fault Detection Readback: Output channel status, relay status is
not available
System Faults: Outputs are turned off if
communications with the CPU is lost.
For the 16Ch Relay Module, and the 32Ch Relay Module output specifications,
see Chapter 13.
8.5.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.
This module receives digital data from the CPU and generates 64 non-isolated
relay driver signals. All discrete output modules in the system interface to one or
more Woodward Relay Modules, each with 16 or 32 relays. The contacts of
these relays then connect to the field wiring.
A separate 24 Vdc power source must be provided for the relays; this module
does not furnish this power. A section of a multi-output Main Power Supply can
be used, or power from a single-output Main Power Supply can be used, as long
as sufficient current is available.
Each 64Ch DO Module is connected through two low density discrete cables to
two 32Ch Relay modules or two 16Ch Relay modules daisy chained to two
additional 16Ch Relay modules with two additional low density cables. See
Figure 8-22 for system installation configuration.
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J1
P1
J2
P1
P2 P2
P1
P2
J2
J1
J1 J1
32Ch Relay Module 16Ch Relay Module 16Ch Relay Module
(Channels 33-64) (Channels 33-48) (Channels 49-64)
P1
P2
J2
J1
J1 J1
32Ch Relay Module 16Ch Relay Module 16Ch Relay Module
(Channels 1-32) (Channels 1-16) (Channels 17-32)
Figures 8-23 and 8-24 illustrate examples different discrete output wiring
configurations.
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Configuration Notes
Verify that each set of relay contacts meets the power requirements of the
circuit with which it is being used. Interposing relays are required when the
interfaced circuit demands relay contacts with a higher power rating. If
interposing relays or other inductive loads are required, it is recommended
that interposing relays with surge (inductive kickback) protection be used.
Improper connection could cause serious equipment damage.
8.5.4—FTM Reference
The 64Ch DO Module uses the same relay modules as the 32Ch DO Module.
See the previous section.
8.5.5—Troubleshooting
The 64Ch DO Module uses the same relay modules as the 32Ch DO Module and
therefore has the same troubleshooting approach as the 32Ch DO Module. See
the previous section.
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Chapter 9.
Analog I/O Modules
9.1—Introduction
This chapter contains information on those modules that are classified as analog
I/O modules. There are two types analog I/O modules. There are the single
function type modules and the combination modules. The combination modules
consist of more than one type of input or output. The single type modules consist
of a single type of I/O, such as all 4-20 mA inputs.
All 4-20 mA analog inputs may be used with two-wire ungrounded (loop
powered) transducers or isolated (self-powered) transducers. All analog inputs
have 200 Vdc of common mode rejection. If interfacing to a non-isolated device,
which may have the potential of reaching over 200 Vdc with respect to the
control’s common, the use of a loop isolator is recommended to break any return
current paths producing erroneous readings.
Each board has an on-board processor for automatic calibration of the I/O
channels. Each analog input incorporates a time-stamping feature with 5 ms
resolution for two low set points and two high set points.
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9.3.2—Module Specification
Analog Input Ratings
Number of channels: 24
Update time: 5 ms
Input range: 0-25 mA or 0-5 V; software and hardware
selectable
The maximum voltage input range may vary between 4.975 and 5.025
Volts from module to module.
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The 24 channel analog inputs are divided into two banks, with
channel 1 through channel 12 data gathering at 1.8 ms after the MFT
tick and channel 13 through channel 24 data gathering at 3.7 ms after
the MFT tick.
9.3.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.
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J1
P1
J2
P1
P2
J1 24/8 Analog FTM
(Inputs Ch. 12-24)
(Outputs Ch. 5-8)
P2
J1 24/8 Analog FTM
(Inputs Ch. 1-12)
(Outputs Ch. 1-4)
Analog Inputs
For a 4–20 mA input signal, the 24/8 Analog Module uses a 200 ohm resistor
across the input located on the 24/8 Analog Module. Each analog input channel
may power its own 4–20 mA transducer. See Figure 9-3 for analog input
connection. This power is protected with a 100 mA fuse on each channel to
prevent an inadvertent short from damaging the module. The 24 Vdc outputs are
capable of providing 24 Vdc with ±10% regulation. The maximum current is 0.8
A. Power connections can be made through terminals located on the 24/8 Analog
FTMs. See Chapter 13 for complete field wiring information for the 24/8 Analog
FTM.
When configuring the AI Combo block in GAP, set Conf. input field to
1 for all inputs when used with the 24/8 Analog FTM. This will allow
the block to use the module factory calibration values for the 4-20
mA inputs that were calibrated with 200 ohm internal resistors on the
24/8 Analog Module.
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Analog Outputs
There are 8 analog output channels of 4–20 mA with a full scale range of 0-25
mA. All Analog Outputs can drive a maximum load of 600 ohms (load + wire
resistance). See Figure 9-4 for analog output connection. Each output monitors
the output source current for fault detection. All of the analog outputs may be
individually disabled. When a channel fault or a module fault is detected, the
application program may annunciate the fault, disable the channel and stop using
data in system calculations or control. Care should be taken to prevent ground
loops and other faults when interfacing to non-isolated devices. See Chapter 13
for complete field wiring information for the Analog High Density FTM.
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9.3.4—FTM Reference
See Chapter 13 for complete field wiring information for the Analog High Density
FTM. See Appendix A for part number Cross Reference for modules, FTMs, and
cables.
9.3.5—Troubleshooting
Each 24/8 Analog module has a red Fault LED that is turned on when the system
is reset. During initialization of a module, which occurs after every CPU reset, the
CPU turns the Fault LED on. The CPU then tests each module using diagnostic
routines built into the software. If the diagnostic test is not passed, the LED
remains on or blinks. If the test is successful, the LED goes off. If the Fault LED
on a module is illuminated after the diagnostics and initialization have been run,
the module may be faulty or may be located in the wrong slot.
Analog Input Faults: The application software may be set with a high and low
latch set point to detect input faults.
Analog Output Driver Faults: The module monitors the source currents and
annunciates faults. The application software determines the course of action in
the event of a fault.
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Microcontroller Faults: The system monitors a software watchdog, a hardware
watchdog, and a software watchdog on the VME bus communications. All
outputs are shut down in the event of a microcontroller fault.
Troubleshooting Guide
If during normal control operation, all of the 24/8 Analog modules have Fault
LEDs on, check the chassis’ CPU module for a failure. If during normal control
operation only the 24/8 Analog module’s Fault LED is on or flashing, insure that it
is installed in the correct slot. If it is, then replace that module. See instructions
for replacement in Chapter 15, Installation (System Level Installation). When a
module fault is detected, its outputs will be disabled or de-energized.
Analog Inputs
If an analog input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 15, Installation (System
Level Installation).
2. Measure the input voltage on the FTM terminal block. It should be in the
range of 0-5 V.
3. Verify that there are no or minimal AC components to the Analog Input
signal. Improper shielding may introduce AC noise on the input
terminals.
4. Check the wiring. If the inputs are reading 0 or the engineering units that
correspond to 0 mA, look for a loose connection on the terminal blocks,
disconnected or misconnected cables, a missing jumper on the terminal
block if the input is a current input, or a blown fuse on the 24 Vdc on the
FTM.
5. If all of the inputs are reading high, check that the 24 Vdc is not
connected across the input directly.
6. Check the software configuration to ensure that the input is configured
properly.
7. If all of the channels on the 24/8 Analog module are not working, check
the fuse on the 24/8 Analog module. See instructions for module
replacement in Chapter 15, Installation (System Level Installation). This
fuse is visible and can be changed through the bottom of the module. If
the fuse is blown, fix the wiring problem, then replace the fuse with
another fuse of the same type and rating.
8. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace
the module.
9. If the readings are incorrect on several channels of the 24/8 Analog
module, corresponding to both cables, replace the module.
10. If replacing the module does not fix the problem, replace the FTM. The
FTM contains only traces and a few discrete components, so failure is
extremely unlikely. See instructions for replacing the FTM in Chapter 15,
Installation (System Level Installation).
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MicroNet Simplex & MicroNet Plus Manual 26166V1
Analog Outputs
If an analog output is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 15, Installation (System
Level Installation).
2. Check the load resistance to ensure that it is not greater than 600 ohms.
3. Check to ensure that the load wiring is isolated.
4. Check the wiring for a loose connection on the FTM terminal blocks and
disconnected or misconnected cables.
5. Disconnect the field wiring and connect a resistor across the output. If
the output is correct across the resistor, there is a problem with the field
wiring.
6. If all of the channels on the 24/8 Analog module are not working, check
the fuse on the 24/8 Analog module. See instructions for module
replacement in Chapter 15, Installation (System Level Installation). This
fuse is visible and can be changed through the bottom of the module. If
the fuse is blown, fix the wiring problem, then replace the fuse with
another fuse of the same type and rating.
7. Check the software configuration to ensure that the output is configured
properly.
8. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace
the module.
9. If the readings are incorrect on several channels of the module,
corresponding to both cables, replace the module.
10. If replacing the module does not fix the problem, replace the FTM. The
FTM contains only traces and a few discrete components, so failure is
extremely unlikely. See instructions for replacing the FTM in Chapter 15,
Installation (System Level Installation).
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9.4.2—Specifications
To obtain overall signal input accuracy and bandwidth, the Dataforth FTM (0–5
V) module input accuracy and the Dataforth 24/8 Analog Module must be taken
into account.
** The maximum input voltage range may vary between 4.975 and 5.025 Volts
from Dataforth module to Dataforth module.
Outputs can drive a maximum load of 600 ohms (load + wire resistance).
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
9.4.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.
J1
P1
J2
P1
P2
J1
Simplex Dataforth FTM
(Inputs Ch. 12-24)
(Outputs Ch. 5-8)
P2
J1
Simplex Dataforth FTM
(Inputs Ch. 1-12)
(Outputs Ch. 1-4)
Field Wiring
See chapter 13 for detail wiring connections for the Simplex Dataforth FTM. Each
input channel requires a Dataforth plug-in module per input. Install one of the five
different Dataforth modules into each of the 12 plug-in slots on the FTM. It is not
necessary to have a plug-in module in a slot if not used. With the Simplex
Dataforth FTM connected to J1 of the Dataforth Module, channels 1-12 will be
active. With the Simplex Dataforth FTM connected to J2 of the Dataforth Module,
channels 13-24 will be active. Wire each channel per the following examples for
each type of plug-in module. Install jumpers on FTM module as shown for
specific type of input.
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The cold junction compensation (CJC) is performed by using an NTC thermistor,
externally mounted on the FTM module, as shown in Figure 9-7. The
thermocouple signal will fail high if an open wire is detected.
1
Fuse
100 mA 250 V
2
154 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
MicroNet™ Module Dataforth® FTM
Plug-in
FTM
Module Term Blk
1
0 13
Sense
NTC
Thermistor * 2
3 2 14
- In
+24 V RTD
3
+ V out 4 1 15
+ In
0.01uf, 500V
Com 4
- 5 16
3 5
IN * Note: The thermistor remains present on
Px 2
OUT
17 the FTM on all circuits, but has no effect
1
1
Fuse
100 mA 250 V
2
When configuring the AI Combo block in GAP, set Conf. input field to
2 for all 4-20 mA inputs when used with the current input plug-in
module. This will allow the block to use the module factory voltage
calibration values with a gain factor for a 200 ohm external resistor
on the Dataforth FTM.
Plug-in FTM
Module Term Blk
1
0 13
2
3 2 14 4/20 mA (Loop Powered)
+24 V
+ V out 4 1 3
15
+ In -
Sig
0.01uf, 500V
4
4-20mA Transmitter
- Com 5 16
Shield +
+24 V
3 5
IN
Px 2
1 OUT
17
6
18
+24 V
24 RTN
Jumper
TB15
1
Fuse
100 mA 250 V
2
Woodward 155
MicroNet Simplex & MicroNet Plus Manual 26166V1
MicroNet™ Module Dataforth® FTM
3
4-20mA Transmitter
+ V out 4 1
15
+ In +
Sig
0.01uf, 500V
Com 4
- 5 16
Shield
3 5
IN
Px 2
1 OUT
17
6
24 RTN 18
Jumper
TB15
1
Fuse
100 mA 250 V
2
When configuring the AI Combo block in GAP, set Conf. input field to
0 for all voltage inputs when used with the voltage input plug-in
module. This will allow the block to use the module factory voltage
calibration values with the Dataforth FTM.
3
0-5VDC Transmitter
+ V out 4 1
15
+ In +
Sig
0.01uf, 500V
- Com 5 4
16
Shield
3 5
IN
Px 2
1 OUT
17
6
24 RTN 18
Jumper
TB15
1
Fuse
100 mA 250 V
2
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
Analog Output Connection
The Analog Output circuit doesn’t use a plug-in module. No jumper connections
are required. See Figure 9-12 for an example of wiring a 4-20 mA output device.
+24 V
MicroNet™ Module
I/O Lockout
Analog Output +
Dataforth® FTM
Feedback - FTM
TB1
Analog Output
- Out -
1
Output
Analog Output B + Out + Device
2
0.01uf, 500V
Shield
3
24 COM
TB15
9.4.4—FTM Reference
See Chapter 13 for complete field wiring of the Simplex Dataforth FTM. See
Appendix A for part number Cross Reference for modules, FTMs, and cables.
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MicroNet Simplex & MicroNet Plus Manual 26166V1
9.4.5—Troubleshooting
Each Dataforth 24/8 Analog Module has a red Fault LED that is turned on when
the system is reset. During initialization of a module, which occurs after every
CPU reset, the CPU turns the Fault LED on. The CPU then tests each module
using diagnostic routines built into the software. If the diagnostic test is not
passed, the LED remains on or blinks. If the test is successful, the LED goes off.
If the Fault LED on a module is illuminated after the diagnostics and initialization
have been run, the module may be faulty or may be located in the wrong slot.
Analog Input Faults: The application software may be set with a high and low
latch set point to detect input faults.
Analog Output Driver Faults: The module monitors the source currents and
annunciates faults. The application software determines the course of action in
the event of a fault.
Troubleshooting Guide
If during normal control operation all of a chassis’ Dataforth 24/8 Analog Module
have Fault LEDs on, check the chassis’ CPU module for a failure. If during
normal control operation only the Dataforth Module’s Fault LED is on or flashing,
insure that it is installed in the correct slot. If it is, then replace that module. See
instructions for replacement in Chapter 15, Installation (System Level
Installation). When a module fault is detected, its outputs should be disabled or
de-energized.
Thermocouple Inputs
If an Thermocouple input is not functioning properly, verify the following:
1. Verify that the correct Dataforth plug-in module is installed. Swap plug-in
modules on FTM. Replace module if problem follows module.
2. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 15, Installation (System
Level Installation).
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
4. Check the wiring. If the inputs are reading full scale, look for a loose
connection on the terminal blocks, disconnected or misconnected cables,
a missing jumper on the terminal block, or a blown fuse on the 24 Vdc on
the FTM.
5. Check the software configuration to ensure that the input is configured
properly.
6. Verify that FTM module is within operating limits of +5 to 45 degrees C.
7. If all of the thermocouple channels on the Dataforth Module are not
working, check the fuse on the Dataforth Module. See instructions for
module replacement in Chapter 15, Installation (System Level
Installation). This fuse is visible and can be changed through the bottom
of the module. If the fuse is blown, fix the wiring problem, then replace
the fuse with another fuse of the same type and rating.
8. If the readings are incorrect on several channels of the Dataforth Module,
after replacing both cables, replace the module. If replacing the module
does not fix the problem, replace the FTM. See instructions for replacing
the FTM in Chapter 15, Installation (System Level Installation).
RTD Inputs
If an RTD input is not functioning properly, verify the following:
1. Verify that the correct Dataforth plug-in module is installed. Swap plug-in
modules on FTM. Replace module if problem follows module.
2. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 15, Installation (System
Level Installation).
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
4. Check the wiring. If the inputs are minimum scale or full scale, look for a
loose connection on the terminal blocks, disconnected or misconnected
cables, a missing jumper on the terminal block, or a blown fuse on the 24
Vdc on the FTM.
5. Check the software configuration to ensure that the input is configured
properly.
6. If all of the RTD channels on the Dataforth Module are not working,
check the fuse on the Dataforth Module. See instructions for module
replacement in Chapter 15, Installation (System Level Installation). This
fuse is visible and can be changed through the bottom of the module. If
the fuse is blown, fix the wiring problem, then replace the fuse with
another fuse of the same type and rating.
7. If the readings are incorrect on several channels of the Dataforth Module,
after replacing both cables, replace the module. If replacing the module
does not fix the problem, replace the FTM. See instructions for replacing
the FTM in Chapter 15, Installation (System Level Installation).
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MicroNet Simplex & MicroNet Plus Manual 26166V1
4-20 mA Analog Inputs
If a 4-20 mA analog input is not functioning properly, verify the following:
1. Verify that the correct Dataforth plug-in module is installed.
2. Check that the cable is shielded and the shield is properly grounded.
3. Measure the input voltage on the FTM terminal block. It should be in the
range of 0.8-4.0 V.
4. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
5. Check the wiring. If the inputs are reading 0 or the engineering units that
correspond to 0 mA, look for a loose connection on the terminal blocks,
disconnected or misconnected cables, a missing jumper on the terminal
block if the input is a current input, or a blown fuse on the 24 Vdc on the
FTM.
6. Check the software configuration to ensure that the input is configured
properly.
7. If all of the 4-20 mA channels on the Dataforth Module are not working,
check the fuse on the Dataforth Module. See instructions for module
replacement in Chapter 15, Installation (System Level Installation). This
fuse is visible and can be changed through the bottom of the module. If
the fuse is blown, fix the wiring problem, then replace the fuse with
another fuse of the same type and rating.
8. If the readings are incorrect on several channels of the Dataforth Module,
after replacing both cables, replace the module. If replacing the module
does not fix the problem, replace the FTM. The 4-20 mA configured FTM
contains only traces and a few discrete components, so failure is
extremely unlikely. See instructions for replacing the FTM in Chapter 15,
Installation (System Level Installation).
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
Analog Outputs
If an analog output is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded.
2. Check the load resistance to ensure that it is not greater than 600 ohms.
3. Check to ensure that the load wiring is isolated.
4. Check the wiring for a loose connection on the FTM terminal blocks and
disconnected or misconnected cables.
5. Disconnect the field wiring and connect a resistor across the output. If
the output is correct across the resistor, there is a problem with the field
wiring.
6. If all of the channels on the Dataforth Module are not working, check the
fuse on the Dataforth Module. See instructions for module replacement
in Chapter 15, Installation (System Level Installation). This fuse is visible
and can be changed through the bottom of the module. If the fuse is
blown, fix the wiring problem, then replace the fuse with another fuse of
the same type and rating.
7. Check the software configuration to ensure that the output is configured
properly.
8. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace
the module.
9. If the readings are incorrect on several channels of the module,
corresponding to both cables, replace the module.
10. 1 If replacing the module does not fix the problem, replace the FTM. The
FTM contains only traces and a few discrete components, so failure is
extremely unlikely. See instructions for replacing the FTM in Chapter 15,
Installation (System Level Installation).
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MicroNet Simplex & MicroNet Plus Manual 26166V1
There are two configurations of the Analog Combo Modules. One has the analog
inputs configured for 4-20 mA and the other is configured for 0-5 V. See
Appendix A for specific part numbers. In a simplex system, either Analog Combo
module is connected through two analog cables to one Analog Combo FTM. All
of the I/O are accessible on the FTM, and the channels are labeled to correspond
to their software locations, e.g. analog input 1 on the FTM will be analog input 1
in the application software.
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
9.5.2—Module Specifications
Digital Speed Sensor Inputs
Number of channels: 4
Update time: 5 ms
The maximum input voltage range may vary between 4.975 and 5.025
Volts from module to module.
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MicroNet Simplex & MicroNet Plus Manual 26166V1
4–20 mA Analog Output Ratings
Number of channels: 4
Update time: 5 ms
Driver: Pulse Width Modulated (PWM)
PWM frequency: 6.14 kHz
Filter: 3 poles at 500 ms
Current output: 4–20 mA current output range: 0 - 25 mA
Isolation: 0 Vrms
Max load resistance: 600 ohms (load + wire resistance)
Current readback: 11 bits
Readback isolation: -60 dB CMRR, 200 Vdc common mode
Resolution: 11 bits
Accuracy: Software calibrated to 0.2%, over 25 mA full
scale
Temperature drift: 125 ppm/C, maximum
Readback accuracy: 0.2%, over 25 mA full scale
Readback temp drift: 400 ppm/C, maximum
9.5.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
There are two configurations of the Analog Combo Modules. One has the analog
inputs configured for 4-20 mA and the other is configured for 0-5 V. See
Appendix A for specific part numbers. In a simplex system, each Analog Combo
module is connected through two Low Density analog cables to one Analog
Combo FTM. All of the I/O are accessible on the FTM, and the channels are
labeled to correspond to their software locations. See Figure 9-15 for
configuration.
J1
P1
J2
P1
P2 P2
J1 J2
Field Wiring
See Chapter 13 for detail wiring connections for the Analog Combo FTM. Wire
each channel per the following examples for each type of signal.
Any of the module’s four speed channels accepts passive magnetic pickup units
(MPUs) or proximity probes. Each speed input channel can only accept one MPU
or one proximity probe.
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MicroNet Simplex & MicroNet Plus Manual 26166V1
When a speed sensor input channel has been wired as either MPU or
proximity probe input, the unused MPU/Prox must be jumpered at the
FTM. When an input channel is not used, both the MPU and Prox
inputs must be jumpered. See example in Figure 9-16.
4 Com
35 35 48 +MPU Input
Jumper
34 34 5 -MPU Input
MPU/PROX_2 .01uF
15 15 49
2.1K ohm
+Prox Input + Ch. 2 (Prox.)
17 17 6
3W
PROX #2
50
F11
24/12V 7 NC
Reg.
-
51
J2 J2
37 37 8 +MPU Input
Jumper
36 36 52 -MPU Input
MPU/PROX_3 .01uF
18 18 9
2.1K ohm
+Prox Input + Ch. 3 (Prox.)
19 19 53
J1 J1 3W
PROX #3
15 15 10 NC
11 11 F10
24/12V 54
J2 J2 Reg.
15 15 -
11
11 11
35 35 55 +MPU Input
Jumper
34 34 12 -MPU Input
MPU/PROX_4 .01uF
15 15 56 Shld
2.1K ohm Ch. 4
+Prox Input
17 17 13 +Prox Input (Not Used)
+ F9 3W
57 +24VDC
+24VDC J1 J1 Jumper
13 13 24/12V 14 +12VDC
Reg.
- J2 J2
13 13 58 Com
J1 J1
20 20 88
J2 J2
Ground to DIN Rail
20 20
166 Woodward
Manual 26166V1 MicroNet Simplex & MicroNet Plus
A proximity probe may be used to sense very low speeds. With a proximity
probe, speed can be sensed down to 0.5 Hz. When interfacing to open collector
type proximity probes, a pull-up resistor is required between the supplied
proximity probe voltage and the proximity probe input to the FTM. Individually
fused 12 Vdc and 24 Vdc sources are provided with each speed input to power
system proximity probes (100 mA fuses, located on the FTMs, are used).
External pull-up resistors are required when interfacing with an open collector
type proximity probe. See Figure 9-16 for MPU/proximity probe wiring example.
Channel 1 shows an MPU connection, channel 2 shows a 24 V proximity
connection, and channel 3 is an example of a 12V proximity connection. Always
jumper the unused MPU connection to eliminate possible noise interference
when connecting a proximity probe.
Analog Inputs
The analog inputs may be current or voltage type dependent on the part number.
See Appendix A for specific part numbers. Both modules use the same cable and
FTM.
All current inputs may be used with two-wire ungrounded (loop powered)
transducers or isolated (self-powered) transducers. All analog inputs have 200
Vdc of common mode rejection. If interfacing to a non-isolated device, which may
have the potential of reaching over 200 Vdc with respect to the control’s
common, the use of a loop isolator is recommended to break any return current
paths that may produce erroneous readings. All current inputs use 200 ohm
resistors across their inputs.
Each current input channel may power its own 4–20 mA transducer. This power
is protected with a 100 mA fuse on each channel to prevent an inadvertent short
from damaging the module. The 24 Vdc outputs are capable of providing 24 Vdc
with ±10% regulation. Power connections can be made through terminals located
on the FTMs. Refer to Figure 9-17 for 4-20 mA Current Input wiring.
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MicroNet Simplex & MicroNet Plus Manual 26166V1
TB1
F8
24 +
Loop Powered
Transducer
68 -
.01uF
25 Ch. 1
J1 J1
-
Anti- 9 9 69 -
200
AI_01 aliasing Ohm
+ Filter 27 27 26 +
F7
70 NC
27 NC
.01uF
71 Ch. 2
-
7 7 28 -
Anti-
200 Self Powered
AI_02 aliasing Ohm Transducer
+ Filter 25 25 72 +
F6
29 +24V
73 COM
.01uF
30 SHLD Ch. 3
-
Anti- 5 5 74 -Input
200
AI_03 aliasing Ohm
+ Filter 23 23 31 +Input
F5
75 +24V
32 COM
.01uF
76 SHLD Ch. 4
-
Anti- 2 2 33 -Input
200
AI_04 aliasing Ohm
+ Filter 21 21 77 +Input
F4
34 +24V
78 COM
.01uF
35 SHLD Ch. 5
J2 J2
-
Anti- 9 9 79 -Input
200
AI_05 aliasing Ohm
+ Filter 27 27 36 +Input
F3
80 +24V
37 COM
.01uF
81 SHLD Ch. 6
-
Anti- 7 7 38 -Input
200
AI_06 aliasing Ohm
+ Filter 25 25 82 +Input
F2
13 13 39 +24V
J1 J1
13 13 83 COM
.01uF
40 SHLD Ch. 7
J2 J2
-
Anti- 5 5 84 -Input
200
AI_07 aliasing Ohm
+ Filter 23 23 41 +Input
F1
- 15 15 85 +24V
11 11
+24VDC J1 J1 42 COM
+ 15 15 .01uF
11 11 86 SHLD Ch. 8
J2 J2
-
Anti- 2 2 43 -Input
200
AI_08 aliasing Ohm
+ Filter 87
21 21 +Input
J1&2 J1&2
20 20 88
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
Only self-powered voltage transducers should be used on voltage input
channels. The full scale range must not exceed 5 volts. Refer to Figure 9-18 for
0-5 Vdc voltage transducer input wiring.
TB1
F8
24 NC
68 NC
.01uF
25 Ch. 1
J1 J1
-
9 9 69 -
Anti- Self Powered
AI_01 aliasing Voltage
+ Filter 27 27 26 + Transducer
F7
70 NC
27 NC
.01uF
71 SHLD Ch. 2
-
Anti- 7 7 28 -Input
AI_02 aliasing
+ Filter 25 25 72 +Input
F6
29 NC
73 NC
.01uF
30 SHLD Ch. 3
-
Anti- 5 5 74 -Input
AI_03 aliasing
+ Filter 23 23 31 +Input
F5
75 NC
32 NC
.01uF
76 SHLD Ch. 4
-
Anti- 2 2 33 -Input
AI_04 aliasing
+ Filter 21 21 77 +Input
F4
34 NC
78 NC
.01uF
35 SHLD Ch. 5
J2 J2
-
Anti- 9 9 79 -Input
AI_05 aliasing
+ Filter 27 27 36 +Input
F3
80 NC
37 NC
.01uF
81 SHLD Ch. 6
-
Anti- 7 7 38 -Input
AI_06 aliasing
+ Filter 25 25 82 +Input
F2
13 13 39 NC
J1 J1
13 13 83 NC
.01uF
40 SHLD Ch. 7
J2 J2
-
Anti- 5 5 84 -Input
AI_07 aliasing
+ Filter 23 23 41 +Input
F1
- 15 15 85 NC
11 11
+24VDC J1 J1 42 NC
+ 15 15 .01uF
11 11 86 SHLD Ch. 8
J2 J2
-
Anti- 2 2 43 -Input
AI_08 aliasing
+ Filter 21 21 87 +Input
J1&2 J1&2
20 20 88
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MicroNet Simplex & MicroNet Plus Manual 26166V1
Analog Outputs
The analog outputs are 4–20 mA with a full-scale range of 0–25 mA. Each output
monitors the output source current for fault detection. All of the analog outputs
may be individually disabled. When a channel fault or a module fault is detected,
the application program may annunciate the fault, disable the channel or module,
and stop using the data in system calculations or control.
The Analog Combo module has four 4–20 mA current output drivers. All analog
outputs can drive a maximum load of 600 ohms (load + wire resistance). Care
should be taken to prevent ground loops and other faults when interfacing to non-
isolated devices. See Figure 9-19 for an example of 4–20 mA output wiring.
Actuator Outputs
The actuator outputs may be configured for 4–20 mA or 20–160 mA.
Configuration is done through the application software; no hardware
modifications in the forms of jumpers or switches are necessary. For fault
detection, each output monitors the output source current and the output return
current. All of the actuator outputs may be individually disabled. When a channel
fault or a module fault is detected, the application program may annunciate the
fault, disable the channel or module, and stop using the data in system
calculations or control.
Dither may be provided in the application software for each output. Dither is a low
frequency (25 Hz) signal consisting of a 5 millisecond pulse modulated onto the
DC actuator-drive current to reduce sticking due to friction in linear type
actuators. Woodward TM-type actuators typically require dither. Dither amplitude
is variable through the application software. See Figure 9-19 for an example of
actuator wiring.
Configuration Notes
Maximum impedance for a 4 to 20 mA actuator output driver is 360 ohms
(actuator impedance + wire resistance).
Maximum impedance for a 20 to 160 mA actuator output is 45 ohms
(actuator impedance + wire resistance).
Each actuator driver senses its source and return current to allow
overcurrent and undercurrent alarms and shutdowns.
9.5.4—FTM Reference
See Chapter 13 for complete Analog Combo FTM field wiring information. See
Appendix A for proper Module, FTM, and cable part numbers.
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
J1 J1 16 SHLD
I/O Lockout
33 33 15 +Output Ch. 1
Analog AO_01
+
Output 32 32 59 -Output
- .01uF
Feedback
61
Analog
B +
Output 31 31 17 Ch. 2
Output
AO_02 Device
30 30 60 -
.01uF
24 COM
19 SHLD
J2 J2
33 33 18 +Output Ch. 3
AO_03
32 32 62 -Output
.01uF
64 SHLD
31 31 63 +Output Ch. 4
AO_04
30 30 20 -Output
22 SHLD
J1 J1 .01uF
29 29 21 +Output Ch. 1
ACT_01
28 28 65 -Output
.01uF
67 SHLD
J2 J2
29 29 66 +Output Ch. 2
ACT_02
28 28 23 -Output
J1&2 J1&2
20 20 88
Figure 9-19—Analog Output and Actuator Wiring for an Analog Combo FTM
9.5.5—Troubleshooting
Fault Detection (Module Hardware)
Each Analog Combo module has a red Fault LED that is turned on when the
system is reset. During initialization of a module, which occurs after every CPU
reset, the CPU turns the Fault LED on. The CPU then tests the module using
diagnostic routines built into the software. If the diagnostic test is not passed, the
LED remains on or blinks. If the test is successful, the LED goes off. If the Fault
LED on a module is illuminated after the diagnostics and initialization have been
completed, the Analog Combo module may be faulty or may be located in the
wrong slot.
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Fault Detection (I/O)
In addition to detecting module hardware faults, the application program may
detect I/O faults.
Analog Input Faults. The application software may set a high and low latch set
point to detect input faults.
Speed Sensor Input Faults. The application software may set a high and low
latch set point to detect input faults. The low latch set point must be greater than
one fiftieth of the frequency range.
Analog Output Driver Faults. The module monitors the source currents and
annunciates faults. The application determines the course of action in the event
of a fault.
Actuator Driver Or Load Faults. The module monitors the source and return
currents and annunciates faults. The application determines the course of action
in the event of a fault.
Troubleshooting Guide
If during normal control operation all of a chassis’ Analog Combo modules have
Fault LEDs on, check the chassis’ CPU module for a failure. If during normal
control operation only the Analog Combo module’s Fault LED is on or flashing,
insure that it is installed in the correct slot. If it is, then replace that Analog
Combo module. See instructions for replacement in Chapter 15, Installation.
When a module fault is detected, its outputs should be disabled or de-energized.
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11. If replacing the module does not fix the problem, replace the FTM. See
instructions for replacing the FTM in Chapter 15, Installation. The FTM
does not contain any active components on the MPU inputs, so replacing
it should be the last option.
Proximity Probes
If a proximity probe input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 15, Installation.
2. Measure the input voltage on the terminal block. It should be in the range
of 3.5 – 32 Vpeak.
3. Verify that the signal waveform is clean and void of double zero
crossings.
4. Verify that no ground connection exists and that the resulting 60 Hz
signal is absent.
5. Measure the frequency. It should be in the range of 0.5 Hz to 25 kHz.
6. Verify that any unused MPU/Prox inputs are jumpered per Figure 9-16.
7. Check the wiring. Look for a loose connection at the terminal blocks,
disconnected or misconnected cables, a missing jumper on the terminal
block, or a blown fuse on the 24 Vdc on the FTM.
8. Check the software configuration to ensure that the input is configured
properly.
9. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace
the Analog Combo module.
10. If the readings are incorrect on several channels of the Analog Combo
module, corresponding to both cables, replace the Analog Combo
module.
11. If replacing the module does not fix the problem, replace the FTM. See
instructions for replacing the FTM in Chapter 15, Installation. The FTM
contains only a wire-wound 3W resistor and traces, so failure is
extremely unlikely and replacing it should be the last option.
Analog Inputs
If an analog input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 15, Installation.
2. Measure the input voltage on the terminal block. It should be in the range
of 0-5 V.
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
4. Check the wiring. If the inputs are reading 0 or the engineering units that
correspond to 0 mA or volts, look for a loose connection on the terminal
blocks, disconnected or misconnected cables, a missing jumper on the
terminal block if the input is a current input, or a blown fuse on the
24 Vdc on the FTM.
5. If all of the inputs are reading high, check that the 24 Vdc is not
connected across the input directly.
6. Check the software configuration to ensure that the input is configured
properly.
7. Check the fuse on the FTM. See the instructions and fuse locations
below.
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8. If the other channels on the Analog Combo module are not working
either, check the fuse on the Analog Combo module. See instructions for
module replacement in Chapter 15, Installation. This fuse is visible and
can be changed through the bottom of the module. If the fuse is blown,
fix the wiring problem, then replace the fuse with another fuse of the
same type and rating.
9. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace
the Analog Combo module.
10. If the readings are incorrect on several channels of the module,
corresponding to both cables, replace the Analog Combo module.
11. If replacing the module does not fix the problem, replace the FTM. See
instructions for replacing the FTM in Chapter 15, Installation. The FTM
does not contain any active components on the MPU inputs, so replacing
it should be the last option.
Analog Outputs
If an analog output is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 15, Installation.
2. Check the load resistance to ensure that it is not greater than 600 ohms.
3. Check to ensure that the load wiring is isolated.
4. Check the wiring for a loose connection on the terminal blocks and
disconnected or misconnected cables.
5. Disconnect the field wiring and connect a resistor across the output. If
the output is correct across the resistor, there is a problem with the field
wiring.
6. If the other output channels on the Analog Combo module are also not
working, check the fuse on the Analog Combo module. See instructions
for module replacement in Chapter 15, Installation. This fuse is visible
and can be changed through the bottom of the module. If the fuse is
blown, fix the wiring problem and replace the fuse with a fuse of the
same type and rating.
7. Check the software configuration to ensure that the output is configured
properly.
8. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace
the Analog Combo module.
9. If the readings are incorrect on several channels of the module,
corresponding to both cables, replace the Analog Combo module.
10. If replacing the module does not fix the problem, replace the FTM. See
instructions for replacing the FTM in Chapter 15, Installation. The FTM
does not contain any active components on the MPU inputs, so replacing
it should be the last option.
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Actuator Outputs
If an actuator output is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 15, Installation.
2. Check the load resistance to ensure that it is below the specified limit.
3. Check to ensure that the load wiring is isolated.
4. Check the wiring for a loose connection on the terminal blocks or
disconnected or misconnected cables.
5. Disconnect the field wiring and connect a resistor across the output.
6. If the other output channels on the Analog Combo module are also not
working, check the fuse on the Analog Combo module. See instructions
for module replacement in Chapter 15, Installation. This fuse is visible
and can be changed through the bottom of the module. If the fuse is
blown, fix the wiring problem, and replace the fuse with a fuse of the
same type and rating.
7. Check the software configuration to ensure that the output is configured
properly.
8. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace
the Analog Combo module.
9. If the readings are incorrect on several channels of the module,
corresponding to both cables, replace the Analog Combo module.
10. If replacing the module does not fix the problem, replace the FTM. See
instructions for replacing the FTM in Chapter 15, Installation. The FTM
does not contain any active components on the MPU inputs, so replacing
it should be the last option.
If power has not been removed from the control system, power will
be active at the module and also at the FTM. Shorting of protected
circuitry could cause a control system shutdown.
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9.6.2—Module Specifications
Thermocouple/4-20 mA Analog Inputs
Number of channels: 24
Current range: 0-24 mA (if configured for 4–20 mA)
Voltage range: ±72.8 mV (if configured for thermocouple)
Input impedance: 103 ohms (±1%) for 4-20 mA inputs
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Thermocouple Accuracy
The overall accuracy of the thermocouple measurement is dependent on the
ambient temperature of the board. The following accuracies are based on a
board temperature between 0 and 55C. All accuracies are in percent of full scale
range for the type of thermocouple and the range specified.
CJ Update time: 5 ms
CJ accuracy: ±3 C
Latency
odd numbered channels: 1 ms
even numbered channels: 3 ms
Failure detection: Open wire detection provided for thermocouples
Isolation: All input channels are isolated from the rest of
the MicroNet platform to 500 Vdc, however they
are not isolated from each other. The inputs are
differential, with a high impedance between
channels.
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RTD Range
(Must conform to DIN (Deutsche Institut für Normung) standard for 100 or 200
ohm European curve (Alpha = .00385) or American curve 100 or 200 ohm curve
(Alpha = .00392))
100 RTD (European Curve): 18.49 (–200 C/–328 F) to 390.48 (850
C/1562 F)
200 RTD (European Curve): 37.04 (–200 C/–328 F) to 533.10 (457
C/854.6 F)
100 RTD (American Curve): 59.57 (–100 C/–148 F) to 269.35 (457
C/854.6 F)
200 RTD (American Curve): 119.14 (–100 C/–148 F) to 538.70
(457 C/854.6 F)
RTD Accuracy
The overall accuracy of the RTD measurement is dependent on the ambient
temperature of the board. The following accuracies are based on a board
temperature between 0 and 55C. All accuracy are in percent of full scale range
for the type of RTD specified.
Update time: 5 ms
I/O Latency: 1 ms
Isolation: All input channels are isolated from the rest of the MicroNet platform to
500 Vdc, however inputs are not isolated from each other.
9.6.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.
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In a Simplex system, each 34Ch HDVIM module is connected through two high
density 62 conductor analog cables to two 34Ch HDVIM FTMs. All inputs on the
module are accessible on the FTM, and the channels are labeled to correspond
to their software locations (e.g., analog input 1 on the FTM will be analog input 1
in the application software). See Figure 9-21. for an example.
J1
P1
J2
P1
P2
34Ch HDVIM FTM
J1 (AI/TC Ch. 1-12)
(RTD Ch. 1-4)
Loop power for the Analog inputs must be supplied by an external supply, if
needed. This supply should be wired to terminals 40 and 81 on each FTM. The
FTM will fuse and distribute the power to 9 sets of terminals on the FTM. The 4–
20 mA, thermocouple, or RTD configurable inputs are selected in the GAP block
software, for each input. The GAP block configuration sets input gain via
software. The maximum wire size that the FTM can accept is one 16 AWG or two
20 AWG wires.
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4-20 mA Inputs
For a 4–20 mA input signal, the 34Ch HDVIM module uses a 100 ohm resistor
across the input. All 4–20 mA inputs may be used with two-wire ungrounded
(loop powered) transducers or isolated (self-powered) transducers. All Analog
inputs have 11 Vdc of common mode rejection. If interfacing to a non-isolated
device, which may have the potential of reaching over 11 Vdc with respect to the
control’s common, the use of a loop isolator is recommended to break any return
current paths, which could produce erroneous readings. 0-5 V inputs are not
supported by this module. No loop power is provided by the MicroNet module. An
external supply must be connected to the FTM for powering loop powered inputs.
RTD Inputs
RTD inputs must be configured to use either the European or American curve in
software. Only 100 and 200 ohm platinum RTDs are supported. 200 ohm RTDs
are limited to the maximum temperature on the American curve, even when the
European curve is used. The RTD source current is 2 mA, and the RTD sense
input should be tied to the negative side of the RTD, at the RTD.
Thermocouple Inputs
See Module Specifications for supported thermocouple types. A cold junction
sensor is provided on the 34Ch HDVIM FTM. If the actual cold junction in the
field wiring occurs elsewhere, the temperature of that junction must be brought
into the control as a thermocouple, RTD, or 4–20 mA input, and the application
software must be configured to use the appropriate cold junction temperature.
The thermocouple and cold junction input units (C or F) should be consistent in
the application software.
The first 12 Analog inputs on each FTM are isolated as a group from control
common, earth ground, and the rest of the Analog inputs. The next 4 or 6 Analog
inputs on the FTM are also isolated as a group from control common, earth
ground, and the rest of the Analog inputs. This results in 4 isolated groups of
inputs on each module.
9.6.4—FTM Reference
See Chapter 13 for complete 34Ch HDVIM FTM field wiring information. See
Appendix A for proper Module, FTM, and cable part numbers.
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Figure 9-23—Analog Input Interface Wiring to the 34Ch HDVIM Module for
Thermocouple Inputs
Figure 9-24—Analog Input Interface Wiring to the 34Ch HDVIM Module for
4–20 mA Inputs
Figure 9-25—4–20 mA Input Interface Wiring to the 34Ch HDVIM Module for
4–20 mA on 4/20 mA/RTD Inputs
Figure 9-26—RTD Input Interface Wiring to the 34Ch HDVIM Module for RTDs
on 4–20 mA/RTD Inputs
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9.6.5—Troubleshooting
Each 34Ch HDVIM module has a red fault LED that is turned on when the
system is reset. During initialization of a board, which occurs after every CPU
reset, the CPU turns the Fault LED on. The CPU then tests the board using
diagnostic routines built into the software. If the diagnostic test is not passed, the
LED remains on or blinks. If the test is successful, the LED goes off. If the fault
LED on a board is illuminated after the diagnostics and initialization have been
completed, the 34Ch HDVIM module may be faulty.
Analog Input Faults. The application software may set a high and low latch set
point to detect input faults. For thermocouple inputs, open wire detection is
provided.
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Troubleshooting Guide
If an Analog input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the shields and grounding section in Chapter 15, installation.
2. Measure the input voltage on the terminal block. It should be in the range
of 0–5 V for 4–20 mA inputs. RTD inputs have a 2 mA current source.
Thermocouple inputs should have the appropriate millivolt signal.
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
Thermocouple inputs are extremely sensitive to signal fluctuations.
4. Check the wiring. For a 4–20 mA input if the input is reading 0 or the
engineering units that correspond to 0 mA, look for a loose connection at
the terminal blocks and disconnected or misconnected cables.
5. For RTD inputs, check for proper connection of the sense line.
6. For thermocouple inputs, check for proper cold junction location.
7. If the input is reading high, check that the power is not connected across
the input directly.
8. Check the software configuration to ensure that the input is configured
properly. Ensure that the proper RTD or thermocouple type is selected, if
applicable.
9. After verifying all of the above, exchange the J1 and J2 cables. If the
problem moves to a different channel, replace the cable. If not, replace
the 34Ch HDVIM module.
10. If the readings are incorrect on several channels of the 34Ch HDVIM
module, corresponding to both cables, replace the 34Ch HDVIM module.
11. If replacing the module does not fix the problem, replace the FTM. See
the instructions in Chapter 15, Installation, for replacing the FTM. The
FTM contains only traces and a few discrete components, so failure is
extremely unlikely.
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9.8.2—Specification
Number of Channels: 8
Input Range: 0-25 mA
Accuracy: 0.5% of full scale
Temperature Coefficient: 12 ppm/degrees C
Anti-aliasing filter 2 poles at 12 ms (Channels 1-8)
Module interface: VMEbus
Resolution: 16 bit converter
Isolation: 1500 Vac continuous (channel input to control
common)
CMRR: -90 db
Input Impedance: 249 ohms
Status Indication: RED LED - channel fault or board fault
9.8.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.
In a simplex system, each 8Ch Current Input (4-20 mA) module is connected
through one Low Density Analog cable to one Analog Input FTM. All of the I/O
are accessible on the FTM. See Figure 9-28 for configuration.
J1
P1
P2
J1
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Field Wiring
See Chapter 13 for detail wiring connections for the Analog Input FTM. See
Figure 9-29 for transducer wiring.
All analog inputs may be used with two-wire ungrounded (loop powered)
transducers or isolated (self-powered) transducers. Loop powered or self
powered 4–20 mA transducers may be connected to the current input modules
via the Analog Input FTM shown in Figure 9-29.
9.8.4—FTM Reference
See Chapter 13 for complete Analog Input FTM field wiring. See Appendix A for
proper Module, FTM, and cable part numbers.
9.8.5—Troubleshooting
The input MUX (multiplexer) permits the module to read either the value of the
precision-voltage reference for this channel, or the sensed input for this channel.
The MUX receives the current input and, under the control of the microcontroller,
passes the value through the Gain amplifier to the Isolation Amplifier. The output
of the Isolation Amplifier goes to one input of the channel-selecting MUX.
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J2 J1 TB1
-15V +15V
19 19 1 +
15V1
.01uF Loop Powered
Gnd - Transducer
18 18 2
A1
+ 7.5V
Anti- 37 37 20
249
AI_01 aliasing Ohm
- Filter 36 36 21
-15V +15V
15V2 17 17 3
.01uF
Gnd
16 16 4
A2
+ 7.5V
35 35 22 +
Anti-
249 Self Powered
AI_02 aliasing Ohm Transducer
- Filter 34 34 23 -
-15V +15V
15V3 15 15 5 +15V
.01uF
Gnd
14 14 6 SHLD
7.5V
A3
Ch. 3
+
Anti- 33 33 24 +Input
249
AI_03 aliasing Ohm
- Filter 32 32 25 -Input
-15V +15V
15V4 13 13 7 +15V
.01uF
Gnd
12 12 8 SHLD
7.5V
A4
Ch. 4
+
Anti- 31 31 26 +Input
249
AI_04 aliasing Ohm
- Filter 30 30 27 -Input
-15V +15V
15V5 11 11 9 +15V
.01uF
Gnd
10 10 10 SHLD
7.5V
A5
Ch. 5
+
Anti- 29 29 28 +Input
249
AI_05 aliasing Ohm
- Filter 28 28 29 -Input
-15V +15V
15V6 9 9 11 +15V
.01uF
Gnd
8 8 12 SHLD
7.5V
A6
Ch. 6
+
Anti- 27 27 30 +Input
249
AI_06 aliasing Ohm
- Filter 26 26 31 -Input
-15V +15V
15V7 7 7 13 +15V
.01uF
Gnd
6 6 14 SHLD
7.5V
A7
Ch. 7
+
Anti- 25 25 32 +Input
249
AI_07 aliasing Ohm
- Filter 24 24 33 -Input
-15V +15V
15V8 5 5 15 +15V
.01uF
Gnd
4 4 16 SHLD
7.5V
A8
Ch. 8
+
Anti- 23 23 34 +Input
249
AI_08 aliasing Ohm
- Filter 22 22 35 -Input
3 3 17
2 2 18
1 1 19
21 21 36
20 20 37
Ground to DIN Rail
J1 Outer Shell 38
Figure 9-29—Analog Input Wiring for an 8Ch Current Input (0-25mA) Module
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This MUX, under control of the microprocessor, selects the channel to be read.
The analog output of this MUX is converted to a digital value by the A/D
converter, and passed to the microcontroller. The microcontroller makes any
necessary corrections to this value and stores the result in the Dual-Port RAM.
The CPU can then access the values stored in Dual-Port RAM through the VME
interface and bus. See Figure 9-30 for block diagram of module.
During initialization, which occurs after every reset, the CPU turns the FAULT
LEDs on. The CPU then tests each I/O module using diagnostic routines built
into software. If the diagnostic test is not passed, the LED remains on. If the test
is successful, the LED goes off.
During initialization of the module, the module's micro-controller turns the LED off
after power-on self tests have passed and the CPU has initialized the module.
The CPU also tells this module in which rate group each channel is to run, as
well as special information. At run time, the CPU then periodically broadcasts a
"key" to all I/O cards, telling them which rate groups are to be updated at that
time. Through this initialization/key broadcast system, each I/O module handles
its own rate-group scheduling with minimal CPU intervention.
This module also has on-card on-line fault detection and automatic
calibration/compensation. Each input channel has its own precision voltage
reference. Once per minute, while not reading inputs, the on-board
microcontroller reads this reference. The microcontroller then uses this data read
from the voltage reference for both fault detection and automatic temperature
compensation/calibration.
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Limits have been set for the expected readings when the on-board
microcontroller reads each voltage reference. If the reading obtained is outside
these limits, the system determines that the input channel, A/D converter, or the
channel's precision-voltage reference is not functioning properly. If this happens,
the micro-controller flags that channel as having a fault condition. The CPU will
then take whatever action the application engineer has provided for in the
application program.
The readings from the precision-voltage reference are also used for on-line
temperature compensation and automatic calibration for the module. The
readings of the precision-voltage reference, obtained from the A/D converter, are
used by the microcontroller to determine software scaling- and offset-constants
for each channel. These scaling-and offset-constants are respectively multiplied
by and added to each channel reading to provide corrected channel readings.
The module therefore includes no potentiometers and needs no calibration.
Each I/O module has a fuse on it; this fuse is visible and can be changed through
a cutout in the plastic cover of the module. If this fuse is blown, replace it with a
fuse of the same type and size.
Troubleshooting Guide
If a current input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 15, Installation.
2. Measure the input voltage across the + and – inputs on the terminal
block. It should be in the range of 0-5 V.
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
4. Check the wiring. If the inputs are reading 0 or the engineering units that
correspond to 0 mA, look for a loose connection on the terminal blocks,
disconnected or misconnected cables.
5. Check the software configuration to ensure that the input is configured
properly.
6. If the other channels on the module are not working either, check the
fuse on the 8Ch Current Input (0-25mA) module. This fuse is visible and
can be changed through the bottom of the module. If the fuse is blown,
fix the wiring problem, then replace the fuse with another fuse of the
same type and rating.
7. If the problem remains,, swap out the 8Ch Current Input (0-25mA)
module with another module of the same part number. If the problem
remains, replace the cable.
8. If the problem remains, replace the FTM. The FTM contains only traces
and a few discrete components, so failure is extremely unlikely. See
instructions for replacing the FTM in Chapter 15, Installation.
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9.9.2—Specification
Number of Channels: 8
Input Range: 0-25 mA
Accuracy: 0.5% of full scale
Temperature Coefficient: 12 ppm/degrees C
Anti-aliasing filter 2 poles at 12 ms (Channels1-6)
Anti-aliasing filter 2 poles at 5 ms (Channels 7-8)
(Channel 8 is the derivative of channel 7.)
Module interface: VMEbus
Resolution: 16 bit converter
Isolation: 1500 Vac continuous (channel input to control
common)
CMRR: -90 db
Input Impedance: 249 Ohms
Status Indication: RED LED - channel fault or board fault
9.9.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.
In a simplex system, each 8Ch Current Input module is connected through one
analog cable to one FTM. All of the I/O are accessible on the FTM.
J1
P1
P2
J1
Non-Standard
Analog Input FTM
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Field Wiring
See Chapter 13 for detail wiring connections for the Non-standard Analog Input
FTM. See Figure 9-33 for transducer wiring.
The first six analog inputs may be used with two-wire ungrounded (loop powered)
transducers or isolated (self-powered) transducers. The seventh channel can be
used with a self powered transducer only. Channel eight should not be
connected to any field wiring. Loop powered or self powered 4–20 mA
transducers may be connected to the current input modules via the Non-
Standard Analog Input FTM shown in Figure 9-33.
9.9.4—FTM Reference
The output from channel seven is split and fed to channel seven on the Non-
Standard Current Input (4-20 mA) Module and also fed through a derivative
circuit on the FTM to channel eight on the Non-Standard Current Input (4-20 mA)
Module. See Chapter 13 for complete field wiring information for the Non-
Standard Analog Input FTM. See Appendix A for proper Module, FTM, and cable
part numbers.
9.9.5—Troubleshooting
The input MUX (multiplexer) permits the module to read either the value of the
precision-voltage reference for this channel, or the sensed input for this channel.
The MUX receives the current input and, under the control of the microcontroller,
passes the value through the Gain amplifier to the Isolation Amplifier. The output
of the Isolation Amplifier goes to one input of the channel-selecting MUX.
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
MicroNet Module CABLE FTM
J2 J1 TB1
-15V +15V
19 19 1 +
15V1
.01uF Loop Powered
Gnd - Transducer
18 18 2
A1
+ 7.5V
Anti- 37 37 20
249
AI_01 aliasing Ohm
- Filter 36 36 21
-15V +15V
15V2 17 17 3
.01uF
Gnd
16 16 4
A2
+ 7.5V
35 35 22 +
Anti-
249 Self Powered
AI_02 aliasing Ohm Transducer
- Filter 34 34 23 -
-15V +15V
15V3 15 15 5 +15V
.01uF
Gnd
14 14 6 SHLD
7.5V
A3
Ch. 3
+
Anti- 33 33 24 +Input
249
AI_03 aliasing Ohm
- Filter 32 32 25 -Input
-15V +15V
15V4 13 13 7 +15V
.01uF
Gnd
12 12 8 SHLD
7.5V
A4
Ch. 4
+
Anti- 31 31 26 +Input
249
AI_04 aliasing Ohm
- Filter 30 30 27 -Input
-15V +15V
15V5 11 11 9 +15V
.01uF
Gnd
10 10 10 SHLD
7.5V
A5
Ch. 5
+
Anti- 29 29 28 +Input
249
AI_05 aliasing Ohm
- Filter 28 28 29 -Input
-15V +15V
15V6 9 9 11 +15V
.01uF
Gnd
8 8 12 SHLD
7.5V
A6
Ch. 6
+
Anti- 27 27 30 +Input
249
AI_06 aliasing Ohm
- Filter 26 26 31 -Input
-15V +15V
15V7 7 7 13 +15V
.01uF
Gnd
6 6 14 SHLD
7.5V
A7
Ch. 7
+ Special 25 25 32 +Input
Anti- 249
AI_07 aliasing Ohm
- 24 24 33 -Input
Filter
+15V In
Derivative
Circuit
-15V Out
-15V +15V
15V8 5 5 15 NC
.01uF
Gnd
4 4 16 NC
7.5V
A8
Ch. 8
+ Special 23 23 34 NC
Anti- 249
AI_08 aliasing Ohm
- 22 22 35 NC
Filter
3 3 17
2 2 18
1 1 19
21 21 36
20 20 37
Ground to DIN Rail
J1 Outer Shell 38
Figure 9-33—Analog Input Wiring for a Non-Standard 8Ch Current Input (0–25
mA) Module
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This MUX, under control of the microprocessor, selects the channel to be read.
The analog output of this MUX is converted to a digital value by the A/D
converter, and passed to the microcontroller. The microcontroller makes any
necessary corrections to this value and stores the result in the Dual-Port RAM.
The CPU can then access the values stored in Dual-Port RAM through the VME
interface and bus. See Figure 9-30 for block diagram of module.
During initialization, which occurs after every reset, the CPU turns the FAULT
LEDs on. The CPU then tests each I/O module using diagnostic routines built
into software. If the diagnostic test is not passed, the LED remains on. If the test
is successful, the LED goes off.
During initialization of the module, the module's micro-controller turns the LED off
after power-on self tests have passed and the CPU has initialized the module.
The CPU also tells this module in which rate group each channel is to run, as
well as special information. At run time, the CPU then periodically broadcasts a
"key" to all I/O cards, telling them which rate groups are to be updated at that
time. Through this initialization/key broadcast system, each I/O module handles
its own rate-group scheduling with minimal CPU intervention.
This module also has on-card on-line fault detection and automatic
calibration/compensation. Each input channel has its own precision voltage
reference. Once per minute, while not reading inputs, the on-board
microcontroller reads this reference. The microcontroller then uses this data read
from the voltage reference for both fault detection and automatic temperature
compensation/calibration.
Limits have been set for the expected readings when the on-board
microcontroller reads each voltage reference. If the reading obtained is outside
these limits, the system determines that the input channel, A/D converter, or the
channel's precision-voltage reference is not functioning properly. If this happens,
the micro-controller flags that channel as having a fault condition. The CPU will
then take whatever action the application engineer has provided for in the
application program.
The readings from the precision-voltage reference are also used for on-line
temperature compensation and automatic calibration for the module. The
readings of the precision-voltage reference, obtained from the A/D converter, are
used by the microcontroller to determine software scaling- and offset-constants
for each channel. These scaling-and offset-constants are respectively multiplied
by and added to each channel reading to provide corrected channel readings.
The module therefore includes no potentiometers and needs no calibration.
Each I/O module has a fuse on it; this fuse is visible and can be changed through
a cutout in the plastic cover of the module. If this fuse is blown, replace it with a
fuse of the same type and size.
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Troubleshooting Guide
If a current input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 15, Installation.
2. Measure the input voltage across the + and – inputs on the terminal
block. It should be in the range of 0-5 V.
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
4. Check the wiring. If the inputs are reading 0 or the engineering units that
correspond to 0 mA, look for a loose connection on the terminal blocks,
disconnected or misconnected cables.
5. Check the software configuration to ensure that the input is configured
properly.
6. If the other channels on the module are not working either, check the
fuse on the Non-Standard 8Ch Current Input (0-25mA) module. This fuse
is visible and can be changed through the bottom of the module. If the
fuse is blown, fix the wiring problem, then replace the fuse with another
fuse of the same type and rating.
7. If the problem remains,, swap out the Non-Standard 8Ch Current Input
(0-25mA) module with another module of the same part number. If the
problem remains, replace the cable.
8. If the problem remains, replace the FTM. The FTM contains only traces
and a few discrete components, so failure is extremely unlikely. See
instructions for replacing the FTM in Chapter 15, Installation.
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
9.11.2—Specification
Number of Channels: 8
Input Range: 0-10 Volts
Accuracy: 0.5% of full scale
Temperature Coefficient: 12 ppm/degrees C
Anti-aliasing filter 2 poles at 12 ms (Channels 1-8)
Module interface: VMEbus
Resolution: 16 bit converter
Isolation: 1500 Vac continuous (channel input to control
common)
CMRR: -90 db
Input Impedance: 2 MΩ
Status Indication: RED LED - channel fault or board fault
9.11.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.
In a simplex system, each 8Ch Voltage Input module is connected through one
analog cable to one FTM. All of the I/O are accessible on the FTM.
J1
P1
P2
J1
Field Wiring
See Chapter 13 for detail wiring connections for the Analog Input FTM. See
Figure 9-36 for transducer wiring.
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J2 J1 TB1
19 19 1 NC
.01uF
18 18 2
+
37 37 20 +
Anti-
0-10VDC
AI_01 aliasing
Transducer
- Filter 36 36 21 -
17 17 3 NC
.01uF
16 16 4 SHLD
+
Anti- 35 35 22 +Input Ch. 2
AI_02 aliasing
- Filter 34 34 23 -Input
15 15 5 NC
.01uF
14 14 6 SHLD
+
Anti- 33 33 24 +Input Ch. 3
AI_03 aliasing
- Filter 32 32 25 -Input
13 13 7 NC
.01uF
12 12 8 SHLD
+
Anti- 31 31 26 +Input Ch. 4
AI_04 aliasing
- Filter 30 30 27 -Input
11 11 9 NC
.01uF
10 10 10 SHLD
+
Anti- 29 29 28 +Input Ch. 5
AI_05 aliasing
- Filter 28 28 29 -Input
9 9 11 NC
.01uF
8 8 12 SHLD
+
Anti- 27 27 30 +Input Ch. 6
AI_06 aliasing
- Filter 26 26 31 -Input
7 7 13 NC
.01uF
6 6 14 SHLD
+
Anti- 25 25 32 +Input Ch. 7
AI_07 aliasing
- Filter 24 24 33 -Input
5 5 15 NC
.01uF
4 4 16 SHLD
+
Anti- 23 23 34 +Input Ch. 8
AI_08 aliasing
- Filter 22 22 35 -Input
3 3 17
2 2 18
1 1 19
21 21 36
20 20 37
Ground to DIN Rail
J1 Outer Shell 38
Figure 9-36—Voltage Input Wiring for an 8Ch Voltage Input (0–10 Vdc) Module
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9.11.4—FTM Reference
See Chapter 13 for complete field wiring information for the Voltage Input (0–10
Vdc) FTM. See Appendix A for part number Cross Reference for modules, FTMs,
and cables.
9.11.5—Troubleshooting
The input MUX (multiplexer) permits the module to read either the value of the
precision-voltage reference for this channel, or the sensed input for this channel.
The MUX receives the voltage input and, under the control of the microcontroller,
passes the value through the Gain amplifier to the Isolation Amplifier. The output
of the Isolation Amplifier goes to one input of the channel-selecting MUX.
This MUX, under control of the microprocessor, selects the channel to be read.
The analog output of this MUX is converted to a digital value by the A/D
converter, and passed to the microcontroller. The microcontroller makes any
necessary corrections to this value and stores the result in the Dual-Port RAM.
The CPU can then access the values stored in Dual-Port RAM through the VME
interface and bus. See Figure 9-37 for block diagram of module.
During initialization, which occurs after every reset, the CPU turns the FAULT
LEDs on. The CPU then tests each I/O module using diagnostic routines built
into software. If the diagnostic test is not passed, the LED remains on. If the test
is successful, the LED goes off.
During initialization of the module, the module's micro-controller turns the LED off
after power-on self tests have passed and the CPU has initialized the module.
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The CPU also tells this module in which rate group each channel is to run, as
well as special information. At run time, the CPU then periodically broadcasts a
"key" to all I/O cards, telling them which rate groups are to be updated at that
time. Through this initialization/key broadcast system, each I/O module handles
its own rate-group scheduling with minimal CPU intervention.
This module also has on-card on-line fault detection and automatic
calibration/compensation. Each input channel has its own precision voltage
reference. Once per minute, while not reading inputs, the on-board
microcontroller reads this reference. The microcontroller then uses this data read
from the voltage reference for both fault detection and automatic temperature
compensation/calibration.
Limits have been set for the expected readings when the on-board
microcontroller reads each voltage reference. If the reading obtained is outside
these limits, the system determines that the input channel, A/D converter, or the
channel's precision-voltage reference is not functioning properly. If this happens,
the micro-controller flags that channel as having a fault condition. The CPU will
then take whatever action the application engineer has provided for in the
application program.
The readings from the precision-voltage reference are also used for on-line
temperature compensation and automatic calibration for the module. The
readings of the precision-voltage reference, obtained from the A/D converter, are
used by the microcontroller to determine software scaling- and offset-constants
for each channel. These scaling-and offset-constants are respectively multiplied
by and added to each channel reading to provide corrected channel readings.
The module therefore includes no potentiometers and needs no calibration.
Each I/O module has a fuse on it; this fuse is visible and can be changed through
a cutout in the plastic cover of the module. If this fuse is blown, replace it with a
fuse of the same type and size.
Troubleshooting Guide
If a voltage input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 15, Installation.
2. Measure the input voltage across the + and – inputs on the terminal
block. It should be in the range of 0-5 V.
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
4. Check the wiring. If the inputs are reading 0 or the engineering units that
correspond to 0 V, look for a loose connection on the terminal blocks,
disconnected or misconnected cables.
5. Check the software configuration to ensure that the input is configured
properly.
6. If the other channels on the module are not working either, check the
fuse on the 8Ch Voltage Input (0-10 Vdc) module. This fuse is visible and
can be changed through the bottom of the module. If the fuse is blown,
fix the wiring problem, then replace the fuse with another fuse of the
same type and rating.
7. If the problem remains,, swap out the 8Ch Voltage Input (0-10 Vdc)
module with another module of the same part number. If the problem
remains, replace the cable.
8. If the problem remains, replace the FTM. The FTM contains only traces
and a few discrete components, so failure is extremely unlikely. See
instructions for replacing the FTM in Chapter 15, Installation.
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9.13.2—Specification
Number of Channels: 8
Current range: 0–25 mA
Maximum load resistance: 600 ohms max.
Analog Channel bandwidth: 500 Hz min.
Module interface: VMEbus
Output update time: 1 ms
Resolution: 12 bit
Accuracy: 0.1% of full scale @25 degrees C
Maximum Drift: 50 ppm/degrees C
Status Indication: RED LED - channel fault or board fault
Channel faults: Output current monitored
Microcontroller faults: System monitors a software watchdog
System faults: All outputs are set to zero if MFT is lost.
Operating Temp: 0 to 70 °C
Isolation: None
9.13.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.
In a simplex system, each 8Ch Current Output module is connected through one
analog cable to one FTM. All of the I/O are accessible on the FTM.
J1
P1
P2
J1
There are 8 analog output channels of 4–20 mA with a full scale range of 0-25
mA. All Analog Outputs can drive a maximum load of 600 ohms (load + wire
resistance). See Figure 9-40 for analog output connection. Each output monitors
the output source current for fault detection. All of the analog outputs may be
individually disabled. When a channel fault or a module fault is detected, the
application program may annunciate the fault, disable the channel and stop using
data in system calculations or control. Care should be taken to prevent ground
loops and other faults when interfacing to non-isolated devices.
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
J2 J1 TB1
19 19 1 NC
+24 .01uF
V
18 18 2 SHLD
37 37 20 +Output Ch. 1
I/O Lockout AO_01
36 36 21 -Output
Analog
+
Output 17 17 3 NC
- .01uF
Feedback
16 16 4
Analog
B +
Output 35 35 22 Ch. 2
Output
AO_02 Device
34 34 23 -
24 COM
15 15 5 NC
.01uF
14 14 6 SHLD
33 33 24 +Output Ch. 3
AO_03
32 32 25 -Output
13 13 7 NC
.01uF
12 12 8 SHLD
31 31 26 +Output Ch. 4
AO_04
30 30 27 -Output
11 11 9 NC
.01uF
10 10 10 SHLD
29 29 28 +Output Ch. 5
AO_05
28 28 29 -Output
9 9 11 NC
.01uF
8 8 12 SHLD
27 27 30 +Output Ch. 6
AO_06
26 26 31 -Output
7 7 13 NC
.01uF
6 6 14 SHLD
25 25 32 +Output Ch. 7
AO_07
24 24 33 -Output
5 5 15 NC
.01uF
4 4 16 SHLD
23 23 34 +Output Ch. 8
AO_08
22 22 35 -Output
3 3 17 NC
2 2 18 NC
1 1 19 NC
21 21 36 NC
20 20 37
Ground to DIN Rail
J1 Outer Shell 38
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9.13.4—FTM Reference
See Chapter 13 for complete field wiring information for the 8Ch Current Output
(4–20 mA) FTM. See Appendix A for part number Cross Reference for modules,
FTMs, and cables.
9.13.5—Troubleshooting
The system writes output values to the Dual-Port RAM through the VME bus and
interface. The microcontroller scales the data using calibration constants stored
in EEPROM, and schedules outputs to occur at the proper time.
The microcontroller monitors the output current of each channel and alerts the
system if a fault is detected. The current-output drivers can be disabled by the
system. If a fault, which prevents the entire card from operating is detected by
either the microcontroller or the system, the FAULT LED will illuminate. See
Figure 9-41 for module block diagram.
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
7. Check the software configuration to ensure that the output is configured
properly.
8. After verifying all of the above, replace the 8Ch Current Output ( 4–20
mA) Module.
9. If replacing the module does not fix the problem, replace the FTM. See
instructions for replacing the FTM in Chapter 15, Installation. The FTM
does not contain any active components on the MPU inputs, so replacing
it should be the last option.
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9.14.2—Specification
Number of Channels: 8
Current range: 0 – 1.25 mA
Maximum load resistance: 10K ohms max.
Analog Channel bandwidth: 500 Hz min.
Module interface: VMEbus
Output update time: 1mS
Resolution: 12 bit
Accuracy: 0.1% of full scale @25 °C
Maximum Drift: 50 ppm/degrees C
Status Indication: RED LED - channel fault or board fault
Channel faults: Output current monitored
Microcontroller faults: System monitors a software watchdog
System faults: All outputs are set to zero if MFT is lost.
Operating Temp: 0 to 70 °C
Isolation: None
9.14.3—Installation
See 8Ch Current Output (4-20 mA) Module.
9.14.4—FTM Reference
See Chapter 13 for complete field wiring information for the 8Ch Current Output
(0–1 mA) FTM. See Appendix A for part number Cross Reference for modules,
FTMs, and cables.
9.14.5—Troubleshooting
See 8Ch Current Output (4-20 mA) Module.
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9.16.2—Specification
Number of Channels: 8
Current range: 0 – 6.25 V
Minimum load resistance: 500 ohms
Analog Channel bandwidth: 500 Hz min.
Module interface: VMEbus
Output update time: 1mS
Resolution: 12 bit
Accuracy: 0.1% of full scale @25 °C
Maximum Drift: 50 ppm/degrees C
Status Indication: RED LED - channel fault or board fault
Channel faults: Output current monitored
Microcontroller faults: System monitors a software watchdog
System faults: All outputs are set to zero if MFT is lost.
Operating Temp: 0 to 70 °C
Isolation: None
9.16.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.
In a simplex system, each 8Ch Voltage Output module is connected through one
analog cable to one FTM. All of the I/O are accessible on the FTM.
J1
P1
P2
J1
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
There are 8 analog output channels of 0-5 Vdc with a full scale range of
0-6.25 Vdc. All Analog Outputs can drive a minimum load of 500 ohms (load +
wire resistance). See Figure 9-45 for analog output connection. Each output
monitors the output source voltage for fault detection. All of the analog outputs
may be individually disabled. When a channel fault or a module fault is detected,
the application program may annunciate the fault, disable the channel and stop
using data in system calculations or control. Care should be taken to prevent
ground loops and other faults when interfacing to non-isolated devices.
9.16.4—FTM Reference
See Chapter 13 for complete field wiring information for the 8Ch Voltage Output
(0–5 Vdc) FTM. See Appendix A for part number Cross Reference for modules,
FTMs, and cables.
9.16.5—Troubleshooting
Figure 9-46 is a block diagram of the Voltage Output Module with eight 0-5 Vdc
outputs.
The system writes output values to the Dual-Port RAM through the VME bus and
interface. The microcontroller scales the data using calibration constants stored
in EEPROM, and schedules outputs to occur at the proper time.
The microcontroller monitors the output voltage of each channel and alerts the
system if a fault is detected. If a fault, which prevents the entire card from
operating is detected by either the microcontroller or the system, the FAULT LED
will illuminate.
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MicroNet Simplex & MicroNet Plus Manual 26166V1
J2 J1 TB1
19 19 1 NC
+24 V .01uF
18 18 2 SHLD
37 37 20 +Output Ch. 1
I/O Lockout AO_01
36 36 21 -Output
Analog 17 17 3 NC
Output B
.01uF
16 16 4
35 35 22 + Ch. 2
Analog Output
+ AO_02
Output - - Device
34 34 23
Feedback
24 COM 15 15 5 NC
.01uF
14 14 6 SHLD
33 33 24 +Output Ch. 3
AO_03
32 32 25 -Output
13 13 7 NC
.01uF
12 12 8 SHLD
31 31 26 +Output Ch. 4
AO_04
30 30 27 -Output
11 11 9 NC
.01uF
10 10 10 SHLD
29 29 28 +Output Ch. 5
AO_05
28 28 29 -Output
9 9 11 NC
.01uF
8 8 12 SHLD
27 27 30 +Output Ch. 6
AO_06
26 26 31 -Output
7 7 13 NC
.01uF
6 6 14 SHLD
25 25 32 +Output Ch. 7
AO_07
24 24 33 -Output
5 5 15 NC
.01uF
4 4 16 SHLD
23 23 34 +Output Ch. 8
AO_08
22 22 35 -Output
3 3 17 NC
2 2 18 NC
1 1 19 NC
21 21 36 NC
20 20 37
Ground to DIN Rail
J1 Outer Shell 38
Figure 9-45—Analog Output Wiring for an 8Ch Voltage Output (0–5 Vdc) Module
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9.17.2—Specification
Number of Channels: 8
Current range: 0 – 12.5 V
Maximum load resistance: 500 ohms min.
Analog Channel bandwidth: 500 Hz min.
Module interface: VMEbus
Output update time: 1 ms
Resolution: 12 bit
Accuracy: 0.1% of full scale @25°C
Maximum Drift: 50 ppm/degrees C
Status Indication: RED LED - channel fault or board fault
Channel faults: Output current monitored
Microcontroller faults: system monitors a software watchdog
System faults: All outputs are set to zero if MFT is lost.
Operating Temp: 0°C to 70°C
Isolation: None
9.17.3—Installation
See 8Ch Voltage Output (0-5 Vdc) Module.
9.17.4—FTM Reference
See Chapter 13 for complete field wiring information for the 8Ch Voltage Output
(0–10 Vdc) FTM. See Appendix A for part number Cross Reference for modules,
FTMs, and cables.
9.17.5—Troubleshooting
See 8Ch Voltage Output (0-5 Vdc) Module.
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
9.19.2—Specification
Number Channels: 8 double ended, fully isolated, thermocouple
input channels
1 cold junction channel.
9.19.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.
In a simplex system, each 8Ch TC (Fail Low) module is connected through one
low Density analog cable to one TC Input FTM. All of the I/O are accessible on
the FTM.
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MicroNet Simplex & MicroNet Plus Manual 26166V1
J1
P1
P2
J1
TC Input FTM
9.19.4—FTM Reference
See Chapter 13 for TC Input FTM information. See Appendix A for proper
Module, FTM, and cable part numbers.
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
J2 J1 TB1
19 19 1 NC
.01uF
18 18 2
+
37 37 20 +
Anti-
TC_01 aliasing
- Filter 36 36 21 -
17 17 3 NC
.01uF
16 16 4 SHLD
+
Anti- 35 35 22 +Input Ch. 2
TC_02 aliasing
- Filter 34 34 23 -Input
15 15 5 NC
.01uF
14 14 6 SHLD
+
Anti- 33 33 24 +Input Ch. 3
TC_03 aliasing
- Filter 32 32 25 -Input
13 13 7 NC
.01uF
12 12 8 SHLD
+
Anti- 31 31 26 +Input Ch. 4
TC_04 aliasing
- Filter 30 30 27 -Input
11 11 9 NC
.01uF
10 10 10 SHLD
+
Anti- 29 29 28 +Input Ch. 5
TC_05 aliasing
- Filter 28 28 29 -Input
9 9 11 NC
.01uF
8 8 12 SHLD
+
Anti- 27 27 30 +Input Ch. 6
TC_06 aliasing
- Filter 26 26 31 -Input
7 7 13 NC
.01uF
6 6 14 SHLD
+
Anti- 25 25 32 +Input Ch. 7
TC_07 aliasing
- Filter 24 24 33 -Input
5 5 15 NC
.01uF
4 4 16 SHLD
+
Anti- 23 23 34 +Input Ch. 8
TC_08 aliasing
- Filter 22 22 35 -Input
+15V 3 3 17 NC
Cold
CJ_09 2 2 AD590 18 NC
Junction
GND 1 1 19 NC
21 21 36 NC
20 20 37
Ground to DIN Rail
J1 Outer Shell 38
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9.19.5—Troubleshooting
The board performs on-line temperature compensation and hardware
diagnostics. To do this, once per minute, it reads two known voltages for each
channel. These values are checked against certain limits to determine if a
hardware fault has occurred. These values are also used to determine software
scaling constants used for temperature compensation. The MUX receives the
thermocouple input and, under the control of the microcontroller, passes the
value through the gain amplifier to the isolation amplifier. The output of the
isolation amplifier goes to one input of the channel-selecting MUX.
This MUX, under control of the microprocessor, selects the channel to be read.
The analog output of this MUX is converted to a digital value by the A/D
converter, and passed to the microcontroller. The microcontroller uses a lookup
table to linearize the thermocouple readings and stores the result in the Dual-Port
RAM. The CPU can then access the values stored in Dual-Port RAM through the
VME interface and bus. Upon detection of an open wire on the input, the channel
will indicate a minimum scale reading. See Figure 9-51 for module block
diagram.
During initialization, which occurs after every reset, the CPU turns the FAULT
LEDs on. The CPU then tests each I/O module using diagnostic routines built
into software. If the diagnostic test is not passed, the LED remains on. If the test
is successful, the LED goes off.
During initialization of the module, the module's micro-controller turns the LED off
after power-on self tests have passed and the CPU has initialized the module.
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The CPU also tells this module in which rate group each channel is to run, as
well as special information. At run time, the CPU then periodically broadcasts a
"key" to all I/O cards, telling them which rate groups are to be updated at that
time. Through this initialization/key broadcast system, each I/O module handles
its own rate-group scheduling with minimal CPU intervention.
This module also has on-card on-line fault detection and automatic
calibration/compensation. Each input channel has its own precision voltage
reference. Once per minute, while not reading inputs, the on-board
microcontroller reads this reference. The microcontroller then uses this data read
from the voltage reference for both fault detection and automatic temperature
compensation/calibration.
Limits have been set for the expected readings when the on-board
microcontroller reads each voltage reference. If the reading obtained is outside
these limits, the system determines that the input channel, A/D converter, or the
channel's precision-voltage reference is not functioning properly. If this happens,
the micro-controller flags that channel as having a fault condition. The CPU will
then take whatever action the application engineer has provided for in the
application program.
The readings from the precision-voltage reference are also used for on-line
temperature compensation and automatic calibration for the module. The
readings of the precision-voltage reference, obtained from the A/D converter, are
used by the microcontroller to determine software scaling- and offset-constants
for each channel. These scaling-and offset-constants are respectively multiplied
by and added to each channel reading to provide corrected channel readings.
The module therefore includes no potentiometers and needs no calibration.
Each I/O module has a fuse on it; this fuse is visible and can be changed through
a cutout in the plastic cover of the module. If this fuse is blown, replace it with a
fuse of the same type and size.
Troubleshooting Guide
If an Thermocouple input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the shields and grounding section in Chapter 15, installation.
2. Measure the input voltage on the terminal block. It should be in the range
of appropriate millivolt signal.
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
Thermocouple inputs are extremely sensitive to signal fluctuations.
4. If the input is reading minimum range, look for a loose connection at the
terminal blocks and disconnected or misconnected cables.
5. If all the temperature measurements are offset by a fixed amount , check
for proper cold junction location. Replace the FTM.
6. Check the software configuration to ensure that the input is configured
properly. Ensure that the proper thermocouple type is selected.
7. After verifying all of the above, replace the 8Ch TC module.
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9.20.2—Specification
Number Channels: 8 double ended, fully isolated, thermocouple
input channels
1 cold junction channel.
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Thermocouple Types and ranges:
9.20.3—Installation
See 8Ch TC (Fail Low) Module.
9.20.4—FTM Reference
See Chapter 13 for complete field wiring information for the 8Ch TC (Fail High)
FTM. See Appendix A for part number Cross Reference for modules, FTMs, and
cables.
9.20.5—Troubleshooting
See 8Ch TC (Fail Low) Module.
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T=(R*25.95)-(234.5)
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
9.22.2—Specification
Number of Channels: 8 semi-isolated, RTD channels
Input Type: 3 wire
(Must conform to 10 ohm copper RTD temperature/resistance relationship (Alpha
= .00427))
9.22.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.
In a simplex system, each 8Ch RDT Input Module is connected through one low
Density analog cable to one Analog Input FTM. All of the I/O are accessible on
the FTM.
J1
P1
P2
J1
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J2 J1 TB1
19 19 1
.01uF
18 18 2
+ +
Current
Source
37 37 20
RTD_01 RTD
- 36 36 21 -
17 17 3 Sense
.01uF
16 16 4 Shld
Ch. 2
+ Current
Source
35 35 22 +Input
RTD_02
- 34 34 23 -Input
15 15 5 Sense
.01uF
14 14 6 Shld
Ch. 3
+ Current
Source
33 33 24 +Input
RTD_03
- 32 32 25 -Input
13 13 7 Sense
.01uF
12 12 8 Shld
Ch. 4
+ Current
Source
31 31 26 +Input
RTD_04
- 30 30 27 -Input
11 11 9 Sense
.01uF
10 10 10 Shld
Ch. 5
+ Current
Source
29 29 28 +Input
RTD_05
- 28 28 29 -Input
9 9 11 Sense
.01uF
8 8 12 Shld
Ch. 6
+ Current
Source
27 27 30 +Input
RTD_06
- 26 26 31 -Input
7 7 13 Sense
.01uF
6 6 14 Shld
Ch. 7
+ Current
Source
25 25 32 +Input
RTD_07 - 24 24 33 -Input
5 5 15 Sense
.01uF
4 4 16 Shld
Ch. 8
+ Current
Source
23 23 34 +Input
RTD_08
- 22 22 35 -Input
3 3 17 NC
2 2 18 NC
1 1 19 NC
21 21 36 NC
20 20 37
Ground to DIN Rail
J1 Outer Shell 38
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9.22.4—FTM Reference
See Chapter 13 for complete field wiring information for the 8Ch RTD Input (10
ohm) FTM. See Appendix A for part number Cross Reference for modules,
FTMs, and cables.
9.22.5—Troubleshooting
The board performs on-line temperature compensation and hardware
diagnostics. To do this, once per minute, it reads two known voltages for each
channel. These values are checked against certain limits to determine if a
hardware fault has occurred. These values are also used to determine software
scaling constants used for temperature compensation. The MUX receives the
RTD input and, under the control of the microcontroller, passes the value through
the gain amplifier to the isolation Amplifier. The gain amplifier introduces the
proper gain for the type of RTD used. The output of the isolation amplifier goes to
one input of the channel-selecting MUX.
This MUX, under control of the microprocessor, selects the channel to be read.
The analog output of this MUX is converted to a digital value by the A/D
converter, and passed to the microcontroller. The microcontroller uses a lookup
table to linearize the RTD reading and stores the result in the Dual-Port RAM.
The CPU can then access the values stored in Dual-Port RAM through the VME
interface and bus. See Figure 9-56 for module block diagram.
During initialization, which occurs after every reset, the CPU turns the FAULT
LEDs on. The CPU then tests each I/O module using diagnostic routines built
into software. If the diagnostic test is not passed, the LED remains on. If the test
is successful, the LED goes off.
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During initialization of the module, the module's micro-controller turns the LED off
after power-on self tests have passed and the CPU has initialized the module.
The CPU also tells this module in which rate group each channel is to run, as
well as special information. At run time, the CPU then periodically broadcasts a
"key" to all I/O cards, telling them which rate groups are to be updated at that
time. Through this initialization/key broadcast system, each I/O module handles
its own rate-group scheduling with minimal CPU intervention.
This module also has on-card on-line fault detection and automatic
calibration/compensation. Each input channel has its own precision voltage
reference. Once per minute, while not reading inputs, the on-board
microcontroller reads this reference. The microcontroller then uses this data read
from the voltage reference for both fault detection and automatic temperature
compensation/calibration.
Limits have been set for the expected readings when the on-board
microcontroller reads each voltage reference. If the reading obtained is outside
these limits, the system determines that the input channel, A/D converter, or the
channel's precision-voltage reference is not functioning properly. If this happens,
the micro-controller flags that channel as having a fault condition. The CPU will
then take whatever action the application engineer has provided for in the
application program.
The readings from the precision-voltage reference are also used for on-line
temperature compensation and automatic calibration for the module. The
readings of the precision-voltage reference, obtained from the A/D converter, are
used by the microcontroller to determine software scaling- and offset-constants
for each channel. These scaling-and offset-constants are respectively multiplied
by and added to each channel reading to provide corrected channel readings.
The module therefore includes no potentiometers and needs no calibration.
Each I/O module has a fuse on it; this fuse is visible and can be changed through
a cutout in the plastic cover of the module. If this fuse is blown, replace it with a
fuse of the same type and size.
Troubleshooting Guide
If an RTD input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the shields and grounding section in Chapter 15, installation.
2. Measure the input voltage on the terminal block (Sense to – input). It
should be in the range generated by a 4 mA current source across the
RTD.
3. Verify that there are no or minimal AC components to the Analog Input
signal. AC components can be caused by improper shielding.
4. Check for proper connection of the sense line.
5. Check the software configuration to ensure that the input is configured
properly. Ensure that the proper RTD is selected.
6. If replacing the module does not fix the problem, replace the FTM. See
the instructions in Chapter 15, Installation, for replacing the FTM. The
FTM contains only traces and a few discrete components, so failure is
extremely unlikely.
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
9.23.2—Specification
Number of Channels: 8 semi-isolated, RTD channels
Input Type: 3 wire
(Must conform to (Deutsche Institut für Normung) DIN standard for 100 ohm
European curve (Alpha = .00385) or American curve 100 ohm curve (Alpha =
.00392))
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MicroNet Simplex & MicroNet Plus Manual 26166V1
Temperature ranges
Standard module: –40 to +450 °C (100 ohm platinum, American,
European)
High Temp Module: –40 to +645 °C (100 ohm platinum, European)
–40 to +450 °C (100 ohm platinum, American)
Excitation: 2mA
Module interface: VMEbus
Output: Linearized temperatures in °C
Resolution: 14 bit converter
Accuracy: 0.5% of full scale over the entire temperature
range
Temperature Coefficient: 12 ppm/degree C
Isolation: 1500 Vac continuous (input channels to
control common, not channel to channel)
Input Impedance: 2.2 MΩ
CMRR: -90 db
Status Indication: RED LED - channel fault or board fault
9.23.3—Installation
See 8Ch RTD Input (10 ohm) Module.
9.23.4—FTM Reference
See Chapter 13 for complete field wiring information for the 8Ch RTD Input (100
ohm) FTM. See Appendix A for part number Cross Reference for modules,
FTMs, and cables.
9.23.5—Troubleshooting
See 8Ch RTD Input (10 ohm) Module.
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9.24.2—Specification
Number of Channels: 8 semi-isolated, RTD channels
Input Type: 3 wire
(Must conform to (Deutsche Institut für Normung) DIN standard for 200 ohm
European curve (Alpha = .00385) or American curve 200 ohm curve (Alpha =
.00392))
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MicroNet Simplex & MicroNet Plus Manual 26166V1
Temperature ranges –40 to +450 °C (200 ohm platinum, American,
European)
Excitation: 1mA
Module interface: VMEbus
Output: Linearized temperatures in °C
Resolution: 14 bit converter
Accuracy: 0.5% of full scale over the entire temperature
range
Temperature Coefficient: 12 ppm/degree C
Isolation: 1500 Vac continuous(input channels to control
common, not channel to channel)
Input Impedance: 2.2 MΩ
CMRR: -90 db
Status Indication: RED LED - channel fault or board fault
9.24.3—Installation
See 8Ch RTD Input (10 ohm) Module.
9.24.4—FTM Reference
See Chapter 13 for complete field wiring information for the 8Ch RTD Input (200
ohm) FTM. See Appendix A for part number Cross Reference for modules,
FTMs, and cables.
9.24.5—Troubleshooting
See 8Ch RTD Input (10 ohm) Module.
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9.25.2—Specification
Number of Channels: 8 semi-isolated, RTD channels
Input Type: 3 wire
(Must conform to (Deutsche Institut für Normung) DIN standard for 500 ohm
European curve (Alpha = .00385) or American curve 500 ohm curve (Alpha =
.00392))
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Temperature ranges –40 to +450 °C (500 ohm platinum, American,
European)
Excitation: 400 μA
Module interface: VMEbus
Output: Linearized temperatures in °C
Resolution: 14 bit converter
Accuracy: 0.5% of full scale over the `entire temperature
range
Temperature Coefficient: 12 ppm/degree C
Isolation: 1500 Vac continuous(input channels to control
common, not channel to channel)
Input Impedance: 2.2 MΩ
CMRR: -90 db
Status Indication: RED LED - channel fault or board fault
9.25.3—Installation
See 8Ch RTD Input (10 ohm) Module.
9.25.4—FTM Reference
See Chapter 13 for complete field wiring information for the 8Ch RTD Input (500
ohm) FTM. See Appendix A for part number Cross Reference for modules,
FTMs, and cables.
9.25.5—Troubleshooting
See 8Ch RTD Input (10 ohm) Module.
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9.26.1—Module Description
This module has four speed inputs that can be configured as either transformer
isolated MPU inputs or non-isolated proximity inputs. The configuration of MPU
and proximity inputs is dependent on the part number.
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9.26.2—Specification
Number Channels: 4
Input Type: MPU/Proximity Detector (factory selected by
part number)
Input Frequency Range: MPU: 50 Hz to 25 KHz
Prox: 0.04 Hz to 2 KHz
Input Amplitude: MPU: 1 Vrms min, 25 Vrms max, Freq > 20 Hz
Prox: 10 mA
Input Impedance: MPU: 2000 Ω
Prox: 2000 Ω
Isolation Voltage: MPU: 500 Vrms
Prox: None
Resolution: 16 bits
0.0015% of range per LSB
Speed Accuracy (max): 0.01% over temperature range
Temperature drift: 1 ppm/C
Derivative Accuracy (max): 0.10% of range (p-p)
Speed Filter: 5-10,000 ms (2 real poles)
Derivative Filter: 5-10,000 ms (1 pole + speed filter)
Acceleration Limit: 1-10,000 percent/second
Operating Temperature : –15 to +55 °C
9.26.3—Installation
The modules slide into card guides in the control's chassis and plug into the
motherboard. The modules are held in place by two screws, one at the top and
one at the bottom of the front panel. Also at the top and bottom of the module are
two handles which, when toggled (pushed outward), move the modules out just
far enough for the boards to disengage the motherboard connectors.
In a simplex system, each 4Ch Speed Module is connected through one low
Density analog cable to one Analog Input FTM. All of the I/O are accessible on
the FTM.
J1
P1
P2
J1
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Any of the module’s four speed channels accept passive magnetic pickup units
(MPUs) or proximity probes. The number of MPU and proximity inputs per
module is determined by the position of jumpers internal to the module. These
jumpers are factor set. The part number of the module will determine the ratio of
MPU to Proximity inputs. Each speed input channel can only accept one MPU or
one proximity probe. See Appendix A for desired part number of modules.
A proximity probe may be used to sense very low speeds. With a proximity
probe, speed can be sensed down to 0.5 Hz. When interfacing to open collector
type proximity probes, a pull-up resistor is required between the supplied
proximity probe voltage and the proximity probe input to the FTM. See Figure
7-62 for MPU and proximity probe wiring examples.
9.26.4—FTM Reference
See Chapter 13 for complete field wiring information for the 4Ch MPU/Proximity
FTM. See Appendix A for part number Cross Reference for modules, FTMs, and
cables.
9.26.5—Troubleshooting
Speed ranges are selected from the GAP and the signal is pre-scaled
accordingly. The pre-scaled signal then goes to a counter where the period of the
signal is measured. The Digital Signal Processor samples the counter's values
every 100 microseconds and performs a divide to generate a digital speed signal.
Once every rate time (5-200 ms typically), the latest speed and derivative
information is moved to the Dual-Port RAM for access by the CPU module.
During initialization, which occurs after every reset, the CPU turns the FAULT
LEDs on. The CPU then tests each I/O module using diagnostic routines built
into software. If the diagnostic test is not passed, the LED remains on. If the test
is successful, the LED goes off.
During initialization of the module, the module's micro-controller turns the LED off
after power-on self tests have passed and the CPU has initialized the module.
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MicroNet Simplex & MicroNet Plus Manual 26166V1
MicroNet Module CABLE FTM
+24VDC
+5VDC
J2 J1 TB1
19 19 1 NC
.01uF
MPU_01 18 18 2
JPR 3
+
37 37 20
JPR 1
MPU #1
36 36 21 -
17 17 3 +24V
.01uF
16 16 4 Shld
MPU/PROX_02 Ch. 2
35 35 22 +Input
34 34 23 -Input
15 15 5 +24V
.01uF
14 14 6 Shld
MPU/PROX_03 Ch. 3
+24VDC 33 33 24 +Input
+5VDC
32 32 25 -Input
13 13 7 +24VDC
.01uF
JPR 23
PROX_04 12 12 8
+
31 31 26
PROX #4
30 30 27 -
JPR 21
11 11 9 NC
.01uF
10 10 10 NC
29 29 28 NC
28 28 29 NC
9 9 11 NC
.01uF
8 8 12 NC
27 27 30 NC
26 26 31 NC
7 7 13 NC
.01uF
6 6 14 NC
25 25 32 NC
24 24 33 NC
5 5 15 NC
.01uF
4 4 16 NC
23 23 34 NC
22 22 35 NC
3 3 17 NC
2 2 18 NC
1 1 19 NC
21 21 36 NC
20 20 37
Ground to DIN Rail
J1 Outer Shell 38
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Manual 26166V1 MicroNet Simplex & MicroNet Plus
The CPU also tells this module in which rate group each channel is to run, as
well as special information. At run time, the CPU then periodically broadcasts a
"key" to all I/O cards, telling them which rate groups are to be updated at that
time. Through this initialization/key broadcast system, each I/O module handles
its own rate-group scheduling with minimal CPU intervention.
Each I/O module has a fuse on it; this fuse is visible and can be changed through
a cutout in the plastic cover of the module. If this fuse is blown, replace it with a
fuse of the same type and size.
Troubleshooting Guide
MPUs. If a magnetic pickup input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 15, Installation.
2. Measure the input voltage on the terminal block. It should be in the range
of 1-25 VRMS.
3. Verify that the signal waveform is clean and void of double zero
crossings.
4. Verify that no ground connection exists and that the resulting 60 Hz
signal is absent.
5. Measure the frequency. It should be in the range of 50 Hz - 25 kHz.
6. Check the wiring. Look for a loose connection at the terminal blocks and
disconnected or misconnected cables.
7. Check the software configuration to ensure that the input is configured
properly.
8. If the readings are incorrect on several channels of the module, replace
the Speed module.
9. If replacing the module does not fix the problem, replace the FTM. See
instructions for replacing the FTM in Chapter 15, Installation. The FTM
does not contain any active components on the MPU inputs, so replacing
it should be the last option.
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Proximity Probes
If a proximity probe input is not functioning properly, verify the following:
1. Check that the cable is shielded and the shield is properly grounded per
the Shields and Grounding section in Chapter 15, Installation.
2. Measure the input voltage on the terminal block. It should be in the range
of 3.5 - 24 Vpeak.
3. Verify that the signal waveform is clean and void of double zero
crossings.
4. Verify that no ground connection exists and that the resulting 60 Hz
signal is absent.
5. Measure the frequency. It should be in the range of 0.5 Hz to 25 kHz.
6. Check the wiring. Look for a loose connection at the terminal blocks,
disconnected or misconnected cables.
7. Check the software configuration to ensure that the input is configured
properly.
8. If the readings are incorrect on several channels of the Speed module,
replace the Speed module.
9. If replacing the module does not fix the problem, replace the FTM. See
instructions for replacing the FTM in Chapter 15, Installation.
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Woodward 241
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2010/5/Colorado