User Guide: BT85x Series
User Guide: BT85x Series
User Guide
BT85x Series
Bluetooth v4.2 Dual-Mode USB HCI Module
Version 1.0
BT85x Series
Datasheet
REVISION HISTORY
Version Date Notes Contributor Approver
1.0 07 Nov 2017 Initial Release Jacky Kuo Jonathan Kaye
CONTENTS
1 Scope ....................................................................................................................................................... 4
2 Operational Description ........................................................................................................................... 4
3 Block Diagram and Descriptions ............................................................................................................... 5
4 Specifications ........................................................................................................................................... 6
5 Pin Definitions .......................................................................................................................................... 6
6 DC Electrical Characteristics ..................................................................................................................... 8
7 RF Characteristics ..................................................................................................................................... 8
8 Interface .................................................................................................................................................. 9
8.1. Global Coexistence Interface .................................................................................................................... 9
8.2. USB Interface ......................................................................................................................................... 10
8.3. PCM Interface ........................................................................................................................................ 10
8.3.1. Slot Mapping .......................................................................................................................................... 10
8.3.2. Frame Synchronization ........................................................................................................................... 10
8.3.3. Data Formatting ....................................................................................................................................... 13
8.3.4. Wideband Speech Support ..................................................................................................................... 13
8.3.5. Multiplexed Bluetooth Over PCM ........................................................................................................... 14
8.3.6. Burst PCM Mode .................................................................................................................................... 14
8.4. I2S Interface............................................................................................................................................ 15
8.5. BSC (Cypress Serial Control) Master Interface......................................................................................... 17
9 Antenna Performance ............................................................................................................................ 19
10 Mechanical Dimensions and Land Pattern .............................................................................................. 21
11 Implementation Note ............................................................................................................................. 22
11.1. PCB Layout on Host PCB ......................................................................................................................... 22
11.1.1. Antenna Keep-out and Proximity to Metal or Plastic .............................................................................. 22
11.1.2. USB Dongle Design Example Using BT850-SA.......................................................................................... 23
12 Application Note for Surface Mount Modules ........................................................................................ 24
12.1. Introduction ........................................................................................................................................... 24
12.2. Shipping ................................................................................................................................................. 24
12.2.1. Tray Package .......................................................................................................................................... 24
12.2.2. Tape and Reel Package Information ....................................................................................................... 25
12.3. Reflow Parameters ................................................................................................................................. 26
13 Japan (MIC) Regulatory .......................................................................................................................... 27
13.1. Antenna Information .............................................................................................................................. 27
14 FCC Regulatory ....................................................................................................................................... 28
15 Industry Canada Regulatory ................................................................................................................... 30
16 European Union Regulatory ................................................................................................................... 32
17 Ordering Information ............................................................................................................................. 33
17.1. General Comments ................................................................................................................................ 33
18 Bluetooth SIG Approvals......................................................................................................................... 33
19 Additional Assistance ............................................................................................................................. 35
1 SCOPE
This document describes key hardware aspects of the Laird BT85x Bluetooth HCI module and Adapter . This
document is mainly intended to assist device manufacturers and related parties with the integration of this
module into their host devices. Data in this document are drawn from several sources including data sheets for
the Cypress CYW20704A2.
Because the BT850-Sx is currently in development stage, this document is preliminary and the information in
this document is subject to change. Please contact Laird Technologies or visit the product page on the Laird
website to obtain the most recent version of this document.
BT851
BT850-SA BT850-ST
2 OPERATIONAL DESCRIPTION
The BT85x series of USB HCI modules and Adapter leverage the Cypress CYW20704 A2 chipset to provide
exceptionally low power consumption with outstanding range for OEMs needing both Classic Bluetooth and
Bluetooth Low Energy support. The Bluetooth v4.2 core specification shortens your development time and
provides enhanced throughput, security and privacy.
The BT850 modules are ideal when designers need both performance and minimum size. For maximum
flexibility in integration, they support a host USB interface, I2S and PCM audio interfaces, GPIO, and Cypress’GCI
coexistence (2-Wire). The modules provide excellent RF performance and identical footprint options for
integrated antenna or an external antenna via a trace pin.
These modules present a Bluetooth standard HCI interface with native support for Windows, Linux and Android
Bluetooth software stacks for operating system backed devices. The BT851 Pluggable USB Adapter with inbuilt
Bluetooth stack simply plugs into any Windows, Android or Linux device via external USB connection.
Additionally, Laird has partnered with Searan for support of their ultra small, flexible ‘dotstack’ platform for
embedded Cortex M3 and M4 implementations.
CYW20704A2 The BT85x is based on CYW20704A2 dual mode chip. The chip is a single-chip radio with on-
(Main chip) chip LDO regulators and baseband IC for Bluetooth 2.4 GHz systems including EDR to 3 Mbps.
Dedicated signal and baseband processing is included for full Bluetooth operation. The chip
provides I2S/PCM and USB interfaces. There are two general purpose I/Os be configured for
proprietary of Cypress GCI used and a general purpose I/O can be configured for
scan/inquire/paging/data traffic of indicator. These three I/O pins are controlled by
firmware.
Antenna BT850-SA & BT851 – The antenna is a ceramic monopole chip antenna.
BT850-ST – Trace Pad provision for use with a range of certified External Antennas
Band Pass The band pass filter filters the out-of-band emissions from the transmitter to meet the
Filter specific regulations for type approvals of various countries.
EEPROM There are 512 k bits EEPROM embedded on the BT85x which can be used to store
parameters, such as BD_ADDR, USB enumeration information, maximum TX power, PCM
configuration, USB product ID, USB vendor ID, and USB product description. With that, the
BT850 module can support UHE/HCI Proxy mode.
Crystal The embedded 40 MHz crystal is used for generating the clock for the entire module.
4 SPECIFICATIONS
Table 1: BT850 specifications
Categories Feature Implementation
Bluetooth® V4.2 Dual Mode – BR / EDR / LE
Frequency 2.402 - 2.480 GHz
Maximum Transmit Class 1
Wireless Power +8 dBm from antenna
Specification
Receive Sensitivity -94 dBm
Range Circa 100 meters
Data Rates Up to 3 Mbps (over-the-air)
Host Interface USB Full speed USB 2.0
GPIO 3.3V for all general purpose I/Os
HCI Host Controller Interface over USB
Operational Modes
UHE USB HID Emulation
EEPROM 2-wire 512 K bits
Coexistence 802.11 (Wi-Fi) 2-Wire Cypress Global Coexistence Interface (GCI)
Supply Voltage Supply 3.3V +/-10%
Power Idle Mode ~8 mA
Current
Consumption File Transfer ~43 mA
Antenna Options Internal Multilayer ceramic antenna
External Trace Pad
8.5 x 13 x 1.6 mm (BT850-Sx - modules)
Physical Dimensions
16 x 43 x 11 (BT851 – USB dongle)
Environmental Operating -30° C to +85° C
Storage -40° C to +85° C
Lead Free Lead-free and RoHS-compliant
Miscellaneous
Warranty 1-Year warranty
Approvals Bluetooth® Controller Subsystem Approved
FCC/IC/CE/RCM/Giteki All BT85x series
5 PIN DEFINITIONS
Table 2: BT850 pin definitions
Pin No. Pin Name I/O Supply Domain Description If Unused
1 NC NC
2 NC
3 GND GND Ground GND
4 USB_D+ Bidirectional 3V3 USB data plus N/A
6 DC ELECTRICAL CHARACTERISTICS
Table 3: Recommended operating conditions
Rating Min Max Unit
Storage temperature -40 +150 ⁰C
Operating Temperature -30 +85 ⁰C
3V3 Input 3.0 3.6 V
7 RF CHARACTERISTICS
Table 6: BDR/EDR/LE transmitter characteristics (Input = 3V3 @ 25℃)
Parameter Min Typ. Max BT. Spec. Unit
GFSK Maximum RF Transmit Power 6 8 10 20 dBm
EDR Maximum RF Transmit Power 2 4 6 20 dBm
RF power variation over temperature range - 2.0 - - dB
RF power variation over BT band - 2 - - dB
RF power control step 2 4 8 - dB
8 INTERFACE
8.1. Global Coexistence Interface
The BT850-Sx supports the proprietary Cypress Global Coexistence Interface (GCI) which is a two-wire interface.
The following key features are associated with the interface:
Enhanced coexistence data can be exchanged over GCI_SECI_IN and GCI_SECI_OUT a two-wire interface,
one serial input (GCI_SECI_IN), and one serial output (GCI_SECI_OUT). The both pins are controlled by the
configuration file that is stored in EEPROM from the host.
It supports generic UART communication between WLAN and Bluetooth devices.
To conserve power, it is disabled when inactive.
It supports automatic resynchronization upon waking from sleep mode.
It supports a baud rate of up to 4 Mbps.
Error! Reference source not found. shows the 2-wire BT coexistence interface assignments.
Figure 3 and Table 10 shows PCM Timing Diagram and Specifications for the slave mode of short-frame.
Table 10: PCM Interface timing specifications (Short-Frame Sync, Slave Mode)
Ref No. Characteristics Minimum Typical Maximum Unit
1 PCM bit clock frequency - - 12 MHz
2 PCM bit clock LOW 41 - - ns
Table 11: PCM Interface timing specifications (Long-Frame Sync, Master Mode)
Ref No. Characteristics Minimum Typical Maximum Unit
1 PCM bit clock frequency - - 12 MHz
2 PCM bit clock LOW 41 - - ns
3 PCM bit clock HIGH 41 - - ns
4 PCM_SYNC delay 0 - 25 ns
5 PCM_OUT delay 0 - 25 ns
6 PCM_IN setup 8 - - ns
7 PCM_IN hold 8 - - ns
Delay from rising edge of PCM_BCLK during last bit 0 - 25 ns
8
period to PCM_OUT becoming high impedance
Figure 5 and Table 12 shows PCM Timing Diagram and Specifications for the slave mode of long-frame.
Table 12: PCM Interface timing specifications (Long-Frame Sync, Slave Mode)
Ref No. Characteristics Minimum Typical Maximum Unit
1 PCM bit clock frequency - - 12 MHz
2 PCM bit clock LOW 41 - - ns
3 PCM bit clock HIGH 41 - - ns
4 PCM_SYNC setup 8 - - ns
5 PCM_SYNC_hold 8 - - ns
6 PCM_OUT delay 0 - 25 ns
7 PCM_IN setup 8 - - ns
8 PCM_IN hold 8 - - ns
Delay from rising edge of PCM_BCLK during last bit 0 - 25 ns
9
period to PCM_OUT becoming high impedance
Figure 7: PCM burst mode timing (Receive Only, Short Frame Sync)
Table 13: PCM burst mode specifications (Receive Only, Short-Frame Sync)
Ref No. Characteristics Minimum Typical Maximum Unit
1 PCM bit clock frequency - - 24 MHz
2 PCM bit clock LOW 20.8 - - ns
3 PCM bit clock HIGH 20.8 - - ns
4 PCM_SYNC setup 8 - - ns
5 PCM_SYNC_hold 8 - - ns
6 PCM_IN setup 8 - - ns
7 PCM_IN hold 8 - - ns
Figure 8 and Table 14 shows PCM Burst mode timing diagram and specifications for the receive-only mode of
long-frame sync.
Figure 8: PCM burst mode timing (Receive Only, Long Frame Sync)
Table 14: PCM burst mode specifications (Receive Only, Long-Frame Sync)
Ref No. Characteristics Minimum Typical Maximum Unit
1 PCM bit clock frequency - - 24 MHz
2 PCM bit clock LOW 20.8 - - ns
3 PCM bit clock HIGH 20.8 - - ns
4 PCM_SYNC setup 8 - - ns
5 PCM_SYNC_hold 8 - - ns
6 PCM_IN setup 8 - - ns
7 PCM_IN hold 8 - - ns
I2S SCK and I2S WS become outputs in master mode and inputs in slave mode, while I2S SDO always stays as an
output. The channel word length is 16 bits and the data is justified so that the MSB of the left-channel data is
aligned with the MSB of the I2S bus, per the I2S specification. The MSB of each data word is transmitted one bit
clock cycle after the I2S WS transition, synchronous with the falling edge of bit clock. Left-channel data is
transmitted when I2S WS is low, and right-channel data is transmitted when I2S WS is high. Data bits sent by the
BT850 are synchronized with the falling edge of I2S_SCK and should be sampled by the receiver on the rising
edge of I2S_SSCK.
The clock rate in master mode is either of the following:
48 kHz x 32 bits per frame = 1.536 MHz
48 kHz x 50 bits per frame = 2.400 MHz
The master clock is generated from the input reference clock using a N/M clock divider.
In the slave mode, any clock rate is supported to a maximum of 3.072 MHz.
The time periods specified in Figure 9 and Figure 10 are defined by the transmitter speed. The receiver
specifications must match transmitter performance.
NVRAM may contain configuration information about the customer application, including the following:
Fractional-N information
BD_ADDR
UART baud rate
USB enumeration information
SDP service record
File system information used for code, code patches, or data
Figure 11 and Table 16 define the timing requirements for the BSC interface.
9 ANTENNA PERFORMANCE
Table 17, Figure 12, and Figure 13 shows the antenna gain and performance.
11 IMPLEMENTATION NOTE
11.1. PCB Layout on Host PCB
Checklist (for PCB):
MUST locate the BT850 module close to the edge of PCB.
Use solid GND plane on inner layer (for best EMC and RF performance).
Place GND vias close to module GND pads as possible
Route traces to avoid noise being picked up on VCC supply.
Antenna Keep-out area:
– Ensure there is no copper in the antenna keep-out area on any layers of the host PCB.
– Keep all mounting hardware and metal clear of the area to allow proper antenna radiation.
– For best antenna performance, place the BT850 module on the edge of the host PCB, preferably in the
corner with the antenna facing the corner.
– A different host PCB thickness dielectric will have small effect on antenna.
Figure 14: Recommend antenna keep-out area (in blue) used on the BT850
12.2. Shipping
12.2.1. Tray Package
Modules are shipped in ESD (Electrostatic Discharge) safe trays that can be loaded into most manufacturer’s pick
and place machines. Layouts of the trays are provided in Figure 17.
Note: Ordering information for Tape and Reel packaging is an addition of T/R to the end of the full
module part number. For example, BT850-Sx becomes BT850-Sx-T/R.
There are 2500 BT850-Sx modules taped in a reel (and packaged in a pizza box) and five boxes per carton
(12,500 modules per carton). Reel, boxes, and carton are labeled with the appropriate labels. See Figure 20.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds.
Temperatures should not exceed the minimums or maximums presented in Table 18.
14 FCC REGULATORY
Model US/FCC CANADA/IC
BT850-SA SQGBT850
BT850-ST SQGBT850
BT851 SQGBT850
DVK-BT850-SA
DVK-BT850-ST
The BT85x family has been designed to operate with the antenna listed below having a maximum gain of 0.5 dBi.
The required antenna impedance is 50 ohms.
Item Part Number Mfg. Type Gain (dBi)
1 AT3216-B2R7HAA ACX Ceramic 0.5
2 001-0030 mFlexPIFA LAIRD PIFA 2
3 001-0014 FlexPIFA LAIRD PIFA 2
4 0600-00040 LAIRD Dipole 2
5 NanoBlue MAF94045 LAIRD PCB Dipole 2
IMPORTANT:
If the conditions above cannot be met (for example certain device configurations or co-location with
another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot
be used on the final product. In these circumstances, the OEM integrator will be responsible for re-
evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
When using Laird’s FCC grant for the BT850, the integrator must include specific information in the
user’s guide for the device into which the BT850 is integrated. The integrator must not provide
information to the end user regarding how to install or remove this RF module in the user’s manual of
the device into which the BT850 is integrated. The following FCC statements must be added in their
entirety and without modification into a prominent place in the user’s guide for the device into which
the BT850 is integrated:
IMPORTANT NOTE: To comply with FCC requirements, the BT850 must not be co-located or
operating in conjunction with any other antenna or transmitter.
This device is intended only for OEM integrators under the following conditions:
The transmitter module may not be co-located with any other transmitter or antenna,
If the condition above is met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
This device is intended only for OEM integrators under the following conditions:
The transmitter module may not be co-located with any other transmitter or antenna.
If the condition above is met, further transmitter test will not be required. However, the OEM integrator is still
responsible for testing their end-product for any additional compliance requirements required with this module
installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:
Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
Tant que les 1 condition ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas
nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes
exigences de conformité supplémentaires requis pour ce module installé.
IMPORTANT NOTE:
If these conditions cannot be met (for example, certain laptop configurations or co-location with another
transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used on the
final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate Canada authorization.
NOTE IMPORTANTE:
Embedded Wireless Solutions Support Center: 30 Americas: +1-800-492-2320
http://ews-support.lairdtech.com Europe: +44-1628-858-940
www.lairdtech.com/bluetooth © Copyright 2017 Laird. All Rights Reserved Hong Kong: +852 2923 0610
BT85x Series
Datasheet
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations
d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est
plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances,
l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une
autorisation distincte au Canada.
End Product Labeling
The final end product must be labeled in a visible area with the following: “Contains IC: 3147A-BT850”.
This radio transmitter (IC: 3147A-BT850) has been approved by Industry Canada to operate with the antenna
types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a
gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Le présent émetteur radio (IC: 3147A-BT850) a été approuvé par Industrie Canada pour fonctionner avec les
types d'antenne énumérés ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans
cette liste, et dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur.
17 ORDERING INFORMATION
Part Number Description
BT850-SA BTv4.2 Dual Mode USB HCI Module – Integrated Antenna
BT851 BTv4.2 Dual Mode USB Dongle
BT850-ST BTv4.2 Dual Mode USB HCI Module –External Antenna
DVK-BT850-SA Development Kit for BT850-SA Module
DVK-BT850-ST Development Kit for BT850-ST Module
The Qualification Process requires each company to registered as a member of the Bluetooth SIG –
http://www.bluetooth.org
The following link provides a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/
For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new
qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on
your membership status, please refer to the following webpage:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees
For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG
document:
https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486
To start the listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm.
In step 1, select the option, Reference a Qualified Design and enter the Declaration IDs of each subsystem used
in the End Product design. You can then select your pre-paid Declaration ID from the drop down menu or go to
the Purchase Declaration ID page, (please note that unless the Declaration ID is pre-paid or purchased with a
credit card, it will not be possible to proceed until the SIG invoice is paid.
Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help
document. Your new Design will be listed on the SIG website and you can print your Certificate and DoC.
For further information please refer to the following training material:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates
19 ADDITIONAL ASSISTANCE
Please contact your local sales representative or our support team for further assistance:
Laird Technologies Connectivity Products Business Unit
Support Centre: http://ews-support.lairdtech.com
Email: [email protected]
Phone: Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
Web: http://www.lairdtech.com/bluetooth
© Copyright 2017 Laird. All Rights Reserved. Patent pending. Any information furnished by Laird and its agents is believed to be accurate and
reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird materials or products rests
with the end user since Laird and its agents cannot be aware of all potential uses. Laird makes no warranties as to non-infringement nor as to
the fitness, merchantability, or sustainability of any Laird materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or
any of its affiliates or agents shall not be liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the
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herein, Laird means Laird PLC or one or more subsidiaries of Laird PLC. Laird™, Laird Technologies™, corresponding logos, and other marks are
trademarks or registered trademarks of Laird. Other marks may be the property of third parties. Nothing herein provides a license under any
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