BS EN 60286-4:2013

BSI Standards Publication

Packaging of components
for automatic handling
Part 4: Stick magazines for electronic
components encapsulated in packages
of different forms
BS EN 60286-4:2013 BRITISH STANDARD

National foreword
This British Standard is the UK implementation of EN 60286-4:2013. It
is identical to IEC 60286-4:2013. It supersedes BS EN 60286-4:1998
which is withdrawn.
The UK participation in its preparation was entrusted to Technical
Committee EPL/40X, Capacitors and resistors for electronic equipment.
A list of organizations represented on this committee can be obtained on
request to its secretary.
This publication does not purport to include all the necessary provisions of
a contract. Users are responsible for its correct application.
© The British Standards Institution 2013.
Published by BSI Standards Limited 2013

ISBN 978 0 580 72420 6

ICS 31.020; 31.240

Compliance with a British Standard cannot confer immunity from

legal obligations.

This British Standard was published under the authority of the

Standards Policy and Strategy Committee on 30 November 2013.

Amendments/corrigenda issued since publication

Date Text affected

 BS EN 60286-4:2013

EUROPEAN STANDARD EN 60286-4

NORME EUROPÉENNE
EUROPÄISCHE NORM November 2013

ICS 31.020; 31.240 Supersedes EN 60286-4:1998

English version

Packaging of components for automatic handling -

Part 4: Stick magazines for electronic components encapsulated in
packages of different forms
(IEC 60286-4:2013)

Emballage des composants pour Gurtung und Magazinierung von Bauteilen

opérations automatisées – Partie 4: für automatische Verarbeitung -
Magasins chargeurs pour composants Teil 4: Stangenmagazine für elektronische
électroniques encapsulés dans des Bauelemente mit verschiedenen
boîtiers de différentes formes Gehäusen
(CEI 60286-4:2013) (IEC 60286-4:2013)

This European Standard was approved by CENELEC on 2013-08-30. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60286-4:2013 E

BS EN 60286-4:2013
EN 60286-4:2013 -2-

Foreword
The text of document 40/2230/FDIS, future edition 3 of IEC 60286-4, prepared by IEC TC 40, "Capacitors
and resistors for electronic equipment" was submitted to the IEC-CENELEC parallel vote and approved
by CENELEC as EN 60286-4:2013.

The following dates are fixed:

• latest date by which the document has (dop) 2014-05-30

to be implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2016-08-30
standards conflicting with the
document have to be withdrawn

This document supersedes EN 60286-4:1998.

EN 60286-4:2013 includes the following significant technical changes with respect to EN 60286-4:1998:

Clause 4 describes the guidelines for customer specific stick magazine design. It replaces the magazine
design rules for IEC outlined components and rules for orientation of components in stick magazines
which have been moved to Annexes Z to D.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.

Endorsement notice
The text of the International Standard IEC 60286-4:2013 was approved by CENELEC as a European
Standard without any modification.

In the official version, for Bibliography, the following note has to be added for the standard indicated:
ISO 11469 NOTE Harmonized as EN ISO 11469.
 BS EN 60286-4:2013
-3- EN 60286-4:2013

Annex ZA
(normative)

Normative references to international publications

with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 60191-3 1999 Mechanical standardization of semiconductor EN 60191-3 1999
devices -
Part 3: General rules for the preparation of
outline drawings of integrated circuits
IEC 60747-1 2006 Semiconductor devices - - -
+ corr. August 2008 Part 1: General
+ A1 2010
 BS EN 60286-4:2013
–2– 60286-4  IEC:2013

CONTENTS
1 Scope .............................................................................................................................. 5
2 Normative references ....................................................................................................... 5
3 Terms, definitions and conventions .................................................................................. 5
3.1 Terms and definitions ......................................................................................... 5
3.2 Conventions ....................................................................................................... 5
4 Shape and cross-section of stick magazine ...................................................................... 6
5 Dimensions of stick magazines ........................................................................................ 7
5.1 General .............................................................................................................. 7
5.2 Materials ............................................................................................................ 8
5.3 Recycling ........................................................................................................... 8
6 Mechanical stability .......................................................................................................... 8
7 End stoppers and spacers ................................................................................................ 9
8 Orientation of the components in the stick magazine ........................................................ 9
9 Marking ........................................................................................................................... 9
Annex A (informative) DIL packages for through-hole mount ................................................. 10
Annex B (informative) SO packages for surface mounting ..................................................... 12
Annex C (informative) Leaded chip carrier packages (PLCC) for surface mounting ............... 13
Annex D (normative) Rule for the orientation of integrated circuit packages in handling and
shipping carriers such as stick magazines and rails (from IEC 60191-3:1999, Annex G) ......... 14
Bibliography .......................................................................................................................... 16

Figure 1 – Shape and cross-sections of stick magazines ......................................................... 6

Figure 2 – Schematic of stick magazine design and schematic of package profile .................... 7
Figure A.1 – DIL packages for through-hole mounting ............................................................ 10
Figure B.1 – SO packages for surface mounting .................................................................... 12
Figure C.1 – Leaded chip carrier packages (PLCC) for surface mounting ............................... 13
Figure D.1 – Five examples of the terminal No. 1 marking locations ....................................... 15

Table 1 – Tolerances to the package profile dimensions .......................................................... 7

Table 2 – Principle of stick magazine requirements ................................................................. 8
Table 3 – Material reference for magazines and stoppers ........................................................ 8
Table A.1 – e 1 = 3 modules e ................................................................................................ 10
Table A.2 – e 1 = 4 modules e ................................................................................................ 11
Table A.3 – e 1 = 6 modules e ................................................................................................ 11
Table B.1 – Stick magazine dimensions for SO packages ...................................................... 12
Table C.1 – Stick magazine dimensions for PLCC packages .................................................. 13
BS EN 60286-4:2013
60286-4  IEC:2013 –5–

PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 4: Stick magazines for electronic components encapsulated

in packages of different forms

1 Scope

This part of IEC 60286 is applicable to stick magazines (including end stoppers) intended to be
used for storage of electronic components, for transport from the manufacturer to the customer
and for in-house use in the manufacturing plant. They are also used to feed automatic
placement machines for surface mounting as well as for through-hole mounting of electronic
components.

2 Normative references

The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.

IEC 60191-3:1999, Mechanical standardization of semiconductor devices – Part 3: General

rules for the preparation of outline drawings of integrated circuits

IEC 60747-1:2006, Semiconductor devices – Part 1: General

Amendment 1:2010

3 Terms, definitions and conventions

3.1 Terms and definitions

For the purposes of this document, the following definitions apply.

3.1.1
stick magazine
elongated container which has an appropriate cross section designed to accommodate devices

Note 1 to entry: Alternative terms such as tube, rail and magazine may be used.

3.1.2
end stoppers
mechanism placed at each end of the stick magazine to keep the devices from falling out of the
stick magazine

Note 1 to entry: Alternative terms such as pins, plugs, end plugs, nails, retainers etc. may be used, but for the
purposes of this standard "end stopper" shall be used.

3.2 Conventions

All dimensions in tables and figures representing sizes are in millimetres. All dimensions in
tables and figures representing angles or radii are in degrees.
 BS EN 60286-4:2013
–6– 60286-4  IEC:2013

4 Shape and cross-section of stick magazine

Examples of typical and customized cross-sections for stick magazines are given in Figure 1.

Customized form

IEC 1734/13

Figure 1 – Shape and cross-sections of stick magazines

Internal stick magazine configuration shall be such that the individual component is protected
from damage, maintains a fixed orientation and slides freely when one end is elevated at a
minimum angle of 30°.

As magazine material over time is changing, the level of elevation of 30° may not be sufficient
for freely sliding of components. In this case, to allow proper transition of the component from
the magazine to a horizontal surface, the level of elevation should be kept to a minimum.
BS EN 60286-4:2013
60286-4  IEC:2013 –7–

5 Dimensions of stick magazines

5.1 General

Because the shape of the cross-section varies, the controlled distance tolerances should
conform to the values in Table 1, Table 2 and Figure 2. This table provides the tolerances to
the package profile dimensions, which is a summary of the tolerances for various standard
outlines (see Annexes A, B and C).

A
T H

D
A2
B
A3

e1
E
HE
C

IEC 1735/13

Schematic of stick magazine design Schematic of package profile

L
IEC 1736/13

Figure 2 – Schematic of stick magazine design and schematic of package profile

Table 1 – Tolerances to the package profile dimensions

Functional cross reference Tolerances to package

profile dimensions
Stick magazine Package profile

A H

B A3 + 0,5
Package dimension − 0,0
C HE
D A2
Package dimension ± 0,2
E e1

NOTE 1 A 2 is the body height of the component.

NOTE 2 A 3 is the total package height of the component.

NOTE Additional protection of the component can be given by individual design to prevent cross traversing to the
stick magazine length (prevention of bend leads).
 BS EN 60286-4:2013
–8– 60286-4  IEC:2013

Table 2 – Principle of stick magazine requirements

Dimension Nominal value and

tolerances

All radii 0,5° to 1,5°

L 530 mm max.

T 0,6 mm –0,15 / +0,2

5.2 Materials

The material shall be conductive, static dissipative or antistatic (a measuring method and
requirements are under consideration).

The loaded magazines shall be suitable to withstand transport and storage without danger of
giving off vapours or of contaminating the surface of the terminations, which could make
soldering difficult or deteriorate the component properties or terminations by chemical action.

As a minimum, the component device type, manufacturer's name or trade mark and date code
shall be legible without removal of the components from the stick magazine. Where the stick
material is not transparent, a suitable window or a series of windows/holes shall be provided
for inspection purposes.

5.3 Recycling

Stick magazines should be made of recyclable material. When such material is used the
magazine shall be permanently marked with the recycling symbol.

The end-stoppers should be of the same material as the stick magazine. This does not apply to
PVC-free type stick magazines, see Table 3.

Table 3 – Material reference for magazines and stoppers

Magazine type Magazine material Stopper material

PVC type PVC (hard type) PVC (soft type)
PVC free type PVC free PVC free
(e.g. PC or PET) (e.g. Elastomer (thermoplastic))

ISO 11469 should be used.

6 Mechanical stability

The mechanical stability of a loaded magazine during storage, transport and use shall be such
that the components are adequately retained, without deformation of the terminations or other
damage, in order to maintain their orientation within the magazine, yet enabling them to be
easily removed.

The magazine, which should not exceed 530 mm in length, shall also be suitable for use with
automatic placement machines or test equipment, and should be capable of bending in the
length axis through a radius of 600 mm. They shall be so designed that they can be stacked in
the machines and shall not overturn.
BS EN 60286-4:2013
60286-4  IEC:2013 –9–

7 End stoppers and spacers

End stoppers may be used to close the ends of the stick magazines, and spacers may be used
to limit the movement of the components within the stick magazines.

For end stoppers and spacers the following rules apply:

a) They shall be of any suitable material, preferably recyclable. When such a material is used
and size permits, end stoppers and spacers shall be marked with the recycling symbol.
b) They shall be of static dissipative or antistatically-coated material, and spacers shall be of
adequate compliance to prevent component damage.
c) End stoppers shall stay in place at the ends of the magazines until they are intentionally
removed, and shall be easily removable to disperse the devices without damaging the stick
magazines.

8 Orientation of the components in the stick magazine

See IEC 60191-3:1999, Annex G.

Rule (see also Annex D).

Integrated circuit packages shall be put in stick magazines with the terminal No. 1 mark
orientation. The side with the mark has to exit first from the carrier.

When the packages are in the carrier and viewed from the top, the terminal No. 1 mark shall be
left or in the lower left corner, and component marking shall be readable from the left to right.

9 Marking

The magazines shall be marked "Dissipative" or "Antistatic" as applicable.

The direction of unloading shall be marked on the magazines.

If the components are electrostatically sensitive and require special precautions during
handling, the magazines shall also be marked as required in Clause 8 of IEC 60747-1:2006,
Amendment 1:2010.
 BS EN 60286-4:2013
– 10 – 60286-4  IEC:2013

Annex A
(informative)

DIL packages for through-hole mount

See IEC 60191-2, code 050G:1978, code 51G:1987 and code 60G:1987.

The principle of the functional dimensions of stick magazines for DIL package outlines with 6
to 48 terminals, and with a terminal row spacing of 3, 4 or 6 modules (module e = 2,54 mm =
0,1 inch) is as shown in Figure A.1. The functional dimensions, derived from outer and inner
dimensions, are given in Tables A.1, A.2 and A.3. These dimensions apply to ceramic, plastic
and side brazed termination packages.

+ 0,1 A
0,6 - 0,2 mm

D E A2

+ 2°
- 0°

C e1
IEC 1737/13

Magazine section Component cross-section

All radii: 0,5 mm to 1,5 mm.

Figure A.1 – DIL packages for through-hole mounting

Other shapes are permitted within the dimensions given for outline families covered by this
standard.

Stick magazine dimensions for DIL packages with terminal row spacing e 1 are given below.

Table A.1 – e 1 = 3 modules e

Dimensions Low profile Regular profile

package height A 2 package height A 2
mm 2,0 to 3,5 >3,5 to 4,6

A 9,3 ± 0,5 9,3 ± 0,5

B 12,0 ± 0,5 13,5 ± 0,5
C 13,5 ± 0,5 15,5 ± 0,5
D 4,0 ± 0,2 5,1 ± 0,2
E 5,4 ± 0,2 5,4 ± 0,2
BS EN 60286-4:2013
60286-4  IEC:2013 – 11 –

Table A.2 – e 1 = 4 modules e

Dimensions Low profile Regular profile

package height A 2 package height A 2
mm 2,0 to 3,5 >3,5 to 4,6

A 12,0 ± 0,5 12,0 ± 0,5

B 12,0 ± 0,5 13,5 ± 0,5
C 18,0 ± 0,5 18,0 ± 0,5
D 4,0 ± 0,2 5,1 ± 0,2
E 8,2 ± 0,2 8,2 ± 0,2

Table A.3 – e 1 = 6 modules e

Dimensions Low profile Regular profile

package height A 2 package height A 2
mm 2,0 to 3,5 > 3,5 to 4,6

A 17,3 ± 0,5 17,3 ± 0,5

B 12,0 ± 0,5 13,5 ± 0,5
C 23,0 ± 0,5 23,0 ± 0,5
D 4,0 ± 0,2 5,1 ± 0,2
E 12,5 ± 0,2 12,5 ± 0,2

Preferred maximum magazine length: 530 mm.

 BS EN 60286-4:2013
– 12 – 60286-4  IEC:2013

Annex B
(informative)

SO packages for surface mounting

See IEC 60191-2, code 075E:1990 and code 076E:1990.

The principle of the functional dimensions of stick magazines for SO packages with 4 to 28
terminals, and with a maximum width H E of 6,7 mm or 10,7 mm and a maximum height A 2
of 1,8 mm or 2,45 mm respectively, is as given in Figure B.1 and in Table B.1.

D B A2

E
C HE

IEC 1738/13

Magazine section Component cross-section

Figure B.1 – SO packages for surface mounting

Table B.1 – Stick magazine dimensions for SO packages

Package outline type

Dimensions
(see IEC 60191-2)

mm 076E01 – 076E07 075E01 – 075E06

A 7,0 min. 11,0 min.

B 110 % to 135 % of A 2 . 110 % to 135 % of A 2 .

C 110 % to 135 % of H E 110 % to 135 % of H E

D 2,8 min. 3,8 min.

E 3,3 max. 7,1 max.

Magazine material 0,45 – 0,8 0,45 – 0,8

thickness
Length 530 max. 530 max.
BS EN 60286-4:2013
60286-4  IEC:2013 – 13 –

Annex C
(informative)

Leaded chip carrier packages (PLCC) for surface mounting

See IEC 60191-2, code 102E:2001 and code 112E:1990.

The principle of the functional dimensions for PLCC stick magazines is shown in Figure C.1
with variants of cross-sections. The functional dimensions derived from outer and inner
dimensions are given in Table C.1.

A
45°

B
D A A

C HE F

IEC 1739/13

Magazine section Component cross-section

Figure C.1 – Leaded chip carrier packages (PLCC) for surface mounting

Table C.1 – Stick magazine dimensions for PLCC packages

Package outline type

Dimensions
(see IEC 60191-2)

mm 102E02 – 102E07 112E01 – 112E05

C Package width F Package width H E
+ allowance of + allowance of
0,6 min. to 0,9 max. 0,6 min. to 0,9 max.

B, D 110 % to 135 % of package thickness A

A A equals the length where at the set dimension D. the tube is
curved inward by 45° until it reaches height B
Magazine material 0,5 – 1,0
thickness
Length 530 max.
 BS EN 60286-4:2013
– 14 – 60286-4  IEC:2013

Annex D
(normative)

Rule for the orientation of integrated circuit packages in handling

and shipping carriers such as stick magazines and rails
(from IEC 60191-3:1999, Annex G)

D.1 Overview

The users of integrated circuits which are supplied by different manufacturers need to have
integrated circuit packages oriented in a standard way in handling and shipping carriers such
as stick magazines and rails.

For this reason a rule is required to designate the orientations of the integrated circuit
packages relative to their stick magazines or rails and code mark in stick magazines or rails.

D.2 Rule

Integrated circuit packages shall be put in carrier packages such as stick magazines and rails
with the terminal No. 1 mark oriented so that the side with the mark exits first from the carrier.

When the packages are in the carrier and viewed from the top, the terminal No. 1 mark shall be
to the left or in the lower left corner, and marking shall be right side up and readable from the
left to the right.

For examples: see Figure D.1.

Terminal No. 1 exits as first terminal of the row which contains terminal No.1 in case of
magazines containing packages like DIP (dual-line package), QUIP (Quad in-line package),
SOP (small outline package), FP (flatpack), QFP (quad flatpack), CCC (ceramic chip carrier),
or PGA (pin grid array),

or

the row which contains terminal No. 1 in its centre exits first, in the case of magazines
containing packages like PLCC (plastic leaded chip carrier), or CCC (ceramic chip carrier).
BS EN 60286-4:2013
60286-4  IEC:2013 – 15 –

D IP Q FP P LC C P LC C Q FP
Q U IP (re cta n g u la r) (re cta n g u la r) (sq u a re ) (sq u a re )
SOP CCC CCC CCC
FP (le a d le ss) (sq u a re (sq u a re
le a d le ss) le a d le ss)
PGA
(sq u a re )

M a rkin g M a rkin g M a rkin g M a rkin g M a rkin g

S tick m a g a zin e T e ch n o lo g ica l m o ve m e n t d ire ctio n

All packages in this figure are viewed from the top

IEC 1740/13

Figure D.1 – Five examples of the terminal No. 1 marking locations

 BS EN 60286-4:2013
– 16 – 60286-4  IEC:2013

Bibliography

IEC 60191-2, Mechanical standardization of semiconductor devices – Part 2: Dimensions

http://std.iec.ch/

ISO 11469, Plastics – Generic identification and marking of plastic products

_____________
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