ANSYS 2023 R1 Capabilities Chart

• Full Support ▲ Limited Capability ▪ Requires more than 1 product
/ CONTENTS
STRUCTURES FLUIDS
Vibrations.................................................................................................3 Fluent Capabilities.........................................................................22 Automate Any Modeling and Simulation Tool...... 38 Lasers & Fibers.................................................................................49 DESIGN TOOLS
Acoustics...................................................................................................3 Fluent Meshing Capabilities..................................................25 Author Engineering Workflows......................................... 38 CAD Integration..............................................................................49 Fluids.......................................................................................................64
Wave Hydrodynamics..................................................................4 CFX Capabilities...............................................................................25 Automatically Execute the Workflow............................39 Data Libraries....................................................................................49
Geometry.............................................................................................64
Additional Physics............................................................................4 TurboGrid Capabilities................................................................27 Share Automated Analyses and Workflows.............39 STAR......................................................................................................... 50
Heat Transfer.....................................................................................64
Composite Materials.......................................................................5 BladeGen and BladeEditor Capabilities..................... 28 Gain Insight to the Design Problem...............................39 OpticsBuilder.................................................................................... 50
Granta Materials Data for Simulation............................65
Durability................................................................................................. 6 Vista Capabilities............................................................................ 28 Visualize the Design Space....................................................39 Multiphysics........................................................................................65
Explicit Dynamics............................................................................. 6 CFD Post Capabilities................................................................. 28 Probabilistic Analysis..................................................................40
Design of Experiments (Common).................................40
ELECTRONICS Structural...............................................................................................65
Implicit Dynamics............................................................................ 7 Polyflow Capabilities....................................................................29
Low Frequency Electromagnetics...................................52 Tool Interoperability......................................................................65
Geometric Idealization................................................................. 7 Forte Capabilities............................................................................29 Design of Experiments (North America Only).......40
Magnetic Transient.......................................................................52 High Frequency Electromagnetics.................................65
Geometry and STL File Handling........................................ 7 Chemkin-Pro Capabilities...................................................... 30 Design of Experiments (Global).........................................40
Advanced Magnetic Modeling............................................52
HPC - Structures.............................................................................. 8 FENSAP-ICE Capabilities......................................................... 30 Connect Any Engineering Analysis to Systems
Materials................................................................................................... 8 Access to Additional Applications.....................................31 Architecture Model......................................................................40
Concept Design Solution for DIGITAL MISSION ENGINEERING
High Frequency Electromagnetics.................................53 Modeling Capabilities................................................................ 66
Miscellaneous and Usability.................................................... 9 Simulate Complex System Behavior.............................. 41
Power and Signal Integrity Board Simulate & Process Satellite / Spacecraft
Modeling Capabilities................................................................. 10 Verify Requirements.................................................................... 41
Multi Analysis..................................................................................... 10
AUTONOMOUS VEHICLE Simulation Capabilities..............................................................56 Tracking Data................................................................................... 67
Nonlinear Multi-Body Dynamics....................................... 10 SIMULATION RLCG Parasitic Extraction........................................................57 App Development API’s...........................................................68
Optimization........................................................................................11 Human Vision....................................................................................32 SAFETY ANALYSIS Electronics Cooling.......................................................................57

Headlamp Simulation................................................................32 Functional Safety Analysis..................................................... 42 Cable Modeling............................................................................... 58
HPC for Electronics...................................................................... 58 CLOUD
Structural Solver Capabilities..................................................11
Thermal.....................................................................................................11 Sensors Simulation.......................................................................32 Cybersecurity Analysis............................................................... 42
Environment Simulation..........................................................32 Safety Management................................................................... 42 System Modeling for Power Electronics.....................59 VDI Support........................................................................................ 69
Topology and Lattice Optimization..................................12
Preparation..........................................................................................32 System Modeling for RF / Microwave............................59 HPC Support..................................................................................... 69
Particle Methods..............................................................................12
System Modeling for SI/SP......................................................59 Cloud Hardware Provider....................................................... 69
Automotive...........................................................................................12 OPTICS Multiphysics-Platform Technologies.............................60 Storage................................................................................................... 69
Metal Stamping................................................................................13 DIGITAL TWIN Ansys Products Embedded.................................................. 43
Multiphysics Electro-Thermal Interaction.................60 Licensing.............................................................................................. 69
System Simulation, Validation General Solver Capabilities.................................................... 43
Materials for Electronics...........................................................60 Authentication................................................................................. 69
and Digital Twins............................................................................33 Photometry / Radiometry...................................................... 43
ACOUSTICS SIMULATION Miscellaneous...................................................................................60 Web Portal.......................................................................................... 69
Human Vision...................................................................................44
Acoustics & Sound Quality...................................................... 14 Charging and Discharging Modeling...........................60 3rd Party Tools.................................................................................. 69
Wavelength Range......................................................................44
EMBEDDED SOFTWARE Optical Design.................................................................................44
ADDITIVE MANUFACTURING Model-Based Systems Engineering.............................. 34 Optical Sensor..................................................................................44 PHOTONICS
Additive Prep.......................................................................................15 Embedded Control & HMI Software.............................. 34 Head-Up Display............................................................................ 45 Design Environment....................................................................61
Workbench Additive.....................................................................15 Perception Software Testing.................................................35 Solver Performances................................................................... 45 General.....................................................................................................61
Additive Print......................................................................................16 Simulation Preparation............................................................ 45 General Solver Capabilities......................................................61
Additive Science...............................................................................17 CONNECT Post Processing...............................................................................46 Materials Selection & Related Tools.................................62
Licensing and Installation.......................................................36 Optimization.....................................................................................46 Optimization......................................................................................62
Data Management.......................................................................36 Tool Interoperability..................................................................... 47 Post Processing................................................................................62
MATERIALS Imaging & Afocal Design........................................................ 47 Tool Interoperability......................................................................63
Materials Data Management............................................... 18 Process Management................................................................36
Application Management.......................................................36 Lighting and Illumination Design...................................48
Materials Data Analysis...............................................................19
Integrations.........................................................................................37 Programming and Interface................................................48
Data Flow Management...........................................................19
Integration with CAD, CAE, PLM.........................................19 Workflow Management...........................................................37
Restricted Substances.................................................................19 Tool Interoperability......................................................................37
Granta MI - Additive..................................................................... 20 Orchestration and Automation..........................................37
Materials Selection & Related Tools................................ 20 Product Improvement.............................................................. 38
Data Library for Industry......................................................... 20 Product Robustness................................................................... 38
Teaching Resources......................................................................21 Dashboards and Reports........................................................ 38 © 2023 ANSYS, Inc. All Rights Reserved.
2
MECHANICAL MECHANICAL MECHANICAL
/ STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA SHERLOCK MOTION FORMING PRO
VIBRATIONS
Modal • • • • • •
Modal - Pre-Stressed • • • • •
Modal – Damped/Unsymmetric • •
Transient - Mode-Superposition • • • • •
Harmonic - Mode-Superposition • • • •
Harmonic - Full • • ▲
Spectrum • • •
• • • •
1 = Ansys nCode DesignLife Products
Random Vibration
2 = Ansys Fluent
Mistuning • • 3 = Ansys DesignXplorer
Multi-Stage Cyclic Symmetry • 4 = Ansys SpaceClaim
Rotordynamics • • • 5 = Ansys Customization Suite (ACS)
6 = Ansys HPC, ANSYS HPC Pack

ACOUSTICS or Ansys HPC Workgroup
Modal Acoustics • 7 = Ansys Granta Materials Data

for Simulation
Harmonic Acoustics • • 8 = Ansys Additive Suite
Transient Acoustics • • 9 = Ansys Composite Cure Simulation
Boundary Element Method Acoustics • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
Spectral Element Method Acoustics • 11 = Ansys SPEOS
Statistical Energy Analysis Acoustics • 12 = Ansys SPEOS & Ansys SPEOS for NX
Piezoelectric Acoustics • 13 = Ansys CFD Pro - Ansys Fluent with

a reduced set of capabilities
Generation of Acoustic Signature from Contact Regions • • • DMP = Distributed-memory parallel
Acoustics Element Library • • • • SMP = Shared-memory parallel
Acoustics Material Models • • • MAPDL = Mechanical APDL
Explicit = Autodyn
RBD = Rigid Body Dynamics
Aqwa = Aqwa
• Full Support ▲ Limited Capability ▪ Requires more than 1 product 3

WAVE HYDRODYNAMICS
Diffraction and Radiation •
Frequency & Time Domain Motions Analysis •
Moorings, Joints & Tethers •
Internal Tanks •
Load Transfer to Structural Analysis •
ADDITIONAL PHYSICS
1-D Thermal-Flow • • • •
1-D Coupled-Field Circuits • 1 = Ansys nCode DesignLife Products
1-D Electromechanical Transducer • 2 = Ansys Fluent
Piezoelectric • • 3 = Ansys DesignXplorer
Piezoresistive • 4 = Ansys SpaceClaim
Electromagnetic • 5 = Ansys Customization Suite (ACS)

Electro-Migration • • or Ansys HPC Workgroup
Diffusion-Pore-Fluid • 7 = Ansys Granta Materials Data

for Simulation
Diffusion-Thermal-Electric-Magnetic • 8 = Ansys Additive Suite
1-Way Fluid Structure Interaction ▪2

▪
2
▪2
9 = Ansys Composite Cure Simulation
2-Way Fluid-Structure Interaction ▪2

• • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
Incompressible Fluid Dynamics (ICFD) • 11 = Ansys SPEOS
Arbitrary Lagrangian Eulerian Method (ALE) • 12 = Ansys SPEOS & Ansys SPEOS for NX
Electromagnetics (EM) - Boundary Element Method (BEM) • 13 = Ansys CFD Pro - Ansys Fluent with
Multi-scale Modeling • • DMP = Distributed-memory parallel
Conservation Element/Solution Element (CESE) • SMP = Shared-memory parallel
MAPDL = Mechanical APDL
Explicit = Autodyn
Aqwa = Aqwa

COMPOSITE MATERIALS
Material Definitions • • • • • •
Ply Definitions • ▲ • • •
Interface Layers • •
Advanced Ply-Modeling Features •
Variable Material Data • ▲
Solid Extrusion • •
Lay-Up Mapping •
• •
Draping
2 = Ansys Fluent
Lay-Up Exchange Interfaces • 3 = Ansys DesignXplorer
Advanced Failure Criteria Library • ▲ 4 = Ansys SpaceClaim
First-Ply Failure • • • 5 = Ansys Customization Suite (ACS)
Last-Ply failure • • 6 = Ansys HPC, ANSYS HPC Pack

or Ansys HPC Workgroup
Delamination • • 7 = Ansys Granta Materials Data

for Simulation
Composite Cure Simulation ▪9
▲ 8 = Ansys Additive Suite
Sandwich Modeling • • 9 = Ansys Composite Cure Simulation
Automation / Run Scripts • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
Short Fiber Composites • • 11 = Ansys SPEOS
12 = Ansys SPEOS & Ansys SPEOS for NX
13 = Ansys CFD Pro - Ansys Fluent with

DMP = Distributed-memory parallel
SMP = Shared-memory parallel
Explicit = Autodyn
Aqwa = Aqwa

DURABILITY
Stress-Life (SN) • • • • •
Strain-Life (EN) • • • • •
Dang Van ▪1
▪
1
▪1
▪1
Safety Factor • • • • •
Adhesive Bond ▪1
▪
1
▪1
▪1
Crack Growth Linear Fracture Mechanics ▪1

▪
1
▪1
▪1
Seam Weld ▪1
▪
1
▪1
▪1
Spot Weld ▪1
▪
1
▪1
▪1
Thermo-Mechanical Fatigue ▪1
▪
1
▪1
▪1
▲ 2 = Ansys Fluent
Vibration Fatigue ▪1
▪
1
▪1
▪1
• • 3 = Ansys DesignXplorer
▪1
4 = Ansys SpaceClaim
Short-Fiber Composite Fatigue
5 = Ansys Customization Suite (ACS)
Virtual Strain Gauge Correlation ▪1
▪
1
▪1
▪1
Python Scripting Customization ▪1

▪
1
▪1
▪1
▲ or Ansys HPC Workgroup
7 = Ansys Granta Materials Data

EXPLICIT DYNAMICS for Simulation
FE (Lagrange) Solver • • • 8 = Ansys Additive Suite
Euler Solvers • • 9 = Ansys Composite Cure Simulation
Implicit-Explicit Material States • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
Mass Scaling • • • 11 = Ansys SPEOS
Natural Fragmentation • • • 12 = Ansys SPEOS & Ansys SPEOS for NX
Erosion Based on Multiple Criteria • • • 13 = Ansys CFD Pro - Ansys Fluent with
De-Zoning • • DMP = Distributed-memory parallel
Part Activation and Deactivation (Multi Stage Analysis) • • SMP = Shared-memory parallel
Explicit Time Integration • • • MAPDL = Mechanical APDL
Explicit = Autodyn
Aqwa = Aqwa

IMPLICIT DYNAMICS
Implicit Time Integration • • • • •

GEOMETRIC IDEALIZATION
Spring • • ▲ • • •
Mass • • • • • •
Damper • • • • •
Spar • • • •
Beam • • • • • •
Cable • • • • 1 = Ansys nCode DesignLife Products
• • •
2 = Ansys Fluent
Pipe/Elbow
3 = Ansys DesignXplorer
Shell - Thin • • • • • • 4 = Ansys SpaceClaim
Layered Shell -Thin (Composite) • • • • 5 = Ansys Customization Suite (ACS)
Shell - Thick (Solid Shell) • • • • • 6 = Ansys HPC, ANSYS HPC Pack

Layered Shell - Thick (Solid Shell) (Composite) • • • • 7 = Ansys Granta Materials Data
• • • • •
for Simulation
2D Plane / Axisymmetric
8 = Ansys Additive Suite
3D Solids • • • • • • 9 = Ansys Composite Cure Simulation
Layered 3D Solids (Composite) • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS
• • • • • •
for Creo Parametric
Infinite Domain
11 = Ansys SPEOS
2.5D Elements • • 12 = Ansys SPEOS & Ansys SPEOS for NX
Reinforcement Elements • • • • ▪ 13 = Ansys CFD Pro - Ansys Fluent with

Coupled Field ROM Element Technology • • DMP = Distributed-memory parallel
Iso-Geometric Analysis (IGA) • SMP = Shared-memory parallel
GEOMETRY AND STL FILE HANDLING MAPDL = Mechanical APDL
SpaceClaim Direct Modeler • Explicit = Autodyn
Aqwa = Aqwa

HPC - STRUCTURES
4 cores (DMP or Default
SMP) MAPDL, 4 cores (DMP or 4 cores (DMP Number of
Default Number of Cores 4 for Explicit, 4 SMP) MAPDL, 4 or SMP) 4 cores 4 core cores based on 4 core 4 cores
for RBD, 4 for for RBD machine being
AQWA used
Parallel Solving on Local PC and Cluster • • • • • • • ▲

MAPDL GPU Offload Acceleration ▪ 6
▪6
▪ 6
MAPDL - Yes
Ansys Cloud Support
Explicit - No
RBD - No
MAPDL - Yes
RBD - No
MAPDL - Yes • ▲
AQWA - No
Hybrid Parallel • • • 1 = Ansys nCode DesignLife Products
2 = Ansys Fluent
MATERIALS
Basic Linear Materials (Linear, Anisotropic, Temperature
Dependent) • • • • • • • 4 = Ansys SpaceClaim
Basic Nonlinear Materials (Hyperelastic, Plasticity, Rate

• • ▲ • • •
Independent, Isotropic, Concrete, Viscoelasticity)
• • •
Advanced Nonlinear Materials (Rate dependent, Anisotropic, or Ansys HPC Workgroup
Damage Models, Geomaterials, Multiphysics, Acoustics
for Simulation
Specialty Materials (Glass, Foam, Kevlar, Fabric, Biomechanic,
Paper, Cardboard) • • 8 = Ansys Additive Suite
Field Dependent • • • 9 = Ansys Composite Cure Simulation
Reactive Materials (Equations of State, High Explosives, Propellants) • • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
User Defined Materials • • • • • 11 = Ansys SPEOS
Fracture Mechanics and Crack Growth • ▲ 12 = Ansys SPEOS & Ansys SPEOS for NX
Materials Multiscale Homogenization • • 13 = Ansys CFD Pro - Ansys Fluent with

Materials Database ▪ 7
▪ 7
▪ 7
▪ 7
▪7
• ▪ 7
Explicit = Autodyn
Aqwa = Aqwa

MISCELLANEOUS AND USABILITY

Ansys SpaceClaim • ▪
4
▪4
▪4
▪4
▪4
Ansys Customization Suite (ACS) •

Support ACT Extensions • • • • •
Journaling and Scripting • • • • • ▲
Command Snippet Support • • •
Batch run capability • • • • • • •
Read/Write 3rd Party Matrix CAE Data • • • • •
CDB and 3rd party FE Model Import • • • • • 1 = Ansys nCode DesignLife Products
Nastran Bulk File Export • • • • 2 = Ansys Fluent
Direct Input of Nastran Bulk Data Files • 3 = Ansys DesignXplorer
•
Pre-stressing from Nastran Linear Solution
Global/Selective Mass Scaling • • • 6 = Ansys HPC, ANSYS HPC Pack
Keyword Input • • • • or Ansys HPC Workgroup
• • • •
Splitting of Input File into Subfiles for Simulation
User Subroutines • • • • 8 = Ansys Additive Suite
Re-mapping • • • 9 = Ansys Composite Cure Simulation
• • •
10 = Ansys SPEOS for NX & ANSYS SPEOS
Transmitting boundaries for Creo Parametric
Dynamic Storage Allocation • • • • 11 = Ansys SPEOS
Extensive Output Data Controls (ascii/binary) • • • • 12 = Ansys SPEOS & Ansys SPEOS for NX
▲ ▲ ▲ •
Sense Switch Controls - Monitor Simulations Status a reduced set of capabilities
Interactive Real-Time Graphics • • • • • DMP = Distributed-memory parallel
• • • • • •
Double Precision
Explicit = Autodyn
Aqwa = Aqwa

MODELING CAPABILITIES
Contact - Linear • • • • • •
Contact - Nonlinear • • • • • •
Joints • • • • • •
Seam Welds • • • • • •
Spot Welds • • • • • •
Element Birth and Death • • • •
Gasket Elements • •
Rezoning and Adaptive Remeshing • • 1 = Ansys nCode DesignLife Products
Inverse Analysis • 2 = Ansys Fluent
MULTI ANALYSIS
Submodeling • • • • ▲ 5 = Ansys Customization Suite (ACS)
Data Mapping • • • • • 6 = Ansys HPC, ANSYS HPC Pack
• • ▲ ▲ •
Multiphysics Data Mapping
Initial State • • • • • for Simulation
Advanced Multi-Stage 2-D to 3-D Analysis • • 8 = Ansys Additive Suite

NONLINEAR MULTI-BODY DYNAMICS
Rigid Body Mechanisms • • • • for Creo Parametric
Rigid Body Dynamics with CMS Components for Flexible Bodies • • 11 = Ansys SPEOS
• • • • •
Full Transient
CMS with Substructuring • • a reduced set of capabilities
Mixed Rigid - Flexible Systems • • • • • • DMP = Distributed-memory parallel
• •
Function Expression
Drivetrain Creation • Explicit = Autodyn
Links • RBD = Rigid Body Dynamics
Vehicle Dynamics • • Aqwa = Aqwa

OPTIMIZATION
DesignXplorer included • • • ▪3
▪3
Parameters • • • • • ▲ •
Design Point Studies • • • • • •
Correlation Analysis • • • •
Design of Experiments • • • • •
Sensitivity Analysis • • • •
Goal Drive Optimization • • • •
STRUCTURAL SOLVER CAPABILITIES
• • • • • •
Linear Static
2 = Ansys Fluent
Nonlinear Static • • • • • 3 = Ansys DesignXplorer
Pre-Stress Effect, Linear Perturbation • • • ▲ ▲ • 4 = Ansys SpaceClaim
Nonlinear Geometry • • • • • • 5 = Ansys Customization Suite (ACS)
Buckling - Linear Eigenvalue • • • • • 6 = Ansys HPC, ANSYS HPC Pack

Buckling - Nonlinear Post Buckling Behavior • • • • 7 = Ansys Granta Materials Data
Buckling - Nonlinear Post Buckling Behavior - Arc Length • • • for Simulation
Steady State Analysis Applied to a Transient Condition • • 8 = Ansys Additive Suite
•
Advanced Wave Loading
THERMAL for Creo Parametric
Steady State Thermal • • • • ▲ 11 = Ansys SPEOS
Transient Thermal • • • • • 12 = Ansys SPEOS & Ansys SPEOS for NX
Conduction • • • • • • • 13 = Ansys CFD Pro - Ansys Fluent with

Convection • • • • DMP = Distributed-memory parallel
Radiation to Space • • • • SMP = Shared-memory parallel
Radiation - Surface to Surface • • • • MAPDL = Mechanical APDL
Phase Change • • • • • Explicit = Autodyn
• • • •
Thermal Analysis of Layered Shells and Solids
Aqwa = Aqwa

TOPOLOGY AND LATTICE OPTIMIZATION

Structural Optimization • • •
Modal Optimization • • •
Thermal Loads • • •
Inertial Loads • • •
Optimized Design Validation • • •
Manufacturing Constraints • • •
Stress Constraints • • •
Symmetry • • • 1 = Ansys nCode DesignLife Products
Lattice Optimization ▪8
2 = Ansys Fluent
Overhang/Additive Constraints ▪8
PARTICLE METHODS 4 = Ansys SpaceClaim
Smooth Particle Hydrodynamics (SPH) • • 5 = Ansys Customization Suite (ACS)
Smooth Particle Galerkin (SPG) • 6 = Ansys HPC, ANSYS HPC Pack

Corpuscular Particle Method (CPM) • 7 = Ansys Granta Materials Data
Discrete Element Method (DEM) • for Simulation

AUTOMOTIVE
Seat-belts - including modeling of accelerometer, pretensioner,
retractor, sensor, and slip ring • 10 = Ansys SPEOS for NX & ANSYS SPEOS
•
for Creo Parametric
Inflator Models
11 = Ansys SPEOS
Airbag Fabric Constitutive Models • 12 = Ansys SPEOS & Ansys SPEOS for NX
Accelerometers • 13 = Ansys CFD Pro - Ansys Fluent with
Airbag Sensors • a reduced set of capabilities
•
Airbag Breakout
Eulerian Deployment of Airbags • MAPDL = Mechanical APDL
Airbag Folder • Explicit = Autodyn
Unfolded Reference Geometry for Airbags • RBD = Rigid Body Dynamics
Aqwa = Aqwa

AUTOMOTIVE
Dummy Positioner •
Side-Impact Dummy Special Damper •
Airbag Deployment •
METAL STAMPING
Multi-Stage Forming Process Validation •
Material Data Library and Management •
Process Definition •
Tool Setup and Preview •
Drawbead Definition • 2 = Ansys Fluent
Multiple Lancing Operation • 3 = Ansys DesignXplorer
Stamping Specific Post Processing (FLD, Formability Index,
Wrinkling, Skidmark) • 4 = Ansys SpaceClaim
Clamping Simulation • 5 = Ansys Customization Suite (ACS)


for Simulation

for Creo Parametric
11 = Ansys SPEOS

Explicit = Autodyn
Aqwa = Aqwa

ANSYS SOUND ANSYS SOUND ANSYS SOUND
/ ACOUSTICS SIMULATION ENTERPRISE PREMIUM PRO
ACOUSTICS & SOUND QUALITY
Listen and Modify Sound (SAS) • • •

Perform Acoustic Analysis and Psychoacoustic Criteria
Calculations (SAS) • • •
Automatic Sound Component Detection and Separation (SAS) • • •
Connect and Listen to Ansys Mechanical, LS-DYNA, Fluent and
Motion CAE Simulations (SAS) • • •
3D Sound for Listening Room and VR (VR Sound) • •
Interactive Sound for Driving Simulator (Car Sound Simulator) • •
Measure Sound Perception with Listening Test (Jury Listening Test) • • 1 = Ansys nCode DesignLife Products
Engine Sound Design and Engine Sound Enhancement for ICE

Vehicle (ASD) • 2 = Ansys Fluent
•
Active Sound Design for Electric Vehicles (ASD for EV)
Combine Test and Simulation Data to Assess Sound Quality • • • 5 = Ansys Customization Suite (ACS)


for Simulation

for Creo Parametric
11 = Ansys SPEOS

Explicit = Autodyn
Aqwa = Aqwa

ADDITIVE ADDITIVE
/ ADDITIVE MANUFACTURING PRINT SUITE
ADDITIVE PREP
Define Build Envelope ▪ ▪
Multiple Parts ▪ ▪
Optimize Part Orientation Based upon Distortion Tendency,
Build Time and Supports ▪ ▪
Support Region Detection and Manual Modification ▪ ▪
Created Multiple Support Types in One Region ▪ ▪
Control of Support Parameters ▪ ▪
Multiple Support Types ▪ ▪
Angled Supports ▪ ▪ 1 = Ansys nCode DesignLife Products
Perforations, Tooth Patterns, Intrusion, Sizing and Distribution

of Support Walls ▪ ▪ 2 = Ansys Fluent
Automatic Support Generation ▪ ▪ 4 = Ansys SpaceClaim
Export of STL and SpaceClaim Files ▪ ▪ 5 = Ansys Customization Suite (ACS)
Export of Additive Manufacturing Equipment (OEM) Build Files ▪ ▪ 6 = Ansys HPC, ANSYS HPC Pack
▪ ▪
Cost Estimation
Layer/Scan Vector Visualization ▪ ▪ for Simulation
WORKBENCH ADDITIVE 8 = Ansys Additive Suite
Nonlinear and Temperature Dependent Material Properties • 9 = Ansys Composite Cure Simulation
Thermo-Mechanical Coupled Strain Solution • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
Native Mechanical Environment • 11 = Ansys SPEOS
Part Distortion and Residual Stress after Baseplate Cut-Off

and/or Support Removal • 12 = Ansys SPEOS & Ansys SPEOS for NX

Directional Part and Support Removal • a reduced set of capabilities
Recoater Interference Detection • DMP = Distributed-memory parallel
Identification of High Strain (Crack) Locations • SMP = Shared-memory parallel
•
Layer by Layer Stress and Distortion Visualizations
Explicit = Autodyn
Option to Output Only the Last Layer of the Build or
Every Nth Layer • RBD = Rigid Body Dynamics
Distortion Compensation Aqwa = Aqwa

ADDITIVE ADDITIVE
WORKBENCH ADDITIVE
User-Defined Step Option as 1st or Last Sequence Step •
Layered Tetrahedral Meshing •
Post Build Heat Treatment •
Import of STL Supports •
Inherent Strain Isotropic and Anisotropic •
Strain Scaling Factor for Thermal and Structural Analyses •
STL Files can be Exported from STL Supports •
Voxel Mesh Generation • 1 = Ansys nCode DesignLife Products
Wizards to Transfer Results from Additive Print to
Workbench Additive • 2 = Ansys Fluent
Calibration setup in AM Wizard • 3 = Ansys DesignXplorer
AM Bond Implementation • 4 = Ansys SpaceClaim
Layer End Temperature Output • 5 = Ansys Customization Suite (ACS)
•
Process Simulation for Directed Energy Deposition or Ansys HPC Workgroup
Direct Energy Deposition - Wizard • 7 = Ansys Granta Materials Data

for Simulation
Direct Energy Deposition - G-Code Clustering • 8 = Ansys Additive Suite
Direct Energy Deposition - Manual Clustering • 9 = Ansys Composite Cure Simulation
Automatic Distortion Compensation Optimization • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
Scan Pattern Based Anisotropic Strain • 11 = Ansys SPEOS
Machine Learning Thermal Strain • 12 = Ansys SPEOS & Ansys SPEOS for NX
“Binder Jet Sintering • 13 = Ansys CFD Pro - Ansys Fluent with

Sintering Material Model • DMP = Distributed-memory parallel
Sintering Material Model - Wizard • SMP = Shared-memory parallel
ADDITIVE PRINT
Nonlinear and Temperature Dependent Material Properties • • Explicit = Autodyn
Uniform Assumed Isotropic Strain • • RBD = Rigid Body Dynamics
Scan Pattern Based Anisotropic Strain • • Aqwa = Aqwa
Thermal Ratcheting Based Anisotropic Strain • •

ADDITIVE ADDITIVE
ADDITIVE PRINT
Stress-Based Automatically Generated Supports • •

Part Distortion and Residual Stress (as-built) • •
Directional Part and Support Removal • •
Part Distortion and Residual Stress after Baseplate Cut-Off
and/or Support Removal • •
Distortion Compensation • •
Recoater Interference Detection • •
Identification of High Strain (Crack) Locations • • 1 = Ansys nCode DesignLife Products
Input Strain Hardening Factor • • 2 = Ansys Fluent
Import of STL Supports • • 3 = Ansys DesignXplorer
Subvoxel Material Density Assignment • • 4 = Ansys SpaceClaim
Layer by Layer Stress, Distortion and Blade Crash Visualizations • • 5 = Ansys Customization Suite (ACS)

Build File Readers for Multiple AM Machines • • or Ansys HPC Workgroup
Auto Queue Multiple Successive Simulations • • 7 = Ansys Granta Materials Data

for Simulation
Additive Print to Workbench Additive Transfer for Post Processing • • 8 = Ansys Additive Suite
ADDITIVE SCIENCE 9 = Ansys Composite Cure Simulation
•
Meltpool Dimensions for Creo Parametric
Detailed Thermal History ▲ 11 = Ansys SPEOS
% Lack of Fusion Porosity • 12 = Ansys SPEOS & Ansys SPEOS for NX

Sensor Measurement Predictions ▲ a reduced set of capabilities
Ability to Add User-Define Materials • DMP = Distributed-memory parallel
▲
Material Tuning Wizard
Microstructure Prediction • Explicit = Autodyn
Parallel Solving of 2D Microstructure • RBD = Rigid Body Dynamics
Aqwa = Aqwa

GRANTA MI GRANTA MI GRANTA GRANTA MATERIALS
/ MATERIALS ENTERPRISE PRO SELECTOR EDUPACK DATA FOR
SIMULATION
MATERIALS DATA MANAGEMENT
Granta MI Database - "Gold Source" System to Store Corporate
Materials Information • •
Manage Specialist Materials Data Types • •
Manage Meta-Data and Context for Materials •
Traceability for All Materials Data • •
Favorites List: Personal, Public • • ▲ ▲
Access Control • ▲
Version Control •
Multiple Unit System Support • • • • • 1 = Ansys nCode DesignLife Products
Admin UI to Setup and Configure Database • 2 = Ansys Fluent
Template Data Structures for Key Materials Use Cases: Metals,

Composites, Additive Manufacturing • 3 = Ansys DesignXplorer
Template for Simulation • 5 = Ansys Customization Suite (ACS)
Web App for Fast Upload and Export of Materials Data • • 6 = Ansys HPC, ANSYS HPC Pack
• • • •
Browse Materials Data
Edit and Update Materials Data • • ▲ ▲ for Simulation
Search and Query Materials Data • • • • 8 = Ansys Additive Suite
Represent Property Data in Interactive Charts • ▲ • • 9 = Ansys Composite Cure Simulation
• ▲ • •
Comparison Tables and Comparison Charts for Creo Parametric
Generate Reports on Selected Materials Records • 11 = Ansys SPEOS
Export Data to Excel and Third Party Software • ▲ • • 12 = Ansys SPEOS & Ansys SPEOS for NX
Personalize System Homepages and User Profiles • 13 = Ansys CFD Pro - Ansys Fluent with
Configure Web App UI for Specific User Groups • DMP = Distributed-memory parallel
Private Cloud with Azure and AWS • • SMP = Shared-memory parallel
Single Sign On • • MAPDL = Mechanical APDL
Ansys Material Calibration • • Explicit = Autodyn
Aqwa = Aqwa

SIMULATION
MATERIALS DATA ANALYSIS
Interactive Plotting of Data: Scatter, Contour, Error Bar, Surface,
Plotyy, Semilogx, Semilogy, Loglog •
Custom Curve Fitting •
Cross-Table Comparisons of Materials Data •
Scripting Toolkit for Python •
Machine Learning •
DATA FLOW MANAGEMENT
Design and develop material data flow •
Execute material data flows - Processes, Approvals, Notifications •
INTEGRATION WITH CAD, CAE, PLM
Ansys Workbench • • ▲ ▲ ▪ 2 = Ansys Fluent
• • ▪
Ansys Electronics Desktop
Ansys Discovery • • ▲ ▲ ▪ 5 = Ansys Customization Suite (ACS)
Ansys LS-DYNA • 6 = Ansys HPC, ANSYS HPC Pack
Ansys Minerva • or Ansys HPC Workgroup
Ansys optiSLang • 7 = Ansys Granta Materials Data

for Simulation
Abaqus • • 8 = Ansys Additive Suite
ANSA • 9 = Ansys Composite Cure Simulation
HyperMesh • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
Creo • • 11 = Ansys SPEOS
NX & Simcenter 3D • • 12 = Ansys SPEOS & Ansys SPEOS for NX
Windchill • 13 = Ansys CFD Pro - Ansys Fluent with
•
Teamcenter
•
Material Card Connect - Automated File Export
File Export (CATIA v5, SOLIDWORKS, and others) • ▲ ▲ ▲ MAPDL = Mechanical APDL
RESTRICTED SUBSTANCES
Explicit = Autodyn
Data Structures to Support Restricted Substance Analytics,
Store Specs, Materials, Legislations, Substances, Parts • RBD = Rigid Body Dynamics
Report on Restricted Substance Risk for Materials and

Process Portfolio • Aqwa = Aqwa

SIMULATION
RESTRICTED SUBSTANCES
Build and Edit Bills of Materials within a Web App •
At-a-Glance Restricted Substance Complaince for a BoM ▲
Run Reports Across Multiple BoMs ▲
Integrate Restricted Substance Reporting with PLM, CAD ▲
GRANTA MI - ADDITIVE
Traceability and Capture of Additive Manufacturing Data •
AM Data Analytics Including Machine Learning •
Integration with CAD CAE and PLM Systems •
MATERIALS SELECTION & RELATED TOOLS
• •
2 = Ansys Fluent
Reference Data for Materials Selection on PC/Laptop
Interactive 'Ashby Charts' of Materials Property Space ▲ • • 4 = Ansys SpaceClaim
Systematic Materials Selection Methodology • • 5 = Ansys Customization Suite (ACS)
Filter Materials Based on Property Profile • • • • 6 = Ansys HPC, ANSYS HPC Pack
Flilter Materials Based on Links to Other Materials /
Processes / Objects ▲ • • 7 = Ansys Granta Materials Data
for Simulation
Materials Substitution and Equivalency - 'Find Similar' • • 8 = Ansys Additive Suite
Performance Index Finder • • 9 = Ansys Composite Cure Simulation
Engineering Solver - Convert Engineering Requirements
to Materials Properties • • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
Synthesizer - Predict Properties of Hybrid Materials • • 11 = Ansys SPEOS
Part Cost Estimator • • 12 = Ansys SPEOS & Ansys SPEOS for NX
Selection Reports and Export of Charts for Presentations • • 13 = Ansys CFD Pro - Ansys Fluent with
Eco Audit for a Product or Conceptual Design • • DMP = Distributed-memory parallel
Early stage batter pack design, configuration and performance
evaluation - incl. battery cells database • • SMP = Shared-memory parallel

DATA LIBRARY FOR INDUSTRY
Core MaterialUniverse™ Data • • • ▲ Explicit = Autodyn
• •
Core JAHM Curve Data
▪ ▪
Aqwa = Aqwa
Advanced Metals Data

SIMULATION
DATA LIBRARY FOR INDUSTRY
Advanced Polymers Data ▪ ▪
Advanced Composites Data ▪ ▪
Advanced Medical Data ▪ ▪
Advanced Aero Data ▪ ▪ ▪
Advanced ESDU Aero Alloys ▪ ▪
Advanced Additive Manufacturing Data ▪ ▪
Advanced Eco Design ▪ ▪
Advanced Electromagnetic Data ▪ ▪ ▪ • 1 = Ansys nCode DesignLife Products
TEACHING RESOURCES
2 = Ansys Fluent
Granta EduPack Level 1-3 Teaching Databases • 3 = Ansys DesignXplorer
The Elements Teaching Database • 4 = Ansys SpaceClaim
Materials Science and Engineering Teaching Database • 5 = Ansys Customization Suite (ACS)
Sustainability Teaching Database • 6 = Ansys HPC, ANSYS HPC Pack

Bioengineering Teaching Database • 7 = Ansys Granta Materials Data
Architecture Teaching Database • for Simulation
•
Lecture units
Student exercises • 10 = Ansys SPEOS for NX & ANSYS SPEOS
Videos • for Creo Parametric
Micro-Projects • 11 = Ansys SPEOS
•
White Papers
Case Studies • a reduced set of capabilities
Active Learning Toolkits • DMP = Distributed-memory parallel
Data Booklets • SMP = Shared-memory parallel
•
Sample Project Files
Explicit = Autodyn
Phase Diagram Tool • RBD = Rigid Body Dynamics
Medical Devices Teaching Database • Aqwa = Aqwa
Design Teaching Database •
/ FLUIDS CFD Pro CFD Premium CFD Enterprise BladeModeler Vista TF
FLUENT CAPABILITIES
Steady-State Flow • • •
Transient Flow • • •
2D and 3D Flow • • •
Compressible and Incompressible Flow • • •
Customizable Material Properties • • •
Non-Newtonian Viscosity • • •
Real fluids models (steam, refrigerants, cryogenics, NIST data) • •
Pressure-Based Solver • • • 1 = Ansys nCode DesignLife Products
Density-Based Solver • • 2 = Ansys Fluent
Native Multi-GPU Solver • 3 = Ansys DesignXplorer
Coupled and Segregated Solvers • • • 4 = Ansys SpaceClaim
• • •
Subsonic Flow
Supersonic and Hypersonic Flow • • or Ansys HPC Workgroup
Turbulence – RANS models • • • 7 = Ansys Granta Materials Data

for Simulation
Turbulence - LES/SAS/DES • • 8 = Ansys Additive Suite
Heat Transfer - Natural Convection, Conduction and CHT • • • 9 = Ansys Composite Cure Simulation
Heat Transfer - Shell Conduction • • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
Thermal Radiation - Participating & Transparent Media • • 11 = Ansys SPEOS
ECAD Import for PCB Thermal Modeling • • 12 = Ansys SPEOS & Ansys SPEOS for NX
Expressions, Inc. Functions of Solution Values • • • 13 = Ansys CFD Pro - Ansys Fluent with
Flow-Drive Solid Motion (6-DOF) • • DMP = Distributed-memory parallel
Porous Media • • • SMP = Shared-memory parallel
Reduced Order Model (ROM) creation • • MAPDL = Mechanical APDL
Dynamic/Moving-Deforming Mesh • • Explicit = Autodyn
Overset Mesh • • RBD = Rigid Body Dynamics
Dynamic Solution-Adaptive Mesh Refinement • • Aqwa = Aqwa

FLUENT CAPABILITIES
Fan Model • • •
Virtual Blade Model • •
Inert and Massless Particle Tracking • • •
Coupled Particle Tracking (with Mass) • •
Wall Film Modeling • •
Macroscopic Particle Model • •
Reacting/Combusting Particles • •
Particle Break-Up and Coalescence • • 1 = Ansys nCode DesignLife Products
Dense Particle Coupling (DDPM) and Granular Particle modeling • • 2 = Ansys Fluent
Wall Erosion Modeling • • 3 = Ansys DesignXplorer
Discrete Element Model (DEM) • • 4 = Ansys SpaceClaim
• •
Free Surface VOF model
Regime change between particle and free surface (VOF <-> DPM) • • or Ansys HPC Workgroup
Multiphase flow modeling • • 7 = Ansys Granta Materials Data

for Simulation
Complex Multiphase Regime Transitions • • 8 = Ansys Additive Suite
Surface Tension • • 9 = Ansys Composite Cure Simulation
Gas – Liquid – Solid Phase Change models, including Cavitation,

Boiling, Evaporation, Condensation, Solidification and Melting • • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
Reactions Between Fluid Phases • • 11 = Ansys SPEOS
Non-reacting Multicomponent Flow/Species Transport • • • 12 = Ansys SPEOS & Ansys SPEOS for NX
Reacting Multicomponent Flow/Species Transport • • 13 = Ansys CFD Pro - Ansys Fluent with
Extensive Combustion modeling including FGM • • DMP = Distributed-memory parallel
Finite Rate Chemistry modeling • • SMP = Shared-memory parallel
Pollutants and Soot Modeling • • MAPDL = Mechanical APDL
Ability to use Model Fuel Library Reaction Mechanisms • • Explicit = Autodyn
• •
Comprehensive Surface-Kinetics
Aqwa = Aqwa
Flamelet Table Generation • •
FLUENT CAPABILITIES
Virtual cooling hole models (effusion and blade film cooling) • •

Electrochemistry modeling for Li-ion Batteries • •
Battery swelling modeling • •
Battery life modeling • •
Fuel Cell modeling • •
Multiple Stationary & Rotating Reference Frames • • •
Periodic Interfaces • •
Mixing Plane/Stage Frame Change Interface • • 1 = Ansys nCode DesignLife Products
Sliding-Mesh/Transient Rotor-Stator Frame Change Interface • • 2 = Ansys Fluent
Pitch Change across Frame Change Interfaces • • 3 = Ansys DesignXplorer
Aerodynamic damping (Blade Flutter) • • 4 = Ansys SpaceClaim
•
Dedicated Aerodynamics workspace (Fluent Aero)
In-flight Aircraft Icing modeling • or Ansys HPC Workgroup
Adjoint Solver for Shape Optimization • • 7 = Ansys Granta Materials Data

for Simulation
Parameter-driven mesh morphing and optimization • • 8 = Ansys Additive Suite
Parameters • • • 9 = Ansys Composite Cure Simulation
Design Point Studies • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
Design of Experiments • • • 11 = Ansys SPEOS
Local Parallel Solving • • • 12 = Ansys SPEOS & Ansys SPEOS for NX
Distributed Parallel Solving • • 13 = Ansys CFD Pro - Ansys Fluent with

Batch solving • • DMP = Distributed-memory parallel
Parallel Solving on Cloud launched from Desktop • • SMP = Shared-memory parallel
Workbench Integration • • MAPDL = Mechanical APDL
Simulation Reports • • • Explicit = Autodyn
Functional Mockup Unit (FMU) Coupling ▪ ▪ RBD = Rigid Body Dynamics
Fluid Structure Interaction (FSI) with Ansys Mechanical ▪ ▪ Aqwa = Aqwa

FLUENT CAPABILITIES
Fluid Thermal Deformation with Ansys Mechanical ▪ ▪

Built-in FEA solver for Fluid-Structural and Fluid-Thermal Stress
Coupling • •
Fluid Electro-Thermal Interaction ▪ ▪
Electromechanical Thermal Management ▪ ▪
Aero-optics ▪ ▪
Aero Acoustics and Vibro Acoustics • •
Acoustic-Structural • •
Fluid Magnetohydrodynamics (MHD) • • 1 = Ansys nCode DesignLife Products
2 = Ansys Fluent
FLUENT MESHING CAPABILITIES
• • •
Polyhedral, Poly-Hexcore, Hexcore, Tet and Prism meshing
Mosaic-Enabled Meshing Technology • • • 5 = Ansys Customization Suite (ACS)
Task-Based Workflow - Watertight Geometries • • • 6 = Ansys HPC, ANSYS HPC Pack
Task-Based Workflow - Fault Tolerant Geometries • • or Ansys HPC Workgroup
• • •
Parallel Mesh Generation for Simulation
Wrap meshing • • 8 = Ansys Additive Suite
Rapid Octree meshing • • 9 = Ansys Composite Cure Simulation

CFX CAPABILITIES for Creo Parametric
Steady-State Flow • • 11 = Ansys SPEOS
Transient Flow • • 12 = Ansys SPEOS & Ansys SPEOS for NX
Customizable Material Properties • • 13 = Ansys CFD Pro - Ansys Fluent with

Non-Newtonian Viscosity • • DMP = Distributed-memory parallel
Real fluids models (steam, refrigerants, cryogenics, NIST data) • • SMP = Shared-memory parallel
Flow-Drive Solid Motion (6-DOF) • • MAPDL = Mechanical APDL
Pressure-Based Coupled Solver • • Explicit = Autodyn
Expressions, inc. functions of solution values • • RBD = Rigid Body Dynamics
Dynamic/Moving-Deforming Mesh • • Aqwa = Aqwa

CFX CAPABILITIES
Compressible and Incompressible Flow • •

Porous Media • •
Subsonic Flow • •
Supersonic Flow • •
Turbulence – RANS models • •
Turbulence - LES/SAS/DES • •
Heat Transfer - Natural Convection, Conduction and CHT • •
Thermal Radiation - Participating & Transparent Media • • 1 = Ansys nCode DesignLife Products
Particle Tracking (Discrete Phase Modeling) • • 2 = Ansys Fluent
Liquid Droplets (including Evaporation) • • 3 = Ansys DesignXplorer
Reacting/Combusting Particles • • 4 = Ansys SpaceClaim
• •
Wall Erosion Modeling
Free Surface VOF model • • or Ansys HPC Workgroup
Surface Tension • • 7 = Ansys Granta Materials Data

for Simulation
Multiphase flow modeling (Eulerian) • • 8 = Ansys Additive Suite
Gas – Liquid – Solid Phase Change models, including Cavitation,

Boiling, Evaporation and Condensation • • 9 = Ansys Composite Cure Simulation
• •
Reactions Between Fluid Phases for Creo Parametric
Multicomponent Flow/Species Transport • • 11 = Ansys SPEOS
Combustion Modeling • • 12 = Ansys SPEOS & Ansys SPEOS for NX
Acoustics / Aerodynamic noise • • 13 = Ansys CFD Pro - Ansys Fluent with

Blade film cooling model • • DMP = Distributed-memory parallel
Multiple Stationary & Rotating Reference Frames • • SMP = Shared-memory parallel
Periodic Interfaces • • MAPDL = Mechanical APDL
Mixing Plane / Stage Frame Change Interface • • Explicit = Autodyn
• •
Transient Rotor-Stator Frame Change Interface
Aqwa = Aqwa
Pitch Change Across Frame Change Interfaces • •
CFX CAPABILITIES
Pitch Change across Frame Change Interfaces • •

Aerodynamic Damping (Blade Flutter Analysis) • •
Transient Blade Row • •
Time Transformation • •
Fourier Transformation • •
Harmonic Analysis • •
Automated Speedline / Performance Map creation • •
Local and Distributed Parallel Solving • • 1 = Ansys nCode DesignLife Products
Parallel Solving on Cloud launched from Desktop • • 2 = Ansys Fluent
Workbench Integration • • 3 = Ansys DesignXplorer
Functional Mockup Unit (FMU) Coupling • • 4 = Ansys SpaceClaim
▪ ▪
Fluid Structure Interaction (FSI) with Ansys Mechanical
Fluid Thermal Deformation with Ansys Mechanical ▪ ▪ or Ansys HPC Workgroup
Fluid Electro-Thermal Interaction ▪ ▪ 7 = Ansys Granta Materials Data

for Simulation
Electromechanical Thermal Management • • 8 = Ansys Additive Suite
Fluid Magnetohydrodynamics (MHD) • • 9 = Ansys Composite Cure Simulation
TURBOGRID CAPABILITIES 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
Automatic block-structured Hex meshing • • 11 = Ansys SPEOS
Predefined block topologies for blades • • 12 = Ansys SPEOS & Ansys SPEOS for NX
Axial, Radial and Mixed machines • • 13 = Ansys CFD Pro - Ansys Fluent with
Splitter blades • • DMP = Distributed-memory parallel
Compressors, Fans, Turbines, Pumps • • SMP = Shared-memory parallel
Rounded and sharp leading/trailing edges • • MAPDL = Mechanical APDL
Partial tip clearances • • Explicit = Autodyn
Automated hybrid meshing for secondary flow paths, complex tips,

partial tip and hub gaps (buttons), and blends • • RBD = Rigid Body Dynamics
Aqwa = Aqwa
Automatic addition of approximate blends/fillets • •
TURBOGRID CAPABILITIES
Support for multiple input formats (CAD, NDF, profiles/curves) • •

Automatic creation of high-fidelity CAD from profile/curve input ▲ ▲
Mesh refinement maintaining consistent mesh topology • •
BLADEGEN AND BLADEEDITOR CAPABILITIES
Turbomachinery blade design •
Turbo-specific CAD geometry creation •
Single CAD definition for CFD and FEA •
Flow Path CAD geometry creation • 1 = Ansys nCode DesignLife Products
Blade CAD geometry creation • 2 = Ansys Fluent
Splitter Blade CAD geometry creation • 3 = Ansys DesignXplorer
Create high fidelity variable radius blade blends • 4 = Ansys SpaceClaim
•
Flank milled blades
VISTA CAPABILITIES or Ansys HPC Workgroup
Meanline / 1D Turbomachinery Design • 7 = Ansys Granta Materials Data

for Simulation
Centrifugal Compressor Design (CCD) • 8 = Ansys Additive Suite
Centrifugal Pump Design (CPD) • 9 = Ansys Composite Cure Simulation
Radial Turbine Design (RTD) • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
Axial Fan Design (AFD) • 11 = Ansys SPEOS
Through-Flow Quasi-2D Analysis for Turbomachinery Design • 12 = Ansys SPEOS & Ansys SPEOS for NX
Centrifugal Compressor Map creation (CCM) • 13 = Ansys CFD Pro - Ansys Fluent with
CFD POST CABABILITIES
• •
Simulation Reports
Turbo-specific Surface and Line locators • • MAPDL = Mechanical APDL
Turbo coordinate systems • • Explicit = Autodyn
Turbo macros and calculations • • RBD = Rigid Body Dynamics
Multiple case file comparison • • Aqwa = Aqwa

CFD POST CABABILITIES
Point, Line, Surface and Volume locators • •

GPU accelerated animations • •
Keyframe animations • •
Charts • •
Contours, Vectors, Streamlines, Particle Tracks • •
Expressions and quantitative calculations • •
Operating Map post-processing • •
Mesh quality metrics and calculations • • 1 = Ansys nCode DesignLife Products
Polyflow Results Post-processing • • • 2 = Ansys Fluent
POLYFLOW CAPABILITIES 3 = Ansys DesignXplorer
Viscoelasticity and Yield Stress models • • 4 = Ansys SpaceClaim
Extrusion & Co-extrusion modeling • • • 5 = Ansys Customization Suite (ACS)
• • •
Blow Molding modeling or Ansys HPC Workgroup
Fiber Spinning modeling • • • 7 = Ansys Granta Materials Data

for Simulation
Thermoforming modeling • • • 8 = Ansys Additive Suite
Screw extruder modeling • • 9 = Ansys Composite Cure Simulation
2D and 3D forming • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
Mixers and Filling modeling • • 11 = Ansys SPEOS
FORTE CAPABILITIES
Automatic On-the-fly Mesh Generation with Dynamic Refinement • • 13 = Ansys CFD Pro - Ansys Fluent with
Species Transport • • a reduced set of capabilities
• •
Finite Rate Chemistry
Pollutants and Soot Modeling • • MAPDL = Mechanical APDL
Sparse Chemistry Solver Dynamic Cell Clustering Dynamic
Adaptive Chemistry • • Explicit = Autodyn
Ability to Use Model Fuel Library Mechanisms • • RBD = Rigid Body Dynamics
Flame-speed from Fuel-Component Library • • Aqwa = Aqwa

FORTE CAPABILITIES
DPIK Spark-Ignition Model • •

Internal Combustion Engine Specific Solution • •
Ge-rotor, screw compressor and scroll compressor modeling • •
CHEMKIN-PRO CAPABILITIES
Species Transport •
Finite Rate Chemistry •
Multiphase Reactions •
Pollutants and Soot Modeling • 1 = Ansys nCode DesignLife Products
Sparse Chemistry Solver Dynamic Cell Clustering Dynamic Adap-

tive Chemistry • 2 = Ansys Fluent
•
Ability to Use Model Fuel Library Mechanisms
Flame-speed from Fuel-Component Library • 5 = Ansys Customization Suite (ACS)
Internal Combustion Engine Specific Solution • 6 = Ansys HPC, ANSYS HPC Pack
•
0-D/1-D/2-D Reactor Models and Reactor Networks
Plasma Reactions • for Simulation
Comprehensive Surface-Kinetics • 8 = Ansys Additive Suite
Chemical and Phase Equilibrium • 9 = Ansys Composite Cure Simulation
•
Flamelet Table Generation for Creo Parametric
Flame speed and Ignition Table Generation • 11 = Ansys SPEOS
Reaction Sensitivity, Uncertainty and Path Analysis • 12 = Ansys SPEOS & Ansys SPEOS for NX
Surrogate Blend Formulation and Optimization • 13 = Ansys CFD Pro - Ansys Fluent with
Mechanism Reduction • DMP = Distributed-memory parallel
Reaction Workbench • SMP = Shared-memory parallel
Model Fuel Library • • MAPDL = Mechanical APDL
Explicit = Autodyn
FENSAP-ICE CAPABILITIES
•
Simulation of Standard Droplets, SLD and Ice Crystals
•
Aqwa = Aqwa
Inclusion of Vapor/Humidity Effects on Icing

FENSAP-ICE CAPABILITIES
Icing Environments of Appendices C, O (SLD) and D (Ice Crystals) •

Pre-Defined Droplet Size Distributions •
Simulation of Rime, Glaze and Mixed Icing •
Single and Multi-Shot Icing Simulations with Mesh Deformation
for Prediction of Ice Accretion and Aerodynamic Performance •
Degradation
Single and Multi-Shot Icing Simulations with Automatic
Re-Meshing for Prediction of Ice Accretion and Aerodynamic •
Performance Degradation
Conjugate Heat Transfer (CHT) for Anti and De-Icing Simulations ▲ 1 = Ansys nCode DesignLife Products
Ice Cracking • 2 = Ansys Fluent
Ice Shedding • 3 = Ansys DesignXplorer
ACCESS TO ADDITIONAL APPLICATIONS 4 = Ansys SpaceClaim
DesignModeler • 5 = Ansys Customization Suite (ACS)
Discovery Modeling / SpaceClaim • • 6 = Ansys HPC, ANSYS HPC Pack

Ansys Meshing (Workbench Meshing) • • • 7 = Ansys Granta Materials Data
ICEM CFD • • for Simulation
• •
EnSight Enterprise
DesignXplorer • • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
11 = Ansys SPEOS

Explicit = Autodyn
Aqwa = Aqwa

AVxcelerate for AVxcelerate for
/ AUTONOMOUS VEHICLE SIMULATION Headlamp Sensors
HUMAN VISION
Glare Simulation •
HEADLAMP SIMULATION
Advanced Lighting System • •
Lamp Control • •
Virtual Measurement •
Glaring Simulation •
IIHS / C-IASI Regulation Validation •
SENSORS SIMULATION
Ground-Truth Sensor ▲ ▲ 1 = Ansys nCode DesignLife Products
•
2 = Ansys Fluent
Optical Camera Sensor
LiDAR Sensor • 4 = Ansys SpaceClaim
Radar Sensor • 5 = Ansys Customization Suite (ACS)
Multi Sensors • 6 = Ansys HPC, ANSYS HPC Pack
ENVIRONMENT SIMULATION
Basic Driving Scenario • ▪ 7 = Ansys Granta Materials Data
for Simulation
Advanced Driving Scenario ▪ ▪ 8 = Ansys Additive Suite
Advanced Vehicle Dynamic ▪ ▪ 9 = Ansys Composite Cure Simulation
MiL/SiL Connectivity • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
HiL Connectivity • 11 = Ansys SPEOS
PREPARATION 12 = Ansys SPEOS & Ansys SPEOS for NX
Environment Preparation • 13 = Ansys CFD Pro - Ansys Fluent with

Headlamp Preparation • DMP = Distributed-memory parallel
Sensor Models Preparation • SMP = Shared-memory parallel
Libraries of Assets • • MAPDL = Mechanical APDL
Explicit = Autodyn
Aqwa = Aqwa

/ DIGITAL TWIN TWIN BUILDER
SYSTEM SIMULATION, VALIDATION AND DIGITAL TWINS

Integrated Graphical Modeling Environment •
Standard Modeling Languages and Exchange Formats •
Mulit-domain Systems Modeler •
Extensive 0D Application-Specific Libraries •
3rd Party Tool Integrations •
3D ROM •
Embedded Software Integration •
Mulit-Domain System Simulation • 1 = Ansys nCode DesignLife Products
Rapid HMI Prorotyping • 2 = Ansys Fluent
System Optimization • 3 = Ansys DesignXplorer
XIL Integration • 4 = Ansys SpaceClaim
IIOT Connectivity (Microsoft® Azure® IoT, Microsoft Azure Digital

•
Twins , PTC ThingWorx®, SAP Predictive Asset Insights, Rockwell
Automation Emulate 3D and Rockwell Studio 5000) 6 = Ansys HPC, ANSYS HPC Pack
Digital Twin Runtime Deployment • 7 = Ansys Granta Materials Data
Hybrid Analytics • for Simulation

for Creo Parametric
11 = Ansys SPEOS

Explicit = Autodyn
Aqwa = Aqwa

SCADE SCADE SCADE SCADE SCADE SCADE
/ EMBEDDED SOFTWARE Architect Suite Display Test Lifecycle for A661
Applications
SCADE Vision
MODEL-BASED SYSTEMS ENGINEERING
Systems Requirements Analysis ▲ ▲

System & Software Architecture Design • •
SysML Models Import • •
Collaborative Work through Libraries and Model Synchronizations • •
Model Checks • •
Model Diff/Merge • •
System/Software Bi-Directional Sync • •
Model Sharing and IP Protection • • 1 = Ansys nCode DesignLife Products
2 = Ansys Fluent
Model-Based Interface Control Document Production • • 3 = Ansys DesignXplorer
Configurable for Industry Standards (IMA, AUTOSAR, etc.) • • 4 = Ansys SpaceClaim
Product Configuration for Automotive Developers • • 5 = Ansys Customization Suite (ACS)
EMBEDDED CONTROL & HMI SOFTWARE 6 = Ansys HPC, ANSYS HPC Pack
Traceability with Requirement Management Tools • • • • • • 7 = Ansys Granta Materials Data
for Simulation
Automatic Document Generation • • • • • • 8 = Ansys Additive Suite
Data Flow and State Machine Design and Simulation Capabilities • • 9 = Ansys Composite Cure Simulation
Extensive Set of Libraries • • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
Record and Playback Scenarios • • • 11 = Ansys SPEOS
Plant Model co-Simulation including FMI • • • • 12 = Ansys SPEOS & Ansys SPEOS for NX
On Host and on Target Testing • • • 13 = Ansys CFD Pro - Ansys Fluent with
Model and Code Structural Coverage • • • • DMP = Distributed-memory parallel
AUTOSAR-Compliant Code Generation • SMP = Shared-memory parallel
Formal Verification • MAPDL = Mechanical APDL
•
Explicit = Autodyn
Timing and Stack Optimization
Worst Case Execution Time Estimates on Target • Aqwa = Aqwa
Integration with Real-Time Operating Systems •
SCADE SCADE SCADE SCADE SCADE SCADE
/ EMBEDDED SOFTWARE Architect Suite Display Test Lifecycle for A661
Applications
SCADE Vision
EMBEDDED CONTROL & HMI SOFTWARE

Certified Code Generation for DO-178C, EN 50128, ISO26262,
IEC 61508 • •
Certification Kits for DO-178C, EN50128, ISO 26262, IEC 61508 • • • • •
Model-Based Prototyping and Specification of HMIs • •
Support of OpenGL, OpenGL SC and OpenGL ES • •
Font Management • •
Optimization of Graphical Specifications •
Solutions for ARINC 661 • • • 1 = Ansys nCode DesignLife Products
PERCEPTION SOFTWARE TESTING
2 = Ansys Fluent
Preception Software Robustness Testing • 3 = Ansys DesignXplorer
Triggering Conditions Identification • 4 = Ansys SpaceClaim


for Simulation

for Creo Parametric
11 = Ansys SPEOS

Explicit = Autodyn
Aqwa = Aqwa

optiSLang optiSLang ModelCenter ModelCenter ModelCenter
/ CONNECT Ansys Cloud Minerva optiSLang Pro Premium Enterprise Pro Premium Enterprise
LICENSING AND INSTALLATION

Upgrade to Aras SP14 •
Elastic Licensing •
Scalar Variations for Parametric Design Study • •
DATA MANAGEMENT
Data and Project Comparison •
Enhanced Branching •
Custom Digital Thread Configurability •
Automatic file conversion •
New folder widget, saved search for details list • 1 = Ansys nCode DesignLife Products
Added file support for metadata extraction • 2 = Ansys Fluent
Query Builder • 3 = Ansys DesignXplorer
Metadata Extraction • 4 = Ansys SpaceClaim
3D Viewer with Rich Exploration Options • 5 = Ansys Customization Suite (ACS)
ECAD Viewer • 6 = Ansys HPC, ANSYS HPC Pack

SCADE Project File Support • 7 = Ansys Granta Materials Data
Revision Management • for Simulation
File Format Conversion • 8 = Ansys Additive Suite

PROCESS MANAGEMENT
Work Request History Report • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
New Voting Dialog • 11 = Ansys SPEOS
Enhanced Gantt Chart • 12 = Ansys SPEOS & Ansys SPEOS for NX
Change Notice Comparison • 13 = Ansys CFD Pro - Ansys Fluent with
•
Task Completion
•
Simulation Task Review
APPLICATION MANAGEMENT
•
New Applications Page Layout
•
Explicit = Autodyn
Publish and Deploy Apps (optiSLang supported out-of-the-box)
Ansys LS-Dyna Batch Job Template • Aqwa = Aqwa

APPLICATION MANAGEMENT
Job Submission to Ansys HPC Cluster or Ansys Cloud •
Access Local Applications •
Run Apps without Input Files •
Remote Virtual Desktop •
INTEGRATIONS
Ansys Electronics Desktop Add-In • •
Integration with Ansys Workbench • • •
Integration with Ansys Materials Product Family • • • •
Two-Way Integration with ModelCenter • • 1 = Ansys nCode DesignLife Products
Integration with optiSLang • 2 = Ansys Fluent
German Language Support • 3 = Ansys DesignXplorer
Integration with LS-OPT • • • 4 = Ansys SpaceClaim
WORKFLOW MANAGEMENT
Completely Secure Workflows • 6 = Ansys HPC, ANSYS HPC Pack
Enhanced File Management • or Ansys HPC Workgroup
TOOL INTEROPERABILITY 7 = Ansys Granta Materials Data

for Simulation
Ability to submit HPC jobs from desktop apps to Ansys Cloud • 8 = Ansys Additive Suite
Supported running Ansys Cloud In browser interactively • 9 = Ansys Composite Cure Simulation
Support of HPC Solver Licenses • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS
Improved submission in AEDT • for Creo Parametric
ORCHESTRATION AND AUTOMATION 11 = Ansys SPEOS
Build and Automate Workflows • • 12 = Ansys SPEOS & Ansys SPEOS for NX
Integrate 3rd Party Tools • • 13 = Ansys CFD Pro - Ansys Fluent with
App Generation Wizard • DMP = Distributed-memory parallel
Test-Run and Desktop App • • SMP = Shared-memory parallel
Classic Design of Experiments • • • MAPDL = Mechanical APDL
Sampling and Sensitivity Analysis • • • Explicit = Autodyn
Robust Design Optimization • • • RBD = Rigid Body Dynamics
Aqwa = Aqwa

PRODUCT IMPROVEMENT
Scalar Meta-Modeling (including test data) • • •
Signal/Field Meta-Modeling (including sensor & 3D scan data) •
Modeling of Imperfect Surfaces for UQ •
AI for Metamodeling (including algorithms from Probaligence) •
Optimization & Sensitivity Analysis • • • •
Model Calibration • •
Concurrent Design Point Variations • •
Linux Support for DesignXplorer Algorithms • •
PRODUCT ROBUSTNESS
Robust Design & Reliability Analysis • • 2 = Ansys Fluent
Reliability Importance • • 3 = Ansys DesignXplorer
• •
Poisson Distribution for Stochastic Parameters
DASHBOARDS AND REPORTS
Dashboard 2.0 • or Ansys HPC Workgroup
Custom Widget Framework • 7 = Ansys Granta Materials Data

for Simulation
Bookmark Dashboards • 8 = Ansys Additive Suite
AUTOMATE ANY MODELING AND SIMULATION TOOL 9 = Ansys Composite Cure Simulation
Automate File I/O tools • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
Scripting with VBScript, JScript, Java, Perl, and Python • • • 11 = Ansys SPEOS
Integration with 3rd Party Tools • • • 12 = Ansys SPEOS & Ansys SPEOS for NX
AUTHOR ENGINEERING WORKFLOWS
Sequence • • • a reduced set of capabilities
• • •
Loop
If-Then Branch • • • MAPDL = Mechanical APDL
Parallel Branch • • • Explicit = Autodyn
Link Editor • • • RBD = Rigid Body Dynamics
Aqwa = Aqwa

AUTOMATICALLY EXECUTE THE WORKFLOW

Single Execution • • •
Multi-Run Trade Studies • • •
Run in Parallel • • •
SHARE AUTOMATED ANALYSES AND WORKFLOWS
Remote Execution • • •
Protect Intellectual Property • • •
GAIN INSIGHT TO THE DESIGN PROBLEM
Trade Study: Parametric Study • •
Trade Study: Design of Experiments (DOE) • •
Trade Study: Adaptive Design of Experiments • •
Sensitivity Analysis • •
VISUALIZE THE DESIGN SPACE
2D Bar Plot • •
2D Line Plot • •
2D Scatter Plot • •
3D Scatter Plot • •
Carpet Plot • •
Contour Plot • •
Histogram Plot • •
Interaction Effects Plot • •
Main Effects Plot • •
Main Effects Summary Plot • •
Parallel Coordinates • •
Prediction Profiler Contour Plot • •
Prediction Profiler XY Plot • •
Scatter Matrix • •
Variable Importance Plot • •
Variable Importance Summary Plot • •
PROBABILISTIC ANALYSIS
Monte Carlo Analysis • •
DESIGN OF EXPERIMENTS (COMMON)
Box-Behnken • •
Custom • •
Central Composite • •
Eighth Fractional Factorial • •
Face Centered Central Composite • •
Foldover • •
Franklin-Bailey 2 Level Fractional Factorial • • 1 = Ansys nCode DesignLife Products
Full Factorial • • 2 = Ansys Fluent
Half Factorial • • 3 = Ansys DesignXplorer
Latin-Hypercube • • 4 = Ansys SpaceClaim
Parameter Scan • • 5 = Ansys Customization Suite (ACS)
Plackett-Buman • • 6 = Ansys HPC, ANSYS HPC Pack
• •
Selected 2 Level Fractional Factorial
• •
Sixteenth Factional Factorial for Simulation
Taguchi 2 Level Orthogonal Array • • 8 = Ansys Additive Suite
DESIGN OF EXPERIMENTS (NORTH AMERICA ONLY) 9 = Ansys Composite Cure Simulation
Noesis Adaptive DOE • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
DESIGN OF EXPERIMENTS (GLOBAL)
11 = Ansys SPEOS
Design Explorer Orthogonal Array • • 12 = Ansys SPEOS & Ansys SPEOS for NX
Design Explorer Orthogonal Array + LHS • • 13 = Ansys CFD Pro - Ansys Fluent with
CONNECT ANY ENGINEERING ANALYSIS TO SYSTEMS ARCHITECTURE MODEL a reduced set of capabilities
NoMagic MagicDraw® / Cameo® • • • DMP = Distributed-memory parallel
IBM Rhapsody® • • • SMP = Shared-memory parallel
PTC Windchill Modeler® • • • MAPDL = Mechanical APDL
Vitech (Zuken) GENESYS® • • • Explicit = Autodyn
Capella • • • RBD = Rigid Body Dynamics
Aqwa = Aqwa

SIMULATE COMPLEX SYSTEM BEHAVIOR

Execute State Machine Diagrams (Cameo®) •
VERIFY REQUIREMENTS
Physical Requirements • • •
Behavioral Requirements (Cameo® and Windchill Modeler®) • • •
2 = Ansys Fluent


for Simulation

for Creo Parametric
11 = Ansys SPEOS

Explicit = Autodyn
Aqwa = Aqwa

medini medini analyze for medini analyze for Digital Safety
/ SAFETY ANALYSIS analyze Semiconductors Cybersecurity Manager
FUNCTIONAL SAFETY ANALYSIS
Safety Concept Modeling • •

Model Based Safety Analysis • •
Reliability Prediction and Analysis • •
Traceability and Validation Teamwork • •
Integration into Engineering Environment • •
Customization and Process Adaption • •
Ansys Product Integration • •
• •
Reporting and Documentation
2 = Ansys Fluent
Safety of Intended Functional Analysis • • 3 = Ansys DesignXplorer
CYBERSECURITY ANALYSIS 4 = Ansys SpaceClaim
Analysis Contect Establishment and Asset Identification • 5 = Ansys Customization Suite (ACS)
Systems Vulnerability Analysis • 6 = Ansys HPC, ANSYS HPC Pack

Threat Identification • 7 = Ansys Granta Materials Data

for Simulation
Attack Trees, Attack Path Calculation and Attack Collections • 8 = Ansys Additive Suite
Threat Assessment and Treatment • 9 = Ansys Composite Cure Simulation
Requirement Analysis and Management • 10 = Ansys SPEOS for NX & ANSYS SPEOS
for Creo Parametric
Rich Traceability • 11 = Ansys SPEOS
Teamwork and Integrated Task Management • 12 = Ansys SPEOS & Ansys SPEOS for NX
Reporting and Customization • 13 = Ansys CFD Pro - Ansys Fluent with

SAFETY MANAGEMENT DMP = Distributed-memory parallel
Tool Guided Safety Planning • SMP = Shared-memory parallel
•
Assignment & Assested Reuse of Analysis Results for MAPDL = Mechanical APDL
Safety Activities Explicit = Autodyn
Task Based Safety Plan Execution • RBD = Rigid Body Dynamics
Dashboard with KPI Monitoring and Reporting • Aqwa = Aqwa

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ANSYS PRODUCTS EMBEDDED
Ansys SpaceClaim Direct Modeler • • •

Ansys SpaceClaim Catia V5 Interface • • •
Ansys DesignXplorer • • •
Ansys License Manager • • •
GENERAL SOLVER CAPABILITIES
Monte-Carlo Forward Ray Tracing • • •

Monte-Carlo Backward Ray Tracing • •
Deterministic Simulation ▲ • •
Spectral Propagation • • •
Dispersion • • •
Surface Diffusion • • •
Volumic Diffusion • • •
Ambiant Material • • •
Non-Homogeneous Materials • • •
SPEOS Live Preview (GPU Acceleration) • 12
•12
Speos GPU Compute (GPU Acceleration) • 12

•12
Virtual BSDF •10
PHOTOMETRY / RADIOMETRY
Intensity • • •
Illuminance • • •
3D Illuminance • • •
Luminance ▲ • •
3D Energy Density • •
360 View - Observer • •
360 View - Immersive • •
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HUMAN VISION
Dynamic Adaption •
Glare Simulation •
HDR10 Screen Support •
WAVELENGTH RANGE
Visible (360nm - 830nm) • • •
UV (100nm - 360 nm) • •
Near IR (830nm - 2.5um) • •
Far Infra-Red (2.5um - 100um) •
OPTICAL DESIGN
Parabolic Surface • 12
• 12
•12
TIR Lens • 12
• 12
•12
Projection Lens • 12
• 12
•12
Optical Lens •
Optical Surface •
Light Guide •
Sharp Cut-Off Reflector •
Poly-Ellipsoidal Surface •
Micro Optical Stripes •
Freeform Lens • 11
Honeycomb Lens •
OPTICAL SENSOR
Field of View •
Export Sensor Grid as Geometry •
Camera Sensor •
Camera Raw Signal Export •
Camera Sensor Post Processing •
Dynamic Effects in Camera Simulation • • •
Dynamic Effects in LiDAR Simulation • • •
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OPTICAL SENSOR
SPEOS Lens System Importer (ZEMAX OpticStudio) •

LiDAR Sensor •
LiDAR Rotating & Scanning •
LIDAR Raw Time of Flight generation •
HEAD-UP DISPLAY
HUD Optical Analysis •

HUD Optical Design •
HUD Visualisation •
SOLVER PERFORMANCES
Default Number of Cores 4 4 4
Parallel Solving on Local PC • • •

Parallel Solving on Cluster • • •
Parallel Solving with Ansys Cloud Launched from Desktop • • •
Ansys RSM Compatibility • • •
Multi-GPU Solving on Local PC • •
SIMULATION PREPARATION
Source Group • • •
Geometry Group • • •
Local Meshing • • •
3D Textures • •
Polarizer • •
Fluorescent Converter • •
Light Field • • •
Preset Manager • • •

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SIMULATION PREPARATION
Texture Mapping (Bump, Multi-Layer) • •
Uniform Ambiant Source • • •
HDRI Source • • •
CIE Sky Source • •
Natural Light Source • •
Near Infrared Extended Ambient Source • •
Thermic Source •
POST PROCESSING
Virtual Lighting Controller • •
Photometric Numerical Certification • • •
Colorimetric Analysis • • •
Spectral Analysis • •
Light Expert • • •
Layer by Source • •
Layer by Face • •
Layer by Sequence • •
Stray Light Analysis • •
Layer by Polarisation • •
Visibility and Legilbility •
Night Vision Goggle •
Script Automation • • •
OPTIMIZATION
Parameters • • •
Design of Experiment •3
•3
• 3
Design Optimisation •3
•3
• 3
• 10
Ansys optiSLang Interface (12) ▪ ▪ ▪

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TOOL INTEROPERABILITY
Shared Workflows with Ansys Lumerical Products • • •
Shared Workflows with Ansys Zemax OpticStudio • • •
Shared Workflows with Ansys Mechanical • • •
IMAGING & AFOCAL DESIGN
Sequential Ray Tracing • • •
12 Field Points • • •
50 Field Points (Best For Aspheric Design) • • •
2000+ Field Points (Best For Freeforms) • •
Optimization • • •
Contrast Optimization • • •
High-Yield Optimization • • •
Tolerancing • • •
Quick Yield Analysis • • •
Tolerance Data Viewer • • •
Tolerance Data Analysis • • •
Black Box Encryption • • •
Image Quality Analysis • • •
Image Simulation Analysis • • •
Full-Field Aberration Analysis • • •
Aspheric Design • • •
Freeform Optics • • •
Diffractive Optics • • •
Ghost Focus Generator • • •
Multiple Configerations • • •
Birefringence • • •
Stock Lens Matching Tool • • •
TrueFreeform • •
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LIGHTING AND ILLUMINATION DESIGN

Non-sequential ray tracing • • •
Geometic light sources • • •
Measured light sources • • •
Objects • • •
Detectors • • •
Freeform Optics • • •
Colorimetry • • •
Ray splitting • • •
Ray scattering • • •
Measured source models • •
Measured surface scattering models • •
LightningTrace • •
Source Illumination Map • •
Phosphor & fluorescence modeling • •
Path analysis • •
PROGRAMMING AND INTERFACE
Zemax Programming Language • • •
User-configurable shortcut keys • • •
MATLAB interoperability • • •
User-defined surfaces and objects • • •
User-defined scatter profiles and sources • • •
Programmable interface (ZOS-API) • • •

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LASERS & FIBERS

Gaussian beams • • •
Scanning systems • • •
Single mode fiber coupling • • •
Multi-mode fiber coupling • • •
Physical Optics Propagation • • •
M2 & beam quality • • •
CAD INTEGRATION
Export to STEP, IGES, SAT, STL • • •
Import STEP, IGES, SAT, STL • • •
Dynamic link to CAD Software • •
Part-designer - static parts • • •
Part-designer - dynamic parts • •
DATA LIBRARIES
Design Templates collection • • •
Lens Catalog • • •
Materials Catalog • • •
Coatings Catalog • • •
Test Plate Lists • • •
Spectrum Data Files • • •
IS Scatter Catalog • •
Radiant Source Models • •
IES Source Models • •

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STAR
FEA Data Viewer •
Load FEA Data tool •
Fit Assessment tool •
Alignment Check •
Structural Data Summary •
Thermal Data Summary •
STAR System Viewer •
Performance Analysis •
2D Deformation Plot •
Thermal Index Plot •
OPTICSBUILDER
Import .ZBD file •
Update .ZBD file •
Export .ZBD file •
Static Boundary Rays •
Generate reference geometry •
Add mounting edge •
Add fold mirror •
Add sources and detectors •
Region of interest •
Apply surface properties •
Create ray filter •
Animate rays •
Hide/Show Rays •
Partial Rays •
Ray Geometry •
Chief Rays •
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OPTICSBUILDER
Ray Footprints •
Show Tolerances •
Generate lens drawings •
Optical geometry properties •
Editable optics •
System settings •
Optomechanical Packaging Analysis •
Simulation •
Results •
Show detectors •
Report •
Show Clipping Rays •
Show Contaminating Rays •
Print •

EMA3D Nuhertz Electronics Electronics
/ ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable Charge FilterSolutions Pro 2D Enterprise
LOW FREQUENCY ELECTROMAGNETICS

Electrostatics • • •
AC Conduction • • •
DC Conduction • • •
Magnetostatics • • •
Adaptive Field Mesh • • •
AC Harmonic Magnetic • • •
Electric Transient • •
MAGNETIC TRANSIENT
Translational Motion • • •
Fully Automatic Symmetrical Mesh Generation • • •
Rotational Motion • • •
Non-Cylindrical Motion • • •
Advanced Embedded Circuit Coupling • • •
Circuit Coupling with Adaptive Time Stepping • • •
Direct and Iterative Matrix Solvers • • •
ADVANCED MAGNETIC MODELING
Vector Hysteresis Modeling • • •
Multi-Conductive Terminals Modelling (PCBs, Busbars etc.) /
A-Phi Solver • •
Hysteresis Modeling for Anisotropic Material • • •
Frequency Dependent Reduced Order Models • • •
Reduced Order Model Extraction (Linear-Motion,
Rotational-Motion, No- Motion) • • •
Functional Magnetization Direction • • •
Magnetization/De- Magnetization Modeling • • •
Manufacturing Dependent Core L Loss Models • • •
Noise – Vibration Modeling ▪ ▪ ▪
Temperature Dependent De-Magnetization Modeling • • •
ADVANCED MAGNETIC MODELING

Temperature Dependent Core Loss Computation • • •
Lamination Modeling • • •
Magnetostriction and Magnetoelastic Modeling • • •
Hardware in the Loop Modeling • • •
Integrated Motor Synthesis and Design Kit • • •
Integrated Planar Magnetics Synthesis and Design Kit • • •
Temperature Dependant Litz Wire Modeling • • •
Litz Wire Modeling • • •
CONCEPT DESIGN SOLUTION FOR ELECTRICAL MACHINE
Template-Based Magnetic Topologies •
Template-Based Cooling Topologies •
Magnetic 2D FEA with Analytical Solution •
Thermal 2D FEA •
3D Thermal and Fluid Network •
Optimization Workflow ▪
Temperature Dependent Duty-Cycle Analysis •
Manufacturing Effects Due to Winding Impregnation and
Housing Interfaces •
Linear Structural 2D FEA •
Noise Vibration Harness Analytical Modelling •
Electrothermal Reduced Order Model (FMU) •
HIGH FREQUENCY ELECTROMAGNETICS
Fully Automated Adaptive Mesh Refinement • •
Multi-Frequency Broadband Adaptive Meshing • •
Frequency Domain Finite Element (FEM) Analysis • •
Frequency Domain Integral Equation (MoM) Analysis • •
Time Domain FEM Analysis • •
FEM Eigenmode Analysis • •
MoM Characteristic Mode Analysis • •

Physical Optics (PO) Analysis • •
Shooting and Bouncing Ray+ (SBR+) Analysis • •
Physical Theory of Diffraction (PTD) Correction for SBR • •
Uniform Theory of Diffraction (UTD) Correction for SBR • •
Visual Ray Tracing for SBR+ Analysis • •
SBR+ Creeping Wave Correction for RCS of Curved Obects • •
Range Doppler Plots for Radar Scenario Analyses •
Accelerated Doppler Processing (ADP) for SBR+ Range Doppler
Analyses •
RF and Digital Filter Synthesis and Design •
Domain Decomposition Method (DDM) for Frequency Domain
FEM Analysis • •
Hybrid Finite Element/ Integral Equation Analysis • •
Efficient Wirebond Package Meshing • •
UI Coupled Finite Element and/or IE with SBR+ Analysis • •
Modal Wave Port Excitation • •
Terminal Wave Port Excitations • •
Lumped, Voltage and Current Excitations • •
Circuit Port Excitations • •
Parametric Antenna Excitations for SBR+ • •
Floquet Excitations • •
Incident Wave Excitation • •
Magnetic Ferrite Bias Excitation • •
Perfect Electric and Magnetic Boundary • •
Finite Conductivity Boundary • •
Lumped RLC Boundary • •
Symmetry Boundary • •
Periodic Boundary • •
Frequency Dependant Materials • •


Spatial XYZ Material Properties Via Dataset • •
Higher and Mixed Order Elements • •
Curvilinear Element Mesh Correction • •
S,Y,Z Matrix Results • •
E, H, J, P Field Results • •
Direct and Iterative Matrix Solvers • •
Antenna Parameter Calculation • •
Infinite and Finite Antenna Array Calculations • •
Radar Cross Section Calculation • •
FSS, EBG and Metamaterial Calculation • •
Specific Absorption Rate Calculation • •
EMI/EMC Calculation • •
System Level EMI and RFI Analysis • • •
Linear Circuit Analysis with EM Dynamic link • •
Integrated Antenna Synthesis and Design Kit • •
5G SAR Standards Toolkit • •
Power Density and CDF • •
Radar Prep/Post Simulation Wizards • •
3D Component Libraries with User Controled Parametrics • •
3D Component with Encryption Creation • •
3D Component with Encryption Utilization • •
RF Discharge Solver • •
Mutli-paction Solver • •
Volumetric SBR+ for 3D Dielectrics • •
Surface Roughness Model for SBR+ • •
Accelerated Doppler Processing (ADP) for SBR+
Range-Doppler Analysis •

POWER AND SIGNAL INTEGRITY BOARD SIMULATION CAPABILITIES

Electronics Desktop 3D Layout GUI • • • •
ECAD Translation (Altium, Cadence, Mentor, Pulsonix, & Zuken) • • • • • •
MCAD (.sat) Generation from ECAD • • • •
Lead Frame Editor • • •
DC Voltage, Current and Power Analysis for PKG/PCB • •
DC Joule Heating with Ansys Icepak ▪ ▪ ▪ •
Passive Excitation Plane Resonance Analysis • •
Driven Excitation Plane Resonance Analysis • •
Automated Decoupling Analysis • •
Capacitor Loop Inductance Analysis • •
AC SYZ Analysis • •
Dynamically Linked Electromagnetic Field Solvers • •
Chip, Package, PCB Analysis (CPM) • • •
Near-Field EMI Analysis •
Far-Field EMI Analysis •
EMI/EMC Full Board Scan •
Characteristic Impedance (Zo) L PKG/PCB Scan •
Full PCB/PKG Cross-Talk Scanning •
TDR Wizard •
TDR Analysis • • • • •
Transient IBIS Circuit Analysis • • •
Signal Net Analyzer •
SerDes IBIS-AMI Circuit Analysis •
Macro-Modeling (Network Data Explorer) • • • • •
Steady State AC (LNA) Analysis • •
Virtual Compliance - DDRx, GDDRx, & LPDDRx •

POWER AND SIGNAL INTEGRITY BOARD SIMULATION CAPABILITIES

SPISIM Com and USB-C Compliance •
SPISIM IBIS AMI Generation •
Synopsys HSPICE Integration • •
Cadence PSPICE Support • •
Electromagnetically Circuit Driven Field Solvers • • •
RLCG PARASITIC EXTRACTION
DCRL, ACRL & CG Solver • • •
IC Packaging RLCG IBIS Extraction for Signals & Power • •
Touchpanel RLCG Unit Cell Extraction • •
Adaptive Meshing for Accurate Extraction • • •
Bus Bar RLCG Extraction • • • •
Power Inverter & Converter Component Extraction • •
3D Component Library • •
Reduced RLCG Matrix Operations • •
SPICE Equivalent Modeling Export • • •
DCRL & ACRL Joule Heating Analysis with Icepak • •
Macro-Modeling (Network Data Explorer) • •
2D Cable Modeling Toolkit • •
ELECTRONICS COOLING
Multi-Mode Heat Transfer • •
Steady-State and Transient • •
CFD Analysis • •
Turbulent Heat Transfer • •
Multiple-Fluid Analysis • •
Species Transport • •
Solar Loading • •
Reduced Order Flow and Thermal • •
ELECTRONICS COOLING
Network Modeling ▪ ▪ ▪ ▪ • •
Joule Heating Analysis • •
Thermo-Electric Cooler Modeling • •
Thermostat Modeling • •
Package Characterization • •
CABLE MODELING
Finite Difference Time Domain Analysis •
Multi-Conductor Transmission Line Analysis • • • • • • • •
Two-Way Coupling FDTD and Transmission Line Solver ▲ • ▲
Twisted Conductors •
Seam Impedance •
Cable Junctions •
Braided Shield Support •
Pin Voltage, Current Density, Plane Wave Excitations •
Multi-Conductor and Multi-Shield Support • •
Uses SpaceClaim Design Modeler UI •
Thin Surface and Thin Wire Algorithms •
HPC FOR ELECTRONICS
GPU Support ▲ ▲ ▲ •
HPC Meshing, Multi-Domain, Multi-Technology • •
HPC Accelerated Frequency Sweeps • • • •
HPC Accelerated Broadband Fast Frequency Sweep • •
HPC Distributed Hybrid Solving • •
HPC Enabled Domain Decomposition Method • • •
HPC Time Decomposition Method • • •
HPC Enabled Multi-port Excitation Acceleration • •
HPC Acceleration for DCRL, ACRL and CG • •
HPC 2D Skew Parallel Processing • • •
HPC Enabled Parallel Processing • • • • • •
SYSTEM MODELING FOR POWER ELECTRONICS

Circuit Simulation • • • • • • •
Block Diagram Simulation • • • • • • •
State Machine Simulation • • • • • • •
VHDL-AMS Simulation • • • • • • •
Integrated Graphical Modeling Environment • • • • • • •
Power Electronics Component Libraries • • • • • • •
Reduced Order Modeling • • • • • • •
Power Electronic Device and Module Characterization • • • • • • •
Push-Back Excitation • • • •
Co-Simulation with Low Frequency Electromagnetics • • •
Co-Simulation with MathWorks Simulink • • • • • • •
SYSTEM MODELING FOR RF / MICROWAVE
Radio Frequency Interference (RFI) System Solver • • •
Electromagnetic Interference System Solver • • •
RF Link Budget Analysis • • •
RF Co-Site and Antenna Coexistence Analysis • • •
Automated Diagnostics for Rapid Root-Cause Analysis • • •
RF Component Library • • •
Wireless Propagation Models • • •
Multi-Fidelity Parametric Radio Models • • •
SYSTEM MODELING FOR SI/PI
SerDes Channel Modeling - IBIS-AMI, QuickEye and VerifEye •
Multi-Drop & Parallel Bus Modeling - IBIS, HSPICE, Spectre,
PSPICE, and Nexxim Transient ▲ • •
Network Data Exploration • • • • •
TDR analysis • • •
Steady State AC (LNA) Analysis • • •
Virtual Compliance - DDRx, GDDRx, & LPDDRx •

MULTIPHYSICS-PLATFORM TECHNOLOGIES
Advanced, Automated Data Exchange • • • • • •
Drag-n-Drop Multiphysics ▪ ▪ ▪ ▪ ▪ •
Direct Coupling Between Physics • • • • • •
Collaborative Workflows • • • • • •
Fully Managed Co-Simulation • • • • • •
Flexible Solver Coupling Options • • • • • •
MULTIPHYSICS ELECTRO-THERMAL INTERACTION
Convection Cooled Electronics ▪ ▪ ▪ ▪ •
Conduction Cooled Electronics ▪ ▪ ▪ ▪ •
High Frequency Thermal Management ▪ ▪ ▪ •
Low Frequency Thermal Management ▪ ▪ ▪ •
MATERIALS FOR ELECTRONICS
Granta Materials Data for Simulation ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪
Granta MI Materials Gateway ▪ ▪ ▪ ▪ ▪ ▪ ▪
Ansys Granta Advanced Materials – Electromagnetic ▪ ▪ ▪ ▪ ▪ ▲ ▪
MISCELLANEOUS
Integrated Windows HPC Support • • • • •
Integrated IBM Spectrum LSF Support • • • • •
Customizable 3rd Party Scheduler Support • • • • •
Support ACT Extensions ▲ ▲ ▲ ▲ ▲ ▲
Parallel Solving with Ansys Cloud Launched from Desktop • • • • •
Elastic Licensing • • • • • •
CHARGING AND DISCHARGING MODELING
Internal Charging •
Electrostatic Discharge in Air •
Surface Charging •
3D Particle Transport •
Arcing in Solid Dielectrics •
Coupled Charging Simulations •

CML INTER- qINTER- Verilog-A
/ PHOTONICS CHARGE Compliler DGTD FDTD FEEM HEAT CONNECT CONNECT MODE MQW STACK RCWA Platform
DESIGN ENVIRONMENT
Finite Element IDE (with 2D/3D modeling) • • • •
Finite Difference IDE (with 2D/3D modeling) • • • •
Hierarchical Schematic Editor • •
GENERAL
HPC-ready / compatible with cloud providers • •
PIC Element Library •
Supports CML development and distribution • •
Automated CML generation •
Version controlled CMLs •
Structured input with template and data validation •
Automated test case generation •
IP protected CMLs • •
INTERCONNECT and Verilog-A models from single source • • •
Leverage build-in analysis from 3rd party EDA tools •
Design and model using Verilog-A in 3rd party EDA tools •
Available in Ansys Cloud • • • • • • • • • • • •
Ansys Cloud HPC Services Integration • • • • • • • • •
Charge transport (electrostatic potential and drift diffusion) •
Self-consistent heat/charge modeling • •
Heat transport (heat flux, convention, and radiation) •
Finite Element Eigenmode Solver • •
Discontinuous Galerkin Time Domain Solver •
Finite Difference Time Domain solver •
Finite Difference Eigenmode solver • •
Bidirectional eigenmode expansion •
2.5D variational FDTD (varFDTD) •
Advanced Finite Difference Conformal Meshing • • ▲


Quantum mechanical band structure calc. (kp method) •
Waveguide and band diagram calculation •
Gain and spontanious emission calculation •
Temperature, strain, and field effects •
Closed form solver for rapid multilayer thin-film analysis • •
Planewave and dipole illumination • •
Capture Interface and microcavity effects • •
Circuit frequency domain analysis • •
Circuit transient mode simulator •
Circuit transient block mode simulator •
Circuilt multi-mode and multi-channel support • •
Circuit mixed signal representation •
Laser library with TWLM solver •
System library including optical fibre, FEC and MLSE models •
Rigorous Coupled-Wave Analysis Solver •
Waveguide Bend Calculation for Bend Loss and Ring Analysis •
Quantum Logic Gate Simulation •
Quantum Loss Extraction •
MATERIALS SELECTION & RELATED TOOLS
Comprehensive Material Models • • • • • • • • •
Multi-coefficient Models • • •
Non-linearity Modeling • ▲ ▲
Anisotropy Modeling • ▲ ▲ •
OPTIMIZATION
Inverse Design with lumopt • ▲
Particle Swarm • • • • • • • ▲ ▲
Parameter Sweeps • • • • • • • ▲ ▲ ▲
POST PROCESSING
Far-Field Projection • • • •
Band Structure Analysis •
Bidirectional Scattering Distribution Function •
POSTPROCESSING
Q-Factor Analysis • •
Charge Generation Rate • •
Bend Loss Analysis •
Overlap analysis •
Model area analysis •
Helical waveguides •
Extract gain/absorption and spontaneous emission coefficients for
TWLM model (INTERCONNECT) •
Statistical support (Monte-Carlo Analysis) • • • • • • •
Statistical Support (Corner analysis) •
Small-signal analysis •
Steady-state and transient analysis • •
Laser Self-Heating •
Multiphysics Solver Interoperabilty • • • • • •
Automation API (Lumerical script/Matlab/Python) • • • • • • • • • •
Circuit electronic photonic co-simulation (3rd party tools) • •
optiSLang Integration • • • • • • • • • •
Shared workflows with Speos • • •
Speos Surface Models: BSDF/BRDF format exchange •
Speos Surface Models: Diffraction Grating SOP Plugin • • •
Optics Interoperability Workflows with Speos and/or Zemax • • •
Process Enabled Photonic Component Design Workflows • • • • • •
Virtuoso layout integration • •
KLayout integration •

/ DESIGN TOOLS SpaceClaim DesignModeler Discovery
FLUIDS
Inlet and Outlet Conditions •
Steady-state Flow •
Transient Flow •
Incompressible Flow •
Compressible Flow ▲
Porous Media •
Rotating Fluid Zone •
GEOMETRY
Direct Modeling Technology • • 2 = Ansys Fluent
Feature Based Modeling Technology • • • 3 = Ansys DesignXplorer
Open Data from All Major CAD Systems • • • 4 = Ansys SpaceClaim
Modify Imported Geometry • • • 5 = Ansys Customization Suite (ACS)
Defeaturing and Simplification Tools • • • 6 = Ansys HPC, ANSYS HPC Pack

Model Repair • • • 7 = Ansys Granta Materials Data
Add Parameters for Design Exploration • • • for Simulation
• • •
Extract Mid-Surfaces/Shells and Beams
Extract Fluid Volumes • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS
Shared Topology for Conformal Meshing • • • for Creo Parametric
Boundary Condition Mapping • • • 11 = Ansys SPEOS
• •
Reverse Engineering Faceted Data
Prep for Additive Manufacturing • • a reduced set of capabilities
HEAT TRANSFER DMP = Distributed-memory parallel
Steady-state Solid Conduction • SMP = Shared-memory parallel
Transient Solid Conduction • MAPDL = Mechanical APDL
•
Explicit = Autodyn
Natural Convection
Conjugate Heat Transfer • Aqwa = Aqwa
External Radiation •
/ DESIGN TOOLS SpaceClaim DesignModeler Discovery
GRANTA MATERIALS DATA FOR SIMULATION

Materials Data for Simulation ▪
MULTIPHYSICS
Conjugate Heat Transfer •
Thermal-Stress •
STRUCTURAL
Static Structural Analysis •
Modal Analysis •
Pre-Stressed Modal Analysis ▪
Point Masses • 1 = Ansys nCode DesignLife Products
Springs • 2 = Ansys Fluent
Joints • 3 = Ansys DesignXplorer
Nonlinear Contact ▪ 4 = Ansys SpaceClaim
Pre-Tension Bolts • 5 = Ansys Customization Suite (ACS)
Large Deformation ▪ 6 = Ansys HPC, ANSYS HPC Pack

Topology Optimization • 7 = Ansys Granta Materials Data

for Simulation
• • •
Supported running on the Ansys Cloud In browser interactively
Geometry Transfer to Workbench (WB), Fluent, and Mechanical • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS
Physics Transfer to Fluent, Mechanical, and HFSS • for Creo Parametric
HIGH FREQUENCY ELECTROMAGNETICS 11 = Ansys SPEOS
Automated Antenna Simulation Workflow • 12 = Ansys SPEOS & Ansys SPEOS for NX
FDTD Solution with Automated Graded Cartesian Grid • 13 = Ansys CFD Pro - Ansys Fluent with
Circuit Port Excitations • DMP = Distributed-memory parallel
Mode Port Excitations • SMP = Shared-memory parallel
Electric and Magnetic Material Properties • MAPDL = Mechanical APDL
S Parameters Including Smith Charts and Touchstone Export • Explicit = Autodyn
Electric and Magnetic Field Results • RBD = Rigid Body Dynamics
Antenna Parameter Calculation • Aqwa = Aqwa

STK STK STK STK STK Missle ODTK DME
/ DIGITAL MISSION ENGINEERING STK Pro Premium
(Space) Premium (Air) Enterprise Scheduler STK Solis Tool Kit PropNav ODTK SSA STK Engine Component
Libraries
Physics-based object modeling • • • • •
Full 3D and 2D visualization • • • •
Streaming imagery • • • •
Integrated timeline view • • • •
Reporting and graphing • • • • •
Moviemaking • • • •
Geometric sensor models (rectangular, complex conic, SAR, etc.) • • • •
Platform attitude profiles (aligned, ECF, ECI, fixed in axes,
external-file, etc.) • • • •
System constraints (azimuth, elevation, range, line of sight,
temporal, lighting, etc.) • • • •
Single object access calculations • • • •
Many vs. many, multinode access computations • • • •
Body masking • • • •
Sensor obscuration tool • • • •
Import digital terrain data • • • •
Terrain-based analysis and route following • • • •
RF communications system modeling • • • •
Radar system modeling • • • •
Urban environment signal attenuation • • • •
User-defined coverage grids for data visualization • • • •
Advanced orbit trajectory design ▲ • ▲ •
Test and evaluation planning and results analysis ▲ ▲ ▲ •
Parallel computing ▲ • • •
Missile and launch vehicle modeling • • • • ▪1
Real-time tracking data feeds • • •
DIS and HLA interfaces • • •

Libraries
Electro-optical and infrared sensor modeling • • • •
Model advanced space environment effects • • •
Consider spacecraft perturbation effects (e.g., solar radiation
pressure drag) • • •
Spacecraft rendezvous and proximity operation maneuver
planning templates • • •
Solar panel power estimation tool • • • •
Performance-based aircraft route design • • •
Wind effects on airborne vehicle trajectories • • •
Runway and waypoint catalogs • • •
Correlate external ephemeris to known platform performance
envelopes • •
Integrate analysis with SysML state machine simulations •
Resource and asset scheduling in STK-modeled missions ▪1
Dynamic spacecraft attitude system modeling ▪1
Emulate onboard spacecraft attitude flight control systems ▪1
Design attitude system P-I-D controls ▪1
Model onboard spacecraft reaction wheels and gyros ▪1
Advance multi-stage missile system modeling ▪1
Proportional navigation and guidance simulation ▪1
SIMULATE & PROCESS SATELLITE / SPACECRAFT TRACKING DATA
Process spacecraft tracking and measurement data •
Resolve spacecraft maneuvers from tracking measurements •
Multiple simultaneous orbit solutions •
Combine multisource satellite tracking data •
Collection of common automation routines for on-orbit operations ▪
Object association and correlation against existing catalog ▪1 •
Automated maneuver processing, characterization, and refined
orbit estimations •

Libraries
APP DEVELOPMENT API’S
Software development kit APIs for workflow automation &
scripting • • • • • • • • •
Deployment of custom applications developed using STK's API's •
Scalable .DLL's for building custom stand-alone or server-based
applications and services •

Ansys Gateway
/ CLOUD Ansys Cloud Direct Powered by AWS
VDI SUPPORT
Windows (RDP) • •
Linux •
In-browser •
HPC SUPPORT
HPC Support • •
CLOUD HARDWARE PROVIDER
Ansys Managed •
Bring Your Own Cloud •
STORAGE
Object Storage • 2 = Ansys Fluent
Volume Storage • 3 = Ansys DesignXplorer
•
Shared SMB and NFS Storage
LICENSING
Bring Your Own License • • or Ansys HPC Workgroup
Elastic Licensing • • 7 = Ansys Granta Materials Data

for Simulation
AUTHENTICATION 8 = Ansys Additive Suite
Ansys ID/SSO • 9 = Ansys Composite Cure Simulation
Active Directory Integration • 10 = Ansys SPEOS for NX & ANSYS SPEOS

for Creo Parametric
WEB PORTAL
11 = Ansys SPEOS
Access Controls • 12 = Ansys SPEOS & Ansys SPEOS for NX
Template Creation • 13 = Ansys CFD Pro - Ansys Fluent with
• •
Budget Control
Usage Reporting • • SMP = Shared-memory parallel
3RD PARTY TOOLS
3rd Party Tools • Explicit = Autodyn
Aqwa = Aqwa

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• Full Support ▲ Limited Capability ▪ Requires more than 1 product

Multi-Stage Cyclic Symmetry • 4 = Ansys SpaceClaim

Rotordynamics • • • 5 = Ansys Customization Suite (ACS)

6 = Ansys HPC, ANSYS HPC Pack

Modal Acoustics • 7 = Ansys Granta Materials Data

Transient Acoustics • • 9 = Ansys Composite Cure Simulation

Spectral Element Method Acoustics • 11 = Ansys SPEOS

Piezoelectric Acoustics • 13 = Ansys CFD Pro - Ansys Fluent with

Generation of Acoustic Signature from Contact Regions • • • DMP = Distributed-memory parallel

Acoustics Element Library • • • • SMP = Shared-memory parallel

Acoustics Material Models • • • MAPDL = Mechanical APDL

RBD = Rigid Body Dynamics

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 3

1-D Electromechanical Transducer • 2 = Ansys Fluent

Piezoelectric • • 3 = Ansys DesignXplorer

Piezoresistive • 4 = Ansys SpaceClaim

Electromagnetic • 5 = Ansys Customization Suite (ACS)

6 = Ansys HPC, ANSYS HPC Pack

Diffusion-Pore-Fluid • 7 = Ansys Granta Materials Data

Diffusion-Thermal-Electric-Magnetic • 8 = Ansys Additive Suite

1-Way Fluid Structure Interaction ▪2

2-Way Fluid-Structure Interaction ▪2

Incompressible Fluid Dynamics (ICFD) • 11 = Ansys SPEOS

Multi-scale Modeling • • DMP = Distributed-memory parallel

Conservation Element/Solution Element (CESE) • SMP = Shared-memory parallel

MAPDL = Mechanical APDL

RBD = Rigid Body Dynamics

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 4

Advanced Failure Criteria Library • ▲ 4 = Ansys SpaceClaim

First-Ply Failure • • • 5 = Ansys Customization Suite (ACS)

Last-Ply failure • • 6 = Ansys HPC, ANSYS HPC Pack

Delamination • • 7 = Ansys Granta Materials Data

Sandwich Modeling • • 9 = Ansys Composite Cure Simulation

Automation / Run Scripts • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

12 = Ansys SPEOS & Ansys SPEOS for NX

13 = Ansys CFD Pro - Ansys Fluent with

DMP = Distributed-memory parallel

SMP = Shared-memory parallel

MAPDL = Mechanical APDL

RBD = Rigid Body Dynamics

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 5

Crack Growth Linear Fracture Mechanics ▪1

6 = Ansys HPC, ANSYS HPC Pack

Python Scripting Customization ▪1

7 = Ansys Granta Materials Data

FE (Lagrange) Solver • • • 8 = Ansys Additive Suite

Euler Solvers • • 9 = Ansys Composite Cure Simulation

Implicit-Explicit Material States • • • 10 = Ansys SPEOS for NX & ANSYS SPEOS

Mass Scaling • • • 11 = Ansys SPEOS

Natural Fragmentation • • • 12 = Ansys SPEOS & Ansys SPEOS for NX

De-Zoning • • DMP = Distributed-memory parallel

Explicit Time Integration • • • MAPDL = Mechanical APDL

RBD = Rigid Body Dynamics

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 6

Implicit Time Integration • • • • •

Shell - Thick (Solid Shell) • • • • • 6 = Ansys HPC, ANSYS HPC Pack

Reinforcement Elements • • • • ▪ 13 = Ansys CFD Pro - Ansys Fluent with

GEOMETRY AND STL FILE HANDLING MAPDL = Mechanical APDL

SpaceClaim Direct Modeler • Explicit = Autodyn