TB6600FG Toshiba
TB6600FG Toshiba
TB6600FG
PWM Chopper-Type bipolar
Stepping Motor Driver IC
Features
• Single-chip bipolar sinusoidal micro-step stepping motor driver
• Ron (upper + lower) = 0.4 Ω (typ.) Weight:
• Forward and reverse rotation control available HQFP64-P-1010-0.50 : 0.26g( typ.)
• Selectable phase drive (1/1, 1/2, 1/4, 1/8, and 1/16 step)
• Output withstand voltage: Vcc = 50 V
• Output current: IOUT = 4.5 A (absolute maximum ratings, peak)
IOUT = 4.0 A (operating range, maximal value)
• Packages:HQFP64-P-1010-0.50
• Built-in input pull-down resistance: 100 kΩ (typ.), (only TQ terminal: 70 kΩ(typ.))
• Output monitor pins (ALERT): Maximum of IALERT = 1 mA
• Output monitor pins (MO): Maximum of IMO = 1 mA
• Equipped with reset and enable pins
• Stand by function
• Single power supply
• Built-in thermal shutdown (TSD) circuit
• Built-in under voltage lock out (UVLO) circuit
• Built-in over-current detection (ISD) circuit(*)
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TB6600FG
Pin Functions
NC pins : 2,5,9,12,15,18,19,21,24,29,31,33,35,37,39,40,41,42,44,46,48,50,52,57,61,62,63
Pins which have the same symbol should be connected each other outside the IC.
NC pins are excluded from applying ESD because they don’t connect to anything in the IC.
VDD
10k Ω 10kΩ
100kΩ 70kΩ
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Pin Assignment
A LE RT
SGND
V re g
(NC)
(NC)
(NC)
(NC)
(NC)
(NC)
(NC)
(NC)
(NC)
(NC)
OSC
MO
TQ
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
Latch/Auto 49 32 CW/CCW
(NC) 50 31 (NC)
Vref 51 30 CLK
(NC) 52 29 (NC)
Vcc 53 28 Vcc
Vcc 54 27 Vcc
Vcc 55 26 Vcc
Vcc 56 TB6600FG 25 Vcc
(NC) 57 24 (NC)
(Top View)
M1 58 23 RESET
M2 59 22 ENABLE
M3 60 21 (NC)
(NC) 61 20 PGNDA
(NC) 62 19 (NC)
(NC) 63 18 (NC)
OUT2B 64 17 OUT1A
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
OUT2 A
OUT2 A
OUT1 A
N FB
N FB
N FA
N FA
OUT2 B
(NC)
(NC)
OUT1 B
OUT1 B
(NC)
(NC)
(NC)
PGNDB
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Block Diagram
36 38 43 25,26,27,28,53,54,55,56
OUT1A
M1 58
Reg(5V) 16,17
Pre H-Bridge
M2 59 driver A
-drive
10,11
M3 60 OUT2A
RESET 23
OUT1B
ENABLE 22 6,7
Pre H-Bridge
driver B
Latch/Auto 49 -drive
1,64
OUT2B
OSC 34 OSC
Current selector NFB
3,4
circuit B
1/3 100%/30%
Vref 51
47 45 20 8
TQ
SGND PGNDA PGNDB
Setting of Vref
Input
Voltage ratio
TQ
L 30%
H 100%
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Description of Functions
1. Excitation Settings
The excitation mode can be selected from the following eight modes using the M1, M2 and M3 inputs. New
excitation mode starts from the initial mode when M1, M2, or M3 inputs are shifted during motor operation.
In this case, output current waveform may not continue.
Input Mode
M1 M2 M3 (Excitation)
Standby mode
L L L
(Operation of the internal circuit is almost turned off.)
L L H 1/1 (2-phase excitation, full-step)
1/2A type (1-2 phase excitation A type)
L H L
( 0%, 71%, 100% )
1/2B type (1-2 phase excitation B type)
L H H
( 0%, 100% )
H L L 1/4 (W1-2 phase excitation)
H L H 1/8 (2W1-2 phase excitation)
H H L 1/16 (4W1-2 phase excitation)
Standby mode
H H H
(Operation of the internal circuit is almost turned off.)
Note: To change the exciting mode by changing M1, M2, and M3, make sure not to set M1 = M2 = M3 = L or M1 = M2 =
M3 = H.
Standby mode
The operation mode moves to the standby mode under the condition M1 = M2 = M3 = L or M1 = M2 = M3
= H.
The power consumption is minimized by turning off all the operations except protecting operation.
In standby mode, output terminal MO is HZ.
Standby mode is released by changing the state of M1=M2=M3=L and M1=M2=M3=H to other state.
Input signal is not accepted for about 200 μs after releasing the standby mode.
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TB6600FG
2. Function
(1)To turn on the output, configure the ENABLE pin high. To turn off the output, configure the ENABLE
pin low.
(2) The output changes to the Initial mode shown in the table below when the ENABLE signal goes High
level and the RESET signal goes Low level. (In this mode, the status of the CLK and CW/CCW pins are
irrelevant.)
(3) As shown in the below figure of Example 1, when the ENABLE signal goes Low level, it sets an OFF on
the output. In this mode, the output changes to the initial mode when the RESET signal goes Low level.
Under this condition, the initial mode is output by setting the ENABLE signal High level. And the motor
operates from the initial mode by setting the RESET signal High level.
(Example 1)
(例1)
CLK
RESET
ENABLE
Internal
内部電流設定 current set
Output current(*)
出力電流(A相)
(phase A )
(*: Output current starts rising at the timing of PWM frequency just after ENABLE pin outputs high.)
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3. Initial Mode
When RESET is used, the phase currents are as follows.
The average current is lower than the calculated value because this IC has the method of peak current
detection.
Please use the IC under the conditions as follows;
5. OSC
Triangle wave is generated internally by CR oscillation by connecting external resistor to OSC terminal.
Rosc should be from 30kΩ to 120kΩ. The relation of Rosc and fchop is shown in below table and figure. The
values of fchop of the below table are design guarantee values. They are not tested for pre-shipment.
Rosc(kΩ) fchop(kHz)
Min Typ. Max
30 - 60 -
51 - 40 -
120 - 20 -
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6. Decay Mode
It takes approximately five OSCM cycles for charging-discharging a current in PWM mode. The 40% fast
decay mode is created by inducing decay during the last two cycles in Fast Decay mode.
The ratio 40% of the fast decay mode is always fixed.
The relation between the master clock frequency (fMCLK), the OSCM frequency (fOSCM) and the PWM
frequency (fchop) is shown as follows:
fOSCM = 1/20 ×fMCLK
fchop = 1/100 ×fMCLK
fchop
OSCM
Internal
Waveform
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6-2. Effect of Decay Mode
• Decreasing the current (In case the current is decreased to the predefined value in a short time because
it decays quickly.)
Charge
Even if the output current rises above the predefined current at the RNF point, the
current control mode is briefly switched to Charge mode for current sensing.
• Decreasing the current (In case it takes a long time to decrease the current to the predefined value
because the current decays slowly.)
Charge Charge
Even if the output current rises above the predefined current at the RNF point, the
current control mode is briefly switched to Charge mode for current sensing.
During Mixed Decay and Fast Decay modes, if the predefined current level is less than the output current at
the RNF (current monitoring point), the Charge mode in the next chopping cycle will disappear (though the
current control mode is briefly switched to Charge mode in actual operations for current sensing) and the
current is controlled in Slow and Fast Decay modes (mode switching from Slow Decay mode to Fast Decay
mode at the MDT point).
Note: The above figures are rough illustration of the output current. In actual current waveforms, transient response
curves can be observed.
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TB6600FG
fchop fchop
OSCM
Internal
waveform
Predefined Current Level
IOUT
NF
Predefined
Current Level NF
40%
Fast
DECAY
MODE
fchop fchop
Predefined
Current Level
IOUT NF
MDT (MIXED DECAY TIMMING) points
Predefined NF
Current Level
40%
Fast
DECAY
MODE
• When the output current value > predefined current level in Mixed Decay mode
Predefined
Current NF
Level
IOUT
NF
Predefined Current
Level
40%
Fast
DECAY MDT (MIXED DECAY TIMMING) points
MODE
Even if the output current rises above the predefined current at the
RNF point, the current control mode is briefly switched to Charge
mode for current sensing.
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Output Stage Transistor Operation Mode
U1 U2 U1 U2 U1 U2
OFF ON ON L2 L1 L2
L1 L2 L1 ON ON OFF
CLK U1 U2 L1 L2
Note: The above chart shows an example of when the current flows as indicated by the arrows in the above figures.
If the current flows in the opposite direction, refer to the following chart:
CLK U1 U2 L1 L2
Upon transitions of above-mentioned functions, a dead time of about 300 ns (Design guarantee value) is inserted
respectively.
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Thermal Shut-Down circuit (TSD)
(1) Automatic return
TSD = 160°C (typ.) (Note)
TSDhys = 70°C (typ.) (Note)
Output state
Output on Output off Output on
H
ALERT output
L
In case of automatic return, the return timing is adjusted at charge start of fchop after the temperature falls to the
return temperature (90°C (typ.) in the above figure).
The return period after the temperature falls corresponds to one cycle to two cycles of fchop.
Output state
Output on Output off Output on
H
ALERT output
L
H
ENABLE input
L
0.3ms or more when Rosc=51kΩ
The operation returns by programming the ENABLE as H → L → H shown in above figure or turning on power
supply and turning on UVLO function. In this time, term of L level of ENABLE should be 0.3ms or more.
To recover the operation, the junction temperature (the chip temperature) should be 90°C or less when ENABLE
input is switched from L to H level. Otherwise, the operation does not recover.
Note: Pre-shipment testing is not performed.
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ISD (Over current detection)
Current that flows through output power MOSFETs are monitored individually. If the current exceeds the
over-current detection value in at least one of the eight output power MOSFETs, over-current is detected
and then L level is outputted as an ALERT signal. In this case, all output power MOSFETs are turned off.
However, always add a fuse in the power supply line because IC can be broken due to the current being
over absolute maximum ratings.
Masking term of 1μs or more (typ. when Rosc=51kΩ) (Note) should be provided in order to protect detection
error by noise. ISD does not work during the masking term.
Dead band
1μs or more(typ.)
Output state
Output on Output off Output on
H
ALERT output
L
H
ENABLE input
L
0.3ms or more when Rosc=51kΩ
The operation returns by programming the ENABLE as H → L → H shown in above figure or turning
on power supply and turning on UVLO function.
Note: Pre-shipment testing is not performed.
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TB6600FG
When Vcc falls to around 5.5 V and UVLO operates, output turns off.
It recovers automatically from the initial mode when both Vcc rise to around 6.0 V or more. The following
values are design guarantee values.
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TB6600FG
ALERT output
ALERT terminal outputs low in detecting either TSD or ISD.
ALERT terminal is connected to power supply externally via pull-up resistance.
VALERT = 0.5 V (max) at 1 mA
MO output
MO turns on at the predetermined state and output low.
MO terminal is connected to power supply externally via pull-up resistance.
VMO = 0.5 V (max) at 1 mA
State MO
Initial Low
Not initial Z
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Sequence and current level in each excitation mode
1/1-step Excitation Mode (M1: L, M2: L, M3: H, CW Mode)
CLK
MO
(%)
100
IA 0
−100
(%)
100
IB 0
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8
CLK
MO
(%)
100
IA 0
−100
(%)
100
IB 0
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8
It operates from the initial state after the excitation mode is switched.
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1/2-step Excitation Mode (A type) (M1: L, M2: H, M3: L, CW Mode)
CLK
MO
(%)
100
71
IA 0
−71
−100
(%)
100
71
IB 0
−71
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8
CLK
MO
(%)
100
71
IA 0
−71
−100
(%)
100
71
IB 0
−71
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8
It operates from the initial state after the excitation mode is switched.
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TB6600FG
1/2-step Excitation Mode (B type) (M1: L, M2: H, M3: H, CW Mode)
CLK
MO
(%)
100
IA 0
−100
(%)
100
IB 0
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8
CLK
MO
(%)
100
IA 0
−100
(%)
100
71
IB 0
−71
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8
It operates from the initial state after the excitation mode is switched.
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1/4-step Excitation Mode (M1: H, M2: L, M3: L, CW Mode)
CLK
MO
(%)
100
92
71
38
IA 0
−38
−71
−92
−100
(%)
100
92
71
38
IB 0
−38
−71
−92
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16
CLK
MO
(%)
100
92
71
38
IA 0
−38
−71
−92
−100
(%)
100
92
71
38
IB 0
−38
−71
−92
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16
It operates from the initial state after the excitation mode is switched.
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1/8-Step Excitation Mode (M1: H, M2: L, M3: H, CW Mode)
CLK
MO
(%)
100
98
92
83
71
56
38
20
IA
0
−20
−38
−56
−71
−83
−92
−98
−100
(%)
100
98
92
83
71
56
38
20
IB
0
−20
−38
−56
−71
−83
−92
−98
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 t18 t19 t20 t21 t22 t23 t24 t25 t26 t27 t28 t29 t30 t31 t32
It operates from the initial state after the excitation mode is switched.
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TB6600FG
1/8-Step Excitation Mode (M1: H, M2: L, M3: H, CCW Mode)
CLK
MO
(%)
100
98
92
83
71
56
38
20
IA 0
−20
−38
−56
−71
−83
−92
−98
−100
(%)
100
98
92
83
71
56
38
20
IB 0
−20
−38
−56
−71
−83
−92
−98
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 t18 t19 t20 t21 t22 t23 t24 t25 t26 t27 t28 t29 t30 t31 t32
It operates from the initial state after the excitation mode is switched.
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1/16-step Excitation Mode (M1: H, M2: H, M3: L, CW Mode)
CLK
MO
[%]
100
98
96
92
88
83
77
71
63
IA
56
47
38 IB
29
20
10
−10
−20
−29
−38
−47
−56
−63
−71
−77
−83
−88
−92
−96
−98
−100
t0・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・t64
It operates from the initial state after the excitation mode is switched.
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TB6600FG
1/16-step Excitation Mode (M1: H, M2: H, M3: L, CCW Mode)
CLK
MO
[%]
100
98
96
92
88
83
77 IA
71
63
56
47
38 IB
29
20
10
−10
−20
−29
−38
−47
−56
−63
−71
−77
−83
−88
−92
−96
−98
−100
t0・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・t64
It operates from the initial state after the excitation mode is switched.
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Current level
2-phase, 1-2-phase, W1-2-phase, 2W1-2-phase, 4W1-2-phase excitation (unit: %)
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Absolute Maximum Ratings (Ta = 25°C)
IO
Output current (per one phase) 4.5 A
(PEAK)
I (ALERT)
Drain current (ALERT, MO) 1 mA
I (MO)
Input voltage VIN 6 V
1.7 (Note 1)
Power dissipation PD W
4.2 (Note 2)
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings.
Exceeding the ratings may cause the device breakdown, damage or deterioration, and may result injury by explosion or
combustion.
Please use the IC within the specified operating ranges.
The power supply voltage of 42 V and the output current of 4.5 A are the maximum values of operating range.
Please design the circuit with enough derating within this range by considering the power supply variation, the
external resistance, and the electrical characteristics of the IC. In case of exceeding the power supply voltage
of 42 V and the output current of 4.5 A, the IC will not operate normally.
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Electrical Characteristics (Ta = 25°C, Vcc = 24 V)
twCLKH
Minimum CLK pulse width CLK 2.2 ― ― μs
twCLKL
VOL MO
Output residual voltage IOL = 1 mA ― ― 0.5 V
VOL ALERT
External capacitor = 0.1 μF
Internal constant voltage Vreg 4.5 5.0 5.5 V
(in standby mode)
Chopping frequency fchop Rosc=51kΩ 28 40 52 kHz
Note 1: Though Vref of the test condition for pre-shipment is 3.0V, make sure to configure Vref within the operating
range which is written in page 26 in driving the motor.
tr ― 50 ―
Output transistor switching characteristics VNF = 0 V, Output: Open ns
tf ― 500 ―
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Timing Waveforms and Names
twCLKH twCLKH
CLK
twCLKL
Vcc
90% 90%
OUT1A, OUT2A,
OUT1B, OUT2B
10% 10%
GND
tr tf
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Power Dissipation
TB6600FG
PD - Ta
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How to Turn on the Power
In applying Vcc or shutdown, ENABLE should be Low.
See Example 1(ENABLE = High → RESET = High) and Example 2(RESET = High → ENABLE = High) as
follows. In example 1, a motor can start driving from the initial mode.
[1] CLK : Current step proceeds to the next mode with respect to every rising edge of CLK.
[2] ENABLE : It is in Hi-Z state in low level. It is output in high level.
RESET : It is in the initial mode (Phase A=100% and Phase B=0%) in low level.
(1)ENABLE=Low and RESET=Low: Hi-Z. Internal current setting is in initial mode.
(2)ENABLE=Low and RESET=High: Hi-Z. Internal current setting proceeds by internal counter.
(3)ENABLE=High and RESET=Low: Output in the initial mode (Phase A=100% and Phase B=0%).
(4)ENABLE=High and RESET=High: Output at the value which is determined by the internal counter.
(Example 1)
(例1)
CLK
RESET
ENABLE
Internal
内部電流設定 current set
(Example
(例2)2)
CLK
RESET
ENABLE
(*:Output current starts rising at the timing of PWM frequency just after ENABLE pin outputs high.)
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Application Circuit
0.1μF 47μF
fuse
24V
0.1μF
Vreg MO ALERT Vcc
OUT1A
Reg (5V)
M1
Pre H-Bridge
M2 driver A
-drive
M3
OUT2A
MCU
TSD/ISD/UVLO NFA
Control
CW/CCW
logic
0.2Ω
CLK
Current selector
circuit A
RESET 24V
Latch/Auto
100%/ OUT2B
30%
TQ
NFB
Current selector
1/3 circuit B
Vref 0.2Ω
OSC
OSC
51kΩ
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Note 1: Capacitors for the power supply lines should be connected as close to the IC as possible.
Note 2: Current detecting resistances (RNFA and RNFB) should be connected as close to the IC as possible.
Note 3: Pay attention for wire layout of PCB not to allow GND line to have large common impedance.
Note 4: External capacitor connecting to Vreg should be 0.1μF. Pay attention for the wire between this capacitor and
Vreg terminal and the wire between this capacitor and SGND not to be influenced by noise.
Note 5: The IC may not operate normally when large common impedance is existed in GND line or the IC is easily
influenced by noise. For example, if the IC operates continuously for a long time under the circumstance of
large current and high voltage, the number of clock signals inputted to CLK terminal and that of steps of output
current waveform may not proportional. And so, the IC may not operate normally. To avoid this malfunction,
make sure to conduct Note.1 to Note.4 and evaluate the IC enough before using the IC.
Note 6: Output current may be limited by excitation modes, ambient temperature or thermal performance conditions of
PCB and so on.
Note 7: Make sure that the Junction temperature (Chip temperature) should not exceed Tjmax = 150°C, when you
design products. Do not use the IC under the condition that the Junction temperature (Chip temperature)
should not exceed Tjmax = 150°C, though the thermal shutdown circuit turns on under the abnormal
temperature condition.
Note 8: Current that flows through output power MOSFETs are monitored individually. If the current exceeds the
over-current detection value in at least one of the eight output power MOSFETs, over-current is detected and
then L level is outputted as an ALERT signal. In this case, all output power MOSFETs are turned off. However,
always add a fuse in the power supply line because IC can be broken due to the current being over absolute
maximum ratings.
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Package Dimensions
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation
is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components
and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even
for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over
current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the
wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To
minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse
capacity, fusing time and insertion circuit location, are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON
or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause
injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
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Points to remember on handling of ICs
(4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s
power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the
device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings.
To avoid this problem, take the effect of back-EMF into consideration in system design.
(5) Short-circuiting between outputs, air contamination faults, faults due to improper grounding, short-circuiting
between contiguous pins
Utmost care is necessary in the design of the power supply lines, GND lines, and output lines since the IC may
be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding,
or by short-circuiting between contiguous pins. They may destroy not only the IC but also peripheral parts and
may contribute to injuries for users. Over current may continue to flow in the IC because of this destruction
and cause smoke or ignition of the IC. Expect the volume of this over current and add an appropriate power
supply fuse in order to minimize the effects of the over current. Capacity of the fuse, fusing time, and the
inserting position in the circuit should be configured suitably.
35 2014-03-03
TB6600FG
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
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• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
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