74LVT244A
74LVT244A
74LVT244A
3.3V Octal buffer/line driver (3-State)
Philips Semiconductors Product specification
FEATURES DESCRIPTION
• Octal bus interface The LVT244A is a high-performance BiCMOS product designed for
VCC operation at 3.3V.
• 3-State buffers
This device is an octal buffer that is ideal for driving bus lines. The
• Output capability: +64mA/-32mA device features two Output Enables (OE1, OE2), each controlling
• TTL input and output switching levels four of the 3-State outputs.
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER
20-Pin Plastic SOL –40°C to +85°C 74LVT244A D 74LVT244A D SOT163-1
20-Pin Plastic SSOP Type II –40°C to +85°C 74LVT244A DB 74LVT244A DB SOT339-1
20-Pin Plastic TSSOP Type I –40°C to +85°C 74LVT244A PW 7LVT244APW DH SOT360-1
2Y1 7 14 1Y2
1A3 8 13 2A1
2Y0 9 12 1Y3
GND 10 11 2A0
SV00010
1Y0
2 1A0 18 1
EN
1Y1
4 1A1 16
2 18
1A2 1Y2
6 14 4 16
1A3 1Y3 6 14
8 12
8 12
1 1OE
2A0 2Y0
11 9 19
EN
2A1 2Y1
13 7
2Y2 11 9
15 2A2 5
13 7
2A3 2Y3
17 3 15 5
2OE 17 3
19
SV00011
SV00012
FUNCTION TABLE
INPUTS OUTPUTS
L L L
L H H
H X Z
H = High voltage level
L = Low voltage level
X = Don’t care
Z = High impedance ”off ” state
1998 Feb 19 3
Philips Semiconductors Product specification
DC ELECTRICAL CHARACTERISTICS
LIMITS
SYMBOL PARAMETER TEST CONDITIONS Temp = -40°C to +85°C UNIT
MIN TYP1 MAX
VIK Input clamp voltage VCC = 2.7V; IIK = –18mA –0.9 –1.2 V
VCC = 2.7 to 3.6V; IOH = –100µA VCC-0.2 VCC-0.1
VOH High-level output voltage VCC = 2.7V; IOH = –8mA 2.4 2.5 V
VCC = 3.0V; IOH = –32mA 2.0 2.2
VCC = 2.7V; IOL = 100µA 0.1 0.2
VCC = 2.7V; IOL = 24mA 0.3 0.5
VOL Low-level output voltage VCC = 3.0V; IOL = 16mA 0.25 0.4 V
VCC = 3.0V; IOL = 32mA 0.3 0.5
VCC = 3.0V; IOL = 64mA 0.4 0.55
VCC = 0 or 3.6V; VI = 5.5V 0.1 10
VCC = 3.6V; VI = VCC or GND Control pins ±0.1 ±1
II Input
In ut leakage current µA
VCC = 3.6V; VI = VCC 0.1 1
Data Pins4
VCC = 3.6V; VI = 0 –1 -5
IOFF Output off current VCC = 0V; VI or VO = 0 to 4.5V 1 ±100 µA
VCC = 3V; VI = 0.8V 75 150
IHOLD Bus Hold current A inputs6 VCC = 3V; VI = 2.0V –75 –150 µA
VCC = 0V to 3.6V; VCC = 3.6V ±500
Current into an output in the
IEX VO = 5.5V; VCC = 3.0V 60 125 µA
High state when VO > VCC
Power up/down 3-State VCC ≤ 1.2V; VO = 0.5V to VCC; VI = GND or VCC;
IPU/PD ±1 ±100 µA
output current3 OE/OE = Don’t care
IOZH 3-State output high current VCC = 3.6V; VO = 3V; VI = VIL or VIH 1 5 µA
IOZL 3-State output low current VCC = 3.6V; VO = 0.5V; VI = VIL or VIH –1 –5 µA
ICCH VCC = 3.6V; Outputs High, VI = GND or VCC, IO = 0 0.13 0.19
ICCL Quiescent supply current VCC = 3.6V; Outputs Low, VI = GND or VCC, IO = 0 3 12 mA
ICCZ VCC = 3.6V; Outputs Disabled; VI = GND or VCC, IO = 05 0.13 0.19
Additional supply current per VCC = 3V to 3.6V; One input at VCC-0.6V,
∆ICC 0.1 0.2 mA
input pin2 Other inputs at VCC or GND
NOTES:
1. All typical values are at Tamb = 25°C.
2. This is the increase in supply current for each input at the specified voltage level other than VCC or GND
3. This parameter is valid for any VCC between 0V and 1.2V with a transition time of up to 10msec. From VCC = 1.2V to VCC = 3.3V ± 0.3V a
transition time of 100µsec is permitted. This parameter is valid for Tamb = 25°C only.
4. Unused pins at VCC or GND.
5. ICCZ is measured with outputs pulled to VCC or GND.
6. This is the bus hold overdrive current required to force the input to the opposite logic state.
1998 Feb 19 4
Philips Semiconductors Product specification
AC CHARACTERISTICS
GND = 0V; tR = tF = 2.5ns; CL = 50pF; RL = 500Ω; Tamb = –40°C to +85°C.
LIMITS
AC WAVEFORMS
VM = 1.5V, VIN = GND to 2.7V
2.7V
3.0V or VCC
whichever OE INPUT 1.5V 1.5V
is less
nAx INPUT
VM VM 0V
tPZL tPLZ
0V 3.0V
tPLH tPHL
0V
SA00016
Waveform 1. Input (nAx) to Output (nYx) Propagation Delays SV00103
1998 Feb 19 5
Philips Semiconductors Product specification
SWITCH POSITION
VM = 1.5V
TEST SWITCH Input Pulse Definition
tPLH/tPHL Open
tPLZ/tPZL 6V
tPHZ/tPZH GND
1998 Feb 19 6
Philips Semiconductors Product specification
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
1998 Feb 19 7
Philips Semiconductors Product specification
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1
1998 Feb 19 8
Philips Semiconductors Product specification
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1
1998 Feb 19 9
Philips Semiconductors Product specification
Objective Development This data sheet contains the design target or goal specifications for product development.
specification Specification may change in any manner without notice.
Preliminary Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date.
specification Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
Product Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make
specification changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
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