STM32H7S3x8 STM32H7S7x8
STM32H7S3x8 STM32H7S7x8
Arm® Cortex®-M7 32-bit 600 MHz MCU, 64 KB flash, 620 KB RAM, Ethernet,
2x USB, 2x FD-CAN, advanced graphics and security, 2x12-bit ADCs
Datasheet - production data
Features
Includes ST state-of-the-art patented
technology
LQFP100 (14 x 14 mm) LQFP144 (20 x 20 mm) LQFP176 (24 x 24 mm)
UFBGA UFBGA
Core
UFBGA
DSP instructions
Security and cryptography
Memories
• PSA level 2 and SESIP level 3 certified (under
• 64 Kbytes of user flash memory that can be
certification)
used for user code and/or external memory
configuration. • Flexible life cycle scheme with debug
authentication based on certificate or password
• SRAM: total 620 Kbytes (548 Kbytes with
(debug reopening/regression support)
optional ECC activated) organized as follows:
– 64+64 Kbytes minimum of instruction and • Root of trust thanks to unique boot entry and
data TCM RAM for critical real time secure hide protection area (HDP)
instructions • Secure firmware installation / update
– 384 Kbytes AXI SRAM (128 Kbytes with (SFI/SFU) thanks to embedded root secure
optional remap to TCM RAM fully activated services (RSS)
– 4 Kbytes of backup SRAM (available in the • Secure data storage with hardware unique key
lowest-power modes) (HUK)
• Flexible external memory controller with up to • 2 AES coprocessors including one with
32-bit data bus: SRAM, PSRAM, FRAM, DPA resistance
SDR/LPSDR SDRAM, NOR/NAND memories • Public key accelerator, DPA resistant
• up to 2x Octo-SPI memory interfaces or 1 octo- • On-the-fly encryption/decryption of serial and
SPI + 1 hexa-SPI with XiP, with support for parallel external memories
serial PSRAM/NAND/NOR, HyperRAM™/
• HASH hardware accelerator
HyperFlash™ frame formats running at up to
200 MHz • True random number generator, NIST
SP800-90B compliant
• 2x SD/SDIO/MMC interfaces
• 96-bit unique ID
2x DMA controllers to offload the CPU
• 1 Kbyte OTP (one-time programmable)
• 2 × dual-port DMAs with FIFO and linked listed
• Active tampers
support
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.1 Arm Cortex-M7 with FPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.2 Memory protection unit (MPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.3 Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.3.1 Embedded flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.3.2 Secure access mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.3.3 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.4 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.5 Power supply management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.5.1 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.5.2 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.5.3 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.5.4 SMPS step-down converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.6 Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.7 Reset and clock controller (RCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.7.1 Clock management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
3.7.2 System reset sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
3.8 General-purpose input/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . . 43
3.9 Bus-interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
3.10 General purpose / high-performance direct memory access controller
(GPDMA/HPDMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
3.11 Chrom-ART Accelerator (DMA2D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
3.12 NeoChrom graphic processor (GPU2D) . . . . . . . . . . . . . . . . . . . . . . . . . . 46
3.13 Chrom-GRC (GFXMMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
3.14 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . . 48
3.15 Extended interrupt and event controller (EXTI) . . . . . . . . . . . . . . . . . . . . 48
3.16 Cyclic redundancy check calculation unit (CRC) . . . . . . . . . . . . . . . . . . . 49
3.17 CORDIC co-processor (CORDIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.18 Flexible memory controller (FMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
List of tables
Table 43. Typical and maximum current consumption in System Stop mode . . . . . . . . . . . . . . . . . 172
Table 44. Typical and maximum current consumption in Standby mode . . . . . . . . . . . . . . . . . . . . . 172
Table 45. Typical and maximum current consumption in VBAT mode . . . . . . . . . . . . . . . . . . . . . . . 172
Table 46. Typical and maximum current consumption in Run mode, code with data processing running
from Octo flash memory, cache OFF174
Table 47. Typical and maximum current consumption in Run mode, code with data processing running
from 16-bit memory, cache OFF174
Table 48. Typical and maximum current consumption: data write 50% toggle on 16-bit memory . . 175
Table 49. Typical and maximum current consumption: data write 25% toggle on 16-bit memory . . 175
Table 50. Typical and maximum current consumption: data write 12.5% toggle on 16-bit memory. 176
Table 51. Typical and maximum current consumption: data write 6.25% toggle on 16-bit memory. 176
Table 52. Typical dynamic current consumption of peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
Table 53. Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186
Table 54. High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
Table 55. Timing for analog HSE input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
Table 56. Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
Table 57. Timing for analog LSE input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
Table 58. 4-50 MHz HSE oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192
Table 59. Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
Table 60. HSI48 oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
Table 61. HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
Table 62. CSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
Table 63. LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
Table 64. PLL1 characteristics (wide VCO frequency range) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198
Table 65. PLL1 characteristics (narrow VCO frequency range) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199
Table 66. EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200
Table 67. EMI characteristics for fHSE = 8 MHz and fCPU = 600 MHz . . . . . . . . . . . . . . . . . . . . . . . 201
Table 68. ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202
Table 69. Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202
Table 70. I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
Table 71. I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204
Table 72. Output voltage characteristics for all I/Os except PC13, PC14, and PC15. . . . . . . . . . . . 206
Table 73. Output voltage characteristics for PC13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
Table 74. Output voltage characteristics for PC14 and PC15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
Table 75. Output timing characteristics (HSLV OFF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208
Table 76. Output timing characteristics (HSLV ON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212
Table 77. Output timing characteristics VDDXSPIx 1.2 V range (HSLV OFF) . . . . . . . . . . . . . . . . . . 213
Table 78. Output timing characteristics VDDXSPIx 1.2 V (HSLV ON) . . . . . . . . . . . . . . . . . . . . . . . . 215
Table 79. NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
Table 80. Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings . . . . . . . . . . . . . . . . . 218
Table 81. Asynchronous non-multiplexed SRAM/PSRAM/NOR read-NWAIT timings . . . . . . . . . . . 219
Table 82. Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings . . . . . . . . . . . . . . . . . 220
Table 83. Asynchronous non-multiplexed SRAM/PSRAM/NOR write-NWAIT timings. . . . . . . . . . . 220
Table 84. Asynchronous multiplexed PSRAM/NOR read timings. . . . . . . . . . . . . . . . . . . . . . . . . . . 222
Table 85. Asynchronous multiplexed PSRAM/NOR read-NWAIT timings . . . . . . . . . . . . . . . . . . . . 222
Table 86. Asynchronous multiplexed PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . . . . . . . . . 224
Table 87. Asynchronous multiplexed PSRAM/NOR write-NWAIT timings . . . . . . . . . . . . . . . . . . . . 224
Table 88. Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 225
Table 89. Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227
Table 90. Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
Table 91. Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231
Table 92. Switching characteristics for NAND flash read cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
Table 93. Switching characteristics for NAND flash write cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . 234
Table 94. SDRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236
Table 95. LPSDR SDRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236
Table 96. SDRAM Write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237
Table 97. LPSDR SDRAM Write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238
Table 98. XSPI characteristics in SDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240
Table 99. XSPI characteristics in DTR mode (no DQS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241
Table 100. XSPI characteristics in DTR mode (with DQS)/Hyperbus. . . . . . . . . . . . . . . . . . . . . . . . . 242
Table 101. Delay block characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244
Table 102. ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245
Table 103. Minimum sampling time vs RAIN (12-bit ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248
Table 104. ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250
Table 105. VREFBUF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251
Table 106. Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252
Table 107. Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252
Table 108. Voltage booster for analog switch characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253
Table 109. Digital temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253
Table 110. VCORE monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253
Table 111. VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254
Table 112. VBAT charging characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254
Table 113. Temperature monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254
Table 114. ADF characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255
Table 115. DCMIPP characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257
Table 116. PSSI transmit characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 258
Table 117. PSSI receive characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 259
Table 118. LTDC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 261
Table 119. TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263
Table 120. LPTIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263
Table 121. I3C open-drain measured timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264
Table 122. I3C push-pull measured timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264
Table 123. I2C analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265
Table 124. USART characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266
Table 125. SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 268
Table 126. I2S dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271
Table 127. SAI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273
Table 128. MDIO slave timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275
Table 129. Dynamic characteristics: SD / MMC characteristics, VDD = 2.7 to 3.6 V . . . . . . . . . . . . . 276
Table 130. Dynamic characteristics: eMMC characteristics VDD = 1.71V to 1.9V. . . . . . . . . . . . . . . 277
Table 131. USB OTG_FS electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278
Table 132. USB OTG_HS DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279
Table 133. OTG_HS current consumption characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280
Table 134. UCPD electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280
Table 135. Dynamic characteristics: Ethernet MAC signals for SMI. . . . . . . . . . . . . . . . . . . . . . . . . . 281
Table 136. Dynamic characteristics: Ethernet MAC signals for RMII . . . . . . . . . . . . . . . . . . . . . . . . 282
Table 137. Dynamic characteristics: Ethernet MAC signals for MII . . . . . . . . . . . . . . . . . . . . . . . . . . 282
Table 138. Dynamic JTAG characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 283
Table 139. Dynamics SWD characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284
Table 140. VFQFPN68 - Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 287
Table 141. LQFP100 - Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289
Table 142. TFBGA100 - Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 292
Table 143. TFBGA100 - Recommended PCB design rules (0.8 mm pitch BGA) . . . . . . . . . . . . . . . . 293
Table 144. LQFP144 - Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 295
List of figures
Figure 49. NAND controller waveforms for common memory write access. . . . . . . . . . . . . . . . . . . . 235
Figure 50. SDRAM read access waveforms (CL = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237
Figure 51. SDRAM write access waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239
Figure 52. XSPI DTR (with DQS) write timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243
Figure 53. XSPI DTR (with DQS) read timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243
Figure 54. XSPI DTR clock timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243
Figure 55. ADF timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 256
Figure 56. DCMIPP timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257
Figure 57. PSSI receive timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 259
Figure 58. PSSI transmit timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260
Figure 59. LCD-TFT horizontal timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262
Figure 60. LCD-TFT vertical timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262
Figure 61. USART timing diagram in master mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267
Figure 62. USART timing diagram in slave mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267
Figure 63. SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 269
Figure 64. SPI timing diagram - slave mode and CPHA = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270
Figure 65. SPI timing diagram - master mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270
Figure 66. I2S slave timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272
Figure 67. I2S master timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272
Figure 68. SAI master timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274
Figure 69. SAI slave timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274
Figure 70. MDIO slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275
Figure 71. SD high-speed mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277
Figure 72. SD default mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277
Figure 73. SDMMC DDR mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278
Figure 74. Ethernet SMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 281
Figure 75. Ethernet RMII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282
Figure 76. Ethernet MII timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 283
Figure 77. JTAG timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284
Figure 78. SWD timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284
Figure 79. VFQFPN68 - Outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 286
Figure 80. VFQFPN68 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 287
Figure 81. LQFP100 - Outline(15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 288
Figure 82. LQFP100 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 290
Figure 83. TFBGA100 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 291
Figure 84. TFBGA100 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 293
Figure 85. LQFP144 - Outline(15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 294
Figure 86. LQFP144 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 297
Figure 87. UFBGA144 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 298
Figure 88. UFBGA144 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 299
Figure 89. UFBGA169 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300
Figure 90. UFBGA169 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301
Figure 91. LQFP176 - Outline(15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 302
Figure 92. LQFP176 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 305
Figure 93. WLCSP101L - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306
Figure 94. WLCSP101 - recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 308
Figure 95. WLCSP101 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 309
Figure 96. UFBGA(176+25) - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 310
Figure 97. UFBGA(176+25) - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 311
Figure 98. TFBGA225 - Outline(13) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312
Figure 99. TFBGA225 - Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314
1 Introduction
a. Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
2 Description
STM32H7Sxx8 devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC
core operating at up to 600 MHz. The Cortex -M7 core features a floating point unit (FPU)
which supports Arm double-precision (IEEE 754 compliant) and single-precision data-
processing instructions and data types. The Cortex -M7 core includes 32 Kbytes of
instruction cache and 32 Kbytes of data cache. STM32H7Sxx8 devices support a full set of
DSP instructions and a memory protection unit (MPU) to enhance application security.
STM32H7Sxx8 devices incorporate high-speed embedded memories, 64 Kbytes of user
flash memory and 128 Kbytes of system flash memory,and up to 620 Kbytes of RAM
(including 128 Kbytes that can be shared between ITCM and AXI, including 64 Kbytes
exclusively ITCM, including 128 Kbyte DTCM, including 64 Kbytes exclusively DTCM,
including 32 Kbytes AHB and 4 Kbytes of backup RAM), as well as an extensive range of
enhanced I/Os and peripherals connected to APB buses, AHB buses, 2x32-bit multi-AHB
bus matrix and a multi layer AXI interconnect supporting internal and external memory
access. To improve application robustness, all memories feature error code correction (one
error correction, two error detections).
The devices embed peripherals allowing mathematical/arithmetic function acceleration
(CORDIC coprocessor for trigonometric functions). All the devices offer two ADCs, a low-
power RTC, 4 general-purpose 32-bit timers, 7 general-purpose 16-bit timers including one
PWM timer for motor control, five low-power timers, and a cryptographic acceleration cell
(CRYP), Public key acceleration (PKA), a secure AES coprocessor (SAES) and a memory
cipher engine (MCE) The devices support one digital filter for external sigma-delta
modulators or digital microphone with voice activity detection. They also feature standard
and advanced communication interfaces.
• Standard peripherals:
– Three I2Cs (One shared with I3C)
– Three USARTs, four UARTs and one LPUART
– Six SPIs, four I2Ss in Half-duplex mode. To achieve audio class accuracy, the I2S
peripherals can be clocked by a dedicated internal audio PLL or by an external
clock to allow synchronization (note that the five USARTs also provide SPI slave
capability).
– Two SAI serial audio interfaces
– One SPDIFRX interface with four inputs
– One SWPMI (Single Wire Protocol Master Interface)
– Management Data Input/Output (MDIO) slaves
– Two SDMMC interfaces
– A USB OTG high-speed interface with full-speed capability
– A USB OTG full-speed interface
– A USB Type-C/USB Power Delivery interface
– Two FDCANs interface
– An Ethernet interface
– Chrom-ART Accelerator
– HDMI-CEC
Neo-Chrom (GPU2D) N Y N Y
Chrom-Art (DMA2D) Y
Chrom-GRC (GFXMMU) Y
Graphics
Hardware codec (JPEG) Y
LCD-TFT N Y N Y
Parallel display (FMC8/16) Y
Life cycle support (TIL0/1/2) Y
Root of trust (ST-iROT) N N Y Y
Debug authentication Y
Secure firmware install (SFI) Y
Security Root secure service (RSS) Y
HASH accelerator and PKA verification Y
Crypto processor (Crypt, PKA, SAES) N N Y Y
On-the-fly encryption/decryption (MCE) N N Y Y
True random number generator (TRNG) Y
To reduce the power consumption some STM32H7Sxx8 devices include an optional step-
down converter that can be used either for internal or external supply, or both.
STM32H7Sxx8 devices operate in the –40 to +85°C(a) ambient temperature range from a
1.71 to 3.6 V power supply. The supply voltage can drop down to 1.71 V by using an
external power supervisor the supply voltage must stay above 1.71 V with the embedded
power voltage detector enabled.
Dedicated supply inputs for XSPI and USB are available to allow independent multiple
voltage constraint and greater power supply choice.
A comprehensive set of power-saving modes allows the design of low-power applications.
STM32H7Sxx8 devices are offered in several packages ranging from 68 to 225 pins/balls.
The set of included peripherals changes with the chosen device.
These features make STM32H7Sxx8 microcontrollers suitable for a wide range of
applications:
• Motor drive and application control
• Medical equipment
• Industrial applications: PLC, inverters, circuit breakers
• Printers, and scanners
• Alarm systems, video intercom, and HVAC
• Home audio appliances
• Mobile applications, Internet of Things
• Wearable devices: smart watches.
Figure 1 shows the device block diagram.
a. Under characterization
FIFO
(DMA2D) CK, CKIN, CMD, CDIR,
AHB2
@VSW AHB2 SDMMC2 D[7:0], D0DIR, D123DIR
(AF)
Neo-Chrom graphics ICACHE From
processor (GPU2D) FIFO AHB5 PSSI
xSPIM
CK, CKIN, CMD, CDIR,
D[7:0], D0DIR, D123DIR (AF) SDMMC1 FIFO MCE2 XSPI2 Octo i/f
D[15:0], HSYNC, AHB5
PIXCLK, VSYNC (AF)
DCMIPP CLK, NOE, NWE, NWAIT,
AHB/APB
APB5
AHB/APB
AHB5 SRAM3 128 KB shared DTCM
D[4:1], FS_[A:B], MCLK_A, MCLK_B,
CK[4:1], SCK_[A:B], SD_A, SD_B (AF) SAI1
SRAM2 128 KB 32b TIM2 CH[4;1], ETR (AF)
D[4:1], FS_[A:B], MCLK_A, MCLK_B,
SAI2
From
AHB
RX, TX, CK, CTS, RTS (AF) USART1 WWDG 16b MOSI, MISO, SCK, NSS /
SPI2/I2S2 SDO, SDI, CK, WS, MCK (AF)
CH[1:4]N, CH[1:4], ETR,
BKIN, BKIN2 (AF)
TIM1 (PWM) 16b SPI3/I2S3 MOSI, MISO, SCK, NSS /
SDO, SDI, CK, WS, MCK (AF)
@VDD
BBgen + POWER MNGT VCORE I2C2/SMBUS SCL, SDA, SMBA (AF)
VCAP[4:1], VDDLDO[4:1],
VSSSD, VLXSD,
VDDSD, VFBSD
Voltage regulator I2C3/SMBUS SCL, SDA, SMBA (AF)
3.3 to 1.2V
HDMI-CEC CEC (AF)
2 KB RAM
APB4
TAMP_OUT[8:1] (AF)
TAMPER SRAM I/F
FDCAN2 TX, RX (AF)
PHY
AHB to APB
AHB2 Bus AHB3 Bus AHB4 Bus AHB5 Bus Bridge
V swuitch domain VDD domain From AHB to AXI
MSv55535V6
STM32H7S3L8H6H
STM32H7S7L8H6H
STM32H7S3V8H6
STM32H7S3R8V6
STM32H7S3L8H6
STM32H7S3V8Y6
STM32H7S7L8H6
STM32H7S3V8T6
STM32H7S3Z8T6
STM32H7S3Z8J6
STM32H7S7Z8J6
STM32H7S3A8I6
STM32H7S3I8K6
STM32H7S7A8I6
STM32H7S7I8K6
STM32H7S3I8T6
STM32H7S7I8T6
Peripherals
Low-power 5 5 5 5 3 3 3 4 5
Window watchdog /
independent - 1/1
watchdog
Real-time clock
19/320
- 1
(RTC)
Table 3. STM32H7Sxx8 features and peripheral counts (continued)
20/320
STM32H7S3L8H6H
STM32H7S7L8H6H
STM32H7S3V8H6
STM32H7S3R8V6
STM32H7S3V8Y6
STM32H7S3L8H6
STM32H7S7L8H6
STM32H7S3V8T6
STM32H7S3Z8T6
STM32H7S3Z8J6
STM32H7S7Z8J6
STM32H7S3A8I6
STM32H7S3I8K6
STM32H7S7A8I6
STM32H7S7I8K6
STM32H7S3I8T6
STM32H7S7I8T6
Peripherals
Passive 8 8 8 8 8 7 8 3 3 2 2 7 6 8 7 8 7
Tamper pins(8)
Active 4 4 4 4 4 3 4 1 1 1 1 3 3 4 3 4 3
Random number
- 1
generator
Cryptographic
- Yes
accelerator
DS14359 Rev 2
Hash processor
- 1
(HASH)
On-the-fly For external Octo/Hexa-
Yes
encryption/decryption SPI memory and FMC
SPI/I2S 6/4 6/4 5/4 5/4 5/4 4/3 6/4
USART/UART/LPUART 3/4/1 3/4/1 3/4/1 3/4/1 3/4/1 3/4/1 3/4/1 3/3/1 2/3/1 2/3/1 3/3/1 3/4/1 3/3/1 3/4/1 3/4/1 3/4/1 3/4/1
Communication SPDIFRX 4 inputs 4 inputs 4 inputs 4 inputs 4 inputs 4 inputs 4 inputs - - 1 input - 3 inputs 3 inputs 4 inputs 4 inputs 4 inputs 4 inputs
interfaces
MDIOS 1
1x(4 bit)
SDMMC/EMMC 1 x(4 bit) + 1x 8 bit) 1 x(4 bit) - + 1x(4 bit) 1x(4 bit) and 1x(8 bit)
1x(8 bit)
FDCAN 2
OTG_HS / OTG_FS /
1/1/1 -/1/- -/1/- -/1/- -/1/- -/1/- 1/1/1 1/1/1
UCPD
STM32H7Sxx8
DCMIPP (bits) 16 16 16 16 16 16 16 - - - - 12 8 12 12 16 16
Digital camera
interface/PSSI(9)
PSSI (bits) 16 16 16 16 16 16 16 - - - - 8 8 8 8 16 16
LCD-TFT RGB24
- 0 1 1(10) 1
display controller
Table 3. STM32H7Sxx8 features and peripheral counts (continued)
STM32H7Sxx8
STM32H7S3L8H6H
STM32H7S7L8H6H
STM32H7S3V8H6
STM32H7S3R8V6
STM32H7S3V8Y6
STM32H7S3L8H6
STM32H7S7L8H6
STM32H7S3V8T6
STM32H7S3Z8T6
STM32H7S3Z8J6
STM32H7S7Z8J6
STM32H7S3A8I6
STM32H7S3I8K6
STM32H7S7A8I6
STM32H7S7I8K6
STM32H7S3I8T6
STM32H7S7I8T6
Peripherals
JPEG codec - 1
ChromART
- 1
Accelerator (DMA2D)
Graphic memory
management unit 1
(GFXMMU)
DS14359 Rev 2
ICACHE - No Yes
HDMI CEC - 1
ETH - RMII/MII RMII RMII RMII/MII RMII/MII RMII/MII RMII - - - - RMII/MII RMII RMII RMII/MII RMII/MII RMII/MII
- 119 94 116 122 152 150 98 67 63 65 45 118 93 117 122 152 150
GPIOs
Wakeup pins 4
Maximum CPU
- 600
frequency (MHz)
SMPS step-down
- Yes No Yes No Yes
converter
USB internal
- Yes No Yes
regulator
21/320
DS14359 Rev 2 22/320
Operating
Packages
supply pad
temperatures
Operating voltage
and internal buffer
USB UCPD separate
-
-
-
-
-
-
LQFP176 STM32H7S3I8T6
LQFP144 STM32H7S3Z8T6
LQFP100 STM32H7S3V8T6
1
1.71 to 3.6 V
WLCSP101 STM32H7S3V8Y6
VFQFPN68 STM32H7S3R8V6
Ambient temperature range: -40 to 85 °C
LQFP176 STM32H7S7I8T6
STM32H7Sxx8
Table 3. STM32H7Sxx8 features and peripheral counts (continued)
STM32H7Sxx8
STM32H7S3L8H6H
STM32H7S7L8H6H
STM32H7S3V8H6
STM32H7S3R8V6
STM32H7S3V8Y6
STM32H7S3L8H6
STM32H7S7L8H6
STM32H7S3V8T6
STM32H7S3Z8T6
STM32H7S3Z8J6
STM32H7S7Z8J6
STM32H7S3A8I6
STM32H7S3I8K6
STM32H7S7A8I6
STM32H7S7I8K6
STM32H7S3I8T6
STM32H7S7I8T6
Peripherals
1. No NE4 A24/25.
2. No NBL2/3 A24/25
3. No NBL2/3
DS14359 Rev 2
4. No A24/25
5. No A23/A24/25
6. Quad-SPI support only.
7. No BKIN2, CH4N.
8. A tamper pin can be configured either as passive or active (not both).
9. DCMIPP and PSSI cannot be used simultaneously since they share the same circuitry.
10. RGB 666
11. The junction temperature is limited to 105 °C in the VOS high-voltage range.
23/320
Functional overview STM32H7Sxx8
3 Functional overview
3.3 Memories
VLXSMPS
VLXSMPS SMPS SMPS
VFBSMPS (off) VFBSMPS (on)
VSSSMPS VSSSMPS
VCAP VCAP
VDDSMPS
VLXSMPS
SMPS
VFBSMPS (off)
VSSSMPS
5. Bypass
Note: The features available on the device depend on the package refer to Table 3:
STM32H7Sxx8 features and peripheral counts.
Sleep and Stop low-power modes are entered by the MCU when executing the WFI (Wait
for Interrupt) or WFE (Wait for Event) instructions, or when the SLEEPONEXIT bit of the
Cortex-M7 core is set after returning from an interrupt service routine.
The CPU domain can enter low-power mode (Stop) when the processor, its subsystem and
the peripherals allocated in the domain enter low-power mode.
If part of the domain is not in low-power mode, the domain remains in the current mode.
Finally the system can enter Stop or Standby when all EXTI wakeup sources are cleared.
Run ON ON
ON ON ON (VOS)
Sleep
ON/OFF
Stop ON/OFF OFF ON (SVOS)
OFF
Standby OFF OFF OFF
Some GPIO pins can be used to monitor CPU and domain power states:
RCC
VDD domain
LSION or IWDG activated
lsi_ck
LSI tempo To IWDG
RTCPRE MCO1SEL
VDD domain
÷ 2 to 63 hsi_ck
HSEON 0
OSC_IN MCO1PRE
tempo lse_ck 1
HSE hse_ck ÷ 1 to15 MCO1
OSC_OUT hse_ck 2
CSS hse_ker_ck pll1_q_ck 3
hsi48_ck 4
÷1024 hsi_cal_ck
HSIKERON MCO2SEL
HSION HSIDIV
hsi_osc_ck
HSI tempo ÷1,2,4,8 hsi_ck sys_ck 0
pll2_p_ck 1 MCO2PRE
hsi_ker_ck hse_ck 2 ÷ 1 to15 MCO2
CSIKERON pll1_p_ck 3
CSION ÷4 ucpd_ker_ck
csi_ck 4
CSI tempo csi_ck 5
lsi_ck
csi_ker_ck
HSI48ON ÷128 csi_cal_ck
pll[3:2]_p_ck
SSCG DIVS pll1_s_ck
PKEU (Peripheral clock enabling)
pll[3:2]_r_ck
DIVT
sys_ck
PLL2 per_ck
÷ DIVM2 ref2_ck pll2_p_ck hse_ker_ck
VCO ÷ 2 DIVP To
1 to 16 pll2_q_ck hsi_ker_ck
MHz DIVN DIVQ peripherals
pll2_r_ck csi_ker_ck
DIVR
FRACN lsi_ck
SSCG DIVS pll2_s_ck lse_ck
DIVT pll2_t_ck hsi48_ker_ck
ucpd_ker_ck
PLL3
ref3_ck pll3_p_ck
÷ DIVM3 VCO ÷ 2 DIVP
1 to 16
MHz pll3_q_ck
DIVN DIVQ
pll3_r_ck I2S_CKIN
DIVR
FRACN ETH_MII_CK_TX
SSCG DIVS pll3_s_ck ETH_MII_CK_RX/
DIVT ETH_RMII_REF_CLK
ETH_CLK
D The selected input can be changed on-the-fly without spurs on the output signal. x Represents the selected mux input after a system reset.
MSv54104V4
RCC
System clock generation (SCGU)
trace_ck
÷3 To TPIU
50% Duty-cycle
rcc_cpu_ck
CPU clocks
rcc_fclk
FCPU max
÷8 CPU SysTick clock
sys_cpu_ck
sys_bus_ck
÷ 1,2,4,8,16 APB5 peripheral clocks
FBUS Max / 2
FBUS Max rcc_hclk[4:1] AHB Matrix
AHB1,2,3,4 peripheral clocks
PPRE1 (1)
Phase rcc_pclk1
aligned ÷ 1,2,4,8,16 APB1 peripheral clocks
FBUS Max / 2
PPRE2 (1)
FBUS Max / 2
PPRE4 (1)
rcc_pclk4
÷ 1,2,4,8,16 APB4 peripheral clocks
MSv54113V3
hclk1 0(4)
pll2_p_ck 1
pll3_p_ck 2
Kernel ADF1SEL FMAX / 2 A
ADF I2S_CKIN 3
csi_ker_ck 4
hsi_ker_ck 5
Bus hclk1 - - FMAX / 2 -
pll2_p_ck 0(4)
Kernel pll3_r_ck 1 ADCSEL 125 A
ADC12
per_ck 2
Bus hclk1 - - FMAX / 2 -
CORDIC Bus hclk2 - - FMAX / 2 -
CRC Bus hclk4 - - FMAX / 2 -
CRS Bus pclk1 - - FMAX / 4 -
CRYP Bus hclk3 - - FMAX / 2 -
Bus sys_bus_ck - - FMAX / 2 -
DBG
kernel sys_cpu_ck/3 - - FMAX / 3 -
DB_OCSPI1.
Bus hclk5 - - FMAX / 2 -
DB_OCSPI2
DB_SDMMC1 Bus hclk5 - - FMAX / 2 -
DB_SDMMC2 Bus hclk2 - - FMAX / 2 -
aclk - - FMAX / 2 -
DCMIPP Bus
pclk5 FMAX / 4
GPDMA1 Bus hclk1 - - FMAX / 2 -
hclk5
HPDMA1 Bus - - FMAX / 2 -
aclk
hclk5
DMA2D Bus - - FMAX / 2 -
aclk
ETH_MII_TX_CLK - - 25 A
ETH_MII_TX_CLK/.
ETH_RMII_REF_CL 0(4)
K
ETH1REFCKSEL 25 A
hse_ker_ck 1
Kernel
ETH1 eth_clk_fb 2
hse_ker_ck 0(4)
ETH1PHYCKSEL 50 A
pll3_s_ck 1
clk_ptp_ref_i FMAX / 2 -
Bus hclk1 - - FMAX / 2 -
EXTI Bus pclk4 - - FMAX / 4 -
FLASH Bus hclk5 - - FMAX / 2 -
(4)
hse_ker_ck 0
Kernel pll1_q_ck 1 FDCANSEL 125 A
FDCAN
pll2_p_ck 2
Bus pclk1 - - FMAX / 4 -
hclk5 0(4)
pll1_q_ck 1
Kernel FMCSEL FMAX / 2 A
pll2_r_ck 2
FMC
hsi_ker_ck 3
hclk5 -
Bus - FMAX / 2 -
aclk
GPIOA-H. GPIOM-P Bus hclk4 - - FMAX / 2 -
hclk5
GPU2D Bus - - FMAX / 2 -
aclk
hclk5
GFXMMU Bus - - FMAX / 2 -
aclk
GFXTIM Bus pclk5 - - FMAX / 4 -
HASH Bus hclk3 - - FMAX / 2 -
lse_ck 0(4)
Kernel lsi_ck 1 CECSEL 1
HDMI-CEC -
csi_ker_ck/122 2
Bus pclk1 - - FMAX / 4
pclk1 0(4)
pll3_r_ck 1
Kernel I2C23SEL FMAX / 4 A
I2C2, I2C3 hsi_ker_ck 2
csi_ker_ck 3
Bus pclk1 - - FMAX / 4 -
(4)
pclk1 0
pll3_r_ck 1
Kernel I2C1_I3C1SEL FMAX / 4 A
I2C1/I3C1 hsi_ker_ck 2
csi_ker_ck 3
Bus pclk1 - - FMAX / 4 -
XSPIM Bus hclk5 - - FMAX / 2 -
Kernel lsi_ck - - 1 A
IWDG
Bus pclk4 - - FMAX / 4 -
JPEG Bus hclk5 - - FMAX / 2 -
pclk1 0(4)
pll2_p_ck 1
pll3_r_ck 2
Kernel LPTIM1SEL FMAX / 4 A
LPTIM1 lse_ck 3
lsi_ck 4
per_ck 5
Bus pclk1 - - FMAX / 4 -
pclk4 0(4)
pll2_p_ck 1
pll3_r_ck 2
Kernel LPTIM23SEL FMAX / 4 A
LPTIM2, LPTIM3 lse_ck 3
lsi_ck 4
per_ck 5
Bus pclk4 - - FMAX / 4 -
pclk4 0(4)
pll2_p_ck 1
pll3_r_ck 2
Kernel LPTIM45SEL FMAX / 4 A
LPTIM4, LPTIM5 lse_ck 3
lsi_ck 4
per_ck 5
Bus pclk4 - - FMAX / 4 -
pclk4 0(4)
pll2_q_ck 1
pll3_q_ck 2
Kernel LPUART1SEL FMAX / 4 A
LPUART1 hsi_ker_ck 3
csi_ker_ck 4
lse_ck 5
Bus pclk4 - - FMAX / 4 -
Kernel pll3_r_ck - 90 A
LTDC pclk5 - - FMAX / 4
Bus -
aclk - FMAX / 2
aclk -
MCE1, MCE2, MCE3 Bus - FMAX / 2 -
hclk5 -
MDIO Bus pclk1 - - FMAX / 4 -
PKA Bus hclk3 - - FMAX / 2 -
PWR Bus hclk4 - - FMAX / 2 -
pll3_r_ck 0(4) -
Kernel PSSISEL 100
PSSI per_ck 1 -
Bus hclk2 - - FMAX / 2 -
hclk5 0(4)
Kernel pll2_s_ck 1 XSPI1SEL FMAX / 2 A
XSPI1 pll2_t_ck 2
hclk5
Bus - - FMAX / 2 -
aclk
hclk5 0(4)
Kernel pll2_s_ck 1 XSPI2SEL FMAX / 2 A
XSPI2 pll2_t_ck 2
hclk5
Bus - - FMAX / 2 -
aclk
hsi48_ker_ck 0(4)
pll3_q_ck 1
Kernel OTGFSSEL 50 A
OTGFS hse_ker_ck 2
clk48mohci 3
Bus hclk1 - - FMAX / 2 -
Kernel phy60m_ck - - 60 A
OTGHS
Bus hclk1 - - FMAX / 2 -
RCC Bus hclk4 - - FMAX / 2 -
Kernel hsi48_ker_ck - - 48 A
RNG
Bus hclk3 - - FMAX / 2 -
no clock 0(4)
lse_ck 1
Kernel lsi_ck 2 RTCSEL 4 A
RTC/AWU(5)
hse_ker_ck /
3
(RTCDIV+1)
Bus pclk4 - - FMAX / 4 -
Kernel hclk3 - - FMAX / 2 A
SAES
Bus hclk3 - - FMAX / 2 -
(4)
pll1_q_ck 0
pll2_p_ck 1
Kernel pll3_p_ck 2 SAI1SEL 133 A
SAI1
I2S_CKIN 3
per_ck 4
Bus pclk2 - - FMAX / 4 -
pll1_q_ck 0(4)
pll2_p_ck 1
pll3_p_ck 2
Kernel SAI2SEL 133 A
SAI2 I2S_CKIN 3
per_ck 4
spdif_symb_ck 5
Bus pclk2 - - FMAX / 4 -
SBS Bus pclk4 - - FMAX / 4 -
pll2_s_ck 0(4)
Kernel SDMMC12SEL 200 A
SDMMC1 pll2_t_ck 1
Bus hclk5 - - FMAX / 2 -
pll2_s_ck 0(4)
Kernel SDMMC12SEL 200 A
SDMMC2 pll2_t_ck 1
Bus hclk2 - - FMAX / 2 -
(4)
pll1_q_ck 0
pll2_r_ck 1
Kernel SPDIFRXSEL 200 A
SPDIFRX pll3_r_ck 2
hsi_ker_ck 3
Bus pclk1 - - FMAX / 4 -
pclk4 0(4)
pll2_q_ck 1
pll3_q_ck 2
Kernel SPI6SEL 200 A
SPI/I2S6 hsi_ker_ck 3
csi_ker_ck 4
hse_ker_ck 5
Bus pclk4 - - FMAX / 4 -
(4)
pll1_q_ck 0
pll2_p_ck 1
Kernel pll3_p_ck 2 SPI1SEL 130 A
SPI/I2S1
I2S_CKIN 3
per_ck 4
Bus pclk2 - - FMAX / 4 -
pclk2 0(4)
pll2_q_ck 1
pll3_q_ck 2
Kernel SPI45SEL 200 A
SPI4, SPI5 hsi_ker_ck 3
csi_ker_ck 4
hse_ker_ck 5
Bus pclk2 - - FMAX / 4 -
pll1_q_ck 0(4)
pll2_p_ck 1
Kernel pll3_p_ck 2 SPI23SEL 200 A
SPI/I2S3, SPI/I2S2
I2S_CKIN 3
per_ck 4
Bus pclk1 - - FMAX / 4 -
no clock 0(4)
lse_ck 1
Kernel lsi_ck 2 RTCSEL 4 A
TAMPER
hse_ker_ck/
3
(RTCDIV+1)
Bus pclk4 - - FMAX / 4 -
Kernel lse_ck - - 10 A
DTS
Bus pclk4 - - FMAX / 4 -
TIM2, TIM3, TIM4, Kernel timg1_ck - - FMAX / 2 S
TIM5, TIM6, TIM7,
TIM12, TIM13, Bus pclk1 - - FMAX / 4 -
TIM14
pclk1 0(4)
pll2_q_ck 1
pll3_q_ck 2
USART2, USART3, Kernel UART234578SEL FMAX / 4 A
UART4, UART5, hsi_ker_ck 3
UART7, UART8
csi_ker_ck 4
lse_ck 5
Bus pclk1 - - FMAX / 4 -
Kernel ucpd_ker_ck - - 25 A
UCPD
Bus pclk1 - - FMAX / 4 -
(4)
hse_ker_ck 0
USBPHYC Kernel hse_ker_ck / 2 1 USBPHYCSEL 32 A
pll3_q_ck 2
VREFBUF Bus pclk4 - - FMAX / 4 -
WWDG1 Bus pclk1 - - FMAX / 4 -
1. FMAX value depends on the device reference and can be found on the datasheet of the product.
2. 'A' Means that the kernel clock is asynchronous with respect to bus interface clock.
3. ‘S’ Means that the kernel clock is synchronous with respect to bus interface clock.
4. Reset value
5. The RTC switch is in the VSW voltage domain
Legend
DTCM0
CPU 32/96 Kbytes
Cortex-M7
DTCM1
32-bit bus AXI AHB APB
32/96 Kbytes 64-bit bus Master interface
I$ D$
32KB 32KB ITCM
64/192 Kbytes
Bus multiplexer Slave interface
AXIM
AHBP
From
GPU ICACHE
AHB SDMMC1 HPDMA1 DCMIPP DMA2D GFXMMMU
ICACHE AXI AXI
domain
To AHB domain
MCE3 FMC
MCE1 XSPI1
MCE2 XSPI2
SRAM4
SRAM3
SRAM2
SRAM1
FLASH
GPV
From CM7_AHBP
From AXI
AHB1
SRAM1
16 Kbytes
SRAM2
16 Kbytes
AHB2
AHB3
AHB4
AHB5
MSv55520V5
Main features
• Multi-threaded fragment (pixel) processing core with a VLIW (very-long instruction
word) instruction set
• Fixed point functional units
• Command list based DMAs to minimize CPU overhead
• Two 64-bit AXI master interfaces for texture, command list and framebuffer access
• Dedicated 64-bit AXI master interface for command list
• 32-bit AHB slave interface for register bank access
• Up to 4 general-purpose flags for system-level synchronization
• Texture decompression unit with TSC™4 and TSC™6/TSC™6a support
• 16 Kbyte texture cache (ICACHE)
2D drawing features
• Pixel/line drawing
• Filled rectangles
• Triangles, quadrilateral drawing
• Anti-aliasing 8xMSAA (multi-sample anti-aliasing)
Image transformations
• 3D perspective correct projections
• Texture mapping with bilinear filtering or point sampling
Blit support
• Rotation, mirroring, stretching (independently on x and y axis)
• Source and/or destination color keying
• Pixel format conversions
Note: Binary curves, Edwards curves and Curve25519 are not supported by the PKA.
Number of regions 4
Cipher engines AES x 2 12 rounds Noekeon x2
Derive key function normal, fast
Master key 2
Chaining modes (encryption mode) block, stream block
Cipher context(s) 2 0
Note: When MCE is used in conjunction with XSPI it is mandatory to access the flash memory
using the memory map mode of the flash memory controller.
Any integer
Advanced- Up, Down,
TIM1 16-bit between 1 and Yes 4 4
control Up/down
65536
Any integer
TIM2,TIM3, Up, Down,
32-bit between 1 and Yes 4 No
TIM4 TIM5 Up/down
65536
Any integer
TIM9,TIM12 16-bit Up between 1 and No 2 No
65536
Any integer
General
TIM13,TIM14 16-bit Up between 1 and No 1 No
purpose
65536
Any integer
TIM15 16-bit Up between 1 and Yes 2 1
65536
Any integer
TIM16, TIM17 16-bit Up between 1 and Yes 1 1
65536
Any integer
Basic TIM6, TIM7 16-bit Up between 1 and Yes 0 No
65536
LPTIM1,
LPTIM2, Up Yes 2 No
Low-power LPTIM3 1, 2, 4, 8, 16,
16-bit
timer 32, 64, 128
LPTIM4,
Up No 0 No
LPTIM5
a. Under characterization.
USART1 Full
USART2 Full
USART3 Full
UART4 Basic
UART5 Basic
UART7 Basic
UART8 Basic
LPUART1 Low-power
3.42.1 Introduction
The device embed six serial peripheral interfaces (SPI) that can be used to communicate
with external devices while using the specific synchronous protocol. The SPI protocol
supports half-duplex, full-duplex and simplex synchronous, serial communication with
external devices.
The interface can be configured as master or slave and can operate in multi-slave or multi-
master configurations. The device configured as master provides communication clock
(SCK) to the slave device. The slave select (SS) and ready (RDY) signals can be applied
optionally just to setup communication with concrete slave and to assure it handles the data
flow properly. The Motorola® data format is used by default, but some other specific modes
are supported as well.
Data and CRC size Configurable from 4 to 32- bit Configurable from 4 to 16- bit
CRC polynomial length configurable from 5 CRC polynomial length configurable from 5
CRC computation
to 33- bit to 17- bit
Size of FIFOs 16x8-bit 8x8-bit
Number of data control
Up to 65536 Up to 65536
(TSIZE)
I2S feature Yes No
Autonomous in Stop
modes with wakeup No No
capability
Autonomous in LP-Stop
and Standby modes No No
with wakeup capability
Note: For detailed information about instances capabilities to exit from Stop and Standby modes
refer to SPI wakeup and interrupt requests in reference manual RM0477.
The SAI can work in master or slave configuration. The audio sub-blocks can be either
receiver or transmitter and can work synchronously or asynchronously (with respect to the
other one). The SAI can be connected with other SAIs to work synchronously.
Host mode - X X
Device mode - X -
Host mode X X X
Device mode X X -
overhead. It has a clock domain independent from the CPU clock, allowing the HDMI-CEC
controller to wake up the MCU from Stop mode on data reception.
1 2 3 4 5 6 7 8 9 10
A PB8 PB6 PB3 BOOT0 PM14 PM12 PM9 PM6 PM8 PM2
PC14-
B PB9 PB7 PB4 PM13 PM11 DVDD PM5 PM3 PM1
OSC32_IN
PC15-
C VSS VBAT VCAP4 VSS VDD50USB VSS PM0 PA14 PA15
OSC32_OUT
D VDDSMPS VSSSMPS PC13 PB5 VDD VSSUSB VDD33USB VCAP3 PA12 PA13
E VFBSMPS VLXSMPS VDD VSS VDDLDO VDDLDO VDD PA8 PA10 PA11
PH1-
F PH0-OSC_IN NRST VREFM PB0 VSS VDDLDO VSS PB14 PA9
OSC_OUT
G PC0 PA1 VSSA VDD PB2 VDDXSPI1 VDD VCAP2 PB12 PB15
H PC1 VDDA PA5 VSS VDDXSPI1 VSS VDDXSPI1 PO0 PB10 PB13
J VREFP PA2 PA7 PO1 PP2 PO5 PP5 PP6 PP7 PB11
K PA0 PA4 PA6 PB1 PP4 PP3 PO4 PP0 PO2 PP1
MSv55547V3
1 2 3 4 5 6 7 8 9 10 11 12
VDD33U VDD50U
A VSS PB8 PB6 PB5 PD7 BOOT0 PM11 PM9 PM6
SB SB
VSS
B VBAT PC13 PE1 PE0 PB3 PD5 PM12 PM8 PM5 PM2 PM3 PD4
PC14- PC15-
C OSC32_I OSC32_ PB9 PE2 PB4 PD6 PM14 DVDD VSS PM1 PD2 PC12
N OUT
D PE5 VSS PE3 PB7 VSS VDD VSS VSSUSB VDD PD3 PC10 PA15
VSSSMP
E S
PE6 PE4 VDD VCAP4 PM13 VSS PM0 PC11 PA14 PA12 PA13
PH0-
G VSS
OSC_IN
PC0 VDD PC1 VDDLDO VDDLDO VSS PC7 PC9 PC8 PA9
PH1-
H OSC_OU PC3 VSSA VSS VREFM VCAP1 VSS VCAP2 PB14 PB12 PD14 PC6
T
J PC2 PA1 VDDA PA5 VDD PO1 PO0 PD8 VDD PB10 PB13 PB15
L PA2 PA4 PC4 PB0 PB2 PP2 PO5 PP0 PO2 PP1 PD11 PD13
M VSS PA6 PC5 PB1 PP4 PP3 PO4 PP5 PP6 PP7 PD10 VSS
MSv55548V3
1 2 3 4 5 6 7 8 9 10 11 12 13
A PB8 PB6 PE0 PB3 PF1 PD7 PD5 PM11 PM6 PM5 PM2 PM3 PG1
VDD50U
B VBAT PB7 PE2 PB5 PF2 PD6 PM14 PM12 VSS
SB
PM1 PD4 PE13
PC15- PC14-
VDD33U
C OSC32_ OSC32_I VDD VSS VDD VSS PM9
SB
VSS VDD PD3 PE12 PE11
OUT N
VDDSMP VSSSMP
D S S
PE3 PB9 PE1 PF0 PM13 VSSUSB PM8 PG0 VSS PD2 PD1
VFBSMP VLXSMP
E S S
PE4 PC13 VCAP4 PB4 BOOT0 DVDD PM0 PD0 VDD PC11 PC12
F PF5 PF6 VSS PE6 PE5 VDDLDO VSS VDDLDO VCAP3 PA10 VSS PA14 PC10
PH0-
G PF8
OSC_IN
VDD PF7 PF9 VSS VSS VSS PC9 PC7 VDD PA12 PA15
PH1-
H OSC_OU PC2 PC0 NRST PC1 VDDLDO VSS VDDLDO VCAP2 PC6 VSS PA8 PA13
T
J PC3 VSS VREFM VSSA PA3 VCAP1 PE9 PB12 PB14 PD15 PC8 PA9 PA11
VDDXSPI
K PA0 VDD VREFP VDDA PB0 PE7 PO1
1
PO0 VDD VSS PB15 PD14
VDDXSPI VDDXSPI
L PA1 PA4 PA5 PC5 VDD VSS
1
VSS
1
VSS PD12 PB10 PB13
M PA2 PA7 PB1 PF11 PE10 PP2 PO5 PP5 PP6 PP7 PD10 PD13 PB11
MSv55553V3
N PA6 PC4 PB2 PE8 PP4 PP3 PO4 PP0 PO2 PP1 PD8 PD9 PD11
1 2 3 4 5 6 7 8 9 10 11 12
VDD50U
A VSS PB8 PB6 PD7 PD5 PM12
SB
PD4 PC10 PA15 PA9 VSS
VDD33U
B VBAT PB9 PE1 PB5 PD6 PM11
SB
PD3 PD0 PA13 PA12 PC8
PC14- PC15-
C OSC32_I OSC32_ PC13 PB7 PB3 BOOT0 VSS PG1 PD2 PA14 PA8 PC6
N OUT
D PE5 VSS PE3 VDD PE2 PM13 VDD PG0 PC11 PA10 PC9 PC7
VSSSMP VDDXSPI
E S
PE6 PE4 VSS VCAP4 PB4 PM14 VSS PA11
2
PN3 PN11
PH0- VDDXSPI
G VSS
OSC_IN
PC0 NRST VSS VDDLDO VDDLDO VSS PN1
2
PN2 PN9
PH1-
H OSC_OU PC3 VDDA VREFM PC1 VCAP1 VSS VCAP2 VDD VSS PN7 PN6
T
VDDXSPI
J PC2 PA0 VSSA VDD VSS PB1 PO1 PO0 PB10
2
PN4 PN5
L PA2 PA5 PA7 PB0 PB2 PP2 PO5 PP0 PO2 PP1 PB15 PB13
M VSS PA4 PA6 PC5 PP4 PP3 PO4 PP5 PP6 PP7 PB11 VSS
MSv55543V3
1 2 3 4 5 6 7 8 9 10 11 12 13
VDD50U
A PB8 PB6 PE0 PB3 PF1 PD7 PD5 PM11
SB
PE13 PE11 PC10 PA15
B VBAT PB7 PE2 PB5 PF2 PG2 PD6 PM12 PG1 PD4 PD1 PD0 PA13
PC15- PC14-
VDD33U
C OSC32_ OSC32_I VDD VSS VDD VSS PM14
SB
VSS VDD PC12 PA14 PA11
OUT N
VDDSMP VSSSMP
D S S
PE3 PB9 PE1 PF0 PM13 PG0 PD3 PE14 VSS PA12 PA9
VFBSMP VLXSMP
E S S
PE4 PC13 VCAP4 PB4 BOOT0 PE12 PD2 PC11 VDD PA10 PA8
F PF8 PF6 VSS PE6 PE5 VDDLDO VSS VDDLDO VCAP3 PC9 VSS PC8 PC6
PH1-
PH0- VDDXSPI
G OSC_OU
OSC_IN
VDD PF7 PF9 VSS VSS VSS PC7 PN1
2
PN11 PN3
T
VDDXSPI
H PC3 PC2 PC0 NRST PC1 VDDLDO VSS VDDLDO VCAP2
2
VSS PN10 PN0
VDDXSPI
J PA0 VSS VREFM VSSA PA3 VCAP1 PD8 PB12 PB14 PN12
2
PN9 PN2
VDDXSPI
K PA2 VDD VREFP VDDA PB0 PE7 PO1
1
PO0 VDD VSS PN7 PN6
VDDXSPI VDDXSPI
L PA1 PA4 PA5 PB2 VDD VSS
1
VSS
1
VSS PB10 PN4 PN5
M PA6 PA7 PB1 PE8 PE9 PP2 PO5 PP5 PP6 PP7 PD10 PB13 PN8
MSv55554V3
N PC4 PC5 PF11 PE10 PP4 PP3 PO4 PP0 PO2 PP1 PD9 PB11 PB15
A VSS PB6 PB5 PF3 PF1 PD7 PD5 PM12 PM14 PM6 PM8 PM3 PD4 PE15 VSS
VDD50US
B PB8 PE1 PE2 PB3 PF4 PF0 PD6 PM11 PM9 PM5
B
PM1 PG0 PE13 PE11
C VBAT PB9 PB7 PE0 PB4 PF2 BOOT0 PM13 DVDD VSSUSB PM2 PM0 PE14 PE12 PD1
PC14-
VDD33US
D OSC32_I VSS PC13 VDD VSS VSS VDD VSS
B
VDD VSS PD3 PD2 PD0 PC12
N
PC15-
E VSS OSC32_O VSS VSS VSS PC11 PC10 PA15
UT
F PE5 PE3 PE4 VSS VCAP4 VSS VSS VSS VSS VDD PA14 PA12 PA13
VSSSMP
G S
VLXSMPS PE6 VDD VSS VDDLDO VSS VDDLDO VCAP3 VSS PA10 PA8 PA11
VFBSMP VDDSMP
H S S
PF5 VSS VSS VSS VDDLDO VSS VSS VSS VSS PC9 PA9
J PF6 PF8 PF7 VSS VSS VDDLDO VSS VDDLDO VSS VDD PC6 PC7 PC8
VDDXSPI
K PF10 PF9 VSS VDD VSS VCAP1 VSS
1
VCAP2 VSS PD14 PD15 PB15
PH0-
L VSS
OSC_IN
VSS VSSA VDD PB12 PB14 PB13
PH1-
VDDXSPI VDDXSPI
M OSC_OU NRST VREFP VDDA PA4 VDD VSS
1
VSS
1
VSS VDD PD12 PB10 PB11
T
N PC0 PC3 VREFM PA3 PA7 PB0 PF12 PE9 PE10 VSS PP5 PD8 PD10 PD11 PD13
P PC1 PC2 PA1 PA5 PC4 PB2 PF13 PE7 PO1 PP2 PO5 PP6 PP7 PO0 PD9
R VSS PA0 PA2 PA6 PC5 PB1 PF11 PE8 PP4 PP3 PO4 PP0 PO2 PP1 VSS
MSv55550V3
A VSS PB6 PB5 PF3 PF1 PG3 PD7 PD5 PM14 PM11 PD4 PE15 PE11 PD1 VSS
B PB8 PE1 PE2 PB3 PF4 PF0 PD6 BOOT0 PM13 PM12 PG0 PE13 PE12 PD0 PC12
VDD50US
C VBAT PB9 PB7 PE0 PB4 PF2 PG2 VSS
B
PG1 PD3 PE14 PD2 PC11 PA15
PC14-
VDD33US
D OSC32_I VSS PC13 VDD VSS VSS VDD VSS
B
VDD VSS VSS PC10 PA13 PA11
N
PC15-
E VSS OSC32_O VSS VSS VSS PA14 PA12 PA9
UT
F PE5 PE3 PE4 VSS VCAP4 VSS VSS VSS VSS VDD PA10 PA8 PC8
VSSSMP
G S
VLXSMPS PE6 VDD VSS VDDLDO VSS VDDLDO VCAP3 VSS PC9 PC7 PC6
VDDXSPI
J PF6 PF8 PF7 VSS VSS VDDLDO VSS VDDLDO VSSUSB 2
PN10 PN11 PN0
VDDXSPI
K PF10 PF9 DVDD VDD VSS VCAP1 VSS
1
VCAP2 VSS PB14 PN9 PN2
PH0- VDDXSPI
L VSS
OSC_IN
VSS VSSA
2
PB12 PN7 PN6
PH1-
VDDXSPI VDDXSPI
M OSC_OU NRST VREFP VDDA PA4 VDD VSS
1
VSS
1
VSS VDD PB15 PN4 PN5
T
N PC0 PC3 VREFM PA3 PA7 PB0 PF12 PE9 PE10 VSS PP5 PD8 PB10 PB13 PN8
P PC1 PC2 PA1 PA5 PC4 PB2 PF13 PE7 PO1 PP2 PO5 PP6 PP7 PO0 PB11
R VSS PA0 PA2 PA6 PC5 PB1 PF11 PE8 PP4 PP3 PO4 PP0 PO2 PP1 VSS
MSv55544V3
VDD33USB
VDD50USB
VDDLDO
VSSUSB
BOOT0
VCAP4
DVDD
PM13
PM14
PM12
PM11
VDD
VDD
PM9
PM8
VDD
VDD
PM6
PM5
PM3
PM2
PM1
PM0
PD7
PD6
PD5
VSS
PB9
PB8
PB7
PB6
PE2
PE1
PE0
PD4
PD3
PB5
PB4
PB3
PF4
PF3
PF2
PF1
PF0
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
VBAT 1 132 VSS
PC13 2 131 PE15
PC14-OSC32_IN 3 130 PE14
PC15-OSC32_OUT 4 129 PE13
VDD 5 128 PE12
VSS 6 127 PE11
PE3 7 126 PD2
PE4 8 125 PD1
PE5 9 124 PD0
PE6 10 123 PC12
VSS 11 122 PC11
VDD 12 121 PC10
VSSSMPS 13 120 VDD
VLXSMPS 14 119 VDDLDO
VDDSMPS 15 118 VSS
VFBSMPS 16 117 VCAP3
PF5 17 116 PA15
PF6 18 115 PA14
PF7 19 114 PA13
PF8 20 113 PA12
PF9 21 112 PA11
PF10 22 111 PA10
PH0-OSC_IN 23 LQFP176 110 PA9
PH1-OSC_OUT 24 109 PA8
NRST 25 108 VSS
VSS 26 107 VDD
VDD 27 106 PC9
PC0 28 105 PC8
PC1 29 104 PC7
PC2 30 103 PC6
PC3 31 102 PD15
VSSA 32 101 PD14
VREFM 33 100 VDD
VREFP 34 99 VDDLDO
VDDA 35 98 VSS
PA0 36 97 VCAP2
PA1 37 96 PB15
PA2 38 95 PB14
PA3 39 94 PB13
VSS 40 93 PB12
VDD 41 92 PB11
PA4 42 91 PB10
PA5 43 90 PD13
PA6 44 89 PD12
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
PC4
PC5
PB0
PB1
PB2
VDD
VSS
PE7
PE8
PE9
PE10
VDD
VDDLDO
VSS
VCAP1
PO1
VDDXSPI1
VSS
PP4
PP2
PP3
VSS
VDDXSPI1
PO5
PO4
PP5
PP0
VSS
VDDXSPI1
PP6
PO2
PP7
PP1
VSS
VDDXSPI1
PO0
PD8
PD9
PD10
VDD
VSS
PA7
PF11
PD11
MSv55551V3
VDD33USB
VDD50USB
VDDLDO
BOOT0
VCAP4
PM13
PM14
PM12
PM11
PE15
PE14
PE13
PE12
PE11
VDD
VDD
VDD
PG2
PG1
PD7
PD6
PD5
VSS
PG0
VSS
PB9
PB8
PB7
PB6
PE2
PE1
PE0
PD4
PD3
PD2
PD1
PB5
PB4
PB3
PF4
PF3
PF2
PF1
PF0
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
VBAT 1 132 PD0
PC13 2 131 PC12
PC14-OSC32_IN 3 130 PC11
PC15-OSC32_OUT 4 129 PC10
VDD 5 128 VDD
VSS 6 127 VDDLDO
PE3 7 126 VSS
PE4 8 125 VCAP3
PE5 9 124 PA15
PE6 10 123 PA14
VSS 11 122 PA13
VDD 12 121 PA12
VSSSMPS 13 120 PA11
VLXSMPS 14 119 PA10
VDDSMPS 15 118 PA9
VFBSMPS 16 117 PA8
PF5 17 116 VDD
PF6 18 115 PC9
PF7 19 114 PC8
PF8 20 113 PC7
PF9 21 112 PC6
PF10 22 111 PN1
PH0-OSC_IN 23 LQFP176 110 VDDXSPI2
PH1-OSC_OUT 24 109 PN3
NRST 25 108 PN11
VSS 26 107 PN0
VDD 27 106 PN10
PC0 28 105 VDDXSPI2
PC1 29 104 VSS
PC2 30 103 PN2
PC3 31 102 PN9
VSSA 32 101 PN6
VREFM 33 100 PN7
VREFP 34 99 VDDXSPI2
VDDA 35 98 VSS
PA0 36 97 PN5
PA1 37 96 PN4
PA2 38 95 PN8
PA3 39 94 VSS
VSS 40 93 VDDXSPI2
VDD 41 92 VDD
PA4 42 91 VDDLDO
PA5 43 90 VSS
PA6 44 89 VCAP2
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
PC4
PC5
PB0
PB1
PB2
VDD
VSS
PE7
PE8
PE9
PE10
VDD
VDDLDO
VSS
VCAP1
PO1
VDDXSPI1
VSS
PP4
PP2
PP3
VSS
VDDXSPI1
PO5
PO4
PP5
PP0
VSS
VDDXSPI1
PP6
PO2
PP7
PP1
VSS
VDDXSPI1
PO0
PB10
PB12
PB13
PB14
PB15
PA7
PF11
PB11
MSv55545V3
2 4 6 8 10
1 3 5 7 9 11
PC14-
B VDD VDD3USB PM6 PM11 VSS
OSC32_IN
PC15-
D VCAP3 PM0 DVDD PM13 PB5 OSC32_O
UT
PH0-
M PB15 PB10 PD12 PA6 PC0
OSC_IN
PH1-
P VDD PP0 PO4 PO1 PA0
OSC_OUT
W VCAP1 VDD
MSv55555V3
A VSS PE0 PF3 PF2 PG3 BOOT0 PM12 VSS PM6 PM3 VSS PD3 PE14 PD2 VSS
B PB8 PE2 PB5 PF4 PF0 PD7 PM11 PM9 PM5 PM2 PG0 PE13 PD1 PC10 PC11
C VBAT PB9 PE1 PB3 PF1 PG2 PM13 PM14 PM8 PM1 PD4 PE11 PD0 PA12 PA11
PC15- PC14-
VDD50US
D OSC32_O OSC32_I VSS PB7 PB4 VSS PD5 DVDD
B
PM0 PE15 PC12 PA14 PA9 PC8
UT N
E PE6 PE4 VSS PC13 PB6 VCAP4 PD6 VSSUSB VSS PG1 PE12 PA13 PA10 PC9 PC6
VDD33US
F PG14 PG12 PG11 PE5 PE3 VSS VDD
B
VDD VDD VCAP3 PA8 PC7 PN1 VSS
VFBSMP
G VLXSMPS
S
PF5 PG15 PG13 VDD VDDLDO VSS VDDLDO VSS PA15 VSS PN3 PN0 PN11
VDDXSPI
J VSS PF9 PF10 NRST VSSA VDDA VDDLDO VSS VDDLDO VSS
2
VSS PN7 PN6 VSS
PH1-
PH0- VDDXSPI
K OSC_IN
OSC_OU PC0 VREFM VREFP VDD VSS VDD VSS VDD VCAP2
2
PN8 PN4 PN5
T
VDDXSPI VDDXSPI
L PC1 PC2 PC3 PA2 PC4 VSS VCAP1
1
VDD
1
VSS PB12 PD15 PD14 PN12
VDDXSPI
M PA0 PA1 PA4 PA7 PF11 PE7 PG6 VSS VSS
1
PD8 PD11 PB14 PB15 VSS
N PA3 PA5 PC5 PB2 PF15 PG4 PG7 PP2 PP3 PP0 PP7 PO0 PD12 PB11 PB13
P PA6 PB0 PF13 PF14 PE9 PG5 PG8 PO1 VSS PP5 PO2 PP1 PD9 PD13 PB10
R VSS PB1 PF12 PE8 PE10 VSS PG9 PP4 PO5 PO4 PP6 VSS PG10 PD10 VSS
MSv55542V4
A VSS PE0 PF3 PF2 PG3 BOOT0 PM12 VSS PM6 PM3 VSS PD3 PE14 PD2 VSS
B PB8 PE2 PB5 PF4 PF0 PD7 PM11 PM9 PM5 PM2 PG0 PE13 PD1 PC10 PC11
C VBAT PB9 PE1 PB3 PF1 PG2 PM13 PM14 PM8 PM1 PD4 PE11 PD0 PA12 PA11
PC15- PC14-
VDD50US
D OSC32_O OSC32_I VSS PB7 PB4 VSS PD5 DVDD
B
PM0 PE15 PC12 PA14 PA9 PC8
UT N
E PE6 PE4 VSS PC13 PB6 VCAP4 PD6 VSSUSB VSS PG1 PE12 PA13 PA10 PC9 PC6
VDD33US
F PG14 PG12 PG11 PE5 PE3 VSS VDD
B
VDD VDD VCAP3 PA8 PC7 PN1 VSS
VFBSMP
G VLXSMPS
S
PF5 PG15 PG13 VDD VDDLDO VSS VDDLDO VSS PA15 VSS PN3 PN0 PN11
VDDXSPI
J VSS PF9 PF10 NRST VSSA VDDA VDDLDO VSS VDDLDO VSS
2
VSS PN7 PN6 VSS
PH1-
PH0- VDDXSPI
K OSC_IN
OSC_OU PC0 VREFM VREFP VDD VSS VDD VSS VDD VCAP2
2
PN8 PN4 PN5
T
VDDXSPI VDDXSPI
L PC1 PC2 PC3 PA2 PC4 VSS VCAP1
1
VDD
1
VSS PB12 PD15 PD14 PN12
VDDXSPI VDDXSPI
M PA0 PA1 PA4 PA7 PF11 PE7 VSS
1
VSS
1
PO3 PP10 PB14 PB15 VSS
N PA3 PA5 PC5 PB2 PF15 PP12 PP14 VSS PP2 PP5 PO2 PP1 PD12 PB11 PB13
P PA6 PB0 PF13 PF14 PE9 PP11 PO1 PP15 PP3 PO5 PP0 PP7 PP8 PD13 PB10
R VSS PB1 PF12 PE8 PE10 VSS PP13 PP4 VSS PO4 PP6 VSS PO0 PP9 VSS
MSv55541V4
VDD33USB
BOOT0
VCAP4
PM13
PM14
PM12
PM11
VDD
VDD
VSS
VSS
PB9
PB8
PB7
PB5
PB4
PB3
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
VBAT 1 51 VCAP3
PC13 2 50 PA15
PC14-OSC32_IN 3 49 PA14
PC15-OSC32_OUT 4 48 PA13
PH0-OSC_IN 5 47 PA12
PH1-OSC_OUT 6 46 PA11
NRST 7 45 PA10
VSS 8 44 PA9
VDD 9 VFQFPN68 43 PA8
VSSA 10 42 VDD
VREFP 11 41 VSS
VDDA 12 40 VCAP2
PA0 13 39 PB15
PA1 14 38 PB14
PA2 15 37 PB12
PA3 16 36 PB11
PA4 17 35 PB10
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
VDD
PB0
PB1
PB2
PP2
PP3
VSS
VDDXSPI1
PO4
PP0
PP1
VSS
VDDXSPI1
PO0
PA5
PA6
PA7
MSv55546V3
VDD50USB
VDD33USB
VSSUSB
BOOT0
VCAP4
DVDD
PM12
PM14
PM13
PM11
VDD
VDD
PM3
PM5
PM6
PM8
PM9
VSS
PB3
PB4
PB5
PB6
PB7
PB8
PB9
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
VBAT 1 75 PM2
PC13 2 74 PM1
PC14-OSC32_IN 3 73 PM0
PC15-OSC32_OUT 4 72 PC12
PH0-OSC_IN 5 71 PC11
PH1-OSC_OUT 6 70 PC10
NRST 7 69 VDD
VSS 8 68 VSS
VDD 9 67 VCAP3
PC0 10 66 PA15
PC1 11 65 PA14
VSSA 12 64 PA13
VREFM 13 LQFP100 63 PA12
VREFP 14 62 PA11
VDDA 15 61 PA10
PA0 16 60 PA9
PA1 17 59 PA8
PA2 18 58 VDD
PA3 19 57 VSS
VSS 20 56 VCAP2
PA4 21 55 PB15
PA5 22 54 PB14
VDD 23 53 PB13
PA6 24 52 PB12
PA7 25 51 PB11
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
PB10
PO0
VDDXSPI1
VSS
PP1
PP7
PO2
VDDXSPI1
PP6
VSS
PP0
PP5
PO4
PO5
VDDXSPI1
VSS
PP3
PP2
PP4
VSS
VDDXSPI1
PO1
PB2
PB1
PB0
MSv55552V3
VDD33USB
VDD50USB
VSSUSB
BOOT0
VCAP4
DVDD
PM13
PM14
PM12
PM11
VDD
VDD
VDD
PM9
PM8
PM6
PM5
PM3
PM2
PM1
PM0
VSS
VSS
PD7
PD6
PD5
PD4
PD3
PB7
PB6
PE2
PE1
PE0
PB5
PB4
PB3
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
109
119
118
117
116
115
114
113
112
110
111
PB8 1 108 VDD
PB9 2 107 VSS
VBAT 3 106 PD2
PC13 4 105 PD1
PC14-OSC32_IN 5 104 PD0
PC15-OSC32_OUT 6 103 PC12
VDD 7 102 PC11
VSS 8 101 PC10
PE3 9 100 VDD
PE4 10 99 VSS
PE5 11 98 VCAP3
PE6 12 97 PA15
PH0-OSC_IN 13 96 PA14
PH1-OSC_OUT 14 95 PA13
NRST 15 94 PA12
VSS 16 93 PA11
VDD 17 92 PA10
PC0 18 91 PA9
PC1 19 LQFP144 90 PA8
PC2 20 89 VSS
PC3 21 88 VDD
VSSA 22 87 PC9
VREFM 23 86 PC8
VREFP 24 85 PC7
VDDA 25 84 PC6
PA0 26 83 PD15
PA1 27 82 PD14
PA2 28 81 VDD
PA3 29 80 VSS
VSS 30 79 VCAP2
VDD 31 78 PB15
PA4 32 77 PB14
PA5 33 76 PB13
PA6 34 75 PB12
PA7 35 74 PB11
PC4 36 73 PB10
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
PC5
PB0
PB1
PB2
VDD
VSS
VCAP1
PO1
VDDXSPI1
VSS
PP4
PP2
PP3
VSS
VDDXSPI1
PO5
PO4
PP5
PP0
VSS
VDDXSPI1
PP6
PO2
PP7
PP1
VSS
VDDXSPI1
PO0
PD8
PD9
VDD
VSS
PD10
PD12
PD13
PD11
MSv55540V4
Unless otherwise specified in brackets below the pin name, the pin function during
Pin name
and after reset is the same as the actual pin name
S Supply pin
Pin type I Input only pin
I/O Input/output pin
FT 5V-tolerant I/O
TT 3.6V-tolerant I/O
B Dedicated BOOT pin
Bidirectional reset pin with embedded weak pull-up
RST
resistor
Option for TT or FT I/Os(1)
_a I/O, with analog switch function supplied by VDDA
I/O structure
_f I/O, Fm+ capable
_h I/O with high-speed low-voltage mode (HSLV)
_s I/O supplied only by VDDIOx(2)
_t I/O with tamper function functional in VBAT mode
_c I/O power delivery
_d I/O i/o dead battery
_u I/O USB
Unless otherwise specified by a note, all I/Os are set as analog inputs during and after
Notes
reset.
Alternate
Functions selected through GPIOx_AFR registers
Pin functions
functions Additional
Functions directly selected/enabled through peripheral registers
functions
1. The related I/O structures in the table below are a concatenation of various options. Examples: FT_hat, FT_fs, TT_a.
2. VDDIOx represents VDD or VDDXSPIx.
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
TIM17_CH1, TIM4_CH4,
DS14359 Rev 2
I2C1_SDA/I3C1_SDA,
SPI2_NSS/I2S2_WS,
PSSI_D7, SDMMC1_CDIR, TAMP_IN2/
B2 C3 B2 D4 D4 C2 176 176 C2 - C2 C2 68 100 2 PB9 I/O FT_h -
UART4_TX, FDCAN1_TX, TAMP_OUT1
SDMMC2_D5,
SDMMC1_D5, DCMIPP_D7,
EVENTOUT
C3 B1 B1 B1 B1 C1 1 1 C1 H9 C1 C1 1 1 3 VBAT S - - - -
C1 A1 A1 C4 B9 A1 - - A1 B9 A1 A1 - - - VSS S - - - -
TAMP_IN1/
TAMP_OUT2,
D3 B2 C3 E4 E4 D3 2 2 D3 G10 E4 E4 2 2 4 PC13 I/O - - EVENTOUT RTC_OUT1/
92/320
RTC_TS,
WKUP3
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
93/320 Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
PC14-
B1 C1 C1 C2 C2 D1 3 3 D1 B11 D2 D2 3 3 5 OSC32_IN( I/O - - EVENTOUT OSC32_IN
OSC32_IN)
PC15-
OSC32_OU
C2 C2 C2 C1 C1 E2 4 4 E2 D11 D1 D1 4 4 6 I/O - - EVENTOUT OSC32_OUT
T(OSC32_O
UT)
D5 D6 D4 C3 C3 D4 5 5 D4 F11 F7 F7 - - 7 VDD S - - - -
TRACED0, LPTIM5_ETR,
TIM15_BKIN, SAI1_SD_B,
- D3 D3 D3 D3 F2 7 7 F2 - F5 F5 - - 9 PE3 I/O FT_h - ETH_MII_RXD3, -
FMC_D12/FMC_AD12,
EVENTOUT
TRACED1, SAI1_D2,
ADF1_SDI0, TIM15_CH1N,
STM32H7Sxx8
SPI4_NSS, SAI1_FS_A,
- E3 E3 E3 E3 F3 8 8 F3 - E2 E2 - - 10 PE4 I/O FT_h - -
PSSI_D4,
FMC_D13/FMC_AD13,
DCMIPP_D4, EVENTOUT
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
TRACED2, ADF1_CCK1,
SAI1_CK2, TIM15_CH1,
DS14359 Rev 2
SPI4_MISO, SAI1_SCK_A,
- D1 D1 F5 F5 F1 9 9 F1 - F4 F4 - - 11 PE5 I/O FT_h - -
PSSI_D6,
FMC_D14/FMC_AD14,
DCMIPP_D6, EVENTOUT
TRACED3, TIM1_BKIN2,
SAI1_D1, ADF1_SDI0,
TIM15_CH2, SPI4_MOSI,
- E2 E2 F4 F4 G3 10 10 G3 - E1 E1 - - 12 PE6 I/O FT_h - SAI1_SD_A, PSSI_D7, -
SAI2_MCLK_B,
FMC_D15/FMC_AD15,
DCMIPP_D7, EVENTOUT
E3 D9 D7 C5 - D7 - - D7 - F9 F9 - - - VDD S - - - -
E4 D2 D2 D11 C9 D5 - - D2 R4 A15 A15 - - - VSS S - - - -
LPTIM1_IN2,
SPI1_SCK/I2S1_CK,
SPDIFRX_IN0, PSSI_D3,
- - - - - - - - - - F3 F3 - - - PG11 I/O FT_h - SDMMC2_D2, -
ETH_MII_TX_EN/ETH_RMII
_TX_EN, FMC_D28,
DCMIPP_D3, EVENTOUT
94/320
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
95/320 Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
LPTIM1_IN1,
SPI6_MISO/I2S6_SDI,
DS14359 Rev 2
SPDIFRX_IN1,
- - - - - - - - - - F2 F2 - - - PG12 I/O FT_h - SDMMC2_D3, -
ETH_MII_TXD1/ETH_RMII_
TXD1, FMC_D29, LCD_G1,
EVENTOUT
TRACED0, LPTIM1_CH1,
SPI6_SCK/I2S6_CK,
SDMMC2_D6,
- - - - - - - - - - G5 G5 - - - PG13 I/O FT_h - -
ETH_MII_TXD0/ETH_RMII_
TXD0, FMC_D30, LCD_CLK,
EVENTOUT
TRACED1, LPTIM1_ETR,
SPI6_MOSI/I2S6_SDO,
SDMMC2_D7,
- - - - - - - - - - F1 F1 - - - PG14 I/O FT_h - -
ETH_MII_TXD1/ETH_RMII_
TXD1, FMC_D31, LCD_B1,
EVENTOUT
STM32H7Sxx8
LPTIM1_CH2, PSSI_D13,
- - - - - - - - - - G4 G4 - - - PG15 I/O FT_h - FMC_NBL3, DCMIPP_D13, -
EVENTOUT
F6 D5 E4 F3 D11 D6 11 11 D5 T1 D3 D3 - - - VSS S - - - -
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
D2 E1 E1 D2 D2 G1 13 13 G1 H11 H2 H2 - - - VSSSMPS S - - - -
E2 F1 F1 E2 E2 G2 14 14 G2 J10 G1 G1 - - - VLXSMPS S - - - -
D1 F2 F2 D1 D1 H2 15 15 H2 K11 H1 H1 - - - VDDSMPS S - - - -
E1 F3 F3 E1 E1 H1 16 16 H1 L10 G2 G2 - - - VFBSMPS S - - - -
DCMIPP_D15,
UCPD_FRSTX1, PSSI_D15,
- - - - F1 H3 17 17 H3 - G3 G3 - - - PF5 I/O FT_h - -
FMC_CLE, ETH_MII_RXD2,
FMC_A16, EVENTOUT
TIM16_CH1, SPI5_NSS,
SAI1_SD_B, UART7_RX,
- - - F2 F2 J1 18 18 J1 - H5 H5 - - - PF6 I/O FT_h - -
FMC_ALE, FMC_A17,
EVENTOUT
TIM17_CH1, SPI5_SCK,
SAI1_MCLK_B, UART7_TX,
- - - G4 G4 J3 19 19 J3 - H4 H4 - - - PF7 I/O FT_h - -
FMC_A18, LCD_G0,
EVENTOUT
96/320
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
97/320 Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
TIM16_CH1N,
DCMIPP_PIXCLK,
DS14359 Rev 2
SPI5_MISO, SAI1_SCK_B,
- - - F1 G1 J2 20 20 J2 - H3 H3 - - - PF8 I/O FT_h - -
UART7_RTS, PSSI_PDCK,
TIM13_CH1, FMC_A19,
LCD_G1, EVENTOUT
TIM17_CH1N, SPI5_MOSI,
SAI1_FS_B, UART7_CTS,
- - - G5 G5 K2 21 21 K2 - J2 J2 - - - PF9 I/O FT_h - -
TIM14_CH1, FMC_A21,
LCD_R0, EVENTOUT
TIM16_BKIN, SAI1_D3,
DCMIPP_D15, PSSI_D15,
- - - - - K1 22 22 K1 - J3 J3 - - - PF10 I/O FT_h - PSSI_D11, FMC_A22, -
DCMIPP_D11, LCD_R1,
EVENTOUT
PH0-
F1 G2 G2 G2 G2 L2 23 23 L2 M11 K1 K1 5 5 13 OSC_IN(PH I/O FT_h - EVENTOUT OSC_IN
0)
PH1-
STM32H7Sxx8
F2 H1 H1 G1 H1 M1 24 24 M1 P11 K2 K2 6 6 14 OSC_OUT( I/O FT_h - EVENTOUT OSC_OUT
PH1)
F8 D7 E8 F7 F3 D8 - - D6 T7 D6 D6 - - - VSS - - - - -
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
W1
G4 F9 F9 E11 C10 F12 27 27 F12 G6 G6 9 9 17 VDD S - - - -
0
G7 G4 H9 G3 E11 G4 - - G4 - H6 H6 - - - VDD - - - - -
GFXTIM_FCKCAL,
SAI2_FS_B, FMC_NBL1,
G1 G3 G3 H3 H3 N1 28 28 N1 M9 K3 K3 - 10 18 PC0 I/O FT_h - ADC12_INP10
GFXTIM_LCKCAL,
EVENTOUT
TRACED0, SAI1_D1,
ADF1_SDI0, ADC12_INP11,
SPI2_MOSI/I2S2_SDO, ADC12_INN10,
H1 G5 H5 H5 H5 P1 29 29 P1 L8 L1 L1 - 11 19 PC1 I/O FT_h - SAI1_SD_A, FMC_A16, TAMP_IN7/TAM
SDMMC2_CK, ETH_MDC, P_OUT8,
FMC_A0, MDIOS_MDC, WKUP4
EVENTOUT
TIM1_CH1,
SPI2_MISO/I2S2_SDI, ADC12_INP12,
- J1 J1 H2 H2 P2 30 30 P2 - L2 L2 - - 20 PC2 I/O FT_h -
FMC_A17, ETH_MII_TXD2, ADC12_INN11
FMC_A1, EVENTOUT
98/320
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
99/320 Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
TIM1_CH2,
SPI2_MOSI/I2S2_SDO,
DS14359 Rev 2
ADC12_INP13,
- H2 H2 H1 J1 N2 31 31 N2 - L3 L3 - - 21 PC3 I/O FT_h - FMC_A18,
ADC12_INN12
ETH_MII_TX_CLK, FMC_A2,
EVENTOUT
G3 H3 J3 J4 J4 L4 32 32 L4 R10 J5 J5 10 12 22 VSSA S - - - -
F4 H5 H4 J3 J3 N3 33 33 N3 N10 K4 K4 - 13 23 VREFM S - - - -
J1 K3 K3 K3 K3 M3 34 34 M3 U10 K5 K5 11 14 24 VREFP S - - - -
H2 J3 H3 K4 K4 M4 35 35 M4 T11 J6 J6 12 15 25 VDDA S - - - -
TIM2_CH1, TIM5_CH1,
TIM9_CH1, TIM15_BKIN,
SPI6_NSS/I2S6_WS,
USART2_CTS/USART2_NS ADC12_INP0,
K1 K1 J2 J1 K1 R2 36 36 R2 P9 M1 M1 13 16 26 PA0 I/O FT_h - S, UART4_TX, ADC12_INN1,
SDMMC2_CMD, WKUP1
SAI2_SD_B,
FMC_AD7/FMC_D7,
LCD_G3, EVENTOUT
STM32H7Sxx8
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
TIM2_CH2, TIM5_CH2,
LPTIM3_IN1, TIM15_CH1N,
DS14359 Rev 2
DCMIPP_D0, PSSI_D0,
USART2_RTS, UART4_RX,
G2 J2 K1 L1 L1 P3 37 37 P3 K7 M2 M2 14 17 27 PA1 I/O FT_h - SAI2_MCLK_B, ADC12_INP1
ETH_MII_RX_CLK/ETH_RMI
I_REF_CLK,
FMC_AD6/FMC_D6,
LCD_G2, EVENTOUT
TIM2_CH3, TIM5_CH3,
LPTIM3_IN2, TIM15_CH1,
USART2_TX, SAI2_SCK_B,
ADC12_INP14,
J2 L1 L1 K1 M1 R3 38 38 R3 V11 L4 L4 15 18 28 PA2 I/O FT_h - ETH_MDIO,
WKUP2
FMC_AD5/FMC_D5,
LCD_B7, MDIOS_MDIO,
EVENTOUT
TIM2_CH4, TIM5_CH4,
LPTIM3_CH1, TIM15_CH2,
I2S6_MCK, SPI4_RDY,
USART2_RX,
- K2 K2 J5 J5 N4 39 39 N4 - N1 N1 16 19 29 PA3 I/O FT_h - GFXTIM_LCKCAL, ADC12_INP15
SPI5_RDY, SPI1_RDY,
ETH_MII_COL,
100/320
GFXTIM_FCKCAL, LCD_DE,
TIM1_CH3, EVENTOUT
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
101/320 Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
- G1 G1 G7 G6 E3 40 40 D12 - F6 F6 - 20 30 VSS S - - - -
DS14359 Rev 2
STM32H7Sxx8
- J9 - K10 G11 K4 - - M6 - K6 K6 19 23 - VDD S - - - -
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
PWR_CSLEEP, TIM1_BKIN,
TIM3_CH1, LPTIM3_ETR,
DS14359 Rev 2
SPI1_MISO/I2S1_SDI,
PSSI_PDCK,
K3 M2 M3 M1 N1 R4 44 44 R4 M7 P1 P1 20 24 34 PA6 I/O FT_h - ADC12_INP3
SPI6_MISO/I2S6_SDI,
TIM13_CH1, MDIOS_MDC,
LCD_B7, DCMIPP_PIXCLK,
LCD_HSYNC, EVENTOUT
TIM1_CH1N, TIM3_CH2,
SPI1_MOSI/I2S1_SDO,
SPI6_MOSI/I2S6_SDO,
ADC12_INP7,
J3 K4 L3 M2 M2 N5 45 45 N5 T9 M4 M4 21 25 35 PA7 I/O FT_h - TIM14_CH1, LCD_R4,
ADC12_INN3
ETH_MII_RX_DV/ETH_RMII
_CRS_DV, FMC_INT,
LCD_B1, EVENTOUT
I2S1_MCK, FMC_A19,
SPDIFRX_IN2,
- L3 K4 N1 N2 P5 46 46 P5 - L5 L5 - - 36 PC4 I/O FT_h - ADC12_INP4
ETH_MII_RXD0/ETH_RMII_
RXD0, FMC_A3, EVENTOUT
SAI1_D3, DCMIPP_D15,
PSSI_D15, FMC_A21,
ADC12_INP8,
- M3 M4 N2 L4 R5 47 47 R5 - N3 N3 - - 37 PC5 I/O FT_h - SPDIFRX_IN3,
ADC12_INN4
ETH_MII_RXD1/ETH_RMII_
102/320
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
TIM1_CH2N, TIM3_CH3,
TIM9_CH1,
DS14359 Rev 2
SPI1_SCK/I2S1_CK,
UART4_CTS, ADC12_INP9,
F5 L4 L4 K5 K5 N6 48 48 N6 R8 P2 P2 22 26 38 PB0 I/O FT_h -
ETH_MII_TXD0/ETH_RMII_ ADC12_INN5
TXD0, GFXTIM_TE,
[RNG_S1], LCD_VSYNC,
EVENTOUT
TIM1_CH3N, TIM3_CH4,
TIM9_CH2, FDCAN2_TX,
LCD_G2,
K4 M4 J6 M3 M3 R6 49 49 R6 L6 R2 R2 23 27 39 PB1 I/O FT_h - ADC12_INP5
ETH_MII_TXD1/ETH_RMII_
TXD1, FMC_NOE,
[RNG_S2], EVENTOUT
RTC_OUT2, SAI1_D1,
ADF1_SDI0, SAI1_SD_A,
G5 L5 L5 L4 N3 P6 50 50 P6 N6 N4 N4 24 28 40 PB2 I/O FT_h - SPI3_MOSI/I2S3_SDO, -
LCD_B2, FMC_NWE,
EVENTOUT
STM32H7Sxx8
M1
- - - L5 K2 L12 51 51 - K8 K8 - - 41 VDD S - - - -
2
- H4 G8 H7 G8 E12 52 52 E3 - G8 G8 - - - VSS S - - - -
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
SPI5_MOSI, PSSI_D12,
SAI2_SD_B, FMC_A23,
DS14359 Rev 2
USART1_TX, SPI5_NSS,
- - - - - P7 - - P7 - P3 P3 - - - PF13 I/O FT_h - PSSI_D10, FMC_D20, ADC2_INP2
DCMIPP_D10, EVENTOUT
USART1_CTS, SPI5_MOSI,
ADC2_INP6,
- - - - - - - - - - P4 P4 - - - PF14 I/O FT_h - FMC_A24, LCD_G0,
ADC2_INN2
EVENTOUT
USART1_RTS, SPI5_SCK,
- - - - - - - - - - N5 N5 - - - PF15 I/O FT_h - FMC_A25, LCD_G1, -
EVENTOUT
TIM1_ETR, UART7_RX,
- - - K6 K6 P8 54 54 P8 - M6 M6 - - - PE7 I/O FT_h - FMC_A20, SAI2_SD_B, -
FMC_A4, EVENTOUT
TIM1_CH1N, UART7_TX,
- - - M4 N4 R8 55 55 R8 - R4 R4 - - - PE8 I/O FT_h - -
FMC_A12, EVENTOUT
104/320
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
105/320 Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
TIM1_CH1, UART7_RTS,
- - - M5 J7 N8 56 56 N8 - P5 P5 - - - PE9 I/O FT_h - FMC_A14, FMC_BA0, -
DS14359 Rev 2
EVENTOUT
TIM1_CH2N, UART7_CTS,
- - - N4 M5 N9 57 57 N9 - R5 R5 - - - PE10 I/O FT_h - FMC_A15, FMC_BA1, -
EVENTOUT
- G6 G6 H6 H6 J7 59 59 J7 U8 J7 J7 - - - VDDLDO S - - - -
- H6 H6 J6 J6 K7 61 61 K7 W8 L7 L7 - - 43 VCAP1 S - - - -
TIM1_BKIN2,
ETH_MII_RXD0/ETH_RMII_
- - - - - - - - - - N6 - - - - PG4 I/O FT_h - -
RXD0, FMC_D22,
EVENTOUT
TIM1_ETR,
ETH_MII_RXD1/ETH_RMII_
- - - - - - - - - - P6 - - - - PG5 I/O FT_h - -
RXD1, FMC_D23,
STM32H7Sxx8
EVENTOUT
TIM17_BKIN, PSSI_D12,
- - - - - - - - - - M7 - - - - PG6 I/O FT_h - ETH_MDC, FMC_NBL2, -
DCMIPP_D12, EVENTOUT
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
SAI1_MCLK_A, PSSI_D13,
- - - - - - - - - - N7 - - - - PG7 I/O FT_h - FMC_D24, DCMIPP_D13, -
DS14359 Rev 2
EVENTOUT
SPI6_NSS/I2S6_WS,
SPDIFRX_IN2,
- - - - - - - - - - P7 - - - - PG8 I/O FT_h - -
ETH_PPS_OUT, FMC_D25,
LCD_G0, EVENTOUT
SPI1_MISO/I2S1_SDI,
SPDIFRX_IN3, PSSI_RDY,
SAI2_FS_B, SDMMC2_D0,
- - - - - - - - - - R7 - - - - PG9 I/O FT_h - -
FMC_D26,
DCMIPP_VSYNC,
EVENTOUT
- - - - - - - - - U4 - L8 - - - VDDXSPI1 S - - - -
- - - - - - - - - - - H7 - - - VSS S - - - -
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
G6 K5 K5 K8 K8 K9 63 63 K9 V1 L8 L10 - 30 45 VDDXSPI1 S - - - -
DS14359 Rev 2
- K8 J5 K11 J2 F8 64 64 F4 - H7 H8 - 31 46 VSS S - - - -
- - - - - - - - - - - P8 - - - PP15 I/O FT_h - XSPIM_P1_IO15 -
H5 K7 K7 L7 L7 M8 69 69 M8 V7 L10 M8 28 36 51 VDDXSPI1 S - - - -
STM32H7Sxx8
M1 M1 M1 M1
H7 K9 K9 L9 L9 75 75 - - 42 57 VDDXSPI1 S - - - -
0 0 0 0
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
M1 M1 M1 M1
J9 P13 78 78 P13 R2 N11 P12 - 45 60 PP7 I/O FT_h - XSPIM_P1_IO7 -
0 0 0 0
DS14359 Rev 2
K10 L10 L10 N10 N10 R14 79 79 R14 U2 P12 N12 31 46 61 PP1 I/O FT_h - XSPIM_P1_IO1 -
M1
- M1 L10 L8 G6 80 80 F9 - H11 J1 32 47 62 VSS S - - - -
2
- - - - - - 81 81 - - - - 33 48 63 VDDXSPI1 S - - - -
M1
- - - - - - - - - - - - - - PP10 I/O FT_h - XSPIM_P1_IO10 -
2
- - - - - - - - - - - J8 - - - VSS S - - - -
SPI1_NSS/I2S1_WS,
PSSI_D2, SAI2_SD_B,
- - - - - - - - - - R13 - - - - PG10 I/O FT_h - -
SDMMC2_D1, FMC_D27,
DCMIPP_D2, EVENTOUT
108/320
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
109/320 Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
USART3_TX, SPDIFRX_IN1,
ETH_MII_TX_EN/ETH_RMII
DS14359 Rev 2
USART3_RX, FMC_SDCLK,
- - - N11 N12 P15 84 - - - P13 - - - 66 PD9 I/O FT_h - -
LCD_R1, EVENTOUT
TIM1_CH4, DCMIPP_D4,
SPI4_RDY, USART3_CK,
TAMP_IN8/TAM
- M11 - M11 M11 N13 85 - - - R14 - - - 67 PD10 I/O FT_h - PSSI_D4, SPI5_RDY,
P_OUT7
SPI1_RDY, FMC_CLK,
LCD_B0, EVENTOUT
TIM1_ETR, LPTIM2_IN2,
DCMIPP_D6,
M1
- L11 - - N13 N14 86 - - - - - - 68 PD11 I/O FT_h - USART3_CTS/USART3_NS -
2
S, PSSI_D6, SAI2_SD_A,
FMC_D16, EVENTOUT
M1
- - - - L5 87 - - P1 L9 L9 - - 69 VDD S - - - -
2
STM32H7Sxx8
M1
- - - L10 G8 88 - F10 - J1 J10 - - 70 VSS S - - - -
2
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
LPTIM1_IN1, TIM4_CH1,
LPTIM2_IN1, USART3_RTS,
DS14359 Rev 2
M1
- K11 - - L11 89 - - M5 N13 N13 - - 71 PD12 I/O FT_h - PSSI_D12, SAI2_FS_A, -
3
FMC_NE1, DCMIPP_D12,
LCD_DE, EVENTOUT
LPTIM1_CH1, TIM4_CH2,
UCPD_FRSTX2,
M1
- L12 - - N15 90 - - - P14 P14 - - 72 PD13 I/O FT_h - SAI2_SCK_A, PSSI_D13, -
2
FMC_INT, DCMIPP_D13,
EVENTOUT
TIM2_CH3, LPTIM2_IN1,
I2C2_SCL,
SPI2_SCK/I2S2_CK,
M1
H9 J10 J9 L11 L12 91 83 N13 M3 P15 P15 35 50 73 PB10 I/O FT_h - USART3_TX, -
4
ETH_MII_RX_ER,
FMC_D11/FMC_AD11,
LCD_G7, EVENTOUT
TIM2_CH4, LPTIM2_ETR,
I2C2_SDA, USART3_RX,
M1 M1 ETH_MII_TX_EN/ETH_RMII
J10 K12 M11 N12 92 84 P15 K5 N14 N14 36 51 74 PB11 I/O FT_h - -
3 5 _TX_EN,
FMC_D10/FMC_AD10,
LCD_G6, EVENTOUT
110/320
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
111/320 Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
TIM1_BKIN, LPTIM2_IN2,
I2C2_SMBA,
DS14359 Rev 2
SPI2_NSS/I2S2_WS,
G9 H10 K10 J8 J8 L13 93 85 L13 L4 L12 L12 37 52 75 PB12 I/O FT_h - USART3_CK, FDCAN2_RX, -
FMC_D9/FMC_AD9,
LCD_G5, UART5_RX,
EVENTOUT
TIM1_CH1N, LPTIM2_CH1,
SPI2_SCK/I2S2_CK,
SDMMC1_D0,
USART3_CTS/USART3_NS
M1
H10 J11 L12 L13 L15 94 86 N14 - N15 N15 - 53 76 PB13 I/O FT_h - S, PSSI_D2, FDCAN2_TX, -
2
LCD_G4, ETH_MII_RXD3,
FMC_D8/FMC_AD8,
DCMIPP_D2, UART5_TX,
EVENTOUT
TIM1_CH2N, TIM12_CH1,
LPTIM2_CH2, USART1_TX,
M1 M1 SPI2_MISO/I2S2_SDI,
F9 H9 K11 J9 J9 L14 95 87 K13 L2 38 54 77 PB14 I/O FT_h - -
3 3 USART3_RTS, UART4_RTS,
STM32H7Sxx8
SDMMC2_D0, FMC_NE1,
LCD_DE, EVENTOUT
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
RTC_REFIN, TIM1_CH3N,
TIM12_CH2, USART1_RX,
DS14359 Rev 2
M1 M1 M1 SPI2_MOSI/I2S2_SDO,
G10 J12 L11 N13 K12 K15 96 88 M1 39 55 78 PB15 I/O FT_h - PVD_IN
3 4 4 UART4_CTS, SDMMC2_D1,
LCD_G7, FMC_A20,
EVENTOUT
F7 G7 G7 H8 H8 H8 99 91 H8 - J9 J9 - - - VDDLDO S - - - -
- - - - - - 100 92 - - - - 42 58 81 VDD S - - - -
LPTIM1_CH2, TIM4_CH3,
LPTIM2_CH1, DCMIPP_D7,
- H11 - - K13 K13 101 - - - L14 L14 - - 82 PD14 I/O FT_h - UCPD_FRSTX1, -
UART8_CTS, PSSI_D7,
FMC_D17, EVENTOUT
TIM4_CH4, LPTIM5_OUT,
DCMIPP_D9,
- - - - J10 K14 102 - - - L13 L13 - - 83 PD15 I/O FT_h - UCPD_FRSTX2, -
UART8_RTS, PSSI_D9,
FMC_D18, EVENTOUT
112/320
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
M1 XSPIM_P2_IO4,
- - K12 - - - 95 N15 - K13 K13 - - - PN8 I/O FT_h - -
3 FMC_D4/FMC_AD4
M1 XSPIM_P2_IO2,
- - J11 L12 - - - 96 - K14 K14 - - - PN4 I/O FT_h - -
4 FMC_D2/FMC_AD2
M1 XSPIM_P2_IO3,
- - J12 L13 - - - 97 - K15 K15 - - - PN5 I/O FT_h - -
5 FMC_D3/FMC_AD3
- - - - - H7 - 98 H4 - J15 K9 - - - VSS S - - - -
XSPIM_P2_NCLK,
- - H11 K12 - - - 100 L14 - J13 J13 - - - PN7 I/O FT_h - -
FMC_CLK
XSPIM_P2_CLK,
- - H12 K13 - - - 101 L15 - J14 J14 - - - PN6 I/O FT_h - -
FMC_SDCLK
XSPIM_P2_IO5,
- - G12 J12 - - - 102 K14 - H14 H14 - - - PN9 I/O FT_h - -
FMC_D5/FMC_AD5
XSPIM_P2_IO0,
STM32H7Sxx8
- - G11 J13 - - - 103 K15 - H15 H15 - - - PN2 I/O FT_h - -
FMC_D0/FMC_AD0
- - - - - H9 - 104 H6 - K7 L6 - - - VSS S - - - -
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
XSPIM_P2_IO6,
- - F12 H12 - - - 106 J13 - H13 H13 - - - PN10 I/O FT_h - -
FMC_D6/FMC_AD6
DS14359 Rev 2
XSPIM_P2_DQS0,
- - F11 H13 - - - 107 J15 - G14 G14 - - - PN0 I/O FT_h - -
FMC_NE4
XSPIM_P2_IO7,
- - E12 G12 - - - 108 J14 - G15 G15 - - - PN11 I/O FT_h - -
FMC_D7/FMC_AD7
XSPIM_P2_IO1,
- - E11 G13 - - - 109 H15 - G13 G13 - - - PN3 I/O FT_h - -
FMC_D1/FMC_AD1
- - - - - H10 - - H7 - K9 L11 - - - VSS S - - - -
- - - - - - - 110 - - - - - - - VDDXSPI2 S - - - -
XSPIM_P2_NCS1,
- - G9 G10 - - - 111 H14 - F14 F14 - - - PN1 I/O FT_h - -
FMC_NBL0
TIM3_CH1, TIM9_CH1,
I2S2_MCK,
SDMMC1_D0DIR, PSSI_D0,
- H12 C12 F13 H10 J13 103 112 G15 - E15 E15 - - 84 PC6 I/O FT_h - -
SDMMC2_D6,
SDMMC1_D6, DCMIPP_D0,
EVENTOUT
114/320
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
115/320 Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
TRGIO, TIM3_CH2,
TIM9_CH2, I2S3_MCK,
DS14359 Rev 2
SDMMC1_D123DIR,
- G9 D12 G9 G10 J14 104 113 G14 - F13 F13 - - 85 PC7 I/O FT_h - -
PSSI_D1, SDMMC2_D7,
SDMMC1_D7, DCMIPP_D1,
EVENTOUT
TRACED1, TIM3_CH3,
I2C3_SMBA, UART5_RTS,
- G11 B12 F12 J11 J15 105 114 F15 - D15 D15 - - 86 PC8 I/O FT_h - -
PSSI_D2, SDMMC1_D0,
DCMIPP_D2, EVENTOUT
MCO2, TIM3_CH4,
I2C3_SDA, I2S_CKIN,
- G10 D11 F10 G9 H14 106 115 G13 - E14 E14 - - 87 PC9 I/O FT_h - UART5_CTS, PSSI_D3, -
SDMMC1_D1, DCMIPP_D3,
EVENTOUT
STM32H7Sxx8
I2C3_SCL, USART1_CK,
E8 F10 C11 E13 H12 G14 109 117 F14 K1 F12 F12 43 59 90 PA8 I/O FT_h - OTG_FS_SOF, UART7_RX, -
FMC_AD4/FMC_D4,
LCD_B6, EVENTOUT
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
TIM1_CH2, LPUART1_TX,
I2C3_SDA,
DS14359 Rev 2
SPI2_SCK/I2S2_CK,
F10 G12 A11 D13 J12 H15 110 118 E15 J2 D14 D14 44 60 91 PA9 I/O FT_h - PSSI_D0, USART1_TX, -
FMC_AD3/FMC_D3,
DCMIPP_D0, LCD_B5,
EVENTOUT
TIM1_CH3, LPUART1_RX,
PSSI_D1, USART1_RX,
MDIOS_MDIO,
E9 F11 D10 E12 F10 G13 111 119 F13 H1 E13 E13 45 61 92 PA10 I/O FT_h - -
FMC_AD2/FMC_D2,
DCMIPP_D1, LCD_B4,
EVENTOUT
TIM1_CH4, LPUART1_CTS,
SPI2_NSS/I2S2_WS,
UART4_RX,
E10 F12 E9 C13 J13 G15 112 120 D15 K3 C15 C15 46 62 93 PA11 I/O FT_h - USART1_CTS/USART1_NS -
S, FDCAN1_RX,
FMC_AD1/FMC_D1,
LCD_B3, EVENTOUT
116/320
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
117/320 Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
TIM1_ETR, LPUART1_RTS,
SPI2_SCK/I2S2_CK,
DS14359 Rev 2
UART4_TX, USART1_RTS,
D9 E11 B11 D12 G12 F14 113 121 E14 J4 C14 C14 47 63 94 PA12 I/O FT_h - -
SAI2_FS_B, FDCAN1_TX,
FMC_AD0/FMC_D0,
LCD_B2, EVENTOUT
PA13(JTMS/
D10 E12 B10 B13 H13 F15 114 122 D14 H3 E12 E12 48 64 95 I/O FT_h - JTMS-SWDIO, EVENTOUT -
SWDIO)
PA14(JTCK/
C9 E10 C10 C12 F12 F13 115 123 E13 G2 D13 D13 49 65 96 I/O FT_h - JTCK-SWCLK, EVENTOUT -
SWCLK)
JTDI, TIM2_CH1,
TIM2_ETR, HDMI_CEC,
SPI1_NSS/I2S1_WS,
SPI3_NSS/I2S3_WS,
C10 D12 A10 A13 G13 E15 116 124 C15 F1 G11 G11 50 66 97 PA15(JTDI) I/O FT_h - -
SPI6_NSS/I2S6_WS,
UART4_RTS, UART7_TX,
FMC_D15/FMC_AD15,
LCD_R5, EVENTOUT
STM32H7Sxx8
- - - - - H13 118 126 H12 - L11 M9 52 68 99 VSS S - - - -
E6 F7 F7 F8 F8 G9 119 127 G9 E2 G9 G9 - - - VDDLDO S - - - -
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
TIM1_BKIN,
SPI3_SCK/I2S3_CK,
DS14359 Rev 2
- D11 A9 A12 F13 E14 121 129 D13 F3 B14 B14 - 70 101 PC10 I/O FT_h - USART3_TX, UART4_TX, -
PSSI_D14, SDMMC1_D2,
DCMIPP_D14, EVENTOUT
SPI3_MISO/I2S3_SDI,
USART3_RX, UART4_RX,
- E9 D9 E10 E12 E13 122 130 C14 G4 B15 B15 - 71 102 PC11 I/O FT_h - -
PSSI_D4, SDMMC1_D3,
DCMIPP_D4, EVENTOUT
TRACED3, TIM1_CH4,
TIM15_CH1,
SPI6_SCK/I2S6_CK,
- C12 - C11 E13 D15 123 131 B15 - D12 D12 - 72 103 PC12 I/O FT_h - SPI3_MOSI/I2S3_SDO, -
USART3_CK, UART5_TX,
PSSI_D9, SDMMC1_CK,
DCMIPP_D9, EVENTOUT
PSSI_DE, FMC_A22,
UART4_RX, FDCAN1_RX,
- - B9 B12 E10 D14 124 132 B14 - C13 C13 - - 104 PD0 I/O FT_h - -
FMC_A6, DCMIPP_HSYNC,
EVENTOUT
FMC_A23, UART4_TX,
- - - B11 D13 C15 125 133 A14 - B13 B13 - - 105 PD1 I/O FT_h - FDCAN1_TX, FMC_A7, -
118/320
EVENTOUT
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
119/320 Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
TRACED2, TIM1_ETR,
TIM3_ETR, TIM15_BKIN,
DS14359 Rev 2
- C11 C9 E9 D12 D13 126 134 C13 - A14 A14 - - 106 PD2 I/O FT_h - PSSI_D11, UART5_RX, -
SDMMC1_CMD,
DCMIPP_D11, EVENTOUT
- - - - - J6 - - J4 - M9 N8 - - - VSS S - - - -
TIM1_CH2, SPI4_NSS,
- - - A11 C13 B15 127 135 A13 - C12 C12 - - - PE11 I/O FT_h - SAI2_SD_B, LCD_VSYNC, -
FMC_SDNWE, EVENTOUT
TIM1_CH3N, SPI4_SCK,
- - - E8 C12 C14 128 136 B13 - E11 E11 - - - PE12 I/O FT_h - SAI2_SCK_B, -
FMC_SDNRAS, EVENTOUT
TIM1_CH3, SPI4_MISO,
- - - A10 B13 B14 129 137 B12 - B12 B12 - - - PE13 I/O FT_h - SAI2_FS_B, FMC_SDNCAS, -
EVENTOUT
TIM1_CH4,
GFXTIM_FCKCAL,
SPI4_MOSI, SAI2_MCLK_B,
STM32H7Sxx8
- - - D10 - C13 130 138 C12 - A13 A13 - - - PE14 I/O FT_h - -
FMC_SDNE0,
GFXTIM_LCKCAL,
EVENTOUT
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
TIM1_BKIN,
GFXTIM_LCKCAL,
DS14359 Rev 2
- - - - - A14 131 139 A12 - D11 D11 - - - PE15 I/O FT_h - FMC_SDCKE0, -
GFXTIM_FCKCAL,
EVENTOUT
M1
- - - - - J8 132 140 J6 - R1 - - 107 VSS S - - - -
5
DCMIPP_HSYNC, PSSI_DE,
USART2_RTS, TAMP_IN6/TAM
- B12 A8 B10 B12 A13 135 143 A11 - C11 C11 - - 110 PD4 I/O FT_h -
ETH_PHY_INTN, FMC_NL, P_OUT3
EVENTOUT
TIM1_CH4N, LCD_R7,
- - D8 D8 D10 B13 - 144 B11 - B11 B11 - - - PG0 I/O FT_h - -
EVENTOUT
120/320
- - C8 B9 A13 - - 145 C10 - E10 E10 - - - PG1 I/O FT_h - LCD_R6, EVENTOUT -
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
121/320 Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
B10 C10 - - B11 B12 137 - - E4 C10 C10 - 74 112 PM1 I/O FT_c - - UCPD_CC2
A10 B10 - - A11 C11 138 - - H5 B10 B10 - 75 113 PM2 I/O FT_d - - UCPD_DB1
B9 B11 - - A12 A12 139 - - F5 A10 A10 - 76 114 PM3 I/O FT_d - - UCPD_DB2
- - - - - J10 - - J8 - P9 R6 - - - VSS S - - - -
UART7_RX,
A9 B8 - - D9 A11 146 - - E6 C9 C9 - 83 121 PM8 I/O FT_u - -
OTG_HS_VBUS
STM32H7Sxx8
- - - - - - 148 - - A8 - - - 85 123 VDD S - - - -
- - - - - K3 - - K6 - R1 R9 - - - VSS S - - - -
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
TIM1_CH4N,
DCMIPP_PIXCLK,
TAMP_IN5/TAM
- B6 A5 A7 A7 A7 154 153 A8 - D7 D7 - - 129 PD5 I/O FT_h - PSSI_PDCK, USART2_TX,
P_OUT4
FMC_NCE, FMC_NE2,
EVENTOUT
SAI1_D1, ADF1_SDI0,
ETH_CLK,
SPI3_MOSI/I2S3_SDO,
- C6 B5 B7 B6 B7 155 154 B7 - E7 E7 - - 130 PD6 I/O FT_h - SAI1_SCK_A, USART2_RX, -
PSSI_D10, FMC_INT,
SDMMC2_CK, FMC_NE3,
DCMIPP_D10, EVENTOUT
122/320
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
123/320 Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
ETH_MII_RX_CLK/ETH_RMI
I_REF_CLK,
DS14359 Rev 2
SPI1_MOSI/I2S1_SDO,
PSSI_D2, USART2_CK,
- A5 A4 A6 A6 A6 156 155 A7 C8 B6 B6 - - 131 PD7 I/O FT_h - -
SPDIFRX_IN0,
SDMMC2_CMD,
FMC_D8/FMC_AD8,
DCMIPP_D2, EVENTOUT
DCMIPP_HSYNC, PSSI_DE,
- - - - - - - - A6 - A5 A5 - - - PG3 I/O FT_h - ETH_PPS_OUT, FMC_D21, -
EVENTOUT
I2C2_SCL, FMC_A9,
- - - A5 A5 A5 159 159 A5 - C5 C5 - - - PF1 I/O FT_h - -
STM32H7Sxx8
EVENTOUT
I2C2_SMBA, DCMIPP_D14,
- - - B5 B5 C6 160 160 C6 - A4 A4 - - - PF2 I/O FT_h - PSSI_D14, FMC_A10, -
EVENTOUT
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
DCMIPP_D9, PSSI_D9,
- - - - - A4 161 161 A4 - A3 A3 - - - PF3 I/O FT_h - ETH_MII_CRS, FMC_A11, -
DS14359 Rev 2
EVENTOUT
DCMIPP_D8, PSSI_D8,
- - - - - B5 162 162 B5 - B4 B4 - - - PF4 I/O FT_h - ETH_MII_TX_ER, FMC_A13, -
EVENTOUT
JTDO-SWO, TIM2_CH2,
LPTIM4_IN1,
DCMIPP_HSYNC,
SPI1_SCK/I2S1_CK,
SPI3_SCK/I2S3_CK,
PB3(JTDO/T
A3 B5 C5 A4 A4 B4 163 163 B4 E8 C4 C4 60 91 134 I/O FT_h - SPI6_SCK/I2S6_CK, -
RACESWO)
SDMMC2_D2, CRS_SYNC,
UART7_RX,
FMC_D14/FMC_AD14,
LCD_R4, PSSI_DE,
EVENTOUT
124/320
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
125/320 Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
NJTRST, TIM16_BKIN,
TIM3_CH1, LPTIM4_ETR,
DS14359 Rev 2
DCMIPP_VSYNC,
SPI1_MISO/I2S1_SDI,
SPI3_MISO/I2S3_SDI,
PB4(NJTRS
B4 C5 E6 E6 E6 C5 164 164 C5 H7 D5 D5 61 92 135 I/O FT_h - SPI2_NSS/I2S2_WS, -
T)
SPI6_MISO/I2S6_SDI,
SDMMC2_D3, UART7_TX,
FMC_D13/FMC_AD13,
LCD_R3, PSSI_RDY,
EVENTOUT
TIM17_BKIN, TIM3_CH2,
LPTIM4_OUT, I2C1_SMBA,
SPI1_MOSI/I2S1_SDO,
PSSI_D10,
SPI3_MOSI/I2S3_SDO,
D4 A4 B4 B4 B4 A3 165 165 A3 D9 B3 B3 62 93 136 PB5 I/O FT_h - SPI6_MOSI/I2S6_SDO, -
FDCAN2_RX, LCD_R2,
ETH_PPS_OUT,
FMC_D12/FMC_AD12,
STM32H7Sxx8
DCMIPP_D10, UART5_RX,
EVENTOUT
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
LPTIM1_IN2, LPTIM2_CH2,
UART8_TX, PSSI_D3, TAMP_IN3/TAM
- B3 B3 D5 D5 B2 171 171 B2 - C3 C3 - - 141 PE1 I/O FT_h -
FMC_D10/FMC_AD10, P_OUT6
DCMIPP_D3, EVENTOUT
TRACECLK, ADF1_CCK0,
SAI1_CK1, LPTIM5_IN1,
SPI4_SCK, SAI1_MCLK_A,
- C4 D5 B3 B3 B3 172 172 B3 - B2 B2 - - 142 PE2 I/O FT_h - -
ETH_MII_TXD3,
FMC_D11/FMC_AD11,
TIM1_CH2N, EVENTOUT
126/320
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
127/320 Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
TIM16_CH1N, TIM4_CH1,
I2C1_SCL/I3C1_SCL,
DS14359 Rev 2
HDMI_CEC, PSSI_D5,
USART1_TX, LPUART1_TX,
A2 A3 A3 A2 A2 A2 173 173 A2 F9 E5 E5 - 97 143 PB6 I/O FT_h - FDCAN2_TX, -
ETH_MII_RX_CLK/ETH_RMI
I_REF_CLK, FMC_SDNE1,
DCMIPP_D5, UART5_TX,
EVENTOUT
TIM17_CH1N, TIM4_CH2,
I2C1_SDA/I3C1_SDA,
DCMIPP_D1, PSSI_RDY,
USART1_RX, LPUART1_RX,
B3 D4 C4 B2 B2 C3 174 174 C3 G8 D4 D4 66 98 144 PB7 I/O FT_h - PSSI_D1, -
ETH_MII_TXD1/ETH_RMII_
TXD1, FMC_SDCKE1,
DCMIPP_VSYNC,
UART5_TX, EVENTOUT
STM32H7Sxx8
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
TIM16_CH1, TIM4_CH3,
USART3_CK,
DS14359 Rev 2
I2C1_SCL/I3C1_SCL,
PSSI_D6, SDMMC1_CKIN,
UART4_RX, FDCAN1_RX,
A1 A2 A2 A1 A1 B1 175 175 B1 J8 B1 B1 67 99 1 PB8 I/O FT_h - -
SDMMC2_D4,
ETH_MII_TXD3,
SDMMC1_D4, DCMIPP_D6,
FMC_D9/FMC_AD9,
EVENTOUT
- - - - - J9 - - J9 - - - - - - VDDLDO S - - - -
D7 A10 B7 C8 C8 D9 - - D9 B3 F8 F8 - - - VDD33USB S - - - -
M1
- - - - - J4 - - H13 - M8 - - - VSS S - - - -
5
- - - - - R1 - - R1 - - - - - - VSS S - - - -
Table 21. STM32H7Sxx8 pin and ball descriptions (continued)
STM32H7Sxx8
Pin number
WLCSP101 SMPS GP
UFBGA144 SMPS GP
UFBGA169 SMPS GP
UFBGA176 SMPS GP
TFBGA100 SMPS GP
I/O structure
VFQFPN68 GP
Pin type
Pin name
LQFP100 GP
LQFP144 GP
Notes
Additional
(function Alternate functions
functions
after reset)
- - - - - M7 - - M7 - - - - - - VSS S - - - -
- - - - - L3 - - L3 - - - - - - VSS S - - - -
- - - - - L1 - - - - - - - - - VSS S - - - -
129/320
STM32H7Sxx8
Table 22. STM32H7Sxx8 pin alternate functions
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
FDCAN1
FMC/SD GFXTIM/
CEC/DC /2/FMC/ CRS/FM
PSSI_/S MMC1/S LPUART
ADF1/L CEC/DC MIPP/SP OCTOS C/LCD/
GFXTIM/ AI1/SDM PI2/I2S2 1/PSSI_/ ETH/LC FMC/LC
Port ADF1/L PTIM2/3/ MIPP/ET I1/I2S1/ PIM_P1/ OTG1_F FMC/GF
PDM_S MC1/SPI /SPI3/I2 SAI2/SD D/MDIO DCMIPP D/MDIO
PTIM1/T 4/5/LPU H/I2C/I3 SPI2/I2S 2/PSSI_/ S/OTG1 XTIM/LC
SYS AI1/TIM 3/I2S3/S S3/SPI6/ MMC1/S S/SDMM /GFXTIM S/PSSI_/ SYS
IM1/2/16 ART1/TI C/I2C2/3 2/SPI3/I SDMMC _HS/SAI D/SDMM
2/3/4/5/1 PI4/UAR I2S6/UA PDIFRX/ C1/2/UA /LCD TIM1/UA
/17 M9/USA /TIM15/ 2S3/SPI 2/SPDIF 2/SDMM C1
2/15 T4/UCP RT7/US SPI6/I2S RT7 RT5
RT3 USART1 4/5/SPI6 RX/SPI5 C2/SPI1/
D ART1/2/ 6/UART
/I2S6 /TIM13/1 I2S1
3 4/5/8
4
USART2
SPI6_N FMC_A
TIM2_C TIM5_C TIM9_C TIM15_ _CTS/U UART4_ SDMMC SAI2_S EVENT
PA0 - SS/I2S6 - - D7/FMC LCD_G3 -
H1 H1 H1 BKIN SART2_ TX 2_CMD D_B OUT
_WS _D7
NSS
ETH_MII
_RX_CL FMC_A
TIM2_C TIM5_C LPTIM3_ TIM15_ DCMIPP PSSI_D USART2 UART4_ SAI2_M EVENT
PA1 - - K/ETH_ D6/FMC LCD_G2 -
H2 H2 IN1 CH1N _D0 0 _RTS RX CLK_B OUT
RMII_RE _D6
DS14359 Rev 2
F_CLK
FMC_A
TIM2_C TIM5_C LPTIM3_ TIM15_ USART2 SAI2_S ETH_M MDIOS_ EVENT
PA2 - - - - D5/FMC LCD_B7
H3 H3 IN2 CH1 _TX CK_B DIO MDIO OUT
_D5
GFXTIM GFXTIM
TIM2_C TIM5_C LPTIM3_ TIM15_ I2S6_M SPI4_R USART2 SPI5_R SPI1_R ETH_MII TIM1_C EVENT
PA3 - _LCKCA _FCKCA LCD_DE
H4 H4 CH1 CH2 CK DY _RX DY DY _COL H3 OUT
L L
Port A
SPI1_N SPI3_N SPI6_N
TIM5_E LPTIM3_ USART2 PSSI_D OTG_H ETH_M DCMIPP EVENT
PA4 - - - SS/I2S1 SS/I2S3 SS/I2S6 LCD_R3 -
TR CH2 _CK E S_SOF DIO _HSYNC OUT
_WS _WS _WS
SPI1_S SPI6_S
PWR_CSTO TIM2_C TIM2_E TIM9_C PSSI_D FMC_N DCMIPP LCD_CL EVENT
PA5 - CK/I2S1 - CK/I2S6 - - -
P H1 TR H2 8 OE _D8 K OUT
_CK _CK
ETH_MII
SPI1_M SPI6_M _RX_DV
TIM1_C TIM3_C TIM14_ FMC_IN EVENT
PA7 - - - OSI/I2S1 - - OSI/I2S6 LCD_R4 /ETH_R LCD_B1 -
H1N H2 CH1 T OUT
_SDO _SDO MII_CRS
_DV
130/320
Table 22. STM32H7Sxx8 pin alternate functions (continued)
131/320 AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
FDCAN1
FMC/SD GFXTIM/
CEC/DC /2/FMC/ CRS/FM
PSSI_/S MMC1/S LPUART
ADF1/L CEC/DC MIPP/SP OCTOS C/LCD/
GFXTIM/ AI1/SDM PI2/I2S2 1/PSSI_/ ETH/LC FMC/LC
Port ADF1/L PTIM2/3/ MIPP/ET I1/I2S1/ PIM_P1/ OTG1_F FMC/GF
PDM_S MC1/SPI /SPI3/I2 SAI2/SD D/MDIO DCMIPP D/MDIO
PTIM1/T 4/5/LPU H/I2C/I3 SPI2/I2S 2/PSSI_/ S/OTG1 XTIM/LC
SYS AI1/TIM 3/I2S3/S S3/SPI6/ MMC1/S S/SDMM /GFXTIM S/PSSI_/ SYS
IM1/2/16 ART1/TI C/I2C2/3 2/SPI3/I SDMMC _HS/SAI D/SDMM
2/3/4/5/1 PI4/UAR I2S6/UA PDIFRX/ C1/2/UA /LCD TIM1/UA
/17 M9/USA /TIM15/ 2S3/SPI 2/SPDIF 2/SDMM C1
2/15 T4/UCP RT7/US SPI6/I2S RT7 RT5
RT3 USART1 4/5/SPI6 RX/SPI5 C2/SPI1/
D ART1/2/ 6/UART
/I2S6 /TIM13/1 I2S1
3 4/5/8
4
FMC_A
TIM1_C I2C3_SC USART1 OTG_FS UART7_ EVENT
PA8 MCO1 - - - - - - D4/FMC LCD_B6 -
H1 L _CK _SOF RX OUT
_D4
SPI2_S FMC_A
TIM1_C LPUART I2C3_SD PSSI_D USART1 DCMIPP EVENT
PA9 - - CK/I2S2 - - - - D3/FMC LCD_B5
H2 1_TX A 0 _TX _D0 OUT
_CK _D3
FMC_A
TIM1_C LPUART PSSI_D USART1 MDIOS_ DCMIPP EVENT
PA10 - - - - - - D2/FMC LCD_B4
H3 1_RX 1 _RX MDIO _D1 OUT
DS14359 Rev 2
_D2
USART1
SPI2_N FMC_A
TIM1_C LPUART UART4_ _CTS/U FDCAN1 EVENT
PA11 - - - SS/I2S2 - - - D1/FMC LCD_B3 -
H4 1_CTS RX SART1_ _RX OUT
Port A _WS _D1
NSS
SPI2_S FMC_A
TIM1_E LPUART UART4_ USART1 SAI2_FS FDCAN1 EVENT
PA12 - - - CK/I2S2 - - D0/FMC LCD_B2 -
TR 1_RTS TX _RTS _B _TX OUT
_CK _D0
JTMS- EVENT
PA13 - - - - - - - - - - - - - -
SWDIO OUT
JTCK- EVENT
PA14 - - - - - - - - - - - - - -
SWCLK OUT
STM32H7Sxx8
Table 22. STM32H7Sxx8 pin alternate functions (continued)
STM32H7Sxx8
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
FDCAN1
FMC/SD GFXTIM/
CEC/DC /2/FMC/ CRS/FM
PSSI_/S MMC1/S LPUART
ADF1/L CEC/DC MIPP/SP OCTOS C/LCD/
GFXTIM/ AI1/SDM PI2/I2S2 1/PSSI_/ ETH/LC FMC/LC
Port ADF1/L PTIM2/3/ MIPP/ET I1/I2S1/ PIM_P1/ OTG1_F FMC/GF
PDM_S MC1/SPI /SPI3/I2 SAI2/SD D/MDIO DCMIPP D/MDIO
PTIM1/T 4/5/LPU H/I2C/I3 SPI2/I2S 2/PSSI_/ S/OTG1 XTIM/LC
SYS AI1/TIM 3/I2S3/S S3/SPI6/ MMC1/S S/SDMM /GFXTIM S/PSSI_/ SYS
IM1/2/16 ART1/TI C/I2C2/3 2/SPI3/I SDMMC _HS/SAI D/SDMM
2/3/4/5/1 PI4/UAR I2S6/UA PDIFRX/ C1/2/UA /LCD TIM1/UA
/17 M9/USA /TIM15/ 2S3/SPI 2/SPDIF 2/SDMM C1
2/15 T4/UCP RT7/US SPI6/I2S RT7 RT5
RT3 USART1 4/5/SPI6 RX/SPI5 C2/SPI1/
D ART1/2/ 6/UART
/I2S6 /TIM13/1 I2S1
3 4/5/8
4
ETH_MII
SPI1_S
TIM1_C TIM3_C TIM9_C UART4_ _TXD0/E GFXTIM LCD_VS EVENT
PB0 - - CK/I2S1 - - - - -
H2N H3 H1 CTS TH_RMII _TE YNC OUT
_CK
_TXD0
ETH_MII
TIM1_C TIM3_C TIM9_C FDCAN2 _TXD1/E FMC_N EVENT
PB1 - - - - - - LCD_G2 - -
H3N H4 H2 _TX TH_RMII OE OUT
_TXD1
DS14359 Rev 2
SPI3_M
ADF1_S SAI1_S FMC_N EVENT
PB2 RTC_OUT2 - SAI1_D1 - - OSI/I2S3 - - LCD_B2 - -
DI0 D_A WE OUT
_SDO
ETH_MII
I2C1_SC _RX_CL
TIM16_ TIM4_C HDMI_C PSSI_D USART1 LPUART FDCAN2 FMC_S DCMIPP UART5_ EVENT
PB6 - - L/I3C1_ - K/ETH_
CH1N H1 EC 5 _TX 1_TX _TX DNE1 _D5 TX OUT
SCL RMII_RE
F_CLK
ETH_MII
I2C1_SD
TIM17_ TIM4_C DCMIPP PSSI_R USART1 LPUART PSSI_D _TXD1/E FMC_S DCMIPP UART5_ EVENT
PB7 - - A/I3C1_ -
CH1N H2 _D1 DY _RX 1_RX 1 TH_RMII DCKE1 _VSYNC TX OUT
SDA
_TXD1
I2C1_SC FMC_D9
TIM16_ TIM4_C USART3 PSSI_D SDMMC UART4_ FDCAN1 SDMMC ETH_MII SDMMC DCMIPP EVENT
PB8 - L/I3C1_ - /FMC_A
CH1 H3 _CK 6 1_CKIN RX _RX 2_D4 _TXD3 1_D4 _D6 OUT
132/320
SCL D9
Table 22. STM32H7Sxx8 pin alternate functions (continued)
133/320 AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
FDCAN1
FMC/SD GFXTIM/
CEC/DC /2/FMC/ CRS/FM
PSSI_/S MMC1/S LPUART
ADF1/L CEC/DC MIPP/SP OCTOS C/LCD/
GFXTIM/ AI1/SDM PI2/I2S2 1/PSSI_/ ETH/LC FMC/LC
Port ADF1/L PTIM2/3/ MIPP/ET I1/I2S1/ PIM_P1/ OTG1_F FMC/GF
PDM_S MC1/SPI /SPI3/I2 SAI2/SD D/MDIO DCMIPP D/MDIO
PTIM1/T 4/5/LPU H/I2C/I3 SPI2/I2S 2/PSSI_/ S/OTG1 XTIM/LC
SYS AI1/TIM 3/I2S3/S S3/SPI6/ MMC1/S S/SDMM /GFXTIM S/PSSI_/ SYS
IM1/2/16 ART1/TI C/I2C2/3 2/SPI3/I SDMMC _HS/SAI D/SDMM
2/3/4/5/1 PI4/UAR I2S6/UA PDIFRX/ C1/2/UA /LCD TIM1/UA
/17 M9/USA /TIM15/ 2S3/SPI 2/SPDIF 2/SDMM C1
2/15 T4/UCP RT7/US SPI6/I2S RT7 RT5
RT3 USART1 4/5/SPI6 RX/SPI5 C2/SPI1/
D ART1/2/ 6/UART
/I2S6 /TIM13/1 I2S1
3 4/5/8
4
I2C1_SD SPI2_N
TIM17_ TIM4_C PSSI_D SDMMC UART4_ FDCAN1 SDMMC SDMMC DCMIPP EVENT
PB9 - - A/I3C1_ SS/I2S2 -
CH1 H4 7 1_CDIR TX _TX 2_D5 1_D5 _D7 OUT
SDA _WS
SPI2_S FMC_D1
TIM2_C LPTIM2_ I2C2_SC USART3 ETH_MII EVENT
PB10 - - CK/I2S2 - - - - 1/FMC_ LCD_G7 -
H3 IN1 L _TX _RX_ER OUT
_CK AD11
ETH_MII
_TX_EN/ FMC_D1
TIM2_C LPTIM2_ I2C2_SD USART3 EVENT
DS14359 Rev 2
SPI2_N FMC_D9
Port B TIM1_B LPTIM2_ I2C2_S USART3 FDCAN2 UART5_ EVENT
PB12 - - SS/I2S2 - - - - /FMC_A LCD_G5
KIN IN2 MBA _CK _RX RX OUT
_WS D9
USART3
SPI2_S FMC_D8
TIM1_C LPTIM2_ SDMMC _CTS/U PSSI_D FDCAN2 ETH_MII DCMIPP UART5_ EVENT
PB13 - - - CK/I2S2 LCD_G4 /FMC_A
H1N CH1 1_D0 SART3_ 2 _TX _RXD3 _D2 TX OUT
_CK D8
NSS
SPI2_MI
TIM1_C TIM12_ LPTIM2_ USART1 USART3 UART4_ SDMMC FMC_N EVENT
PB14 - SO/I2S2 - - - LCD_DE -
H2N CH1 CH2 _TX _RTS RTS 2_D0 E1 OUT
_SDI
SPI2_M
TIM1_C TIM12_ USART1 UART4_ SDMMC FMC_A2 EVENT
PB15 RTC_REFIN - OSI/I2S2 - - LCD_G7 - - -
H3N CH2 _RX CTS 2_D1 0 OUT
_SDO
GFXTIM GFXTIM
SAI2_FS FMC_N EVENT
PC0 - - _FCKCA - - - - - - - - _LCKCA -
_B BL1 OUT
L L
STM32H7Sxx8
SPI2_M
ADF1_S SAI1_S FMC_A1 SDMMC ETH_M MDIOS_ EVENT
Port C PC1 TRACED0 - SAI1_D1 - OSI/I2S2 - - FMC_A0 -
DI0 D_A 6 2_CK DC MDC OUT
_SDO
SPI2_MI
TIM1_C FMC_A1 ETH_MII EVENT
PC2 - - - - SO/I2S2 - - - - FMC_A1 - -
H1 7 _TXD2 OUT
_SDI
Table 22. STM32H7Sxx8 pin alternate functions (continued)
STM32H7Sxx8
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
FDCAN1
FMC/SD GFXTIM/
CEC/DC /2/FMC/ CRS/FM
PSSI_/S MMC1/S LPUART
ADF1/L CEC/DC MIPP/SP OCTOS C/LCD/
GFXTIM/ AI1/SDM PI2/I2S2 1/PSSI_/ ETH/LC FMC/LC
Port ADF1/L PTIM2/3/ MIPP/ET I1/I2S1/ PIM_P1/ OTG1_F FMC/GF
PDM_S MC1/SPI /SPI3/I2 SAI2/SD D/MDIO DCMIPP D/MDIO
PTIM1/T 4/5/LPU H/I2C/I3 SPI2/I2S 2/PSSI_/ S/OTG1 XTIM/LC
SYS AI1/TIM 3/I2S3/S S3/SPI6/ MMC1/S S/SDMM /GFXTIM S/PSSI_/ SYS
IM1/2/16 ART1/TI C/I2C2/3 2/SPI3/I SDMMC _HS/SAI D/SDMM
2/3/4/5/1 PI4/UAR I2S6/UA PDIFRX/ C1/2/UA /LCD TIM1/UA
/17 M9/USA /TIM15/ 2S3/SPI 2/SPDIF 2/SDMM C1
2/15 T4/UCP RT7/US SPI6/I2S RT7 RT5
RT3 USART1 4/5/SPI6 RX/SPI5 C2/SPI1/
D ART1/2/ 6/UART
/I2S6 /TIM13/1 I2S1
3 4/5/8
4
SPI2_M ETH_MII
TIM1_C FMC_A1 EVENT
PC3 - - - - OSI/I2S2 - - - - _TX_CL FMC_A2 - -
H2 8 OUT
_SDO K
ETH_MII
_RXD0/
I2S1_M FMC_A1 SPDIFR EVENT
PC4 - - - - - - - - ETH_R FMC_A3 - -
CK 9 X_IN2 OUT
MII_RXD
0
DS14359 Rev 2
ETH_MII
_RXD1/
DCMIPP PSSI_D FMC_A2 SPDIFR EVENT
PC5 - - SAI1_D3 - - - - ETH_R FMC_A5 - -
_D15 15 1 X_IN3 OUT
MII_RXD
1
SDMMC
TIM3_C TIM9_C I2S2_M PSSI_D SDMMC SDMMC DCMIPP EVENT
PC6 - - - - - 1_D0DI - -
H1 H1 CK 0 2_D6 1_D6 _D0 OUT
R
Port C SDMMC
TIM3_C TIM9_C I2S3_M PSSI_D SDMMC SDMMC DCMIPP EVENT
PC7 TRGIO - - - - 1_D123 - -
H2 H2 CK 1 2_D7 1_D7 _D1 OUT
DIR
SPI3_S
TIM1_B USART3 UART4_ PSSI_D SDMMC DCMIPP EVENT
PC10 - - - - - CK/I2S3 - - -
KIN _TX TX 14 1_D2 _D14 OUT
_CK
SPI3_MI
USART3 UART4_ PSSI_D SDMMC DCMIPP EVENT
PC11 - - - - - SO/I2S3 - - -
_RX RX 4 1_D3 _D4 OUT
_SDI
SPI6_S SPI3_M
TIM1_C TIM15_ USART3 UART5_ PSSI_D SDMMC DCMIPP EVENT
PC12 TRACED3 - - CK/I2S6 OSI/I2S3 - - -
134/320
FDCAN1
FMC/SD GFXTIM/
CEC/DC /2/FMC/ CRS/FM
PSSI_/S MMC1/S LPUART
ADF1/L CEC/DC MIPP/SP OCTOS C/LCD/
GFXTIM/ AI1/SDM PI2/I2S2 1/PSSI_/ ETH/LC FMC/LC
Port ADF1/L PTIM2/3/ MIPP/ET I1/I2S1/ PIM_P1/ OTG1_F FMC/GF
PDM_S MC1/SPI /SPI3/I2 SAI2/SD D/MDIO DCMIPP D/MDIO
PTIM1/T 4/5/LPU H/I2C/I3 SPI2/I2S 2/PSSI_/ S/OTG1 XTIM/LC
SYS AI1/TIM 3/I2S3/S S3/SPI6/ MMC1/S S/SDMM /GFXTIM S/PSSI_/ SYS
IM1/2/16 ART1/TI C/I2C2/3 2/SPI3/I SDMMC _HS/SAI D/SDMM
2/3/4/5/1 PI4/UAR I2S6/UA PDIFRX/ C1/2/UA /LCD TIM1/UA
/17 M9/USA /TIM15/ 2S3/SPI 2/SPDIF 2/SDMM C1
2/15 T4/UCP RT7/US SPI6/I2S RT7 RT5
RT3 USART1 4/5/SPI6 RX/SPI5 C2/SPI1/
D ART1/2/ 6/UART
/I2S6 /TIM13/1 I2S1
3 4/5/8
4
EVENT
PC13 - - - - - - - - - - - - - - -
OUT
EVENT
Port C PC14 - - - - - - - - - - - - - - -
OUT
EVENT
PC15 - - - - - - - - - - - - - - -
OUT
USART2
SPI2_S
TIM1_C PSSI_D _CTS/U FMC_N DCMIPP EVENT
PD3 - - - - CK/I2S2 - - - LCD_B1
H3N 5 SART2_ WAIT _D5 OUT
_CK
NSS
DCMIPP
TIM1_C PSSI_P USART2 FMC_N FMC_N EVENT
PD5 - - - - _PIXCL - - - -
H4N DCK _TX CE E2 OUT
K
SPI3_M
ADF1_S ETH_CL SAI1_S USART2 PSSI_D FMC_IN SDMMC FMC_N DCMIPP EVENT
PD6 - - SAI1_D1 OSI/I2S3 - -
DI0 K CK_A _RX 10 T 2_CK E3 _D10 OUT
_SDO
ETH_MII
STM32H7Sxx8
_RX_CL SPI1_M FMC_D8
PSSI_D USART2 SPDIFR SDMMC DCMIPP EVENT
PD7 - - - - K/ETH_ OSI/I2S1 - /FMC_A -
2 _CK X_IN0 2_CMD _D2 OUT
RMII_RE _SDO D8
F_CLK
Table 22. STM32H7Sxx8 pin alternate functions (continued)
STM32H7Sxx8
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
FDCAN1
FMC/SD GFXTIM/
CEC/DC /2/FMC/ CRS/FM
PSSI_/S MMC1/S LPUART
ADF1/L CEC/DC MIPP/SP OCTOS C/LCD/
GFXTIM/ AI1/SDM PI2/I2S2 1/PSSI_/ ETH/LC FMC/LC
Port ADF1/L PTIM2/3/ MIPP/ET I1/I2S1/ PIM_P1/ OTG1_F FMC/GF
PDM_S MC1/SPI /SPI3/I2 SAI2/SD D/MDIO DCMIPP D/MDIO
PTIM1/T 4/5/LPU H/I2C/I3 SPI2/I2S 2/PSSI_/ S/OTG1 XTIM/LC
SYS AI1/TIM 3/I2S3/S S3/SPI6/ MMC1/S S/SDMM /GFXTIM S/PSSI_/ SYS
IM1/2/16 ART1/TI C/I2C2/3 2/SPI3/I SDMMC _HS/SAI D/SDMM
2/3/4/5/1 PI4/UAR I2S6/UA PDIFRX/ C1/2/UA /LCD TIM1/UA
/17 M9/USA /TIM15/ 2S3/SPI 2/SPDIF 2/SDMM C1
2/15 T4/UCP RT7/US SPI6/I2S RT7 RT5
RT3 USART1 4/5/SPI6 RX/SPI5 C2/SPI1/
D ART1/2/ 6/UART
/I2S6 /TIM13/1 I2S1
3 4/5/8
4
ETH_MII
_TX_EN/
USART3 SPDIFR FMC_N EVENT
PD8 - - - - - - - - - ETH_R LCD_R0 -
_TX X_IN1 BL0 OUT
MII_TX_
EN
USART3
Port D TIM1_E LPTIM2_ DCMIPP _CTS/U PSSI_D SAI2_S FMC_D1 EVENT
PD11 - - - - - - - -
TR IN2 _D6 SART3_ 6 D_A 6 OUT
NSS
FDCAN1
FMC/SD GFXTIM/
CEC/DC /2/FMC/ CRS/FM
PSSI_/S MMC1/S LPUART
ADF1/L CEC/DC MIPP/SP OCTOS C/LCD/
GFXTIM/ AI1/SDM PI2/I2S2 1/PSSI_/ ETH/LC FMC/LC
Port ADF1/L PTIM2/3/ MIPP/ET I1/I2S1/ PIM_P1/ OTG1_F FMC/GF
PDM_S MC1/SPI /SPI3/I2 SAI2/SD D/MDIO DCMIPP D/MDIO
PTIM1/T 4/5/LPU H/I2C/I3 SPI2/I2S 2/PSSI_/ S/OTG1 XTIM/LC
SYS AI1/TIM 3/I2S3/S S3/SPI6/ MMC1/S S/SDMM /GFXTIM S/PSSI_/ SYS
IM1/2/16 ART1/TI C/I2C2/3 2/SPI3/I SDMMC _HS/SAI D/SDMM
2/3/4/5/1 PI4/UAR I2S6/UA PDIFRX/ C1/2/UA /LCD TIM1/UA
/17 M9/USA /TIM15/ 2S3/SPI 2/SPDIF 2/SDMM C1
2/15 T4/UCP RT7/US SPI6/I2S RT7 RT5
RT3 USART1 4/5/SPI6 RX/SPI5 C2/SPI1/
D ART1/2/ 6/UART
/I2S6 /TIM13/1 I2S1
3 4/5/8
4
FMC_D9
LPTIM1_ TIM4_E LPTIM2_ UART8_ PSSI_D SAI2_M DCMIPP EVENT
PE0 - - - - - - /FMC_A -
ETR TR ETR RX 2 CLK_A _D2 OUT
D9
FMC_D1
LPTIM1_ LPTIM2_ UART8_ PSSI_D DCMIPP EVENT
PE1 - - - - - - - - 0/FMC_ -
IN2 CH2 TX 3 _D3 OUT
AD10
FMC_D1
ADF1_C SAI1_C LPTIM5_ SPI4_S SAI1_M ETH_MII TIM1_C EVENT
PE2 TRACECLK - - - - 1/FMC_ -
CK0 K1 IN1 CK CLK_A _TXD3 H2N OUT
DS14359 Rev 2
AD11
FMC_D1
LPTIM5_ TIM15_B SAI1_S ETH_MII EVENT
PE3 TRACED0 - - - - - - 2/FMC_ - -
ETR KIN D_B _RXD3 OUT
AD12
FMC_D1
ADF1_S TIM15_ SPI4_N SAI1_FS PSSI_D DCMIPP EVENT
PE4 TRACED1 - SAI1_D2 - - - 3/FMC_ -
DI0 CH1N SS _A 4 _D4 OUT
AD13
FMC_D1
Port E ADF1_C SAI1_C TIM15_ SPI4_MI SAI1_S PSSI_D DCMIPP EVENT
PE5 TRACED2 - - - 4/FMC_ -
CK1 K2 CH1 SO CK_A 6 _D6 OUT
AD14
FMC_D1
TIM1_B ADF1_S TIM15_ SPI4_M SAI1_S PSSI_D SAI2_M DCMIPP EVENT
PE6 TRACED3 SAI1_D1 - - - 5/FMC_ -
KIN2 DI0 CH2 OSI D_A 7 CLK_B _D7 OUT
AD15
STM32H7Sxx8
H1 RTS 4 0 OUT
STM32H7Sxx8
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
FDCAN1
FMC/SD GFXTIM/
CEC/DC /2/FMC/ CRS/FM
PSSI_/S MMC1/S LPUART
ADF1/L CEC/DC MIPP/SP OCTOS C/LCD/
GFXTIM/ AI1/SDM PI2/I2S2 1/PSSI_/ ETH/LC FMC/LC
Port ADF1/L PTIM2/3/ MIPP/ET I1/I2S1/ PIM_P1/ OTG1_F FMC/GF
PDM_S MC1/SPI /SPI3/I2 SAI2/SD D/MDIO DCMIPP D/MDIO
PTIM1/T 4/5/LPU H/I2C/I3 SPI2/I2S 2/PSSI_/ S/OTG1 XTIM/LC
SYS AI1/TIM 3/I2S3/S S3/SPI6/ MMC1/S S/SDMM /GFXTIM S/PSSI_/ SYS
IM1/2/16 ART1/TI C/I2C2/3 2/SPI3/I SDMMC _HS/SAI D/SDMM
2/3/4/5/1 PI4/UAR I2S6/UA PDIFRX/ C1/2/UA /LCD TIM1/UA
/17 M9/USA /TIM15/ 2S3/SPI 2/SPDIF 2/SDMM C1
2/15 T4/UCP RT7/US SPI6/I2S RT7 RT5
RT3 USART1 4/5/SPI6 RX/SPI5 C2/SPI1/
D ART1/2/ 6/UART
/I2S6 /TIM13/1 I2S1
3 4/5/8
4
GFXTIM GFXTIM
TIM1_B FMC_S EVENT
PE15 - _LCKCA - - - - - - - - - _FCKCA -
KIN DCKE0 OUT
L L
I2C2_SD EVENT
PF0 - - - - - - - - - - LCD_R2 FMC_A8 - -
A OUT
Port F
I2C2_SC EVENT
PF1 - - - - - - - - - - FMC_A9 - -
L OUT
138/320
Table 22. STM32H7Sxx8 pin alternate functions (continued)
139/320 AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
FDCAN1
FMC/SD GFXTIM/
CEC/DC /2/FMC/ CRS/FM
PSSI_/S MMC1/S LPUART
ADF1/L CEC/DC MIPP/SP OCTOS C/LCD/
GFXTIM/ AI1/SDM PI2/I2S2 1/PSSI_/ ETH/LC FMC/LC
Port ADF1/L PTIM2/3/ MIPP/ET I1/I2S1/ PIM_P1/ OTG1_F FMC/GF
PDM_S MC1/SPI /SPI3/I2 SAI2/SD D/MDIO DCMIPP D/MDIO
PTIM1/T 4/5/LPU H/I2C/I3 SPI2/I2S 2/PSSI_/ S/OTG1 XTIM/LC
SYS AI1/TIM 3/I2S3/S S3/SPI6/ MMC1/S S/SDMM /GFXTIM S/PSSI_/ SYS
IM1/2/16 ART1/TI C/I2C2/3 2/SPI3/I SDMMC _HS/SAI D/SDMM
2/3/4/5/1 PI4/UAR I2S6/UA PDIFRX/ C1/2/UA /LCD TIM1/UA
/17 M9/USA /TIM15/ 2S3/SPI 2/SPDIF 2/SDMM C1
2/15 T4/UCP RT7/US SPI6/I2S RT7 RT5
RT3 USART1 4/5/SPI6 RX/SPI5 C2/SPI1/
D ART1/2/ 6/UART
/I2S6 /TIM13/1 I2S1
3 4/5/8
4
STM32H7Sxx8
DCMIPP
TIM16_ SPI5_MI SAI1_S UART7_ PSSI_P TIM13_ FMC_A1 EVENT
PF8 - - - _PIXCL - - LCD_G1 -
CH1N SO CK_B RTS DCK CH1 9 OUT
K
Table 22. STM32H7Sxx8 pin alternate functions (continued)
STM32H7Sxx8
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
FDCAN1
FMC/SD GFXTIM/
CEC/DC /2/FMC/ CRS/FM
PSSI_/S MMC1/S LPUART
ADF1/L CEC/DC MIPP/SP OCTOS C/LCD/
GFXTIM/ AI1/SDM PI2/I2S2 1/PSSI_/ ETH/LC FMC/LC
Port ADF1/L PTIM2/3/ MIPP/ET I1/I2S1/ PIM_P1/ OTG1_F FMC/GF
PDM_S MC1/SPI /SPI3/I2 SAI2/SD D/MDIO DCMIPP D/MDIO
PTIM1/T 4/5/LPU H/I2C/I3 SPI2/I2S 2/PSSI_/ S/OTG1 XTIM/LC
SYS AI1/TIM 3/I2S3/S S3/SPI6/ MMC1/S S/SDMM /GFXTIM S/PSSI_/ SYS
IM1/2/16 ART1/TI C/I2C2/3 2/SPI3/I SDMMC _HS/SAI D/SDMM
2/3/4/5/1 PI4/UAR I2S6/UA PDIFRX/ C1/2/UA /LCD TIM1/UA
/17 M9/USA /TIM15/ 2S3/SPI 2/SPDIF 2/SDMM C1
2/15 T4/UCP RT7/US SPI6/I2S RT7 RT5
RT3 USART1 4/5/SPI6 RX/SPI5 C2/SPI1/
D ART1/2/ 6/UART
/I2S6 /TIM13/1 I2S1
3 4/5/8
4
FDCAN1
FMC/SD GFXTIM/
CEC/DC /2/FMC/ CRS/FM
PSSI_/S MMC1/S LPUART
ADF1/L CEC/DC MIPP/SP OCTOS C/LCD/
GFXTIM/ AI1/SDM PI2/I2S2 1/PSSI_/ ETH/LC FMC/LC
Port ADF1/L PTIM2/3/ MIPP/ET I1/I2S1/ PIM_P1/ OTG1_F FMC/GF
PDM_S MC1/SPI /SPI3/I2 SAI2/SD D/MDIO DCMIPP D/MDIO
PTIM1/T 4/5/LPU H/I2C/I3 SPI2/I2S 2/PSSI_/ S/OTG1 XTIM/LC
SYS AI1/TIM 3/I2S3/S S3/SPI6/ MMC1/S S/SDMM /GFXTIM S/PSSI_/ SYS
IM1/2/16 ART1/TI C/I2C2/3 2/SPI3/I SDMMC _HS/SAI D/SDMM
2/3/4/5/1 PI4/UAR I2S6/UA PDIFRX/ C1/2/UA /LCD TIM1/UA
/17 M9/USA /TIM15/ 2S3/SPI 2/SPDIF 2/SDMM C1
2/15 T4/UCP RT7/US SPI6/I2S RT7 RT5
RT3 USART1 4/5/SPI6 RX/SPI5 C2/SPI1/
D ART1/2/ 6/UART
/I2S6 /TIM13/1 I2S1
3 4/5/8
4
TIM1_C EVENT
PG0 - - - - - - - - - - - - LCD_R7 -
H4N OUT
EVENT
PG1 - - - - - - - - - - - - - LCD_R6 -
OUT
LCD_HS EVENT
PG2 - - - - - - - - - - - - - -
YNC OUT
ETH_MII
_RXD0/
TIM1_B FMC_D2 EVENT
PG4 - - - - - - - - - - ETH_R - -
KIN2 2 OUT
MII_RXD
0
ETH_MII
_RXD1/
TIM1_E FMC_D2 EVENT
Port G PG5 - - - - - - - - - - ETH_R - -
TR 3 OUT
MII_RXD
1
SPI6_N
SPDIFR ETH_PP FMC_D2 EVENT
PG8 - - - - - SS/I2S6 - - - - LCD_G0 -
X_IN2 S_OUT 5 OUT
_WS
SPI1_MI
SPDIFR PSSI_R SAI2_FS SDMMC FMC_D2 DCMIPP EVENT
STM32H7Sxx8
PG9 - - - - - SO/I2S1 - - -
X_IN3 DY _B 2_D0 6 _VSYNC OUT
_SDI
SPI1_N
PSSI_D SAI2_S SDMMC FMC_D2 DCMIPP EVENT
PG10 - - - - - SS/I2S1 - - -
2 D_B 2_D1 7 _D2 OUT
_WS
Table 22. STM32H7Sxx8 pin alternate functions (continued)
STM32H7Sxx8
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
FDCAN1
FMC/SD GFXTIM/
CEC/DC /2/FMC/ CRS/FM
PSSI_/S MMC1/S LPUART
ADF1/L CEC/DC MIPP/SP OCTOS C/LCD/
GFXTIM/ AI1/SDM PI2/I2S2 1/PSSI_/ ETH/LC FMC/LC
Port ADF1/L PTIM2/3/ MIPP/ET I1/I2S1/ PIM_P1/ OTG1_F FMC/GF
PDM_S MC1/SPI /SPI3/I2 SAI2/SD D/MDIO DCMIPP D/MDIO
PTIM1/T 4/5/LPU H/I2C/I3 SPI2/I2S 2/PSSI_/ S/OTG1 XTIM/LC
SYS AI1/TIM 3/I2S3/S S3/SPI6/ MMC1/S S/SDMM /GFXTIM S/PSSI_/ SYS
IM1/2/16 ART1/TI C/I2C2/3 2/SPI3/I SDMMC _HS/SAI D/SDMM
2/3/4/5/1 PI4/UAR I2S6/UA PDIFRX/ C1/2/UA /LCD TIM1/UA
/17 M9/USA /TIM15/ 2S3/SPI 2/SPDIF 2/SDMM C1
2/15 T4/UCP RT7/US SPI6/I2S RT7 RT5
RT3 USART1 4/5/SPI6 RX/SPI5 C2/SPI1/
D ART1/2/ 6/UART
/I2S6 /TIM13/1 I2S1
3 4/5/8
4
ETH_MII
SPI1_S _TX_EN/
LPTIM1_ SPDIFR PSSI_D SDMMC FMC_D2 DCMIPP EVENT
Port G PG11 - - - - CK/I2S1 - - ETH_R -
IN2 X_IN0 3 2_D2 8 _D3 OUT
_CK MII_TX_
EN
EVENT
PH0 - - - - - - - - - - - - - - -
OUT
Port H
EVENT
PH1 - - - - - - - - - - - - - - -
DS14359 Rev 2
OUT
UCPD_
PM0 - - - - - - - - - - - - - - -
CC1
UCPD_
PM1 - - - - - - - - - - - - - - -
CC2
UCPD_
PM2 - - - - - - - - - - - - - - -
DB1
UCPD_
PM3 - - - - - - - - - - - - - - -
DB2
OTG_H
PM5 - - - - - - - - - - - - - - -
S_DM
Port M
OTG_H
PM6 - - - - - - - - - - - - - - -
S_DP
UART7_ OTG_H
PM8 - - - - - - - - - - - - - -
RX S_VBUS
UART7_ OTG_H
PM9 - - - - - - - - - - - - - -
TX S_ID
SPI5_S OTG_FS
PM11 - - - - - - - - - - - - - -
CK _DP
SPI5_N OTG_FS
142/320
PM12 - - - - - - - - - - - - - -
SS _DM
Table 22. STM32H7Sxx8 pin alternate functions (continued)
143/320 AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
FDCAN1
FMC/SD GFXTIM/
CEC/DC /2/FMC/ CRS/FM
PSSI_/S MMC1/S LPUART
ADF1/L CEC/DC MIPP/SP OCTOS C/LCD/
GFXTIM/ AI1/SDM PI2/I2S2 1/PSSI_/ ETH/LC FMC/LC
Port ADF1/L PTIM2/3/ MIPP/ET I1/I2S1/ PIM_P1/ OTG1_F FMC/GF
PDM_S MC1/SPI /SPI3/I2 SAI2/SD D/MDIO DCMIPP D/MDIO
PTIM1/T 4/5/LPU H/I2C/I3 SPI2/I2S 2/PSSI_/ S/OTG1 XTIM/LC
SYS AI1/TIM 3/I2S3/S S3/SPI6/ MMC1/S S/SDMM /GFXTIM S/PSSI_/ SYS
IM1/2/16 ART1/TI C/I2C2/3 2/SPI3/I SDMMC _HS/SAI D/SDMM
2/3/4/5/1 PI4/UAR I2S6/UA PDIFRX/ C1/2/UA /LCD TIM1/UA
/17 M9/USA /TIM15/ 2S3/SPI 2/SPDIF 2/SDMM C1
2/15 T4/UCP RT7/US SPI6/I2S RT7 RT5
RT3 USART1 4/5/SPI6 RX/SPI5 C2/SPI1/
D ART1/2/ 6/UART
/I2S6 /TIM13/1 I2S1
3 4/5/8
4
SPI5_M OTG_FS
PM13 - - - - - - - - - - - - - -
OSI _ID
Port M
SPI5_MI OTG_FS
PM14 - - - - - - - - - - - - - -
SO _VBUS
XSPIM_
FMC_N
PN0 - - - - - - - - - P2_DQS - - - - -
E4
0
DS14359 Rev 2
XSPIM_
FMC_N
PN1 - - - - - - - - - P2_NCS - - - - -
BL0
1
FMC_D0
XSPIM_
PN2 - - - - - - - - - - - /FMC_A - - -
P2_IO0
D0
FMC_D1
XSPIM_
PN3 - - - - - - - - - - - /FMC_A - - -
P2_IO1
D1
FMC_D2
Port N XSPIM_
PN4 - - - - - - - - - - - /FMC_A - - -
P2_IO2
D2
FMC_D3
XSPIM_
PN5 - - - - - - - - - - - /FMC_A - - -
P2_IO3
D3
XSPIM_ FMC_S
PN6 - - - - - - - - - - - - - -
P2_CLK DCLK
XSPIM_
FMC_CL
PN7 - - - - - - - - - P2_NCL - - - - -
K
STM32H7Sxx8
K
FMC_D4
XSPIM_
PN8 - - - - - - - - - - - /FMC_A - - -
P2_IO4
D4
Table 22. STM32H7Sxx8 pin alternate functions (continued)
STM32H7Sxx8
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
FDCAN1
FMC/SD GFXTIM/
CEC/DC /2/FMC/ CRS/FM
PSSI_/S MMC1/S LPUART
ADF1/L CEC/DC MIPP/SP OCTOS C/LCD/
GFXTIM/ AI1/SDM PI2/I2S2 1/PSSI_/ ETH/LC FMC/LC
Port ADF1/L PTIM2/3/ MIPP/ET I1/I2S1/ PIM_P1/ OTG1_F FMC/GF
PDM_S MC1/SPI /SPI3/I2 SAI2/SD D/MDIO DCMIPP D/MDIO
PTIM1/T 4/5/LPU H/I2C/I3 SPI2/I2S 2/PSSI_/ S/OTG1 XTIM/LC
SYS AI1/TIM 3/I2S3/S S3/SPI6/ MMC1/S S/SDMM /GFXTIM S/PSSI_/ SYS
IM1/2/16 ART1/TI C/I2C2/3 2/SPI3/I SDMMC _HS/SAI D/SDMM
2/3/4/5/1 PI4/UAR I2S6/UA PDIFRX/ C1/2/UA /LCD TIM1/UA
/17 M9/USA /TIM15/ 2S3/SPI 2/SPDIF 2/SDMM C1
2/15 T4/UCP RT7/US SPI6/I2S RT7 RT5
RT3 USART1 4/5/SPI6 RX/SPI5 C2/SPI1/
D ART1/2/ 6/UART
/I2S6 /TIM13/1 I2S1
3 4/5/8
4
FMC_D5
XSPIM_
PN9 - - - - - - - - - - - /FMC_A - - -
P2_IO5
D5
FMC_D6
XSPIM_
PN10 - - - - - - - - - - - /FMC_A - - -
P2_IO6
D6
Port N
FMC_D7
XSPIM_
PN11 - - - - - - - - - - - /FMC_A - - -
P2_IO7
DS14359 Rev 2
D7
XSPIM_
PN12 - - - - - - - - - P2_NCS - - - - - -
2
XSPIM_
PO0 - - - - - - - - - P1_NCS - - - - - -
1
XSPIM_
PO1 - - - - - - - - - P1_NCS - - - - - -
2
XSPIM_
PO2 - - - - - - - - - P1_DQS - - - - - -
Port O 0
XSPIM_
PO3 - - - - - - - - - P1_DQS - - - - - -
1
XSPIM_
PO4 - - - - - - - - - - - - - - -
P1_CLK
XSPIM_
PO5 - - - - - - - - - P1_NCL - - - - - -
K
144/320
Table 22. STM32H7Sxx8 pin alternate functions (continued)
145/320 AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
FDCAN1
FMC/SD GFXTIM/
CEC/DC /2/FMC/ CRS/FM
PSSI_/S MMC1/S LPUART
ADF1/L CEC/DC MIPP/SP OCTOS C/LCD/
GFXTIM/ AI1/SDM PI2/I2S2 1/PSSI_/ ETH/LC FMC/LC
Port ADF1/L PTIM2/3/ MIPP/ET I1/I2S1/ PIM_P1/ OTG1_F FMC/GF
PDM_S MC1/SPI /SPI3/I2 SAI2/SD D/MDIO DCMIPP D/MDIO
PTIM1/T 4/5/LPU H/I2C/I3 SPI2/I2S 2/PSSI_/ S/OTG1 XTIM/LC
SYS AI1/TIM 3/I2S3/S S3/SPI6/ MMC1/S S/SDMM /GFXTIM S/PSSI_/ SYS
IM1/2/16 ART1/TI C/I2C2/3 2/SPI3/I SDMMC _HS/SAI D/SDMM
2/3/4/5/1 PI4/UAR I2S6/UA PDIFRX/ C1/2/UA /LCD TIM1/UA
/17 M9/USA /TIM15/ 2S3/SPI 2/SPDIF 2/SDMM C1
2/15 T4/UCP RT7/US SPI6/I2S RT7 RT5
RT3 USART1 4/5/SPI6 RX/SPI5 C2/SPI1/
D ART1/2/ 6/UART
/I2S6 /TIM13/1 I2S1
3 4/5/8
4
XSPIM_
PP0 - - - - - - - - - - - - - - -
P1_IO0
XSPIM_
PP1 - - - - - - - - - - - - - - -
P1_IO1
XSPIM_
PP2 - - - - - - - - - - - - - - -
P1_IO2
XSPIM_
PP3 - - - - - - - - - - - - - - -
DS14359 Rev 2
P1_IO3
XSPIM_
PP4 - - - - - - - - - - - - - - -
P1_IO4
XSPIM_
PP5 - - - - - - - - - - - - - - -
P1_IO5
XSPIM_
PP6 - - - - - - - - - - - - - - -
P1_IO6
Port P
XSPIM_
PP7 - - - - - - - - - - - - - - -
P1_IO7
XSPIM_
PP8 - - - - - - - - - - - - - - -
P1_IO8
XSPIM_
PP9 - - - - - - - - - - - - - - -
P1_IO9
XSPIM_
PP10 - - - - - - - - - - - - - - -
P1_IO10
XSPIM_
PP11 - - - - - - - - - - - - - - -
P1_IO11
STM32H7Sxx8
XSPIM_
PP12 - - - - - - - - - - - - - - -
P1_IO12
XSPIM_
PP13 - - - - - - - - - - - - - - -
P1_IO13
Table 22. STM32H7Sxx8 pin alternate functions (continued)
STM32H7Sxx8
AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
FDCAN1
FMC/SD GFXTIM/
CEC/DC /2/FMC/ CRS/FM
PSSI_/S MMC1/S LPUART
ADF1/L CEC/DC MIPP/SP OCTOS C/LCD/
GFXTIM/ AI1/SDM PI2/I2S2 1/PSSI_/ ETH/LC FMC/LC
Port ADF1/L PTIM2/3/ MIPP/ET I1/I2S1/ PIM_P1/ OTG1_F FMC/GF
PDM_S MC1/SPI /SPI3/I2 SAI2/SD D/MDIO DCMIPP D/MDIO
PTIM1/T 4/5/LPU H/I2C/I3 SPI2/I2S 2/PSSI_/ S/OTG1 XTIM/LC
SYS AI1/TIM 3/I2S3/S S3/SPI6/ MMC1/S S/SDMM /GFXTIM S/PSSI_/ SYS
IM1/2/16 ART1/TI C/I2C2/3 2/SPI3/I SDMMC _HS/SAI D/SDMM
2/3/4/5/1 PI4/UAR I2S6/UA PDIFRX/ C1/2/UA /LCD TIM1/UA
/17 M9/USA /TIM15/ 2S3/SPI 2/SPDIF 2/SDMM C1
2/15 T4/UCP RT7/US SPI6/I2S RT7 RT5
RT3 USART1 4/5/SPI6 RX/SPI5 C2/SPI1/
D ART1/2/ 6/UART
/I2S6 /TIM13/1 I2S1
3 4/5/8
4
XSPIM_
PP14 - - - - - - - - - - - - - - -
P1_IO14
Port P
XSPIM_
PP15 - - - - - - - - - - - - - - -
P1_IO15
DS14359 Rev 2
146/320
STM32H7Sxx8 Memory mapping
5 Memory mapping
Refer to the product line reference manual for details on the memory mapping as well as the
boundary addresses for all peripherals.
6 Electrical characteristics
The STM32H7Sxx8 uses a static voltage trimming mechanism to ensure that the maximum
frequency is reached with the minimum power consumption.
This mechanism is automatically selected when using a internal power supply. The static
voltage-trimming setting is die dependent, and cannot be modified. All values given in this
document are derived and guaranteed for an internal supply with LDO or SMPS only, and
not when a bypass mechanism is used.
Figure 21. Pin loading conditions Figure 22. Pin input voltage
C = 50 pF VIN
MS19011V2 MS19010V2
VDDSMPS
VLXSMPS Step
VFBSMPS Down
Converter
VSSSMPS
VCAP
Core domain (VCORE)
Voltage
VDDLDO
regulator
VSS
Level shifter
VSS
VDD domain
HSI, CSI,
VDD HSI48, Power
VBAT HSE, PLLs switch
Backup domain
charging
VSW Backup VBKP
VBAT regulator
Power switch
VSS
VDD50USB VSS
USB regulator
VDD33USB
DVDD
USB
FS, HS, UCPD
IOs
REF_BUF ADCs
VREF+ Temp.
VREF+
sensor
VREF- VREF-
VSSA
MSv53475V3
IDD_VBAT IDD_VBAT
VBAT VBAT
IDD IDD
VDD VDD
VDDLDO VDDSMPS
VDDA VDDA
ΣIVDD Total current into sum of all VDD power lines (source)(1) 620
(1)
ΣIVSS Total current out of sum of all VSS ground lines (sink) 620
(1)
IVDD Maximum current into each VDD power pin (source) 100
IVSS Maximum current out of each VSS ground pin (sink)(1) 100
Output current sunk or sourced by any I/O and control pin, except
IIO 20 mA
Pxy_C
Total output current sunk by sum of all I/Os and control pins(2) 140
ΣI(PIN)
(2)
Total output current sourced by sum of all I/Os and control pins 140
(3)(4)
IINJ(PIN) Injected current on FT_xxx, TT_xx, RST and B pins -5/+0
ΣIINJ(PIN) Total injected current (sum of all I/Os and control pins)(5) ±25
1. All main power (VDD, VDDA, VDD33USB) and ground (VSS, VSSA) pins must always be connected to the
external power supplies, in the permitted range.
2. This current consumption must be correctly distributed over all I/Os and control pins. The total output
current must not be sunk/sourced between two consecutive power supply pins referring to high pin count
QFP packages.
3. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the
specified maximum value.
4. A positive injection is induced by VIN>VDD while a negative injection is induced by VIN<VSS. IINJ(PIN) must
never be exceeded. Refer also to Table 23: Voltage characteristics for the maximum allowed input voltage
values.
5. When several inputs are submitted to a current injection, the maximum ΣIINJ(PIN) is the absolute sum of the
positive and negative injected currents (instantaneous values).
ESR
R Leak
MS19044V2
SMPS SMPS
VFBSMPS Cfilt VFBSMPS Cfilt
(ON) VVDD_ (ON)
DD_
External
External
Cout1 VSSSMPS 2xCout1 VSSSMPS
VCAP VCAP
VDDLDO VVCORE
CORE VDDLDO VVCORE
CORE
MSv55526V2
Table 31. Inrush current and inrush electric charge characteristics for LDO and SMPS(1)(2)
Symbol Parameter Conditions Min Typ Max Unit
MSv58400V1
MSv58401V1
MSv58402V1
MSv58403V1
Reset temporization
tRSTTEMPO(1) - - 377 550 µs
after BOR0 released
VREFIN_CAL Raw data acquired at temperature of 30 °C, VDDA = 3.3 V 0x08FF F810 - 0x08FF F811
Table 36. Typical and maximum current consumption in Run mode, code with data processing
running from ITCM(1)
Max(2) LDO
frcc_c_ck Typ Typ
Symbol Parameter Conditions Unit
(MHz) LDO SMPS TJ = TJ = TJ = TJ =
25°C 85°C 105°C 125°C
Table 37. Typical and maximum current consumption in Run mode, code with data processing
running from AXISRAM3, cache ON (1)
Max(2) LDO
frcc_c_ck Typ Typ
Symbol Parameter Conditions Unit
(MHz) LDO SMPS TJ = TJ = TJ = TJ =
25°C 85°C 105°C 125°C
Table 38. Typical and maximum current consumption in Run mode, code with data processing
running from AXISRAM3, cache OFF (1)
Max(2) LDO
frcc_c_ck Typ Typ
Symbol Parameter Conditions Unit
(MHz) LDO SMPS TJ = TJ = TJ = TJ =
25°C 85°C 105°C 125°C
Table 39. Typical and maximum current consumption in Run mode, code with data processing
running from internal flash memory, cache ON(1)
Max(2) LDO
frcc_c_ck Typ Typ
Symbol Parameter Conditions Unit
(MHz) LDO SMPS TJ = TJ = TJ = TJ =
25°C 85°C 105°C 125°C
Table 40. Typical and maximum current consumption in Run mode, code with data processing
running from internal flash memory, cache OFF(1)
Max(2) LDO
frcc_c_ck Typ Typ
Symbol Parameter Conditions Unit
(MHz) LDO SMPS TJ = TJ = TJ = TJ =
25°C 85°C 105°C 125°C
All
peripherals ITCM 600 2976 125.0 65.5 42.0 22.2
disabled
All AXI
600 2976 130.0 69.0 43.7 23.2
Supply peripherals SRAM3
µA/
current in disabled,
IDD Internal mA Core-
Run cache ON 600 2976 130.0 67.5 43.7 22.7
flash Mark
mode
All AXI
600 1284 96.0 51.0 74.8 39.7
peripherals SRAM3
disabled, Internal
cache OFF flash 600 564 78.5 43.5 139.2 77.1
Table 43. Typical and maximum current consumption in System Stop mode
Max(1) LDO
Typ Typ
Symbol Parameter Conditions TJ = TJ = Unit
LDO SMPS TJ = TJ =
105 ° 125 °
25 °C 85 °C
C C
Supply OFF OFF 2.4 2.6 2.8 3.0 5.4 15.5 31.5 84.5
current in ON OFF 3.9 4.2 4.5 4.7 8.6 40.5 97.0 160.0
IDD
Standby µA
(Standby) OFF ON 3.0 3.1 3.5 3.7 - - - -
mode,
IWDG OFF ON ON 4.2 4.6 5.0 5.3 - - - -
1. Guaranteed by characterization results.
2. The LSE is in Low-drive mode.
OFF OFF 0.009 0.013 0.021 0.037 0.22 3.40 8.70 27.00
Supply ON OFF 1.5 1.8 1.8 1.9 2.85 19.00 41.00 87.00
IDD
current in µA
(VBAT) VBAT mode OFF ON 0.4 0.5 0.7 0.8 1.10 4.25 9.55 28.50
ON ON 1.9 2.1 2.4 2.5 3.70 19.50 41.50 89.00
1. Guaranteed by characterization results.
2. The LSE is in Low-drive mode.
Table 46. Typical and maximum current consumption in Run mode, code with data processing
running from Octo flash memory(1), cache OFF(2)
Memory
frcc_c_ck Max(3)
Symbol Parameter Conditions frequency( Typ Unit
(MHz) TJ = 105°C
MHz)
Table 47. Typical and maximum current consumption in Run mode, code with data processing
running from 16-bit memory(1), cache OFF(2)
Memory
frcc_c_ck Max(3)
Symbol Parameter Conditions frequency( Typ Unit
(MHz) TJ = 105°C
MHz)
Table 48. Typical and maximum current consumption: data write 50% toggle on 16-bit memory(1)
Memory
frcc_c_ck Max(2)
Symbol Parameter Conditions frequency( Typ Unit
(MHz) TJ = 105°C
MHz)
Table 49. Typical and maximum current consumption: data write 25% toggle on 16-bit memory(1)
Memory
frcc_c_ck Max(2)
Symbol Parameter Conditions frequency( Typ Unit
(MHz) TJ = 105°C
MHz)
Table 50. Typical and maximum current consumption: data write 12.5% toggle on 16-bit memory(1)
Memory
frcc_c_ck Max(2)
Symbol Parameter Conditions frequency( Typ Unit
(MHz) TJ = 105°C
MHz)
Table 51. Typical and maximum current consumption: data write 6.25% toggle on 16-bit memory(1)
Memory
frcc_c_ck Max(2)
Symbol Parameter Conditions frequency Typ Unit
(MHz) TJ = 105°C
(MHz)
I SW = V DDx × f SW × C L
where
ISW is the current sunk by a switching I/O to charge/discharge the capacitive load
VDDx is the MCU supply voltage
fSW is the I/O switching frequency
CL is the total capacitance seen by the I/O pin: C = CINT+ CEXT
The test pin is configured in push-pull output mode and is toggled by software at a fixed
frequency.
CPU
Wakeup from
tWUSLEEP(4) - 15 16 clock
Sleep
cycles
SVOS low, HSI, Flash memory in
42.5 46.0
normal mode
SVOS low, HSI, Flash memory in
42.5 46.0
low-power mode
SVOS high, HSI, Flash memory in
16.0 17.5
normal mode
SVOS high, HSI, Flash memory in
20.0 21.0
Wakeup from low-power mode
tWUDSTOP(4)
Stop SVOS low, CSI, Flash memory in
65.0 71.0 µs
normal mode
SVOS low, CSI, Flash memory in
71.5 77.5
low power mode
SVOS high, CSI, Flash memory in
32.0 35.0
normal mode
SVOS high, CSI, Flash memory in
48.5 54.0
low-power mode
Wakeup from
tWUSTDBY(4) - 280.0 535.0
Standby mode
1. Guaranteed by characterization results.
2. Measurements are made at -40°C under worst-case conditions.
3. Maximum values are for the LDO configuration.
4. The wakeup times are measured from the wakeup event to the point in which the application code reads the first
instruction..
VHSEH
90 %
10 %
VHSEL
tr(HSE) tf(HSE) tW(HSE) tW(HSE) t
THSE
External fHSE_ext
IL
clock source OSC_IN
STM32
ai17528b
Vdc
Vpp
10%
0 t (s)
Signal 1 Signal 2
rise time rise time
MSv55527V1
VLSEH
90%
10%
VLSEL
tr(LSE) tf(LSE) tW(LSE) tW(LSE) t
TLSE
External fLSE_ext
OSC32_IN IL
clock source
STM32
ai17529b
Vdc
Vpp
10%
0 t (s)
Trise Tfall
MSv55528V1
Note: For information on selecting the crystal, refer to application note AN2867 “Oscillator design
guide for STM8AF/AL/S, STM32 MCUs and MPUs” available from the ST website
www.st.com.
Resonator with
integrated capacitors
CL1
OSC_IN fHSE
Bias
8 MHz RF controlled
resonator
gain
Note: For information on selecting the crystal, refer to the application note AN2867 “Oscillator
design guide for STM8AF/AL/S, STM32 MCUs and MPUs” available from the ST website
www.st.com.
Bias
32.768 kHz
RF controlled
resonator
gain
OSC32_OUT
STM32
CL2
ai17531c
1. An external resistor is not required between OSC32_IN and OSC32_OUT and it is forbidden to add one.
VDD=3.3 V,
fHSI48 HSI48 frequency 47.5(1) 48 48.5(1) MHz
TJ=30 °C
TRIM(2) USER trimming step - - 0.175 0.250 %
USER TRIM
USER trimming coverage ± 32 steps ±4.70 ±5.6 - %
COVERAGE(3)
DuCy(HSI48)(2) Duty cycle - 45 - 55 %
Accuracy of the HSI48 oscillator
ACCHSI48_REL(3)(4) TJ=-40 to 125 °C -4.5 - 3.5 %
over temperature (factory calibrated)
VDD=3 to 3.6 V - 0.025 0.05
HSI48 oscillator frequency drift with
ΔVDD(HSI48)(2)(4) VDD=1.62 V to %
VDD(5) (the reference is 3.3 V) - 0.05 0.1
3.6 V
tsu(HSI48)(2) HSI48 oscillator start-up time - - 2.1 4.0 µs
IDD(HSI48)(2) HSI48 oscillator power consumption - - 350 400 µA
Next transition jitter
NT jitter(2) - - ± 0.15 - ns
Accumulated jitter on 28 cycles(6)
Paired transition jitter
PT jitter(2) - - ± 0.25 - ns
Accumulated jitter on 56 cycles(6)
1. Guaranteed by test in production.
2. Guaranteed by design.
3. Guaranteed by characterization.
4. ΔfHSI = ACCHSI48_REL + ΔVDD.
5. These values are obtained by using the formula: (Freq(3.6 V) - Freq(3.0 V)) / Freq(3.0 V) or (Freq(3.6 V) - Freq(1.62 V)) /
Freq(1.62 V).
6. Jitter measurements are performed without clock source activated in parallel.
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the NRST or on the oscillator pins for 1 s.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015 “Software
techniques for improving microcontrollers EMC performance”).
Table 67. EMI characteristics for fHSE = 8 MHz and fCPU = 600 MHz
Max vs.
Monitored frequency [fHSE/fCPU]
Symbol Parameter Conditions Unit
band
8/600 MHz
0.1 to 30 MHz 10
30 to 130 MHz 30
Peak level(1) V = 3.6 V, T = 25 °C, BGA225 dBµV
SEMI DD A 130 MHz to 1 GHz 22
package, compliant with IEC61967-2
1 GHz to 2 GHz 9
Level(2) 0.1 MHz to 2 GHz 4.0 -
1. Refer to AN1709 EMI radiated test chapter.
2. Refer to AN1709 EMI level classification chapter.
Electrostatic
TA = +25 °C conforming to
VESD(HBM) discharge voltage All packages(2) 2 2000
ANSI/ESDA/JEDEC JS-001
(human body model)
Electrostatic V
discharge voltage TA = +25 °C conforming to
VESD(CDM) All packages(2) C2B 750
(charge device ANSI/ESDA/JEDEC JS-002
model)
1. Evaluated by characterization – not tested in production.
2. WLCSP not yet available.
Static latchup
Two complementary static tests are required on six parts to assess the latchup
performance:
• A supply overvoltage is applied to each power supply pin
• A current injection is applied to each input, output and configurable I/O pin
These tests are compliant with JESD78 IC latchup standard.
All I/Os are CMOS and TTL compliant (no software configuration required). Their
characteristics cover more than the strict CMOS technology or TTL parameters. The
coverage of these requirements for FT I/Os is shown in Figure 37.
2.5
Minimum required
logic level 1 zone
TTL standard requirement VIHmin = 2V
2
xV DDIO
= 0.7
V IHmin
ment)
d re quire
VIN (V) ndar
S sta
1.5 (CMO
duction
d in pro IO +
0.18
Teste 0.52 VDD
lation VIHmin = Undefined input range
on simu
Based
1
VDDIO - 0.1
VILmax = 0.4
simulation = 0.3 VDDIO TTL standard requirement VILmax = 0.8V
Based on ment) VILmax
dard require
(CMOS stan
0.5 Tested in production
Minimum required
logic level 0 zone
0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Table 72. Output voltage characteristics for all I/Os except PC13, PC14, and PC15
Symbol Parameter Conditions(1) Min Max Unit
CMOS port(2)
VOL Output low level voltage IIO = 8 mA - 0.4
2.7 V≤ VDD ≤ 3.6 V
CMOS port(2)
VOH Output high level voltage IIO = -8 mA VDD- 0.4 -
2.7 V≤ VDD ≤ 3.6 V
TTL port(2)
VOL(3) Output low level voltage IIO = 8 mA - 0.4
2.7 V≤ VDD ≤ 3.6 V
TTL port(2)
VOH (3) Output high level voltage IIO = -8 mA 2.4 -
2.7 V≤ VDD ≤ 3.6 V
IIO = 20 mA
VOL(3) Output low level voltage - 1.3
2.7 V ≤ VDD ≤ 3.6 V
IIO = -20 mA
VOH(3) Output high level voltage VDD - 1.3 -
2.7 V ≤ VDD ≤ 3.6 V V
IIO = 4 mA
VOL(3) Output low level voltage - 0.4
1.71 V ≤ VDD ≤ 3.6 V
IIO = -4 mA
VOH (3) Output high level voltage VDD - 0.4 -
1.71 V ≤ VDD <3.6 V
Table 77. Output timing characteristics VDDXSPIx 1.2 V range (HSLV OFF)(1)
Speed Symbol Parameter conditions Min Max Unit
Table 77. Output timing characteristics VDDXSPIx 1.2 V range (HSLV OFF)(1) (continued)
Speed Symbol Parameter conditions Min Max Unit
Table 78. Output timing characteristics VDDXSPIx 1.2 V (HSLV ON)(1) (continued)
Speed Symbol Parameter conditions Min Max Unit
VDD
External
reset circuit (1)
RPU
NRST (2) Internal Reset
Filter
0.1 μF
STM32
ai14132d
tw(NE)
FMC_NE
FMC_NOE
FMC_NWE
tv(A_NE) t h(A_NOE)
FMC_A[25:0] Address
tv(BL_NE) t h(BL_NOE)
FMC_NBL[1:0]
t h(Data_NE)
t su(Data_NOE) th(Data_NOE)
t su(Data_NE)
FMC_D[15:0] Data
t v(NADV_NE)
tw(NADV)
FMC_NADV (1)
FMC_NWAIT
th(NE_NWAIT)
tsu(NWAIT_NE)
MS32753V1
FMC_NEx
FMC_NOE
tv(NWE_NE) tw(NWE) t h(NE_NWE)
FMC_NWE
tv(A_NE) th(A_NWE)
FMC_A[25:0] Address
tv(BL_NE) th(BL_NWE)
FMC_NBL[1:0] NBL
tv(Data_NE) th(Data_NWE)
FMC_D[15:0] Data
t v(NADV_NE)
tw(NADV)
FMC_NADV (1)
FMC_NWAIT
th(NE_NWAIT)
tsu(NWAIT_NE)
MS32754V1
FMC_ NE
tv(NOE_NE) t h(NE_NOE)
FMC_NOE
t w(NOE)
FMC_NWE
tv(A_NE) th(A_NOE)
t v(NADV_NE) th(AD_NADV)
tw(NADV)
FMC_NADV
FMC_NWAIT
th(NE_NWAIT)
tsu(NWAIT_NE)
MS32755V1
tw(CLK) tw(CLK)
FMC_CLK
td(CLKL-NExL) td(CLKH-NExH)
Data latency = 0
FMC_NEx
td(CLKL-NADVL) td(CLKL-NADVH)
FMC_NADV
td(CLKL-AV) td(CLKH-AIV)
FMC_A[25:0]
td(CLKL-NOEL) td(CLKH-NOEH)
FMC_NOE
tsu(DV-CLKH) th(CLKH-DV)
tsu(DV-CLKH) th(CLKH-DV)
FMC_D[15:0] D1 D2
tsu(NWAITV-CLKH) th(CLKH-NWAITV)
FMC_NWAIT
(WAITCFG = 1b,
WAITPOL + 0b)
tsu(NWAITV-CLKH) t h(CLKH-NWAITV)
FMC_NWAIT
(WAITCFG = 0b,
WAITPOL + 0b)
tsu(NWAITV-CLKH) th(CLKH-NWAITV)
MS32759V1
FMC_CLK
td(CLKL-NExL) td(CLKH-NExH)
Data latency = 0
FMC_NEx
td(CLKL-NADVL) td(CLKL-NADVH)
FMC_NADV
td(CLKL-AV) td(CLKH-AIV)
FMC_A[25:0]
td(CLKL-NWEL) td(CLKH-NWEH)
FMC_NWE
td(CLKL-Data) td(CLKL-Data)
FMC_D[15:0] D1 D2
FMC_NWAIT
(WAITCFG = 0b, WAITPOL + 0b) tsu(NWAITV-CLKH) td(CLKH-NBLH)
th(CLKH-NWAITV)
FMC_NBL
MS32760V1
FMC_CLK
Data latency = 0
td(CLKL-NExL) td(CLKH-NExH)
FMC_NEx
t d(CLKL-NADVL) td(CLKL-NADVH)
FMC_NADV
td(CLKL-AV) td(CLKH-AIV)
FMC_A[25:16]
td(CLKL-NOEL) td(CLKH-NOEH)
FMC_NOE
td(CLKL-ADIV) th(CLKH-ADV)
t d(CLKL-ADV) tsu(ADV-CLKH) tsu(ADV-CLKH) th(CLKH-ADV)
FMC_AD[15:0] AD[15:0] D1 D2
tsu(NWAITV-CLKH) th(CLKH-NWAITV)
FMC_NWAIT
(WAITCFG = 1b,
WAITPOL + 0b)
tsu(NWAITV-CLKH) th(CLKH-NWAITV)
FMC_NWAIT
(WAITCFG = 0b,
WAITPOL + 0b) tsu(NWAITV-CLKH) th(CLKH-NWAITV)
MS32757V1
FMC_CLK
Data latency = 0
td(CLKL-NExL) td(CLKH-NExH)
FMC_NEx
td(CLKL-NADVL) td(CLKL-NADVH)
FMC_NADV
td(CLKL-AV) td(CLKH-AIV)
FMC_A[25:16]
td(CLKL-NWEL) td(CLKH-NWEH)
FMC_NWE
td(CLKL-ADIV) td(CLKL-Data)
td(CLKL-ADV) td(CLKL-Data)
FMC_AD[15:0] AD[15:0] D1 D2
FMC_NWAIT
(WAITCFG = 0b,
WAITPOL + 0b) tsu(NWAITV-CLKH) th(CLKH-NWAITV)
td(CLKH-NBLH)
FMC_NBL
MS32758V1
FMC_NCEx
ALE (FMC_A17)
CLE (FMC_A16)
FMC_NWE
td(ALE-NOE) th(NOE-ALE)
FMC_NOE (NRE)
tsu(D-NOE) th(NOE-D)
FMC_D[15:0]
MS32767V1
Figure 47. NAND controller waveforms for common memory read access
FMC_NCEx
ALE (FMC_A17)
CLE (FMC_A16)
td(ALE-NOE) th(NOE-ALE)
FMC_NWE
tw(NOE)
FMC_NOE
tsu(D-NOE) th(NOE-D)
FMC_D[15:0]
MS32769V1
FMC_NCEx
ALE (FMC_A17)
CLE (FMC_A16)
td(ALE-NWE) th(NWE-ALE)
FMC_NWE
FMC_NOE (NRE)
tv(NWE-D) th(NWE-D)
FMC_D[15:0]
MS32768V1
Figure 49. NAND controller waveforms for common memory write access
FMC_NCEx
ALE (FMC_A17)
CLE (FMC_A16)
td(ALE-NOE) tw(NWE) th(NOE-ALE)
FMC_NWE
FMC_N OE
td(D-NWE)
tv(NWE-D) th(NWE-D)
FMC_D[15:0]
MS32770V1
FMC_SDCLK
td(SDCLKL_AddC)
td(SDCLKL_AddR) th(SDCLKL_AddR)
th(SDCLKL_AddC)
td(SDCLKL_SNDE) th(SDCLKL_SNDE)
FMC_SDNE[1:0]
td(SDCLKL_NRAS) th(SDCLKL_NRAS)
FMC_SDNRAS
td(SDCLKL_NCAS) th(SDCLKL_NCAS)
FMC_SDNCAS
FMC_SDNWE
tsu(SDCLKH_Data) th(SDCLKH_Data)
FMC_SDCLK
td(SDCLKL_AddC)
td(SDCLKL_AddR) th(SDCLKL_AddR)
th(SDCLKL_AddC)
td(SDCLKL_SNDE) th(SDCLKL_SNDE)
FMC_SDNE[1:0]
td(SDCLKL_NRAS) th(SDCLKL_NRAS)
FMC_SDNRAS
td(SDCLKL_NCAS) th(SDCLKL_NCAS)
FMC_SDNCAS
td(SDCLKL_NWE) th(SDCLKL_NWE)
FMC_SDNWE
td(SDCLKL_Data)
td(SDCLKL_NBL) th(SDCLKL_Data)
FMC_NBL[3:0]
MS32752V2
NCS
CLK, NCLK
Latency count
tv(OUT) th(OUT) tv(OUT) th(OUT)
Dn Dn Dn+1 Dn+1
IO[7:0] 47:40 39:32 31:24 23:16 15:8 7:0
A B A B
Command address
tv(OUT) th(OUT)
Dn Dn Dn+1 Dn+1
IO[15:8] A B A B
MSv69142V2
NCS
CLK, NCLK
DQS0
tv(DQ)
Dn Dn Dn+1 Dn+1
IO[15:8] A B A B
MSv69141V2
CLK
VOD(CLK)
NCLK
MSv69140V2
Positive
V
VREF+ reference - 1.62 - VDDA
voltage
Negative
VREF- reference - VSSA
voltage
ADC clock
fADC 1.62 V ≤ VDDA ≤ 3.6 V 1.5 - 75 MHz
frequency
Resolutio
fADC=
n = 12 - 2.30 -
35MHz
bits
Resolutio
Sampling fADC=
n = 10 - 2.70 -
1.6 V≤VDD -40°C ≤ TJ 35MHz
rate for slow bits All modes SMP=2.5
channels A≤3.6 V ≤ 130°C
Resolutio fADC=
- 4.50 -
n = 8 bits 50MHz
Resolutio fADC=
- 5.50 -
n = 6 bits 50MHz
External
tTRIG trigger Resolution = 12 bits - - 15 1/fADC
period
Internal
sample and
CADC - - 3 - pF
hold
capacitor
Offset
tOFF_CAL calibration - 1335
time
Sampling
tS - 2.5 - 640.5
time
Total
conversion
tS +
time
tCONV N-bits resolution 0.5 +
(including
N
sampling
time)
fADC=6.25 MHz - 22 -
fADC=3.125 MHz - 11 -
1. Guaranteed by design.
2. The voltage booster on ADC switches must be used for VDDA < 2.4 V (embedded I/O switches).
3. These values are valid on BGA packages
4. The tolerance is 2 LSBs for 12-bit, 10-bit and 8-bit resolutions, unless otherwise specified.
47 3.75E-08 6.12E-08
68 3.94E-08 6.25E-08
100 4.36E-08 6.51E-08
150 5.11E-08 7.00E-08
12 bits
220 6.54E-08 7.86E-08
330 8.80E-08 9.57E-08
470 1.17E-07 1.23E-07
680 1.60E-07 1.65E-07
47 3.19E-08 5.17E-08
68 3.35E-08 5.28E-08
100 3.66E-08 5.45E-08
150 4.35E-08 5.83E-08
220 5.43E-08 6.50E-08
330 7.18E-08 7.89E-08
10 bits
470 9.46E-08 1.00E-07
680 1.28E-07 1.33E-07
1000 1.81E-07 1.83E-07
1500 2.63E-07 2.63E-07
2200 3.79E-07 3.76E-07
3300 5.57E-07 5.52E-07
47 2.64E-08 4.17E-08
68 2.76E-08 4.24E-08
100 3.02E-08 4.39E-08
150 3.51E-08 4.66E-08
220 4.27E-08 5.13E-08
330 5.52E-08 6.19E-08
470 7.17E-08 7.72E-08
680 9.68E-08 1.00E-07
8 bits
1000 1.34E-07 1.37E-07
1500 1.93E-07 1.94E-07
2200 2.76E-07 2.74E-07
3300 4.06E-07 4.01E-07
4700 5.73E-07 5.62E-07
6800 8.21E-07 7.99E-07
10000 1.20E-06 1.17E-06
15000 1.79E-06 1.74E-06
47 2.14E-08 3.16E-08
68 2.23E-08 3.21E-08
100 2.40E-08 3.31E-08
150 2.68E-08 3.52E-08
220 3.13E-08 3.87E-08
330 3.89E-08 4.51E-08
470 4.88E-08 5.39E-08
680 6.38E-08 6.79E-08
6 bits
1000 8.70E-08 8.97E-08
1500 1.23E-07 1.24E-07
2200 1.73E-07 1.73E-07
3300 2.53E-07 2.49E-07
4700 3.53E-07 3.45E-07
6800 5.04E-07 4.90E-07
10000 7.34E-07 7.11E-07
15000 1.09E-06 1.05E-06
1. Guaranteed by design.
2. Data valid up to 130 °C, with a 22 pF PCB capacitor and VDDA = 1.6 V.
3. Fast channels correspond to ADCx_INP0 to _INP5, and for ADCx_ INN0 to _INN5.
4. Slow channels correspond to all ADC inputs except for the Fast channels.
VBRS in PWR_CR3= 0 - 5 -
RBC Battery charging resistor kΩ
VBRS in PWR_CR3= 1 1.5 -
ADF_CCK (IO)
ADF_SDIx (I)
MSv55575V1
tsu(HSYNC), ns
DCMI_HSYNC/ DCMI_VSYNC input setup time 2.5 -
tsu(VSYNC)
th(HSYNC),
DCMI_HSYNC/ DCMI_VSYNC input hold time 1 -
th(VSYNC)
1. Evaluated By characterization – Not tested in production.
2. At VOS low, these values are degraded by up to 7%.
1/DCMIPP_PIXCLK
DCMIPP_PIXCLK
tsu(HSYNC) th(HSYNC)
DCMIPP_HSYNC
tsu(VSYNC) th(HSYNC)
DCMIPP_VSYNC
tsu(DATA) th(DATA)
DATA[15:0]
MSv73149V1
tc(PDCK)
CKPOL=0
(input)
CKPOL=1
ts(DATA)
th(DATA)
PSSI D[15:0]
Invalid data IN Valid data IN Invalid data IN
(input)
ts(DE)
th(DE)
DEPOL=0
PSSI_DE
(input)
DEPOL=1
tv(RDY) tho(RDY)
PSSI_RDY
RDYPOL=0
(output)
RDYPOL=1
MSv63436V1
CKPOL=0
(input)
CKPOL=1
tv(DATA) tho(DATA)
PSSI D[15:0]
Invalid data OUT Valid data OUT Invalid data OUT
(output)
tv(DE) tho(DE)
DEPOL=0
PSSI_DE
(output)
DEPOL=1
ts(RDY) th(RDY)
PSSI_RDY
RDYPOL=0
(input)
RDYPOL=1
MSv63437V1
LTDC clock
1.71<VDD<3.
fCLK output - 90 MHz
6 V, 30 pF
frequency
DCLK LTDC clock output duty cycle 45 55 %
tw(CLKH),
Clock High time, low time tw(CLK)//2-0.5 tw(CLK)/2+0.5
tw(CLKL)
tv(DATA) Data output valid time - 3.5
th(DATA) Data output hold time 0.5 -
tv(HSYNC), ns
HSYNC/VSYNC/DE output
tv(VSYNC), - 3.0
valid time
tv(DE)
th(HSYNC),
HSYNC/VSYNC/DE output
th(VSYNC), 0.5 -
hold time
th(DE)
1. Guaranteed by characterization results.
2. At VOS Low, these values are degraded by up to 7%.
tCLK
LCD_CLK
LCD_VSYNC
tv(HSYNC) tv(HSYNC)
LCD_HSYNC
tv(DE) th(DE)
LCD_DE
tv(DATA)
LCD_R[0:7]
LCD_G[0:7] Pixel Pixel Pixel
1 2 N
LCD_B[0:7]
th(DATA)
One line
MS32749V1
tCLK
LCD_CLK
tv(VSYNC) tv(VSYNC)
LCD_VSYNC
LCD_R[0:7]
LCD_G[0:7] M lines data
LCD_B[0:7]
One frame
MS32750V1
AHB/APBx prescaler=1
or 2 or 4, fTIMxCLK = 1 - tTIMxCLK
300 MHz
tres(TIM) Timer resolution time
AHB/APBx
prescaler>4, fTIMxCLK = 1 - tTIMxCLK
150 MHz
Timer external clock
fEXT 0 fTIMxCLK/2 MHz
frequency on CH1 to CH4 f
TIMxCLK = 240 MHz
ResTIM Timer resolution - 16/32 bit
Maximum possible count 65536 ×
tMAX_COUNT - - tTIMxCLK
with 32-bit counter 65536
1. TIMx is used as a general term to refer to the TIM1 to TIM17 timers.
2. Guaranteed by design.
3. The maximum timer frequency on APB1 or APB2 is up to 300 MHz, by setting the TIMPRE bit in the
RCC_CFGR register, if APBx prescaler is 1 or 2 or 4, then TIMxCLK = rcc_hclk1, otherwise TIMxCLK = 4x
Frcc_pclkx1 or TIMxCLK = 4x Frcc_pclkx2.
Master mode,
15.5
1.71 V ≤ VDD ≤ 3.6 V
- -
Slave receiver mode,
41.5
1.71 V ≤ VDD ≤ 3.6 V
Slave mode, ,
- 8.0 10.5
2.7 V ≤ VDD ≤ 3.6 V
tv(TX) Data output valid time Slave mode, ,
- 8.0 12.5
1.71 V ≤ VDD ≤ 3.6 V
Master mode - 1 2
Slave mode 6 - -
th(TX) Data output hold time
Master mode 0.5 - -
1. Guaranteed by characterization results.
2. At VOS Low, these values are degraded by up to 7%.
CPOL=0
CPHA=0
CPOL=1
tw(CKL)
CPHA=1
CK output
CPOL=0
CPHA=1
CPOL=1
tsu(RX) th(RX)
NSS input
1/fCK th(NSS)
tsu(NSS) tw(CKH)
CPHA=0
CPOL=0
CK input
CPHA=0
CPOL=1
tw(CKL) tv(TX) th(TX)
TX output First bit OUT Next bits OUT Last bit OUT
tsu(RX) th(RX)
MSv65387V6
Master mode,
90
1.71 V < VDD < 3.6 V
Master mode,
2.7 V < VDD < 3.6 V, SPI2, 3, 4, 133
5, 6
Master mode,
130
2.7 V < VDD < 3.6 V, SPI1
Slave receiver mode,
fSCK SPI clock frequency - - MHz
2.7 V < VDD < 3.6 V, SPI2, 3, 4, 140
5, 6
Slave receiver mode,
130
1.71 V < VDD < 3.6 V, SPI1
Slave mode transmitter/full
45
duplex, 2.7 V < VDD < 3.6 V
Slave mode transmitter/full
38
duplex, 1.71 V < VDD < 3.6 V
tsu(NSS) NSS setup time Slave mode 2.5 - -
th(NSS) NSS hold time Slave mode 1 - -
ns
tw(SCKH),
SCK high and low time Master mode, prescaler = 2 tSCK-1 tSCK tSCK+1
tw(SCKL)
NSS input
tc(SCK) th(NSS)
tsu(NSS) tw(SCKH)
CPHA=0
SCK input
CPOL=0
CPHA=0
CPOL=1
ta(SO) tw(SCKL) tv(SO) th(SO) tdis(SO)
MISO output First bit OUT Next bits OUT Last bit OUT
tsu(SI) th(SI)
MSv41658V2
NSS input
tc(SCK) th(NSS)
tsu(NSS) tw(SCKH)
CPHA=1
SCK input
CPOL=0
CPHA=1
CPOL=1
ta(SO) tw(SCKL) tv(SO) th(SO) tdis(SO)
MISO output First bit OUT Next bits OUT Last bit OUT
tsu(SI) th(SI)
MSv41659V2
High
NSS input
tc(SCK)
tw(SCKH)
CPHA=0
SCK output
CPOL=0
CPHA=0
CPOL=1
tw(SCKL)
CPHA=1
SCK output
CPOL=0
CPHA=1
CPOL=1
tsu(MI) th(MI)
MOSI output First bit OUT Next bits OUT Last bit OUT
- - 50
Master transmitter - 50
fMCK I2S main clock output Master receiver - 28 MHz
Slave transmitter - 23
Slave receiver - 50
tv(WS) WS valid time - 1.5
Master mode
th(WS) WS hold time 0.5 -
tsu(WS) WS setup time 3 -
Slave mode
th(WS) WS hold time 1 -
tsu(SD_MR) Master receiver 1.5 -
Data input setup time
tsu(SD_SR) Slave receiver 1.5 -
th(SD_MR) Master receiver 2 -
Data input hold time
th(SD_SR) Slave receiver 1 - ns
ai14881c
1. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.
1. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.
SAI characteristics
Unless otherwise specified, the parameters given in Table 127 for SAI are derived from tests
performed under the ambient temperature, fPCLK frequency and VDD supply voltage
conditions summarized in Table 26: General operating conditions, with the following
configuration:
• Output speed is set to OSPEEDRy[1:0] = 10
• Capacitive load CL = 30 pF
• IO Compensation cell activated.
• Measurement points are done at CMOS levels: 0.5VDD
• VOS level set to VOS high
Refer to Section 6.3.15: I/O port characteristics for more details on the input/output
alternate function characteristics (SCK,SD,WS).
SAI_SCK_X
(CKSTR = 0)
SAI_SCK_X
(CKSTR = 1)
th(FS)
SAI_FS_X
(output)
tv(FS) tv(SD_MT) th(SD_MT)
SAI_SD_X
(transmit) Slot n Slot n+2
tsu(SD_MR) th(SD_MR)
SAI_SD_X
(receive) Slot n
MS32771V2
SAI_SCK_X
(CKSTR = 0)
SAI_SCK_X
(CKSTR = 1)
SAI_FS_X
(input)
tsu(FS) tv(SD_ST) th(SD_ST)
SAI_SD_X
Slot n
(receive)
MS32772V2
MDIO characteristics
Unless otherwise specified, the parameters given in Table 128 for the MDIO are derived
from tests performed under the ambient temperature, fPCLK frequency and VDD supply
voltage conditions summarized in Table 26: General operating conditions, with the following
configuration:
• Output speed is set to OSPEEDRy[1:0] = 10
• I/O Compensation cell activated.
• Measurement points are done at CMOS levels: 0.5VDD
• HSLV activated when VDD ≤ 2.7 V
• VOS level set to VOS high
td(MDIO)
tsu(MDIO) th(MDIO)
MSv40460V1
Table 129. Dynamic characteristics: SD / MMC characteristics, VDD = 2.7 to 3.6 V(1)
Symbol Parameter Conditions Min Typ Max(2) Unit
CK
tOVD tOHD
D, CMD
(output)
ai14888
Clock
tvf(OUT) thr(OUT) tvr(OUT) thf(OUT)
USB transceiver
VDDUSB - 3.12(2) - 3.6 V
operating voltage
fHCLK value to guarantee
fHCLK proper operation of the - 30(3) - - MHz
OTG_HS interface
Embedded USB_DP pull-
RPUI - 900 1250 1575
up value during idle
Embedded USB_DP pull-
RPUR - 1425(3) 2250 3090(3)
up value during reception
Ω
Embedded USB_DP and
RPD - 14250 - 24800
USB_DM pull-down value
Output driver
ZDRV Driving high or low 40.5(3) 45 49.5(3)
impedance(4)
tlr Rise time CL < 5 pF 0.5(3) - -
ns
tlf Fall time CL < 5 pF 0.5(3) - -
tlrfm Rise/fall time matching - 80(3) - 125(3) %
1. Evaluated by characterization. Not tested in production, unless otherwise specified.
2. The USB functionality is ensured down to 3 V but not the full USB electrical characteristics
which are degraded in 3.0 to 3.12 V voltage range.
3. Specified by design. Not tested in production.
4. No external termination series resistors are required on USB_DP (D+) and USB_DM (D-). The
matching impedance is already included in the embedded driver.
UCPD characteristics
The UCPD controller complies with USB Type-C Rev 1.2 and USB Power Delivery Rev 3.0
specifications.
ETH_MDC
td(MDIO)
ETH_MDIO(O)
tsu(MDIO) th(MDIO)
ETH_MDIO(I)
MS31384V1
Table 136. Dynamic characteristics: Ethernet MAC signals for RMII (1)
Symbol Parameter Min Typ Max(2) Unit
RMII_REF_CLK
td(TXEN)
td(TXD)
RMII_TX_EN
RMII_TXD[1:0]
tsu(RXD) tih(RXD)
tsu(CRS) tih(CRS)
RMII_RXD[1:0]
RMII_CRS_DV
ai15667b
MII_RX_CLK
tsu(RXD) tih(RXD)
tsu(ER) tih(ER)
tsu(DV) tih(DV)
MII_RXD[3:0]
MII_RX_DV
MII_RX_ER
MII_TX_CLK
td(TXEN)
td(TXD)
MII_TX_EN
MII_TXD[3:0]
ai15668b
tc(TCK)
TCK
tsu(TMS/TDI) th(TMS/TDI)
tw(TCKL) tw(TCKH)
TDI/TMS
tov(TDO) toh(TDO)
TDO
MSv40458V1
tc(SWCLK)
SWCLK
tov(SWDIO) toh(SWDIO)
SWDIO
(transmit)
MSv40459V1
7 Package information
E E
(2X) 0.10 C
SEATING
C PLANE
E2
2
1
PIN 1 ID
C 0.30 X 45'
68 67 b
e
EXPOSED PAD AREA
BOTTOM VIEW B029_VFQFPN68_ME_V1
1. VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Packages No lead. Sawed
version. Very thin profile: 0.80 < A ≤ 1.00mm.
2. The pin #1 identifier must be existed on the top surface of the package by using indentation mark or other
feature of package body. Exact shape and size of this feature is optional.
0.15 6.40
6.65
7.00
8.30
6.40
0.25
0.82
0.65
0.40
B029_VFQFPN68_FP_V2
ș2 ș
(2)
R1
H
R2
B
B-
N
O
(6)
TI
C
SE
D1/4 B GAUGE PLANE
S
E1/4
B ș
4x N/4 TIPS
ș L
4x (L1)
aaa C A-B D
bbb H A-B D (1) (11)
(N-4) x e (13)
C
A (9) (11)
0.05
ccc C b WITH PLATING
A2 A1 b aaa C A-BD
(12)
SIDE VIEW
D (4)
(11) c
(2) (5) D1 c1 (11)
D (3)
(10) (4)
N
b1 BASE METAL
1 (11)
2
3 E1/4 SECTION B-B
E1 E
SECTION A-A
A A
Notes:
1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.
2. The Top package body size may be smaller than the bottom package size by as much
as 0.15 mm.
3. Datums A-B and D to be determined at datum plane H.
4. To be determined at seating datum plane C.
5. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash
or protrusions is “0.25 mm” per side. D1 and E1 are Maximum plastic body size
dimensions including mold mismatch.
6. Details of pin 1 identifier are optional but must be located within the zone indicated.
7. All Dimensions are in millimeters.
8. No intrusion allowed inwards the leads.
9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall
not cause the lead width to exceed the maximum “b” dimension by more than 0.08 mm.
Dambar cannot be located on the lower radius or the foot. Minimum space between
protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch packages.
10. Exact shape of each corner is optional.
11. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm
from the lead tip.
12. A1 is defined as the distance from the seating plane to the lowest point on the package
body.
13. “N” is the number of terminal positions for the specified body size.
14. Values in inches are converted from mm and rounded to 4 decimal digits.
15. Drawing is not to scale.
76 50
0.5
0.3
16.7 14.3
100 26
1.2
1 25
12.3
16.7
1L_LQFP100_FP_V1
ddd C
SEATING
PLANE
A1
A
A2
A1 ball
index
B
D1 A1 ball area
identifier
e D
F
A
B
C
G
D
E
E1
E
F
G
e
H A
J
K
10 9 8 7 6 5 4 3 2 1
eee C A B
fff C
A08Q_ME_V1
Dpad
Dsm
BGA_WLCSP_FT_V1
Table 143. TFBGA100 - Recommended PCB design rules (0.8 mm pitch BGA)
Dimension Recommended values
Pitch 0.8
Dpad 0.400 mm
0.470 mm typ. (depends on the soldermask
Dsm
registration tolerance)
Stencil opening 0.400 mm
Stencil thickness Between 0.100 mm and 0.125 mm
Pad trace width 0.120 mm
BOTTOM VIEW
2 1
(2)
R1
H
R2
B
B-
N
O
TI
C
SE
(6) B GAUGE PLANE
0.25
D 1/4
S
B
L
3
E 1/4 (L1)
(1) (11)
4x N/4 TIPS
aaa C A-B D SECTION A-A
bbb H A-B D 4x
(N-4)x e
C
A
0.05 (12) ddd C A-B D
A2 A1 b ccc C
D (4)
D1 (2) (5)
(10) (3) D (9) (11)
N (4)
b WITH PLATING
1
2
3 E 1/4
(11) (11)
c c1
(6)
D 1/4 (2)
(3) A B (3) (5)
E1 E b1 BASE METAL
(11)
SECTION B-B
A A
(Section A-A)
TOP VIEW
1A_LQFP144_ME_V2
A - - 1.60 - - 0.0630
(12)
A1 0.05 - 0.15 0.0020 - 0.0059
A2 1.35 1.40 1.45 0.0531 0.0551 0.0571
(9)(11)
b 0.17 0.22 0.27 0.0067 0.0087 0.0106
(11)
b1 0.17 0.20 0.23 0.0067 0.0079 0.0090
(11)
c 0.09 - 0.20 0.0035 - 0.0079
c1(11) 0.09 - 0.16 0.0035 - 0.0063
(4)
D 22.00 BSC 0.8661 BSC
(2)(5)
D1 20.00 BSC 0.7874 BSC
E(4) 22.00 BSC 0.8661 BSC
E1(2)(5) 20.00 BSC 0.7874 BSC
e 0.50 BSC 0.0197 BSC
L 0.45 0.60 0.75 0.0177 0.0236 0.0295
L1 1.00 REF 0.0394 REF
N(13) 144
θ 0° 3.5° 7° 0° 3.5° 7°
θ1 0° - - 0° - -
θ2 10° 12° 14° 10° 12° 14°
θ3 10° 12° 14° 10° 12° 14°
R1 0.08 - - 0.0031 - -
R2 0.08 - 0.20 0.0031 - 0.0079
S 0.20 - - 0.0079 - -
aaa 0.20 0.0079
bbb 0.20 0.0079
ccc 0.08 0.0031
ddd 0.08 0.0031
Notes:
1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.
2. The Top package body size may be smaller than the bottom package size by as much
as 0.15 mm.
3. Datums A-B and D to be determined at datum plane H.
4. To be determined at seating datum plane C.
5. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash
or protrusions is “0.25 mm” per side. D1 and E1 are Maximum plastic body size
dimensions including mold mismatch.
6. Details of pin 1 identifier are optional but must be located within the zone indicated.
7. All Dimensions are in millimeters.
8. No intrusion allowed inwards the leads.
9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall
not cause the lead width to exceed the maximum “b” dimension by more than 0.08 mm.
Dambar cannot be located on the lower radius or the foot. Minimum space between
protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch packages.
10. Exact shape of each corner is optional.
11. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm
from the lead tip.
12. A1 is defined as the distance from the seating plane to the lowest point on the package
body.
13. “N” is the number of terminal positions for the specified body size.
14. Values in inches are converted from mm and rounded to 4 decimal digits.
15. Drawing is not to scale.
108 73
1.35
109 0.35 72
0.50
19.90 17.85
22.60
144 37
1 36
19.90
22.60
1A_LQFP144_FP
C Seating plane
ddd Z
A4 A3 A2 A1 A
E1 A1 ball A1 ball A
identifier index area E
e F
A
F
D1 D
e
B
M
12 1
BOTTOM VIEW Øb (144 balls) TOP VIEW
Ø eee M C A B
Ø fff M C A02Y_ME_V2
Dpad
Dsm
BGA_WLCSP_FT_V1
Table 146. UFBGA144 - Recommended PCB design rules (0.80 mm pitch BGA)
Dimension Recommended values
Pitch 0.80 mm
Dpad 0.400 mm
0.550 mm typ. (depends on the soldermask
Dsm
registration tolerance)
Stencil opening 0.400 mm
Stencil thickness Between 0.100 mm and 0.125 mm
Pad trace width 0.120 mm
Z Seating plane
A2 A4
ddd Z
A
A3 A1
b
SIDE VIEW A1 ball A1 ball
identifier index area X
E
E1
e F
A
F
D1 D
e
Y
N
13 1
Dpad
Dsm
BGA_WLCSP_FT_V1
Table 148. UFBGA169 - Recommended PCB design rules (0.5 mm pitch BGA)
Dimension Recommended values
Pitch 0.5 mm
Dpad 0.27 mm
0.35 mm typ. (depends on the soldermask
Dsm
registration tolerance)
Solder paste 0.27 mm aperture diameter.
ș2 ș1
(2) R1
H R2
A2 0.05
(N-4) x e
C
A
A1 (12) ddd C A-BD ccc C
b
SIDE VIEW
D (4)
(2) (5) D1
D (9) (11)
(10) N
(4) b WITH PLATING
E1/4
(11) c c1 (11)
D1/4 (6) (5)
A B (2)
E1 E b1 BASE METAL
(11)
SECTION A-A
A A
SECTION B-B
Notes:
1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.
2. The Top package body size may be smaller than the bottom package size by as much
as 0.15 mm.
3. Datums A-B and D to be determined at datum plane H.
4. To be determined at seating datum plane C.
5. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash
or protrusions is “0.25 mm” per side. D1 and E1 are Maximum plastic body size
dimensions including mold mismatch.
6. Details of pin 1 identifier are optional but must be located within the zone indicated.
7. All Dimensions are in millimeters.
8. No intrusion allowed inwards the leads.
9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall
not cause the lead width to exceed the maximum “b” dimension by more than 0.08 mm.
Dambar cannot be located on the lower radius or the foot. Minimum space between
protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch packages.
10. Exact shape of each corner is optional.
11. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm
from the lead tip.
12. A1 is defined as the distance from the seating plane to the lowest point on the package
body.
13. “N” is the number of terminal positions for the specified body size.
14. Values in inches are converted from mm and rounded to 4 decimal digits.
15. Drawing is not to scale.
1.2
176 133
1 0.5 132
0.3
26.7
21.8
44 89
45 88
1.2
21.8
26.7
1T_FP_V1
e1
A2 ball location A1
F
10 8 6 4 2
11 9 7 5 3 1
A
B
C
G D
E
F Detail A
G
H
J
K e2 E
e L
M
N
P
R
T
U
V
W
A2
e A
D
b
Front view
X
Bump
A3
eee Z
A1
E
Z
Notes 1 and 2 b(101x)
ccc M Z X Y
ddd M Z
Seating plane
Note 4
Note 3
aaa
Detail A
(4X)
rotated 90°
Y
D
Top view
wafer back side
B0FA_WLCSP101L_ME_V1
A1 - 0.17 - 0.0065 -
A2 - 0.38 - - 0.0150 -
e - 0.35 - - 0.0138 -
e1 - 3.03 - - 0.1193 -
e2 - 3.15 - - 0.1240 -
N(6) 101
Dpad
Dsm
BGA_WLCSP_FT_V1
Pitch 0.35 mm
Dpad 0.210 mm
Dsm 0.275 mm typ. (depends on the soldermask registration tolerance)
Stencil opening 0.235 mm
Stencil thickness 0.100 mm
Pin A2 identifier
Product identification
MSv55558V2
A
A2 A3 b A1
A1 ball A
A1 ball index E
identifier area
E1
e F
A
F
D1 D
e
B
R
15 1
Øb (176 + 25 balls)
BOTTOM VIEW TOP VIEW
Ø eee M C A B
Ø fff M C
A0E7_ME_V10
A - - 0.600 - - 0.0236
A1 0.050 0.080 0.110 0.0020 0.0031 0.0043
A2 - 0.450 - - 0.0177 -
A3 - 0.130 - - 0.0051 -
A4 - 0.320 - - 0.0126 -
b 0.240 0.290 0.340 0.0094 0.0114 0.0134
D 9.850 10.000 10.150 0.3878 0.3937 0.3996
D1 - 9.100 - - 0.3583 -
E 9.850 10.000 10.150 0.3878 0.3937 0.3996
E1 - 9.100 - - 0.3583 -
e - 0.650 - - 0.0256 -
F - 0.450 - - 0.0177 -
ddd - - 0.080 - - 0.0031
Dpad
Dsm
BGA_WLCSP_FT_V1
Table 153. UFBGA(176+25) - Recommended PCB design rules (0.65 mm pitch BGA)
Dimension Recommended values
Pitch 0.65 mm
Dpad 0.300 mm
0.400 mm typ. (depends on the soldermask
Dsm
registration tolerance)
Stencil opening 0.300 mm
Stencil thickness Between 0.100 mm and 0.125 mm
Pad trace width 0.100 mm
R
P
N e
M
L
K
J
H D1
G
SD F
E
D
C
B
A
1 3 5 7 9 11 13 15
A1 BALL 2 4 6 8 10 12 14
PAD CORNER 5 b (N BALLS)
eee C A B
fff C
BOTTOM VIEW
ddd C ccc C
A
SEATING
7 PLANE C
A1 A2
SIDE VIEW
B E A
8 A1 BALL
PAD CORNER D/4
E/4
(DATUM A)
(DATUM B)
aaa C
TOP VIEW (4X)
B04V_TFBGA225_ME_V2
Notes:
1. For dimensions in millimeters, dimensioning and tolerancing schemes conform to
ASME Y14.5M-2018.
2. TFBGA stands for Thin profile Fine pitch Ball Grid Array: 1.00mm < A ≤ 1.20mm / Fine
pitch e < 1.00mm.
3. The profile height, A, is the distance from the seating plane to the highest point on the
package. It is measured perpendicular to the seating plane.
4. A1 is defined as the distance from the seating plane to the lowest point on the package
body.
5. Dimension b is measured at the maximum diameter of the terminal (ball) in a plane
parallel to primary datum C.
6. BSC stands for BASIC dimensions. It corresponds to the nominal value and has no
tolerance. For tolerances refer to form and position table.
7. Primary datum C is defined by the plane established by the contact points of three or
more solder balls that support the device when it is placed on top of a planar surface.
8. The terminal (ball) A1 corner must be identified on the top surface of the package by
using a corner chamfer, ink or metallized markings, or other feature of package body or
integral heat slug. A distinguish feature is allowable on the bottom surface of the
package to identify the terminal A1 corner. Exact shape of each corner is optional.
9. e represents the solder ball grid pitch.
10. N represents the total number of balls on the BGA.
11. Basic dimensions SD & SE are defined with respect to datums A and B. It defines the
position of the centre ball(s) in the outer row or column of a fully populated matrix.
12. Values in inches are converted from mm and rounded to 4 decimal digits.
13. Drawing is not to scale.
Dpad
Dsm
BGA_WLCSP_FT_V1
Table 155. TFBGA225 - Recommended PCB design rules (0.8 mm pitch BGA)
Dimension Recommended values
Pitch 0.8 mm
Dpad 0.400 mm
Dsm 0.550 mm
Stencil opening 0.400 mm
Stencil thickness 0.125 to 0.100 mm
8 Ordering information
Example: STM32 H 7S3 Z 8 J 6 H
Device family
STM32 = Arm-based 32-bit microcontroller
Product type
H = High performance
Device subfamily
7S3 = STM32H7S3x8
7S7 = STM32H7S7x8
Pin count
R = 68 pins
V = 100 or 101 pins/balls
Z = 144 pins
A = 169 balls
I = 176 pins/balls
L = 225 balls
Package
J = UFBGA pitch 0.8 ECOPACK2
Y = WLCSP pitch 0.35 ECOPACK2
V = VFQFPN pitch 0.4 ECOPACK2
T = LQFP ECOPACK2
K = UFBGA pitch 0.65 mm ECOPACK2
I = UFBGA pitch 0.5 mm ECOPACK2
H = TFBGA ECOPACK2
Temperature range
6 = –40 to 85 °C
For a list of available options (speed, package, and so on) or for further information on any
aspect of this device, contact your nearest ST sales office.
The STMicroelectronics group of companies (ST) places a high value on product security,
which is why the ST product(s) identified in this documentation may be certified by various
security certification bodies and/or may implement our own security measures as set forth
herein. However, no level of security certification and/or built-in security measures can
guarantee that ST products are resistant to all forms of attacks. As such, it is the
responsibility of each of ST's customers to determine if the level of security provided in an
ST product meets the customer needs both in relation to the ST product alone, as well as
when combined with other components and/or software for the customer end product or
application. In particular, take note that:
• ST products may have been certified by one or more security certification bodies, such
as Platform Security Architecture (www.psacertified.org) and/or Security Evaluation
standard for IoT Platforms (www.trustcb.com). For details concerning whether the ST
product(s) referenced herein have received security certification along with the level
and current status of such certification, either visit the relevant certification standards
website or go to the relevant product page on www.st.com for the most up to date
information. As the status and/or level of security certification for an ST product can
change from time to time, customers should re-check security certification status/level
as needed. If an ST product is not shown to be certified under a particular security
standard, customers should not assume it is certified.
• Certification bodies have the right to evaluate, grant and revoke security certification in
relation to ST products. These certification bodies are therefore independently
responsible for granting or revoking security certification for an ST product, and ST
does not take any responsibility for mistakes, evaluations, assessments, testing, or
other activity carried out by the certification body with respect to any ST product.
• Industry-based cryptographic algorithms (such as AES, DES, or MD5) and other open
standard technologies which may be used in conjunction with an ST product are based
on standards which were not developed by ST. ST does not take responsibility for any
flaws in such cryptographic algorithms or open technologies or for any methods which
have been or may be developed to bypass, decrypt or crack such algorithms or
technologies.
• While robust security testing may be done, no level of certification can absolutely
guarantee protections against all attacks, including, for example, against advanced
attacks which have not been tested for, against new or unidentified forms of attack, or
against any form of attack when using an ST product outside of its specification or
intended use, or in conjunction with other components or software which are used by
customer to create their end product or application. ST is not responsible for resistance
against such attacks. As such, regardless of the incorporated security features and/or
any information or support that may be provided by ST, each customer is solely
responsible for determining if the level of attacks tested for meets their needs, both in
relation to the ST product alone and when incorporated into a customer end product or
application.
• All security features of ST products (inclusive of any hardware, software,
documentation, and the like), including but not limited to any enhanced security
features added by ST, are provided on an "AS IS" BASIS. AS SUCH, TO THE EXTENT
PERMITTED BY APPLICABLE LAW, ST DISCLAIMS ALL WARRANTIES, EXPRESS
OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, unless the
applicable written and signed contract terms specifically provide otherwise.
10 Revision history
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improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
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acknowledgment.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
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Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
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