D945GSEJT TechProdSpec

Intel Desktop Board D945GSEJT
Technical Product Specification
April 2009 Order Number: E62862-001US

The Intel Desktop Board D945GSEJT may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D945GSEJT Specification Update.
Revision History
Revision
-001
Revision History
First release of the Specification. Intel Desktop Board D945GSEJT Technical Product
Date
April 2009
This product specification applies to only the standard Intel Desktop Board D945GSEJT with BIOS identifier JT94510H.86A. Changes to this specification will be published in the Intel Desktop Board D945GSEJT Specification Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTELS TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel Desktop Boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 5937 Denver, CO 80217-9808 or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333. Intel, the Intel logo, and Intel Atom are trademarks of Intel Corporation in the United States and other countries. * Other names and brands may be claimed as the property of others. Copyright 2009, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel Desktop Board D945GSEJT. It describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop Board D945GSEJT and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains

Chapter 1 2 3 4 5 Description A description of the hardware used on the board A map of the resources of the board The features supported by the BIOS Setup program A description of the BIOS error messages, beep codes, and POST codes Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings

NOTE
Notes call attention to important information.
INTEGRATORS NOTES
Integrators notes are used to call attention to information that may be useful to system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
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Intel Desktop Board D945GSEJT Technical Product Specification
Other Common Notation

# GB GB/sec Gbit KB Kbit kbits/sec MB MB/sec Mbit Mbit/sec xxh x.x V * Used after a signal name to identify an active-low signal (such as USBP0#) Gigabyte (1,073,741,824 bytes) Gigabytes per second Gigabit (1,073,741,824 bits) Kilobyte (1024 bytes) Kilobit (1024 bits) 1000 bits per second Megabyte (1,048,576 bytes) Megabytes per second Megabit (1,048,576 bits) Megabits per second An address or data value ending with a lowercase h indicates a hexadecimal value. Volts. Voltages are DC unless otherwise specified. This symbol is used to indicate third-party brands and names that are the property of their respective owners.
iv
Contents
1 Product Description
1.1 Overview.......................................................................................... 9 1.1.1 Feature Summary .................................................................. 9 1.1.2 Board Layout ....................................................................... 11 1.1.3 Block Diagram ..................................................................... 13 1.2 Online Support................................................................................ 14 1.3 Processor ....................................................................................... 14 1.4 System Memory .............................................................................. 15 1.5 Mobile Intel 945GSE Chipset ........................................................... 16 1.5.1 Intel 945GSE Graphics Subsystem .......................................... 16 1.5.2 USB ................................................................................... 18 1.5.3 ATA Support ........................................................................ 18 1.6 Real-Time Clock Subsystem .............................................................. 20 1.7 Legacy I/O Controller ....................................................................... 20 1.7.1 Serial Ports.......................................................................... 20 1.7.2 Parallel Port......................................................................... 21 1.7.3 PS/2 Keyboard Interface ....................................................... 21 1.8 Audio Subsystem............................................................................. 21 1.8.1 Audio Subsystem Drivers....................................................... 22 1.8.2 Audio Connectors and Headers ............................................... 22 1.9 LAN Subsystem ............................................................................... 23 1.9.1 LAN Subsystem Drivers ......................................................... 23 1.9.2 RJ-45 LAN Connector with Integrated LEDs .............................. 24 1.10 Hardware Management Subsystem .................................................... 24 1.10.1 Hardware Monitoring............................................................. 24 1.10.2 Thermal Monitoring .............................................................. 25 1.11 Power Management ......................................................................... 26 1.11.1 ACPI................................................................................... 26 1.11.2 Hardware Support ................................................................ 29 1.11.3 ENERGY STAR*, E-Standby, and EuP Compliance ...................... 32
2 Technical Reference
2.1 Memory Map................................................................................... 2.1.1 Addressable Memory............................................................. 2.2 Connectors and Headers................................................................... 2.2.1 Back Panel .......................................................................... 2.2.2 Component-side Connectors and Headers ................................ 2.3 BIOS Configuration Jumper Block....................................................... 2.4 Mechanical Considerations ................................................................ 2.4.1 Form Factor......................................................................... 33 33 36 37 39 49 51 51
2.5 Electrical Considerations ................................................................... 2.5.1 Power Supply Considerations ................................................. 2.5.2 Fan Header Current Capability................................................ 2.5.3 Add-in Board Considerations .................................................. 2.6 Thermal Considerations .................................................................... 2.7 Power Consumption ......................................................................... 2.7.1 Minimum Load Configuration.................................................. 2.7.2 Maximum Load Configuration ................................................. 2.8 Reliability ....................................................................................... 2.9 Environmental ................................................................................
52 52 52 52 53 55 55 55 56 57 59 60 60 60 61 62 63 63 64 64 64 64 65 65 66
3 Overview of BIOS Features

3.1 Introduction ................................................................................... 3.2 BIOS Flash Memory Organization ....................................................... 3.3 Resource Configuration .................................................................... 3.3.1 PCI* Autoconfiguration.......................................................... 3.4 System Management BIOS (SMBIOS)................................................. 3.5 Legacy USB Support ........................................................................ 3.6 BIOS Updates ................................................................................. 3.6.1 BIOS Recovery..................................................................... 3.6.2 Custom Splash Screen .......................................................... 3.7 Boot Options................................................................................... 3.7.1 CD-ROM Boot ...................................................................... 3.7.2 Network Boot....................................................................... 3.7.3 Booting Without Attached Devices........................................... 3.7.4 Changing the Default Boot Device During POST ........................ 3.8 BIOS Security Features ....................................................................
4 Board Status and Error Messages

4.1 Front-panel Power LED Blink and Internal Speaker Beep Codes .............. 67 4.2 BIOS Error Messages ....................................................................... 67 4.3 Port 80h POST Codes ....................................................................... 68
5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance..................................................................... 5.1.1 Safety Standards.................................................................. 5.1.2 European Union Declaration of Conformity Statement ................ 5.1.3 Product Ecology Statements................................................... 5.1.4 EMC Regulations .................................................................. 5.1.5 Product Certification Markings (Board Level)............................. 5.2 Battery Disposal Information............................................................. 73 73 74 75 79 80 81
vi
Contents
Figures
1-1. 1-2. 1-3. 1-4. 1-5. 2-1. 2-2. 2-3. 2-4. 2-5. 2-6. 2-7. Major Board Components ............................................................... 11 Block Diagram .............................................................................. 13 LAN Connector LED Locations.......................................................... 24 Thermal Sensors and Fan Headers ................................................... 25 Location of the Standby Power Indicator LED..................................... 31 Detailed System Memory Address Map ............................................. 34 Back Panel Connectors ................................................................... 37 Back Panel Connectors ................................................................... 38 Component-side Connectors and Headers ......................................... 39 Connection Diagram for Front Panel Header ...................................... 46 Connection Diagram for Front Panel USB Header................................ 48 Connection Diagram for Front Panel USB Header (with Intel Z-U130 USB Solid-State Drive, or Compatible Device, Support)....................... 48 2-8. Location of the BIOS Configuration Jumper Block ............................... 49 2-9. Board Dimensions ......................................................................... 51 2-10. Localized High Temperature Zones................................................... 54
Tables
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. Feature Summary.............................................................................. 9 Board Components Shown in Figure 1-1 ............................................. 12 Supported Memory Configurations ..................................................... 15 Audio Jack Retasking Support ........................................................... 21 LAN Connector LED States ................................................................ 24 Effects of Pressing the Power Switch .................................................. 26 Power States and Targeted System Power........................................... 27 Wake-up Devices and Events ............................................................ 28 ENERGY STAR Requirements ............................................................. 32 System Memory Map ....................................................................... 35 Component-side Connectors and Headers Shown in Figure 2-4............... 40 Serial Port Header (COM 1 and COM 2)............................................... 41 PS/2 Keyboard Port Header............................................................... 41 PATA Connector (44-Pin) .................................................................. 41 Chassis Fan Header ......................................................................... 42 Chassis Intrusion Header .................................................................. 42 SATA Connectors............................................................................. 42 SATA Power Connector ..................................................................... 42 Parallel Port Header ......................................................................... 43 Front Panel Wireless Activity LED Header ............................................ 43 S/PDIF Header ................................................................................ 43 Internal Mono Speaker Header .......................................................... 44 Front Panel Audio Header for Intel HD Audio........................................ 44 Front Panel Audio Header for AC 97 Audio .......................................... 44 ATX12V Power Connector ................................................................. 45 Front Panel Header .......................................................................... 46
vii
27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. 41. 42. 43. 44. 45. 46. 47.
States for a One-Color Power LED ...................................................... BIOS Configuration Jumper Settings................................................... Fan Header Current Capability........................................................... Thermal Considerations for Components ............................................. Minimum Load Configuration Current and Power Results ....................... Maximum Load Configuration Current and Power Results....................... Intel Desktop Board D945GSEJT Environmental Specifications ............... BIOS Setup Program Menu Bar.......................................................... BIOS Setup Program Function Keys.................................................... Acceptable Drives/Media Types for BIOS Recovery ............................... Boot Device Menu Options ................................................................ Supervisor and User Password Functions............................................. Front-panel Power LED Blink and Internal Speaker Beep Codes .............. BIOS Error Messages ....................................................................... Port 80h POST Code Ranges.............................................................. Port 80h POST Codes ....................................................................... Typical Port 80h POST Sequence........................................................ Safety Standards............................................................................. Lead-Free Board Markings ................................................................ EMC Regulations ............................................................................. Product Certification Markings ...........................................................
47 50 52 55 55 56 57 60 60 63 65 66 67 67 68 69 72 73 78 79 80
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1
1.1
1.1.1
Product Description
Overview
Feature Summary
Table 1 summarizes the major features of Intel Desktop Board D945GSEJT. Table 1. Feature Summary
Form Factor Processor Memory 20 mm-thin mini-ITX, (6.7 inches by 6.7 inches [170 millimeters by 170 millimeters]) compatible with microATX Passively-cooled, soldered-down Single-Core Intel Atom processor N270 One 200-pin Double Data Rate 2 (DDR2) Small Outline Dual Inline Memory Module (SO-DIMM) socket with gold-plated contacts Support for DDR2 533 MHz SO-DIMMs (DDR2 800 MHz and DDR2 667 MHz validated to run at 533 MHz only) Support for up to 2 GB of system memory Passively cooled, mobile Intel 945GSE Express Chipset, consisting of: Intel 82945GSE Graphics and Memory Controller Hub (GMCH) Intel 82801GBM I/O Controller Hub (ICH7-M) Audio Internal Graphics Multi-streaming 2+2 channel audio subsystem with S/PDIF and internal mono speaker support based on the Realtek* ALC662 high definition audio codec Intel GMA950 onboard graphics subsystem with support for: Analog displays (VGA) Digital displays (DVI-D) Legacy I/O Control Peripheral Interfaces Winbond W83627DHG-A based Legacy I/O controller for hardware management, serial, parallel, and PS/2* ports Seven USB 2.0 ports: Three back panel ports Four front panel ports (via two internal headers; one header supports an Intel Z-U130 USB Solid-State Drive (or compatible device) Two Serial ATA (SATA) 3.0 Gb/s connectors (supporting IDE and AHCI) One SATA device power connector LAN Support One One Two One Parallel ATA (PATA) 44-pin connector with ATA-100/66 support parallel port header serial port headers PS/2* keyboard header
Chipset
10/100/1000 Mbits/sec LAN subsystem using a Realtek 8111DL Gigabit Ethernet Controller
continued
Table 1. Feature Summary (continued)

BIOS Intel BIOS (resident in the SPI Flash device) Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS Instantly Available PC Technology Expansion Capabilities Hardware Monitor Subsystem Support for PCI* Local Bus Specification Revision 2.3 Suspend to RAM support Wake on PCI, PCI Express*, PS/2, serial, front panel, USB ports, and LAN One PCI Conventional bus connector PCI Express Full-Mini Card slot Hardware monitoring through the Windbond I/O controller Voltage sense to detect out of range power supply voltages Thermal sense to detect out of range thermal values One fan header One fan sense input used to monitor fan activity Fan speed control Power Integrated DC-to-DC circuitry 12 VDC jack on back panel for external power supply ATX12V 2 x 2 power connector for alternate internal power supply
10
Product Description
1.1.2
Board Layout
Figure 1-1 shows the location of the major components.
Figure 1-1. Major Board Components Table 2 lists the components identified in Figure 1-1.
11
Table 2. Board Components Shown in Figure 1-1

Item/callout from Figure 1-1
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA BB CC DD EE
Description
Back panel connectors +12 V internal power connector (ATX12V) SO-DIMM socket Intel 82945GSE GMCH Intel Atom processor Serial port header (COM 2) Serial port header (COM 1) PS/2 keyboard port header Reserved PATA connector (44-pin) Reserved Chassis fan header Chassis intrusion header SATA connector 0 Intel 82801GBM I/O Controller Hub (ICH7-M) SATA power connector SATA connector 1 Parallel port header Battery Reserved Reserved Front panel header Front panel wireless activity LED header PCI Express Mini Card connector BIOS Setup configuration jumper block PCI Conventional bus add-in card connector S/PDIF header Front panel USB header Internal mono speaker header Front panel audio header Front panel USB header (with Intel Z-U130 USB Solid-State Drive, or compatible device, support)
12
Product Description
1.1.3
Block Diagram
Figure 1-2 is a block diagram of the major functional areas.
Figure 1-2. Block Diagram
13
1.2
Online Support
To find information about
Intel Desktop Board D945GSEJT Desktop Board Support Available configurations for the Intel Desktop Board D945GSEJT Chipset information BIOS and driver updates Integration information
Visit this World Wide Web site:

http://www.intel.com/products/motherboard/D945GSEJT/index.htm http://support.intel.com/support/motherboards/desktop http://www.intel.com/products/motherboard/D945GSEJT/index.htm http://www.intel.com/design/chipsets/embedded/945gse/ http://downloadcenter.intel.com http://www.intel.com/support/go/buildit
1.3
Processor
The board is designed to support a single-core Intel Atom processor N270 soldered down.
NOTE
The board is designed to be passively cooled in a properly ventilated chassis. Chassis venting locations are recommended above the processor heatsink area for maximum heat dissipation effectiveness.
INTEGRATORS NOTE
The board may be powered by using an external 12 VDC or internal ATX12V-compliant power supply. Use of an external 12 VDC power supply is preferred.
For information about
Power supply connectors
Refer to
Section 2.2.2.3, page 45
14
Product Description
1.4

System Memory
DDR2 SDRAM SO-DIMMs with gold-plated contacts Unbuffered, single-sided or double-sided SO-DIMMs 2 GB maximum total system memory Minimum total system memory: 256 MB Non-ECC SO-DIMMs Serial Presence Detect DDR2 533 MHz SDRAM SO-DIMMs (DDR2 800 MHz and DDR2 667 MHz validated to run at 533 MHz only)
The board has one 200-pin DDR2 SO-DIMM socket and supports the following memory features:
NOTE
Due to passively-cooled thermal constraints, system memory must have an operating temperature rating of 85 oC. The board is designed to be passively cooled in a properly ventilated chassis. Chassis venting locations are recommended above the system memory area for maximum heat dissipation effectiveness.
NOTE
To be fully compliant with all applicable DDR2 SDRAM memory specifications, the board should be populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If nonSPD memory is installed, performance and reliability may be impacted or the SO-DIMMs may not function under the determined frequency. Table 3 lists the supported SO-DIMM configurations. Table 3. Supported Memory Configurations
SO-DIMM Capacity 256 MB 256 MB 512 MB 512 MB 512 MB 1024 MB 1024 MB 2048 MB Configuration SS SS DS SS SS DS SS DS SDRAM Density 256 Mbit 512 Mbit 256 Mbit 512 Mbit 1 Gbit 512 Mbit 1 Gbit 1 Gbit SDRAM Organization Front-side/Back-side 32 M x 8/empty 32 M x 16/empty 32 M x 8/32 M x 8 64 M x 8/empty 64 M x 16/empty 64 M x 8/64 M x 8 128 M x 8/empty 128 M x 8/128 M x 8 Number of SDRAM Devices 8 4 16 8 4 16 8 16
Note: In the second column, DS refers to double-sided memory modules (containing two rows of SDRAM) and SS refers to single-sided memory modules (containing one row of SDRAM).
15
1.5

Mobile Intel 945GSE Chipset

Intel 82945GSE Graphics and Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect Intel 82801GBM I/O Controller Hub (ICH7-M) with DMI interconnect
The Mobile Intel 945GSE chipset consists of the following devices:
The GMCH component provides interfaces to the CPU, memory, and the DMI interconnect. The component also provides integrated graphics capabilities supporting 3D, 2D, and display capabilities. The ICH7-M is a centralized controller for the boards I/O paths.
NOTE
The board is designed to be passively cooled in a properly ventilated chassis. Chassis venting locations are recommended above the GMCH heatsink area for maximum heat dissipation effectiveness.
The Intel 945GSE chipset Resources used by the chipset
Refer to
http://www.intel.com/design/chipsets/embedded/945gse/ Chapter 2
1.5.1
1.5.1.1

Intel 945GSE Graphics Subsystem

Intel GMA950 Graphics Controller
The Intel GMA950 graphics controller features the following: 166 MHz core frequency High performance 3-D setup and render engine High quality texture engine DX9* Compliant Hardware Pixel Shader 2.0 Alpha and luminance maps Texture color-keying/chroma-keying Cubic environment reflection mapping Enhanced texture blending functions 3D Graphics Rendering enhancements 1.3 Dual Texture GigaPixel/Sec Fill Rate 16 and 32 bit color Maximum 3D supported resolution of 1600 x 1200 x 32 at 85 Hz Vertex cache Anti-aliased lines OpenGL* version 1.4 support with vertex buffer and EXT_Shadow extensions
16
Product Description
2D Graphics enhancements 8, 16, and 32 bit color Optimized 256-bit BLT engine Color space conversion Anti-aliased lines Video Hardware motion compensation for MPEG2 Software DVD at 30 fps full screen Intel Zoom Utility
Refer to
Section 1.2, page 14

Obtaining graphics software and utilities
1.5.1.2
Video Memory Allocation
Video memory is allocated from the total available system memory for the efficient balancing of 2-D/3-D graphics performance and overall system performance. Dynamic allocation of system memory to video memory is as follows: 256 MB total RAM results in 32 MB video RAM 512 MB total RAM results in 64 MB video RAM 1 GB total RAM results in 128 MB video RAM 2 GB total RAM results in 224 MB video RAM
1.5.1.3
Analog Display (VGA)
The VGA port supports analog displays. The maximum supported resolution is 2048 x 1536 (QXGA) at a 75 Hz refresh rate.
1.5.1.4
Digital Visual Interface (DVI)
The DVI-D port supports digital DVI displays. The maximum supported resolution is 1600 x 1200 (UXGA). The DVI port is compliant with the DVI 1.0 specification.
17
1.5.2
USB
The board supports up to seven USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and EHCI-compatible drivers. ICH7-M provides the USB controllers for all USB ports. The port arrangement is as follows: Three ports are implemented through a single vertical and a dual-port horizontal connector on the back panel Four ports are routed to two separate front panel USB headers
NOTE
One of the front panel USB headers supports an Intel Z-U130 USB Solid-State Drive (or compatible device). Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.
The location of the USB connectors on the back panel The location of the front panel USB headers
Refer to
Figure 2-2, page 37 Figure 2-4, page 39
1.5.3

ATA Support
One PATA connector that supports two devices Two SATA connectors that support one device per connector
The board provides three ATA interface connectors:
1.5.3.1
PATA Interface
The ICH7-Ms PATA controller has one bus-mastering PATA interface that is accessible through a 44-pin connector that is compatible with 2.5 or 3.5 inch PATA hard drives (including 2.5 inch hard drive power support). The PATA interface supports the following modes: Programmed I/O (PIO): processor controls data transfer. 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec. Ultra DMA: DMA protocol on ATA bus supporting host and target throttling and transfer rates of up to 33 MB/sec. ATA-66: DMA protocol on ATA bus supporting host and target throttling and transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible. ATA-100: DMA protocol on ATA bus allows host and target throttling. The ICH7-Ms ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec.
18
Product Description
NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections, noise, and inductive coupling. The PATA interface also supports ATAPI devices (such as CD-ROM drives) and ATA devices using the transfer modes. The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.
The location of the PATA connector
Refer to
Figure 2-4, page 39
1.5.3.2
SATA Interfaces
The ICH7-Ms SATA controller offers two independent SATA ports with a theoretical maximum transfer rate of 3.0 Gbits/sec on each port. One device can be installed on each port for a maximum of two SATA devices. A point-to-point interface is used for host to device connections, unlike PATA which supports a master/slave configuration and two devices on each channel. For compatibility, the underlying SATA functionality is transparent to the operating system. The SATA controller supports IDE and AHCI configuration and can operate in both legacy and native modes. In legacy mode, standard ATA I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP and Windows Vista* operating systems. The board ships with a 1 x 4 power connector and a power cable for powering internal SATA storage devices. SATA power delivery is rated as follows for any combination of hard drives and/or optical drives: 5 V rail: up to 3 A 12 V rail: up to 1.5 A
Refer to
Section 1.2, page 14 Figure 2-4, page 39

Obtaining AHCI driver The location of the SATA connectors
19
1.6
Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to 13 minutes/year at 25 C with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on. When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1-1 on page 11 shows the location of the battery.
1.7

Legacy I/O Controller

Two serial ports One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port (EPP) support Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems PS/2-style keyboard interface Intelligent power management, including a programmable wake-up event interface PCI Conventional bus power management support
The Legacy I/O Controller provides the following features:
The BIOS Setup program provides configuration options for the Legacy I/O controller.
1.7.1
Serial Ports
The serial ports, COM 1 and COM 2, are implemented as two 10-pin headers on the board. The serial ports support data transfers at speeds up to 115.2 kbits/sec with BIOS support.
The location of the serial port headers
Refer to
Figure 2-4, page 39
20
Product Description
1.7.2
Parallel Port
The parallel port is implemented as a 26-pin header on the board. Use the BIOS Setup program to set the parallel port mode.
The location of the parallel port header
Refer to
Figure 2-4, page 39
1.7.3
PS/2 Keyboard Interface

Refer to
Figure 2-4, page 39
A PS/2 keyboard port is implemented as a 6-pin header on the board.

The location of the keyboard header
1.8

Audio Subsystem
Intel 82801GBM ICH7-M Realtek ALC662 audio codec S/PDIF header Front panel audio header with support for Intel High Definition Audio and AC 97 audio Back panel audio line-out connector Internal mono speaker header
The audio subsystem consists of the following devices:
The audio subsystem supports the following audio interfaces:
NOTE
Systems built with an AC 97 front panel will not be able to obtain the Microsoft Windows Vista logo. Table 4 lists the supported functions of the front panel and back panel audio jacks. Table 4. Audio Jack Retasking Support
Supports Supports Audio Jack Front panel Green Front panel Pink Back panel Green Line In? No No No Yes No Yes Line/ Front Out? Supports Rear Out? No No No No No No Supports Center/LFE? No Yes No Supports Mic? Supports Headphone? Yes No Yes
21
1.8.1
Audio Subsystem Drivers

Refer to
Audio drivers are available from Intels World Wide Web site.
Obtaining audio drivers
1.8.2

Audio Connectors and Headers

Back panel audio connector: Line out S/PDIF header: 3-pin header Front panel audio header (supports both AC 97 and HD Audio): 10-pin header (for headphones/mic) Internal mono speaker header: 2-pin header Supports a 1.5 W/8 speaker
The board contains an audio connector on the back panel and audio headers on the component side of the board.
The front/back panel audio connectors are configurable through the audio device drivers. The audio stream for the line-out port is routed according to these dependencies: By default the audio stream is down-mixed to mono and amplified for an internal mono speaker. A connection is detected at the rear line-out port, the audio stream goes to the rear line-out port and the internal mono speaker is disabled.
NOTE
BIOS status and error beep codes can be heard through an internal speaker if the internal speaker is connected to the internal mono speaker header.
The location and signal names of the audio headers and connectors
Refer to
22
Product Description
1.9

LAN Subsystem
Intel 82801GBM ICH7-M Realtek 8111D Gigabit Ethernet Controller for 10/100/1000 Mbits/sec Ethernet LAN connectivity RJ-45 LAN connector with integrated status LEDs CSMA/CD protocol engine LAN connect interface that supports the ethernet controller PCI Conventional bus power management Supports ACPI technology Supports LAN wake capabilities
The LAN subsystem consists of the following:
Additional features of the LAN subsystem include:
1.9.1
LAN Subsystem Drivers

Refer to
LAN drivers are available from Intels World Wide Web site.
Obtaining LAN drivers
23
1.9.2
RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 1-3).
Figure 1-3. LAN Connector LED Locations Table 5 describes the LED states when the board is powered up and the 10/100/1000 Mbits/sec LAN subsystem is operating. Table 5. LAN Connector LED States
LED Color
N/A Link (A) Green N/A Speed (B) Green Yellow
State
Off On Blinking Off On On
Condition
LAN link is not established LAN link is established LAN activity occurring 10 Mb/s data rate 100 Mb/s data rate 1000 Mb/s data rate
1.10 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: Thermal and voltage monitoring Chassis intrusion detection
1.10.1

Hardware Monitoring
The hardware monitoring and fan control subsystem is based on the Winbond W83627DHG device, which supports the following: Processor and system ambient temperature monitoring Chassis fan speed monitoring Power monitoring of +12 V, +5 V, +5 Vstdby, +3.3 V, and +VCCP SMBus interface
24
Product Description
1.10.2
Thermal Monitoring
Figure 1-4 shows the locations of the thermal sensors and fan headers.
Item
A B C
Description
Remote thermal diode, located under the SO-DIMM Thermal diode, located on the processor die Chassis fan header
Figure 1-4. Thermal Sensors and Fan Headers
25
1.11 Power Management

Power management is implemented at several levels, including: Software support through Advanced Configuration and Power Interface (ACPI) Hardware support: Power connector Fan headers LAN wake capabilities Instantly Available PC technology Wake from USB Wake from PS/2 devices Power Management Event signal (PME#) wake-up support WAKE# signal wake-up support
1.11.1
ACPI
ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with the board requires an operating system that provides full ACPI support. ACPI features include: Plug and Play (including bus and device enumeration) Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state A Soft-off feature that enables the operating system to power-off the computer Support for multiple wake-up events (see Table 8 on page 28) Support for a front panel power and sleep mode switch
Table 6 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system. Table 6. Effects of Pressing the Power Switch
If the system is in this state
Off (ACPI G2/G5 Soft off) On (ACPI G0 working state) On (ACPI G0 working state) Sleep (ACPI G1 sleeping state) Sleep (ACPI G1 sleeping state)
and the power switch is pressed for

Less than four seconds Less than four seconds More than four seconds Less than four seconds More than four seconds
the system enters this state

Power-on (ACPI G0 working state) Power-off (ACPI G2/G5 Soft off) Fail safe power-off (ACPI G2/G5 Soft off) Wake-up (ACPI G0 working state) Power-off (ACPI G2/G5 Soft off)
26
Product Description
1.11.1.1
System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state. Table 7 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states. Table 7. Power States and Targeted System Power
Global States
G0 working state G1 sleeping state
Sleeping States
S0 working S1 Processor stopped
Processor States
C0 working C1 stop grant
Device States
D0 working state. D1, D2, D3 device specification specific. D3 no power except for wake-up logic. D3 no power except for wake-up logic. D3 no power except for wake-up logic. D3 no power for wake-up logic, except when provided by battery or external source.
Targeted System Power (Note 1)

Full power > 30 W 5 W < power < 52.5 W
G1 sleeping state G1 sleeping state G2/S5
S3 Suspend to RAM. Context saved to RAM. S4 Suspend to disk. Context saved to disk. S5 Soft off. Context not saved. Cold boot is required. No power to the system.
No power
Power < 5 W (Note 2)
No power
No power
G3 mechanical off. AC power is disconnected from the computer. Notes: 1. 2.
No power
No power to the system. Service can be performed safely.
Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the systems power supply. Dependent on the standby power consumption of wake-up devices used in the system.
27
1.11.1.2
Wake-up Devices and Events
Table 8 lists the devices or specific events that can wake the computer from specific states. Table 8. Wake-up Devices and Events
These devices/events can wake up the computer
LAN PME# signal Wake# signal Power switch RTC alarm Serial port USB PS/2 devices
from this state

S1, S3, S4, S5 (Note 1) S1, S3, S4, S5 (Note 1) S1, S3, S4, S5 (Note 1) S1, S3, S4, S5 (Note 1) S1, S3, S4, S5 (Note 1) S1, S3 S1, S3 S1, S3, S4, S5 (Note 1)
Note 1: S4 implies operating system support only. USB ports are turned off during S4/S5 states.
NOTE
The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events.
28
Product Description
1.11.2

Hardware Support
The board provides several power management hardware features, including: Fan header LAN wake capabilities Instantly Available PC technology Wake from USB PME# signal wake-up support Wake from PS/2 devices WAKE# signal wake-up support +5V Standby Power Indicator LED
LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line.
NOTE
The use of Wake from USB technologies from an ACPI state requires an operating system that provides full ACPI support.
1.11.2.1

Fan Header
The function/operation of the fan header is as follows: The fan is on when the board is in the S0 state. The fan is off when the board is off or in the S3, S4, or S5 state. The chassis fan header supports closed-loop fan control that can adjust the fan speed and is wired to a fan tachometer input. The fan header has a +12 VDC connection.
Refer to
Figure 1-4, page 25 Table 15, page 42

The locations of the fan header and thermal sensors The signal names of the chassis fan header
1.11.2.2
LAN Wake Capabilities
LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem network adapter monitors network traffic at the Media Independent Interface. The board supports LAN wake capabilities with ACPI in the following ways: By Ping By Magic Packet
Upon detecting the configured wake packet type, the LAN subsystem asserts a wakeup signal that powers up the computer.
29
1.11.2.3
Instantly Available PC Technology
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the hard drive(s) and fan will power off, the front panel LED will blink). When signaled by a wake-up device or event, the system quickly returns to its last known state. Table 8 on page 28 lists the devices and events that can wake the computer from the S3 state. The board supports the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer. The use of Instantly Available PC technology requires operating system support and PCI 2.3 compliant add-in cards and drivers.
1.11.2.4
Wake from USB
USB bus activity wakes the computer from an ACPI S1 or S3 state.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB and support in the operating system.
1.11.2.5
PME# Signal Wake-up Support
When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state (with Wake on PME enabled in the BIOS).
1.11.2.6
Wake from PS/2 Devices
PS/2 device activity wakes the computer from an ACPI S1, S3, S4, or S5 state. However, when the computer is in an S4 or S5 state, the only PS/2 activity that will wake the computer is the power key available only on some keyboards.
1.11.2.7
WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state.
30
Product Description
1.11.2.8
+5 V Standby Power Indicator LED
The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 1-5 shows the location of the standby power indicator LED.
CAUTION
If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices.
Figure 1-5. Location of the Standby Power Indicator LED
31
1.11.3
ENERGY STAR*, E-Standby, and EuP Compliance
The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements. This Intel Desktop Board meets the ENERGY STAR requirements listed in Table 9 when used in corresponding system configurations. Table 9. ENERGY STAR Requirements
ENERGY STAR Specification
v4.0 v4.0 v5.0
Computer Type
Desktop Computer Integrated Computer Desktop Computer
Req States
Idle State (Cat A) Sleep Mode Standby Level Off Mode Sleep Mode Idle State
Capability Adjustments
With and without WOL (Sleep, Standby)
TEC Criteria
N/A
With and without additional internal storage
v5.0
Integrated Desktop Computer Thin Client
Active State
Cat A under desktop conventional and desktop proxying operational mode weightings N/A
v5.0
Off Mode Sleep Mode Idle State (Cat B)
With and without WOL (Sleep, Standby)

ENERGY STAR requirements and recommended configurations
Refer to
http://www.intel.com/go/energystar
Intel Desktop Board D945GSEJT also meets the following international program requirements: Korea E-Standby European Union EuP
32
2
2.1
2.1.1
Technical Reference
Memory Map
Addressable Memory
The board utilizes 2 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 2 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following: BIOS/ SPI Flash (4 MB) Local APIC (19 MB) Direct Media Interface (40 MB) Front side bus interrupts (17 MB) GMCH base address registers, internal graphics ranges Memory-mapped I/O that is dynamically allocated for PCI Conventional add-in cards
33
The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 2-1 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.
Figure 2-1. Detailed System Memory Address Map
34
Technical Reference
Table 10 lists the system memory map. Table 10. System Memory Map
Address Range (decimal)
1024 K - 2097152 K 960 K - 1024 K 896 K - 960 K 800 K - 896 K
Address Range (hex)

100000 - FFFFFFFF F0000 - FFFFF E0000 - EFFFF C8000 - DFFFF
Size
2048 MB 64 KB 64 KB 96 KB
Description
Extended memory Runtime BIOS Reserved Potential available high DOS memory (open to the PCI bus). Dependent on video adapter used. Video memory and BIOS Extended BIOS data (movable by memory manager software) Extended conventional memory Conventional memory
640 K - 800 K 639 K - 640 K 512 K - 639 K 0 K - 512 K
A0000 - C7FFF 9FC00 - 9FFFF 80000 - 9FBFF 00000 - 7FFFF
160 KB 1 KB 127 KB 512 KB
35
2.2
Connectors and Headers
CAUTION
Only the following connectors/headers have overcurrent protection: Back panel and front panel USB and PS/2. The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computers chassis, such as fans and internal peripherals. Do not use these connectors/headers to power devices external to the computers chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices. This section describes the boards connectors and headers. The connectors and headers can be divided into these groups: Back panel I/O connectors (see page 37) Component-side connectors and headers (see page 39)
36
Technical Reference
2.2.1
2.2.1.1
Back Panel
Back Panel Connectors
Figure 2-2 shows the location of the back panel connectors.
Item
A B C D E F G
Description
12 V power connector VGA port DVI-D connector USB port USB ports LAN connector (RJ-45) Audio line out
Figure 2-2. Back Panel Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
37
2.2.1.2
I/O Shield
The I/O shield provided with the board allows access to all back panel connectors and is compatible with standard mini-ITX and microATX chassis. As an added benefit for system configurations with wireless PCI Express Mini Card solutions, the I/O shield also provides pre-cut holes for user installation of up to three external wireless antennas. Figure 2-3 shows an I/O shield reference diagram.
Figure 2-3. Back Panel Connectors
38
Technical Reference
2.2.2
Component-side Connectors and Headers
Figure 2-4 shows the locations of the component-side connectors and headers.
Figure 2-4. Component-side Connectors and Headers
39
Table 11 lists the component-side connectors and headers identified in Figure 2-4. Table 11. Component-side Connectors and Headers Shown in Figure 2-4
Item/callout from Figure 2-4
A B C D E F G H I J K L M N O P Q R S T U V W
Description
+12 V internal power connector (ATX12V) Serial port header (COM 2) Serial port header (COM 1) PS/2 keyboard port header Reserved PATA connector (44-pin) Reserved Chassis fan header Chassis intrusion header SATA connectors SATA power connector Parallel port header Reserved Reserved Front panel header Front panel wireless activity LED header PCI Express Mini Card connector PCI Conventional bus add-in card connector S/PDIF header Front panel USB header Internal mono speaker header Front panel audio header Front panel USB header (with Intel Z-U130 USB Solid-State Drive, or compatible device, support)
40
Technical Reference
2.2.2.1
Signal Tables for the Connectors and Headers
Table 12. Serial Port Header (COM 1 and COM 2)

Pin
1 3 5 7 9
Signal Name
DCD (Data Carrier Detect) TXD# (Transmit Data) Ground RTS (Request To Send) RI (Ring Indicator)
Pin
2 4 6 8 10
Signal Name
RXD# (Receive Data) DTR (Data Terminal Ready) DSR (Data Set Ready) CTS (Clear To Send) Key (no pin)
Table 13. PS/2 Keyboard Port Header

Pin
1 3 5
Signal Name
Data Ground Clock
Pin
2 4 6
Signal Name
Key (no pin) +5 V Key (no pin)
Table 14. PATA Connector (44-Pin)

Pin
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43
Signal Name
#Reset Data 7 Data 6 Data 5 Data 4 Data 3 Data 2 Data 1 Data 0 GND DMA Request #IOW #IOR IO Chrdy DMA Acknowledge IRQ14 Addr 1 Addr 0 #CS0 (1F0-1F7) #Active (LED driver) +5V_DC (logic) GND
Pin
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44
Signal Name
GND Data 8 Data 9 Data 10 Data 11 Data 12 Data 13 Data 14 Data 15 Key (no pin) GND GND GND Cable Select GND #IOCS16 Passed Diagnostics Addr 2 #CS1 (3f6-3f7) GND +5V_DC (motor) Type (GND = ATA)
41
Table 15. Chassis Fan Header

Pin
1 2 3
Signal Name
Control +12 V Tach
Table 16. Chassis Intrusion Header

Pin
1 2
Signal Name
Intruder# Ground
Table 17. SATA Connectors

Pin
1 2 3 4 5 6 7
Signal Name
Ground TXP TXN Ground RXN RXP Ground
Table 18. SATA Power Connector

Pin
1 2 3 4
Signal Name
+12 VDC Ground Ground +5 VDC
42
Technical Reference
Table 19. Parallel Port Header

Pin
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
Standard Signal Name

STROBE# AUTOFD# PD0 FAULT# PD1 INT# PD2 SLCTIN# PD3 GROUND PD4 GROUND PD5 GROUND PD6 GROUND PD7 GROUND ACK# GROUND BUSY GROUND PERROR GROUND SELECT KEY (no pin)
ECP Signal Name

STROBE# AUTOFD#, HOSACK PD0 FAULT#, PERIPHREQST# PD1 INT#, REVERSERQST# PD2 SLCTIN# PD3 GROUND PD4 GROUND PD5 GROUND PD6 GROUND PD7 GROUND ACK# GROUND BUSY#, PERIPHACK GROUND PE, ACKREVERSE# GROUND SELECT KEY (no pin)
EPP Signal Name

WRITE# DATASTB# PD0 FAULT# PD1 RESET# PD2 ADDRSTB# PD3 GROUND PD4 GROUND PD5 GROUND PD6 GROUND PD7 GROUND INTR GROUND WAIT# GROUND PE GROUND SELECT KEY (no pin)
Table 20. Front Panel Wireless Activity LED Header

Pin
1 2
Signal Name
LED (+) Ground
Table 21. S/PDIF Header

Pin
1 2 3
Signal Name
Ground S/PDIF out VCC (5 V)
43
Table 22. Internal Mono Speaker Header

Pin
1 2
Signal Name
+
Table 23. Front Panel Audio Header for Intel HD Audio

Pin
1 3 5 7 9
Signal Name
[Port 1] Left channel [Port 1] Right channel [Port 2] Right channel SENSE_SEND (Jack detection) [Port 2] Left channel
Pin
2 4 6 8 10
Signal Name
Ground PRESENCE# (Dongle present) [Port 1] SENSE_RETURN Key (no pin) [Port 2] SENSE_RETURN
Table 24. Front Panel Audio Header for AC 97 Audio

Pin
1 3 5 7 9
Signal Name
MIC MIC_BIAS FP_OUT_R AUD_5V FP_OUT_L
Pin
2 4 6 8 10
Signal Name
AUD_GND AUD_GND FP_RETURN_R KEY (no pin) FP_RETURN_L
Table 28. Front Panel USB Header

Pin
1 3 5 7 9
Signal Name
+5 VDC DD+ Ground KEY (no pin)
Pin
2 4 6 8 10
Signal Name
+5 VDC DD+ Ground No Connect
Table 29. Front Panel USB Header (with Intel Z-U130 USB Solid-State Drive, or Compatible Device, Support)
Pin
1 3 5 7 9
Signal Name
+5 VDC DD+ Ground KEY (no pin)
Pin
2 4 6 8 10
Signal Name
+5 VDC DD+ Ground LED#
44
Technical Reference
2.2.2.2

Add-in Card Connectors
The board has the following add-in card connectors: PCI Express Mini Card (rev 1.2 compliant) connector PCI Conventional (rev 2.3 compliant) bus connector The PCI Conventional bus connector is bus master capable. SMBus signals are routed to the PCI Conventional bus connector. This enables PCI Conventional bus add-in boards with SMBus support to access sensor data on the board. The specific SMBus signals are as follows: The SMBus clock line is connected to pin A40. The SMBus data line is connected to pin A41. The PCI Conventional bus connector also supports single-slot and dual-slot riser cards for use of up to two bus master PCI expansion cards. In order to support two PCI bus master expansion cards, the riser card must support the following PCI signal routing: Pin A11: additional 33 MHz PCI clock Pin B10: additional PCI request signal (i.e., PREQ#2) Pin B14: additional PCI Grant signal (i.e., GNT#2)
Note the following considerations for the PCI Conventional bus connector:
2.2.2.3
Power Supply Connectors
The board has the following power supply connectors: External Power Supply the board can be powered with a 12 V external power supply though a DC connector on the back panel. The rear 12 VDC jack accepts plugs with an inner diameter (ID) of 2.5 mm and an outer diameter (OD) of 5.5 mm, where the inner contact is 12 V and the shell is GND. Internal Power Supply the board can, alternatively, be powered by an internal ATX12V 2 x 2 power connector.
Table 25. ATX12V Power Connector

Pin
1 3
Signal Name
Ground +12 V
Pin
2 4
Signal Name
Ground +12 V

Power supply considerations
Refer to
Section 2.5.1, page 52
NOTE
Based on power consumption test results, the recommended power rating is 60 W (12 V/5 A). Configuration specific power requirements can be estimated by using the test results shown in Table 31 and Table 32. Total power consumption will depend on the system configuration selected by the integrator. See Section 2.7 for minimum and maximum load configurations.
45
2.2.2.4
Front Panel Header
This section describes the functions of the front panel header. Table 26 lists the signal names of the front panel header. Figure 2-5 is a connection diagram for the front panel header. Table 26. Front Panel Header
Pin
1 3
Signal
HD_PWR HDA#
In/ Out
Out Out
Description
Hard disk LED pull-up to +5 V Hard disk active LED
Pin
2 4
Signal
HDR_BLNK_GRN HDR_BLNK_YEL
In/ Out Power LED

Out Out
Description
Front panel green LED Front panel yellow LED
Hard Drive Activity LED
Reset Switch
5 7 Ground FP_RESET# In Ground Reset switch 6 8 FPBUT_IN Ground
On/Off Switch
In Power switch Ground
Power
9 +5 V Power 10 N/C
Not Connected
Not connected
Figure 2-5. Connection Diagram for Front Panel Header
46
Technical Reference
2.2.2.4.1
Hard Drive Activity LED Header
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires one of the following: SATA storage device connected to an onboard SATA connector PATA storage device connected to the onboard PATA connector Intel Z-U130 USB Solid State Drive (or compatible device) connected to one of the front panel USB headers Reset Switch Header
2.2.2.4.2
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.2.2.4.3 Power/Sleep LED Header
Pins 2 and 4 can be connected to a single- or dual-color LED. Table 27 shows the default states for a single-color LED. Table 27. States for a One-Color Power LED
LED State
Off Blinking Steady Green
Description
Power off/hybernate (S5/S4) Sleeping (S3) Running/Away (S0/S1)
NOTE
The LED states listed in Table 27 are default settings that can be modified through BIOS setup. Systems built with a dual-color front panel power LED can also use alternate color state options. 2.2.2.4.4 Power Switch Header
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply circuitry to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply circuitry will recognize another on/off signal.
47
2.2.2.5
Front Panel USB Headers
Figure 2-6 is a connection diagram for the front panel USB headers.
INTEGRATORS NOTES
The +5 VDC power on the USB headers is fused. Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices.
Figure 2-6. Connection Diagram for Front Panel USB Header
Figure 2-7. Connection Diagram for Front Panel USB Header (with Intel Z-U130 USB Solid-State Drive, or Compatible Device, Support)
48
Technical Reference
2.3
BIOS Configuration Jumper Block
CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 2-8 shows the location of the jumper block. The jumper determines the BIOS Setup programs mode. Table 28 lists the jumper settings for the three modes: normal, configure, and recovery.
Figure 2-8. Location of the BIOS Configuration Jumper Block
49
Table 28. BIOS Configuration Jumper Settings

Function/Mode
Normal
Jumper Setting
1-2
Configuration
The BIOS uses current configuration information and passwords for booting.
Configure
2-3
After the POST runs, Setup runs automatically. The maintenance menu is displayed.
Recovery
None
The BIOS attempts to recover the BIOS configuration. See Section 3.7 for more information on BIOS recovery.
50
Technical Reference
2.4
2.4.1
Mechanical Considerations
Form Factor
The board is designed to fit into a mini-ITX or microATX form-factor chassis. Figure 2-9 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 6.7 inches by 6.7 inches [170 millimeters by 170 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the microATX specification.
Figure 2-9. Board Dimensions
NOTE
The board is designed to have a total height of less than 20 mm from the underside of the board to the top of its tallest components, including all back panel I/O ports, internal connectors, installed system memory, and thermal solutions.
51
2.5
2.5.1
Electrical Considerations
Power Supply Considerations
CAUTION
The external 12 VDC jack is the primary power input connector of Intel Desktop Board D945GSEJT. However, the desktop board also provides an internal 2 x 2 power connector that can be used in systems that have an internal power supply. There is no isolation circuitry between the external 12 VDC jack and the internal 2 x 2 power connector. It is the system integrators responsibility to ensure no more than one power supply unit is or can be attached to the board at any time and to ensure the external 12 VDC jack is covered if the internal 2 x 2 power connector is to be used. Simultaneous connection of both external and internal power supply units could result in potential damage to the desktop board, power supplies, or other hardware.
2.5.2
Fan Header Current Capability
Table 29 lists the current capability of the fan header. Table 29. Fan Header Current Capability
Fan Header
Chassis fan
Maximum Available Current

1.0 A
2.5.3
Add-in Board Considerations
The board is designed to provide 2 A (average) of +5 V current for the PCI Conventional slot. The total +5 V current draw for the PCI Conventional expansion slot (total load) must not exceed 2 A.
52
Technical Reference
2.6
Thermal Considerations
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the boards maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.9.
CAUTION
The board is designed to be passively cooled on a properly ventilated chassis. Chassis venting locations are recommended over the processor, voltage regulator, GMCH, and system memory areas for maximum heat dissipation effectiveness. Ensure that proper airflow is maintained around the processor, processor voltage regulator circuit (shown in Figure 2-10), the GMCH, and the SO-DIMM. Failure to do so may result in damage to these components.
CAUTION
A thermal rating of 85 oC is required for the system SO-DIMM for the memory device to tolerate passively-cooled or limited system airflow constraints.
53
Figure 2-10 shows the locations of the localized high temperature zones.
Item
A B C D
Description
Memory SO-DIMM Processor voltage regulator area Intel Atom processor N270 Intel 82945GSE GMCH
Figure 2-10. Localized High Temperature Zones Table 30 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board.
54
Technical Reference
Table 30. Thermal Considerations for Components

Component
Intel Atom processor N270 Processor voltage regulator area Intel 82945GSE GMCH Memory SO-DIMM
Maximum Case Temperature

90 oC 85 oC 105 oC 85 oC

Processor datasheets and specification updates
Refer to
2.7
Power Consumption
Power measurements were performed to determine bare minimum and likely maximum power requirements from the board, as well as attached devices, in order to facilitate power supply rating estimates for specific system configurations.
2.7.1
Minimum Load Configuration
Minimum load refers to the power demand placed on the power supply when using a bare system configuration with minimal power requirement conditions. Minimum load configuration test results are shown in Table 31. The test configuration was defined as follows: 2 GB DDR2/533 MHz SO-DIMM 20-inch LCD display through the DVI-D port USB keyboard and mouse LAN linked at 1 Gbps DOS booted via network (PXE); system at idle All on board peripherals enabled (serial, parallel, audio, )
Table 31. Minimum Load Configuration Current and Power Results

Current Draw at 12 V
1.02 A
Power Consumption
12.28 W
2.7.2
Maximum Load Configuration
Maximum load refers to the incremental power demands placed on the power supply, augmenting the minimum load configuration into a fully-featured system that stresses power consumption from all subsystems. Maximum load configuration test results are shown in Table 32. The test configuration was defined as follows: 2 GB DDR2/533 MHz SO-DIMM 20-inch LCD display through DVI-D port SATA DVD-R/W Load: DVD playback 3.5-inch SATA hard disk drive, running Microsoft Windows Vista Home Basic Load: continuous read/write benchmark
55
2.5-inch PATA hard disk drive Load: continuous read/write benchmark Intel Z-U130 USB Solid-State Drive (or compatible device) on the USB flash drive header Load: continuous read/write benchmark Wireless card on PCI Express Mini Card slot, connected via 802.11n protocol Load: continuous read/write benchmark on remote share Riser card on conventional PCI slot, populated with third-party modem and disk encryption add-in cards USB keyboard and mouse Back and front panel host-powered USB devices (other than keyboard and mouse) at or near 500 mA Load: continuous read/write activity on external drive/peripheral LAN linked at 1 Gbps Load: continuous read/write benchmark on remote share All on board peripherals enabled (serial, parallel, audio, )
Table 32. Maximum Load Configuration Current and Power Results

Subsystem
Minimum Load Configuration SATA DVD-R/W 3.5-inch SATA hard disk drive 2.5-inch PATA hard disk drive Intel Z-U130 USB Solid State Drive (or compatible device) Wireless PCI Express Mini Card PCI cards on riser Host-powered USB devices (other than keyboard and mouse)
Current Draw at 12 V
1.02 A 0.29 A 0.525 A 0.3 A 0.31 A 0.15 A 0.19 A 0.72 A
Power Consumption
12.28 W 3.48 W 6.24 W 3.6 W 3.72 W 1.8 W 2.28 W 8.64 W
Maximum Load Configuration
3.505 A
42.04 W
2.8
Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data was calculated from predicted data at 50 C. The Intel Desktop Board D945GSEJT MTBF is 170,972 hours.
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Technical Reference
2.9
Environmental
Table 33 lists the environmental specifications for the board. Table 33. Intel Desktop Board D945GSEJT Environmental Specifications
Parameter
Temperature Non-Operating Operating Shock Unpackaged Packaged
Specification
-20 C to +70 C 0 C to +35 C 50 g trapezoidal waveform Velocity change of 170 inches/second Half sine 2 millisecond Product weight (pounds) Free fall (inches) <20 21-40 41-80 81-100 36 30 24 18
Velocity change (inches/sec) 167 152 136 118
Vibration Unpackaged Packaged
5 Hz to 20 Hz: 0.01 g Hz sloping up to 0.02 g Hz 20 Hz to 500 Hz: 0.02 g Hz (flat) 10 Hz to 40 Hz: 0.015 g Hz (flat) 40 Hz to 500 Hz: 0.015 g Hz sloping down to 0.00015 g Hz
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3
3.1
Overview of BIOS Features

Introduction
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support. The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as JT94510H.86A. The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST) memory test begins and before the operating system boot begins. The menu bar is shown below. Maintenance Main Advanced Security Power Boot Exit
NOTE
The maintenance menu is displayed only when the board is in configure mode. Section 2.3 on page 49 shows how to put the board in configure mode.
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Table 34 lists the BIOS Setup program menu features. Table 34. BIOS Setup Program Menu Bar
Maintenance
Clears passwords and displays processor information
Main
Displays processor and memory configuration
Advanced
Configures advanced features available through the chipset
Security
Sets passwords and security features
Power
Configures power management features and power states options
Boot
Selects boot options
Exit
Saves or discards changes to Setup program options
Table 35 lists the function keys available for menu screens. Table 35. BIOS Setup Program Function Keys
BIOS Setup Program Function Key
<> or <> <> or <> <Enter> <F9> <F10> <Esc>
Description
Selects a different menu screen (Moves the cursor left or right) Selects an item (Moves the cursor up or down) Executes command or selects the submenu Load the default configuration values for the current menu Save the current values and exits the BIOS Setup program Exits the menu
3.2
BIOS Flash Memory Organization
The Serial Peripheral Interface Flash Memory (SPI Flash) includes an 8 Mbit (1024 KB) flash memory device.
3.3
3.3.1
Resource Configuration
PCI* Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having to configure the system. When a user turns on the system after adding a PCI card, the BIOS automatically configures interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are considered to be available for use by the add-in card.
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3.4
System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information: BIOS data, such as the BIOS revision level Fixed-system data, such as peripherals, serial numbers, and asset tags Resource data, such as memory size, cache size, and processor speed Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board information can be found in the BIOS under the Additional Information header under the Main BIOS page.
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3.5
Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating systems USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled. Legacy USB support operates as follows: 1. When you apply power to the computer, legacy support is disabled. 2. POST begins. 3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu. 4. POST completes. 5. The operating system loads. While the operating system is loading, USB keyboards and mice are recognized and may be used to configure the operating system. (Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.) 6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used. 7. Additional USB legacy feature options can be access by using Intel Integrator Toolkit. To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating systems installation instructions.
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3.6
BIOS Updates
Intel Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from the file location on the Web. Intel Flash Memory Update Utility, which requires booting from DOS. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM.
The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site:
Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS update.
BIOS update utilities
Refer to
http://downloadcenter.intel.com
3.6.1
BIOS Recovery
It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 36 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable. Table 36. Acceptable Drives/Media Types for BIOS Recovery
Media Type
CD-ROM drive connected to the PATA interface CD-ROM drive connected to the SATA interface USB removable drive (a USB Flash Drive, for example) USB diskette drive (with a 1.44 MB diskette) USB hard disk drive
Can be used for BIOS recovery?

Yes Yes Yes No No

BIOS update instructions
Refer to
http://support.intel.com/support/motherboards/desktop/ sb/CS-022312.htm
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3.6.2
Custom Splash Screen
During POST, an Intel splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrators Toolkit that is available from Intel can be used to create a custom splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.
Intel Integrator Toolkit
Refer to
http://developer.intel.com/design/motherbd/software/itk/
3.7
Boot Options
In the BIOS Setup program, the user can choose to boot from optical drives, hard drives, removable media or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, and removable media third. If enabled, the last default boot device is the network.
3.7.1
CD-ROM Boot
Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM format specification. Under the Boot menu in the BIOS Setup program, ATAPI CD-ROM is listed as a boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD in the CD-ROM drive, the system will attempt to boot from the next defined drive.
3.7.2
Network Boot
The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed. Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full.
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3.7.3
Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present: Video adapter Keyboard Mouse
3.7.4
Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu displays the list of available boot devices (as set in the BIOS setup programs Boot Device Priority submenu). Table 37 lists the boot device menu options. Table 37. Boot Device Menu Options
Boot Device Menu Function Keys
<> or <> <Enter> <Esc>
Description
Selects a default boot device Exits the menu, saves changes, and boots from the selected device Exits the menu without saving changes
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3.8
BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode. The user password gives restricted access to view and change Setup options in the BIOS Setup program. This is the user mode. If only the supervisor password is set, pressing the <Enter> key at the password prompt of the BIOS Setup program allows the user restricted access to Setup. If both the supervisor and user passwords are set, users can enter either the supervisor password or the user password to access Setup. Users have access to Setup respective to which password is entered. Setting the user password restricts who can boot the computer. The password prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, the user can enter either password to boot the computer. For enhanced security, use different passwords for the supervisor and user passwords. Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 16 characters in length.
Table 38 shows the effects of setting the supervisor password and user password. This table is for reference only and is not displayed on the screen. Table 38. Supervisor and User Password Functions
Password Set
Neither Supervisor only User only Supervisor and user set Note:
Supervisor Mode
Can change all options (Note) Can change all options N/A Can change all options
User Mode
Can change all options (Note)
Setup Options
None
Password to Enter Setup

None Supervisor
Password During Boot

None None
Can change a Supervisor Password limited number of options Can change all options Enter Password Clear User Password
User Supervisor or user
User Supervisor or user
Can change a Supervisor Password limited number Enter Password of options
If no password is set, any user can change all Setup options.
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4
4.1
Board Status and Error Messages

Front-panel Power LED Blink and Internal Speaker Beep Codes
Basic error and status messages are provided through the front-panel power LED blink codes as well as through audible beep codes on systems with an internal speaker connected to the internal speaker header. Blink/beep codes represent their respective messages as shown in Table 39. Table 39. Front-panel Power LED Blink and Internal Speaker Beep Codes
Type
CPU Initialization Completion of POST BIOS update in progress
Pattern
Beep and blink code: 0.1 second beep/blink within the first second after pressing the power button. Beep and blink code: 0.1 second beep/blink between POST completion and boot device continuing the boot process. Beep code: none. Blink code: on-off (0.5 second each); pattern repeats until BIOS update is complete. Beep and blink code: on-off (0.5 second each) two times, then 3.0 second pause (off); entire pattern repeats (beeps/blinks and pause) until system is powered off. Beep and blink code: on-off (0.1 second each) three times, then 1.5 second pause (off); entire pattern repeats (beeps/blinks and pause) until system is powered off. Beep and blink code: on-off (0.5 second each) four times, then 3.0 second pause (off); entire pattern repeats (beeps/blinks and pause) 16 times, then ends.
Video error
Memory error
Thermal warning
4.2
BIOS Error Messages
Whenever a recoverable error occurs during POST, the BIOS displays an error message describing the problem. Table 40 lists the error messages and provides a brief description of each. Table 40. BIOS Error Messages
Error Message
CMOS Battery Low CMOS Checksum Bad Memory Size Decreased No Boot Device Available
Explanation
The battery may be losing power. Replace the battery soon. The CMOS checksum is incorrect. CMOS memory may have been corrupted. Run Setup to reset values. Memory size has decreased since the last boot. If no memory was removed, then memory may be bad. System did not find a device to boot.
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4.3
Port 80h POST Codes
During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST codes requires a PCI bus add-in card, often called a POST card. The POST card can decode the port and display the contents on a medium such as a seven-segment display.
NOTE
The POST card must be installed in PCI bus connector 1. The following tables provide information about the POST codes generated by the BIOS: Table 41 lists the Port 80h POST code ranges Table 42 lists the Port 80h POST codes themselves Table 43 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal. Table 41. Port 80h POST Code Ranges
Range
00 0F 10 1F 20 2F 30 3F 40 4F 50 5F 60 6F 70 7F 80 8F 90 9F A0 AF B0 BF C0 CF D0 DF E0 FF
Category/Subsystem
Debug codes: Can be used by any PEIM/driver for debug. Host Processors: 1F is an unrecoverable CPU error. Memory/Chipset: 2F is no memory detected or no useful memory detected. Recovery: 3F indicated recovery failure. Reserved for future use. I/O Busses: PCI, USB, ISA, ATA, etc. 5F is an unrecoverable error. Start with PCI. Reserved for future use (for new busses). Output Devices: All output consoles. 7F is an unrecoverable error. Reserved for future use (new output console codes). Input devices: Keyboard/Mouse. 9F is an unrecoverable error. Reserved for future use (new input console codes). Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error. Reserved for future use. Boot device selection. E0 EE: Miscellaneous codes. See Table 42. EF: boot/S3 resume failure. F0 FF: FF processor exception.
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Table 42. Port 80h POST Codes

POST Code
10 11 12 13
Description of POST Operation Host Processor

Power-on initialization of the host processor (Boot Strap Processor) Host processor cache initialization (including APs) Starting Application processor initialization SMM initialization
Chipset
21 Initializing a chipset component
Memory
22 23 24 25 26 27 28 Reading SPD from memory SO-DIMMs Detecting presence of memory SO-DIMMs Programming timing parameters in the memory controller and the SO-DIMMs Configuring memory Optimizing memory settings Initializing memory, such as ECC init Testing memory
PCI Bus
50 51 52 53 57 Enumerating PCI busses Allocating resources to PCI bus Hot Plug PCI controller initialization Reserved for PCI Bus
USB
58 59 Resetting USB bus Reserved for USB
ATA/ATAPI/SATA
5A 5B Resetting PATA/SATA bus and all devices Reserved for ATA
SMBus
5C 5D Resetting SMBus Reserved for SMBus
Local Console
70 71 72 Resetting the VGA controller Disabling the VGA controller Enabling the VGA controller
Remote Console
78 79 7A Resetting the console controller Disabling the console controller Enabling the console controller
continued
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Table 42. Port 80h POST Codes (continued)

POST Code
90 91 92 93 94 95
Description of POST Operation Keyboard (PS/2 or USB)

Resetting keyboard Disabling keyboard Detecting presence of keyboard Enabling the keyboard Clearing keyboard input buffer Instructing keyboard controller to run Self Test (PS/2 only)
Mouse (USB)
98 99 9A 9B Resetting mouse Disabling mouse Detecting presence of mouse Enabling mouse
Fixed Media
B0 B1 B2 B3 Resetting fixed media Disabling fixed media Detecting presence of a fixed media (hard drive detection etc.) Enabling/configuring a fixed media
Removable Media
B8 B9 BA BC Resetting removable media Disabling removable media Detecting presence of a removable media (CD-ROM detection, etc.) Enabling/configuring a removable media
BDS
Dy Trying boot selection y (y=0 to 15)
PEI Core
E0 E2 E1, E3 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN EFI_SW_PEI_PC_HANDOFF_TO_NEXT) Permanent memory found Reserved for PEI/PEIMs
DXE Core
E4 E5 E6 Entered DXE phase Started dispatching drivers Started connecting drivers
continued
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Table 42. Port 80h POST Codes (continued)

POST Code
E7 E8 E9 EB
Description of POST Operation

DXE Drivers Waiting for user input Checking password Entering BIOS setup Calling Legacy Option ROMs Runtime Phase/EFI OS Boot
F4 F5 F8 F9 FA
Entering Sleep state Exiting Sleep state EFI boot service ExitBootServices ( ) has been called EFI runtime service SetVirtualAddressMap ( ) has been called EFI runtime service ResetSystem ( ) has been called PEIMs/Recovery
30 31 34 35 3F
Crisis Recovery has initiated per user request Crisis Recovery has initiated by software (corrupt flash) Loading recovery capsule Handing off control to the recovery capsule Unable to recover
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Table 43. Typical Port 80h POST Sequence

POST Code
21 22 23 25 28 34 E4 12 13 50 51 92 90 94 95 EB 58 5A 92 90 94 5A 28 90 94 E7 01 00
Description
Initializing a chipset component Reading SPD from memory SO-DIMMs Detecting presence of memory SO-DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase Starting application processor initialization SMM initialization Enumerating PCI busses Allocating resourced to PCI bus Detecting the presence of the keyboard Resetting keyboard Clearing keyboard input buffer Keyboard Self Test Calling Video BIOS Resetting USB bus Resetting PATA/SATA bus and all devices Detecting the presence of the keyboard Resetting keyboard Clearing keyboard input buffer Resetting PATA/SATA bus and all devices Testing memory Resetting keyboard Clearing keyboard input buffer Waiting for user input INT 19 Ready to boot
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Regulatory Compliance and Battery Disposal Information

Regulatory Compliance
Safety standards European Union Declaration of Conformity statement Product Ecology statements Electromagnetic Compatibility (EMC) standards Product certification markings
5.1

This section contains the following regulatory compliance information for Intel Desktop Board D945GSEJT:
5.1.1
Safety Standards
Intel Desktop Board D945GSEJT complies with the safety standards stated in Table 44 when correctly installed in a compatible host system. Table 44. Safety Standards
Standard
CSA/UL 60950-1, First Edition EN 60950-1:2006, Second Edition IEC 60950-1:2005, Second Edition
Title
Information Technology Equipment Safety - Part 1: General Requirements (USA and Canada) Information Technology Equipment Safety - Part 1: General Requirements (European Union) Information Technology Equipment Safety - Part 1: General Requirements (International)
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5.1.2
European Union Declaration of Conformity Statement
We, Intel Corporation, declare under our sole responsibility that the product Intel Desktop Board D945GSEJT is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive). The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC and 2006/95/EC. etina Tento vrobek odpovd poadavkm evropskch smrnic 2004/108/EC a 2006/95/EC. Dansk Dette produkt er i overensstemmelse med det europiske direktiv 2004/108/EC & 2006/95/EC. Dutch Dit product is in navolging van de bepalingen van Europees Directief 2004/108/EC & 2006/95/EC. Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC ja 2006/95/EC kehtestatud nuetele. Suomi Tm tuote noudattaa EU-direktiivin 2004/108/EC & 2006/95/EC mryksi. Franais Ce produit est conforme aux exigences de la Directive Europenne 2004/108/EC & 2006/95/EC. Deutsch Dieses Produkt entspricht den Bestimmungen der Europischen Richtlinie 2004/108/EC & 2006/95/EC. 2004/108/EC 2006/95/EC. Magyar E termk megfelel a 2004/108/EC s 2006/95/EC Eurpai Irnyelv elrsainak. Icelandic essi vara stenst regluger Evrpska Efnahags Bandalagsins nmer 2004/108/EC & 2006/95/EC. Italiano Questo prodotto conforme alla Direttiva Europea 2004/108/EC & 2006/95/EC. Latvieu is produkts atbilst Eiropas Direktvu 2004/108/EC un 2006/95/EC noteikumiem. Lietuvi is produktas atitinka Europos direktyv 2004/108/EC ir 2006/95/EC nuostatas. Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 2004/108/EC u 2006/95/EC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004/108/EC & 2006/95/EC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 2004/108/EC i 73/23/EWG. Portuguese Este produto cumpre com as normas da Diretiva Europia 2004/108/EC & 2006/95/EC.
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Espaol Este producto cumple con las normas del Directivo Europeo 2004/108/EC & 2006/95/EC. Slovensky Tento produkt je v slade s ustanoveniami eurpskych direktv 2004/108/EC a 2006/95/EC. Slovenina Izdelek je skladen z dolobami evropskih direktiv 2004/108/EC in 2006/95/EC. Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC & 2006/95/EC. Trke Bu rn, Avrupa Birliinin 2004/108/EC ve 2006/95/EC ynergelerine uyar.
5.1.3
Product Ecology Statements
The following information is provided to address worldwide product ecology concerns and regulations.
5.1.3.1
Disposal Considerations
This product contains the following materials that may be regulated upon disposal: lead solder on the printed wiring board assembly.
5.1.3.2
Recycling Considerations
As part of its commitment to environmental responsibility, Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intels branded products to return used products to selected locations for proper recycling. Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc. Intel Product Recycling Program http://www.intel.com/intel/other/ehs/product_ecology Deutsch Als Teil von Intels Engagement fr den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermglicht, gebrauchte Produkte an ausgewhlte Standorte fr ordnungsgemes Recycling zurckzugeben. Details zu diesem Programm, einschlielich der darin eingeschlossenen Produkte, verfgbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der http://www.intel.com/intel/other/ehs/product_ecology
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Espaol Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envo, trminos y condiciones, etc. Franais Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en uvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits uss en les retournant des adresses spcifies. Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en savoir plus sur ce programme, savoir les produits concerns, les adresses disponibles, les instructions d'expdition, les conditions gnrales, etc. http://www.intel.com/in tel/other/ehs/product_ecology Malay Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran, Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul. Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb. Portuguese Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos so reciclados de maneira adequada. Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Ingls) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponveis, as instrues de envio, os termos e condies, etc.
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Russian , Intel Intel (Product Recycling Program) Intel . , - http://www.intel.com/intel/other/ehs/product_ecology , , , , .. Trke Intel, evre sorumluluuna bamllnn bir paras olarak, perakende tketicilerin Intel markal kullanlm rnlerini belirlenmi merkezlere iade edip uygun ekilde geri dntrmesini amalayan Intel rnleri Geri Dnm Programn uygulamaya koymutur. Bu programn rn kapsam, rn iade merkezleri, nakliye talimatlar, kaytlar ve artlar v.s dahil btn ayrntlarn grenmek iin ltfen http://www.intel.com/intel/other/ehs/product_ecology Web sayfasna gidin.
5.1.3.3
Lead Free Intel Desktop Board
This Intel Desktop Board is a European Union Restriction of Hazardous Substances (EU RoHS Directive 2002/95/EC) compliant product. EU RoHS restricts the use of six materials. One of the six restricted materials is lead. This Intel Desktop Board is lead free although certain discrete components used on the board contain a small amount of lead which is necessary for component performance and/or reliability. This Intel Desktop Board is referred to as Lead-free second level interconnect. The board substrate and the solder connections from the board to the components (second-level connections) are all lead free. China bans the same substances and has the same limits as EU RoHS; however it requires different product marking and controlled substance information. The required mark shows the Environmental Friendly Usage Period (EFUP). The EFUP is defined as the number of years for which controlled listed substances will not leak or chemically deteriorate while in the product. Table 45 shows the various forms of the Lead-Free 2nd Level Interconnect mark as it appears on the board and accompanying collateral.
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Table 45. Lead-Free Board Markings

Description
Lead-Free 2 Level Interconnect: This symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in the board substrate and the solder connections from the board to the components (secondlevel interconnect) is not greater than 0.1% by weight (1000 ppm).
nd
Mark
or
or
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5.1.4
EMC Regulations
Intel Desktop Board D945GSEJT complies with the EMC regulations stated in Table 46 when correctly installed in a compatible host system. Table 46. EMC Regulations
Regulation
FCC 47 CFR Part 15, Subpart B ICES-003 Issue 4 EN55022:2006 EN55024:1998 EN55022:2006 CISPR 22:2005 +A1:2005 +A2:2006 CISPR 24:1997 +A1:2001 +A2:2002 VCCI V-3/2007.04, V-4/2007.04 KN-22, KN-24 CNS 13438:2006
Title
Title 47 of the Code of Federal Regulations, Part15, Subpart B, Radio Frequency Devices. (USA) Interference-Causing Equipment Standard, Digital Apparatus. (Canada) Limits and methods of measurement of Radio Interference Characteristics of Information Technology Equipment. (European Union) Information Technology Equipment Immunity Characteristics Limits and methods of measurement. (European Union) Australian Communications Authority, Standard for Electromagnetic Compatibility. (Australia and New Zealand) Limits and methods of measurement of Radio Disturbance Characteristics of Information Technology Equipment. (International) Information Technology Equipment Immunity Characteristics Limits and Methods of Measurement. (International) Voluntary Control for Interference by Information Technology Equipment. (Japan) Korean Communications Commission Framework Act on Telecommunications and Radio Waves Act (South Korea) Bureau of Standards, Metrology and Inspection (Taiwan)
Japanese Kanji statement translation: this is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.
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Korean Class B statement translation: this is household equipment that is certified to comply with EMC requirements. You may use this equipment in residential environments and other non-residential environments.
5.1.5
Product Certification Markings (Board Level)
Intel Desktop Board D945GSEJT has the product certification markings shown in Table 47: Table 47. Product Certification Markings
Description
UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel Desktop Boards: E210882. FCC Declaration of Conformity logo mark for Class B equipment. Includes Intel name and D945GSEJT model designation.
Mark
CE mark. Declaring compliance to European Union (EU) EMC directive and Low Voltage directive.
Australian Communications Authority (ACA) and New Zealand Radio Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel supplier code number, N-232. Japan VCCI (Voluntary Control Council for Interference) mark.
S. Korea KCC (Korean Communications Commission) mark. Includes adjacent KCC certification number: CPU-D945GSEJT (B) Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark. Includes adjacent Intel company number, D33025. Printed wiring board manufacturers recognition mark. Consists of a unique UL recognized manufacturers logo, along with a flammability rating (solder side). China RoHS/Environmentally Friendly Use Period Logo: This is an example of the symbol used on Intel Desktop Boards and associated collateral. The color of the mark may vary depending upon the application. The Environmental Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined to be 10 years. V-0
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5.2
Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.
PRECAUTION
Risque d'explosion si la pile usage est remplace par une pile de type incorrect. Les piles usages doivent tre recycles dans la mesure du possible. La mise au rebut des piles usages doit respecter les rglementations locales en vigueur en matire de protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier br om muligt genbruges. Bortskaffelse af brugte batterier br foreg i overensstemmelse med gldende miljlovgivning.
OBS!
Det kan oppst eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier br kastes i henhold til gjeldende miljlovgivning.
VIKTIGT!
Risk fr explosion om batteriet erstts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljvrdsbestmmelserna.
VARO
Rjhdysvaara, jos pariston tyyppi on vr. Paristot on kierrtettv, jos se on mahdollista. Kytetyt paristot on hvitettv paikallisten ympristmrysten mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.
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PRECAUCIN
Existe peligro de explosin si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENO
Haver risco de exploso se a bateria for substituda por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminao de baterias usadas deve ser feita de acordo com as regulamentaes ambientais da regio.
ACIAROZNA
, . , , . .
UPOZORNN
V ppad vmny baterie za nesprvn druh me dojt k vbuchu. Je-li to mon, baterie by mly bt recyklovny. Baterie je teba zlikvidovat v souladu s mstnmi pedpisy o ivotnm prosted.
. . .
VIGYAZAT
Ha a telepet nem a megfelel tpus telepre cserli, az felrobbanhat. A telepeket lehetsg szerint jra kell hasznostani. A hasznlt telepeket a helyi krnyezetvdelmi elrsoknak megfelelen kell kiselejtezni.
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AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan.
OSTRZEENIE
Istnieje niebezpieczestwo wybuchu w przypadku zastosowania niewaciwego typu baterii. Zuyte baterie naley w miar moliwoci utylizowa zgodnie z odpowiednimi przepisami ochrony rodowiska.
PRECAUIE
Risc de explozie, dac bateria este nlocuit cu un tip de baterie necorespunztor. Bateriile trebuie reciclate, dac este posibil. Depozitarea bateriilor uzate trebuie s respecte reglementrile locale privind protecia mediului.
. . , .
UPOZORNENIE
Ak batriu vymente za nesprvny typ, hroz nebezpeenstvo jej vbuchu. Batrie by sa mali poda monosti vdy recyklova. Likvidcia pouitch batri sa mus vykonva v slade s miestnymi predpismi na ochranu ivotnho prostredia.
POZOR
Zamenjava baterije z baterijo druganega tipa lahko povzroi eksplozijo. e je mogoe, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi.
UYARI
Yanl trde pil takldnda patlama riski vardr. Piller mmkn olduunda geri dntrlmelidir. Kullanlm piller, yerel evre yasalarna uygun olarak atlmaldr.
O
, . , . , .
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D945GSEJT TechProdSpec

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Intel Desktop Board D945GSEJT

Technical Product Specification

April 2009 Order Number: E62862-001US

What This Document Contains

Notes, Cautions, and Warnings

Intel Desktop Board D945GSEJT Technical Product Specification

Other Common Notation

Intel Desktop Board D945GSEJT Technical Product Specification

3 Overview of BIOS Features

4 Board Status and Error Messages

5 Regulatory Compliance and Battery Disposal Information

Intel Desktop Board D945GSEJT Technical Product Specification

Intel Desktop Board D945GSEJT Technical Product Specification

Table 1. Feature Summary (continued)

Figure 1-1 shows the location of the major components.

Intel Desktop Board D945GSEJT Technical Product Specification

Table 2. Board Components Shown in Figure 1-1

Figure 1-2 is a block diagram of the major functional areas.

Figure 1-2. Block Diagram

Intel Desktop Board D945GSEJT Technical Product Specification

Visit this World Wide Web site:

Intel Desktop Board D945GSEJT Technical Product Specification

Mobile Intel 945GSE Chipset

The Mobile Intel 945GSE chipset consists of the following devices:

Intel 945GSE Graphics Subsystem

For information about

Video Memory Allocation

Analog Display (VGA)

Digital Visual Interface (DVI)

Intel Desktop Board D945GSEJT Technical Product Specification

The board provides three ATA interface connectors:

For information about

Intel Desktop Board D945GSEJT Technical Product Specification

Real-Time Clock Subsystem

Legacy I/O Controller

The Legacy I/O Controller provides the following features:

PS/2 Keyboard Interface

A PS/2 keyboard port is implemented as a 6-pin header on the board.

The audio subsystem consists of the following devices:

The audio subsystem supports the following audio interfaces:

Intel Desktop Board D945GSEJT Technical Product Specification

Audio Subsystem Drivers

Audio Connectors and Headers

The LAN subsystem consists of the following:

Additional features of the LAN subsystem include:

LAN Subsystem Drivers

Intel Desktop Board D945GSEJT Technical Product Specification

RJ-45 LAN Connector with Integrated LEDs

1.10 Hardware Management Subsystem

Figure 1-4. Thermal Sensors and Fan Headers

Intel Desktop Board D945GSEJT Technical Product Specification

1.11 Power Management

and the power switch is pressed for

the system enters this state

System States and Power States

Targeted System Power (Note 1)

G1 sleeping state G1 sleeping state G2/S5

Power < 5 W (Note 2)

Power < 5 W (Note 2)

Power < 5 W (Note 2)

G3 mechanical off. AC power is disconnected from the computer. Notes: 1. 2.

No power to the system. Service can be performed safely.