Power 7 Technical Excellence
Power 7 Technical Excellence
Watson
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Agenda.
POWER7 Processor
POWER7 Servers
Power 750
Power 755
Power 770
Power 780
Power Blades
Gee Whiz Peak
Memory Expansion
VM Control
Green Technologies
Availability
595
Power 780
Power 770
Power 750
520
575
Operating Systems
BladeCenter
JS12 / JS22
JS23 / JS43
Power your planet
Power 755
Instruction Retry
Green Technology built in
Common architecture from Blades to High-end
Performance
Power
Virtualization
Consolidate
to higher levels
Virtualize Processors, Memory, and I/O
Dynamic movement of Partitions and Applications
Reduce infrastructure costs
RAS
Power
POWER7 Processor
POWER7
Processor
POWER7
POWER8
45 nm
POWER6
65 nm
POWER5
130 nm
POWER4
180 nm
Dual Core
Chip Multi Processing
Distributed Switch
Shared L2
Dynamic LPARs (32)
Dual Core
Enhanced Scaling
SMT
Distributed Switch +
Core Parallelism +
FP Performance +
Memory bandwidth +
Virtualization
2001
2004
Dual Core
High Frequencies
Virtualization +
Memory Subsystem +
Altivec
Instruction Retry
Dyn Energy Mgmt
SMT +
Protection Keys
2007
Multi Core
On-Chip eDRAM
Power Optimized Cores
Mem Subsystem ++
SMT++
Reliability +
VSM & VSX (AltiVec)
Protection Keys+
Concept Phase
2010
2010 IBM Corporation
Processor Designs
POWER5
POWER5+
POWER6
POWER7
Technology
130 nm
90 nm
60 nm
45 nm
Size
389 mm2
245 mm2
341 mm2
567 mm2
Transistors
276 M
276 M
790 M
1.2 B
Cores
4/6/8
Frequencies
1.65 GHz
1.9 GHz
3-5 GHz
3-4 GHz
L2 Cache
256 KB / Core
L3 Cache
36 MB
36 MB
32 MB
4 MB / Core
Memory
Cntrl
2/1
LPAR
10 / Core
10 / Core
10 / Core
10 / Core
F
A
S
T
567mm2 Technology:
POWER7
CORE
POWER7
CORE
POWER7
CORE
L2 Cache
L2 Cache
L2 Cache
MC1
L3 Cache and
Chip Interconnect
L2 Cache
L2 Cache
L2 Cache
POWER7
CORE
POWER7
CORE
POWER7
CORE
POWER7
CORE
L2 Cache
Transistors: 1.2 B
L3 REGION
MC0
Scalability up to 32 Sockets
eDRAM technology
IBMs eDRAM technology benefits: Greater density, Less power
requirements, Fewer soft errors, and Better performance
Enables POWER7 to provide 32MB of internal L3 Cache
EDRAM Cell
L3 Cache critical to balanced design / performance:
6:1 Latency improvement for L3 accesses vs external L3
2X Bandwidth improvement with on chip interconnect. 32B busses
to and from each core
No off chip driver or receivers in L3 access path.
POWER7 Core
64-bit PowerPC architecture v2.07
Execution Units
2 Fixed Point Units
2 Load Store Units
4 Double Precision Floating Point Units
1 Branch
1 Condition Register
1 Vector Unit
1 Decimal Floating Point Unit
6 Wide Dispatch
Units include distributed Recovery Function
VSX
FPU
DFU
ISU
FXU
IFU
CRU/BRU
LSU
L2 Cache
IBM i
Release
Max Cores
& Threads Supported
POWER6
Mode
POWER7
Mode
IBM i 6.1
32 / 64
32 / 128
Special
Support
64/128
32 / 128
IBM i 7.1
32 / 64
Special
Support
64/128
AIX
Release/TL
Max Cores
& Threads Supported
POWER6
Mode
POWER7
Mode
AIX 5.3
(All TLs
Supported
64 / 128
N/A
64 / 128
N/A
32 / 128
64 / 128
64 / 256
64 / 256
64 / 128
64 / 256
AIX 7.1
64 / 128
256 / 1024
2010 IBM Corporation
15
Max Processors
& Threads Supported
POWER6 Mode
POWER7 Mode
64 / 128
N/A
64 / 128
N/A
64 / 128
256 / 1024
64 / 128
256 / 1024
POWER7 Design
Physical Design:
8 cores with integrated cache and
memory controllers
4 / 6 / 8 Core options
45nm technology
Features:
4th Generation SMP Fabric Bus
3rd Generation Multi-Threading
New Power Bus
Energy Optimized Design
Multiple Memory Controllers
DDR3 memory support
Enhanced GX System Buses
On-Chip L2/L3 Cache
eDRAM L3 Cache
Industry Standard IO
P
O
W
E
R
Core
Core
Core
Core
L2
L2
L2
L2
G
X
B
U
S
L3 Cache
L2
L2
L2
L2
Core
Core
Core
Core
S
M
P
F
A
B
R
I
C
Memory Interface
L3
Ctrl
Core Vec
4 MB
L2
4 MB
L2
Memory
Cntrl
L3
Alti
Core
Fabric Bus
Controller
GX Bus Cntrl
L3
Ctrl
Memory
Cntrl
Alti
Vec
POWER7
Core
Core
Core
Core
L2
L2
L2
L2
G
X
B
U
S
L3 Cache
L2
L2
L2
L2
Core
Core
Core
Core
S
M
P
F
A
B
R
I
C
Memory Interface
GX+
Bridge
Memory+
L3
P
O
W
E
R
Memory+
Memory++
POWER6
POWER7
Memory Performance:
2x DIMM
Memory Performance:
4x DIMM
Memory Performance:
6x DIMM
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
Multi-threading Evolution
Single thread Out of Order
FX0
FX1
FP0
FP1
LS0
LS1
BRX
CRL
FX0
FX1
FP0
FP1
LS0
LS1
BRX
CRL
FX0
FX1
FP0
FP1
LS0
LS1
BRX
CRL
No Thread Executing
Thread 2
Executing
Thread 0
Executing
Thread 3
Thread 1
Executing
Executing
2010 IBM Corporation
Power POWER7
780 TurboCore
Chip Chip
L3 = 32 MB
P
O
W
E
R
Core
Core
Core
Core
L2
L2
L2
L2
32 MB
L3 Cache
G
X
B
U
S
L2
L2
L2
L2
Core
Core
Core
Core
S
M
P
F
A
B
R
I
C
Memory Interface
TurboCores
Power your planet
Unused
Core
2010 IBM Corporation
Core
Core
Core
Core
L2
L2
L2
L2
G
X
B
U
S
24 MB L3 Cache
L2
L2
L2
L2
Core
Core
Core
Core
S
M
P
F
A
B
R
I
C
Memory Interface
POWER7 SMT4
Requires POWER7 Mode
IBM Confidential
MaxCore option
All cores active
Compute Intensive
Quad-chip MCM
Massive Scale-Out
POWER7 Offerings
Power 780
Power 750
Power 755
Power your planet
Power 770
2010 IBM Corporation
POWER7
Core Offerings
Yes
Yes
Power 750
Yes
Yes (3)
Power 755
Yes
Sockets
Configuration Options
2
6 Core Chips
6 Cores
12 Cores
18 Cores
24 Cores
8 Core Chips
8 Cores
16 Cores
24 Cores
32 Cores
4 TurboCore
8 Base
8 Enhanced
Power 770
Yes
Yes
Power 780
Yes
Yes
Enclosures
Configuration Options
1
2
4 Core Chips
8 Cores
16 Cores
24 Cores
32 Cores
6 Core Chips
12 Cores
24 Cores
36 Cores
48 Cores
8 Core Chips
16 Cores
32 Cores
48 Cores
64 Cores
Energy
Management
EnergyScale
EnergyScale is IBM Trademark. It consists of a built-in Thermal Power Management
Device (TPMD) card and Power Executive software.
IBM Systems Director is also required to manage Energy-Scale functions.
EnergyScale is used to dynamically optimizes the processor performance versus
processor power and system workload.
IBM Systems Director is also required to manage AEM functions and supports the
following functions:
Power Trending
Thermal Reporting
Static Energy Saver Mode
Dynamic Energy Saver Mode
Energy Capping
Soft Energy Capping
Processor Nap
Energy Optimized Fan Control
Altitude Input
Processor Folding
31
Definition of Terms
Energy Trending
EnergyScale provides continuous collection of real-time server
energy consumption. This energy usage data may be displayed or
exported by IBM Systems Director Active Energy Manager.
Thermal Reporting
A measured ambient temperature and a calculated exhaust heat
index temperature can be displayed from Active Energy Manager.
This information can help identify data center hot-spots that need
attention.
32
Definition of Terms
StaticEnergy Saver Mode
Static Energy Saver lowers the processor frequency and voltage on
an Power 750 a fixed amount, reducing the energy consumption of
the system while still delivering predictable performance.
33
Energy Saver varies processor frequency and voltage based on the utilization of the
Power 750 POWER7 processors.
The
Processor
frequency and utilization are inversely proportional for most workloads, implying that as
the frequency of a processor increases, its utilization decreases, given a constant workload.
Dynamic
Energy Saver takes advantage of this relationship to detect opportunities to save power,
based on measured real-time system utilization.
When
a system is idle, the system firmware will lower the frequency and voltage to Static Energy
Saver values.
When
fully utilized, the maximum frequency will vary, depending on whether the user favors
power savings or system performance.
If an administrator prefers energy savings and a system is fully-utilized, the system will reduce
the maximum frequency to 95% of nominal values.
If performance is favored over energy consumption, the maximum frequency will be at least
100% of nominal.
Dynamic Energy Saver is mutually exclusive with Static Power Saver mode.
Only one of these modes may be enabled at a given time.
34
The user must set and enable an energy cap from the Active Energy
Manager user interface.
The main purpose of the energy cap is not to save energy but rather
to allow a data center operator the ability to reallocate energy from
current systems to new systems by reducing the margin assigned to
the existing machines.
35
Setting
Soft
If
36
When
The
When
37
Unlicensed
cores are kept in core Nap until they are licensed and
return to core Nap whenever they are unlicensed again.
38
In
When
When
System
39
Processor
40
POWER7
TPMD
energy usage
Measure cooling costs accurately
Monitor IT costs across components
Manage by department and/or user
Active Energy Manager also provides a source of energy management data that can be
exploited by Tivoli enterprise solutions such as IBM Tivoli Monitoring and IBM Tivoli
Usage and Accounting Manager.
44
POWER7
Model 750
46
4U
Depth: 28.8
POWER7 Architecture
DDR3 Memory
Up to 512 GB
System Unit
IO Expansion Slots
Yes
System Unit
Integrated Ports
Quad 10/100/1000
Optional: Dual 10 Gb
Cluster
Certification (SoD)
EnergyScale
Dual Power
Supplies
Half-High Bay
Up to 4
Processor / Memory
Cards
DVD
Fans
8 SFF Bays
(Disk or SSD)
DVD Drive
Power
Supplies
49
IVE
Ethernet
PCIe
Slot 2
or
GX+ Slot
PCIX
Slot 4
SPCN
System
Port 1
System
Port 2
USB
Ports
HMC
Ports
PCIe
Slot 1
or
GX++ Slot
PCIe
Slot 3
PCIX
Slot 5
50
Processor Card
Processor
VRM
4 DIMM Slots
POWER7
chip
4 DIMM Slots
Memory VRM
Processor Cards
6-core 3.3 GHz
#8335 1 to 4 per
server
8-core 3.0 GHz
#8332 1 to 4 per
server
8-core 3.3 GHz
#8334 1 to 4 per
All processor cards on the same server must be identical feature code
server
8-core
#8336 4 per server
Power your
planet3.55 GHz
51
Power
Supply 1
Power
Supply 2
Anchor Card
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
SN
SN
SN
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
SN
SN
SN
SN
SN
SN
POWER7
Chip
POWER7
Chip
POWER7
Chip
POWER7
Chip
SN
SPCN1
SPCN2
HMC1
HMC2
S1
S2
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
SN
SN
SN
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
SN
SN
SN
GX++ Slot
TPMD
FSP
GX+ Slot
MUX
Tape Drive
SLIM
DVD
8 SFF / SSD
DASD
Op-Panel
Ext SAS
DASD
&
Media
Back
Plane
USB
PCI-X S5
PCI-X S4
PCIe S3
PCIe S2
PCIe S1
SAS
Controller
IO Controller
USB
USB
USB
ENET
PHY
RJ45
RJ45
ENET
PHY
RJ45
RJ45
52
DIMM
Size
Memory
Speed
750 Max
Memory
8 GB
4 GB
1066 MHz
128 GB
16 GB
8 GB
1066 MHz
256 GB
32 GB
16 GB
1066 MHz
512 GB
Power 755
Feature
Size (2 DIMM)
DIMM
Size
Memory
Speed
750 Max
Memory
8 GB
4 GB
1066 MHz
128 GB
16 GB
8 GB
1066 MHz
256 GB
# Proc card
DIMM slots
16
24
32
8 / 256
8 / 384
8 / 512
Min/Max GB 8 / 128
Min = 1 feature per SERVER, but min 1 feat per Proc card recommended
Can NOT mix different size DIMMs on same processor card
Can have different size DIMMs on same server.
The following is for ONE processor card in the Power 750
One proc card GB memory capacity with
1 Pair
2 Pair
3 Pair
4 Pair
Feature
Code
4 GB
16
24
32
#4526
16
8 GB
16
32
48
64
#4527
32
16 GB
32
64
96
128
#4528
64
DIMM size
Feature
GB
Mem
Cntrl
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
D
D
R
3
Nova
Nova
Chip Bandwidth
Max Read Bandwidth:
51.168 GB/sec
Max Write Bandwidth:
25.584 GB/sec
Max Combined Bandwidth: 68.224 GB/sec
Bandwidth
L1 ( Data )
170.4 GB/sec
L2
170.4 GB/sec
L3
113.6 GB/sec
Memory
Intra-Node
Buses
6.4 GB/sec
20 GB/sec
10 GB/sec ( Shared )
20 GB/sec
5** GB/sec
5** GB/sec
30 GB/sec
GX Bus Slot 1
GX Bus Slot 2
Internal IO Slots
Total IO Bandwidth
** Pass thru bus
Peak
Bandwidth
GX+
Internal
Slots
1.25 GHz
PCIe x8
2.5 GHz
2 GB/s simplex
4 GB/s duplex
GX++
(12X DDR)
2.5 GHz
PCIe x8
2.5 GHz
GX+
(Pass-Thru)
PCIe x8
Slot # Description
N/A
Card Size
Concurrent
Maintenance
Connector
N/A
Standard PCI
Short card
Hot Plug
PCIe x8
Short card
No Hot Plug
GX++ Bus
2 GB/s simplex
4 GB/s duplex
Standard PCI
Short card
Hot Plug
PCIe x8
625 MHz
Short card
No Hot Plug
GX+ Bus
2.5 GHz
2 GB/s simplex
4 GB/s duplex
Standard PCI
Long card
Hot Plug
PCIe x8
266 MHz
2.13 GB/s
Standard PCI
Long card
Hot Plug
PCI-X 64b
266 MHz
2.13 GB/s
Standard PCI
Long card
Hot Plug
PCI-X 64b
Slot 1
Slot 2
Slot 3
10 GB/s simplex
20 GB/s duplex
Max
Number
Description
Status
FC 5796
Available
12X
FC 5802
Available
12X
FC 5877
Available
12X
FC 5886
Available
12X
48
7314-G30
Interface
Supported 12X
FC 5786
Supported SCSI
24
FC 5787
(Power 750)
Supported SCSI
24
7031-D24
7031-T24
Supported
24
SCSI
750
20
GB
PCIe
20
GB
20
GB
750
5**
GB
PCIe
PCIe
PCIe
PCIe
PCIe
750
5**
GB
20
GB
PCIe
PCIe
PCIe
PCIe
PCI-X
+
+
PCI-X
750
PCIe
+
+
Two IO Drawers
Recommendations
PCIe drawers (12X DDR) on
GX++ (12X DDR)
PCI-X drawers (12X SDR) on
GX+ (12X SDR)
Rules:
Can not mix PCI-X and PCIe
drawers on the same 12X loop
GX+ or GX++ can attach either
PCIe or PCI-X drawers
Power your planet
PCIe
PCIe
Three IO Drawers
PCI-X
PCI-X
750
PCI-X
+
+
PCIe
PCIe
Five IO Drawers
2010 IBM Corporation
Where 4 SFF DASD on left (from front view) are assigned to the integrated SAS controller, and 4 SFF
DASD on right are assigned to the external rear SAS port.
A PCIe or PCI-X SAS adapter (such as FC 5900 or FC 5901) can access the right 4 SFF
DASD via an external SAS cable as shown on a picture below.
Note that the internal Split DASD Mode SAS cable FC 3669 replaces the internal SAS cable
FC 3668.
61
Lower
62
Operating voltage:
200 to 240 V
Operating Frequency: 50/60 Hz
Power Consumption: 1950 watts (maximum)
Power Factor: 0.97
Thermal Output: 4778 Btu/hour (maximum)
Power-source Loading
1.443 KVA (maximum configuration)
Noise Level and Sound
Rack-mount drawer: 7.0 Bels operating
Functional Differences
Power 550
Power 750
Up to 8 Cores (4 sockets)
Up to 32 Cores (4 sockets)
Up to 256 GB Memory
32 DIMM slots
Up to 512 GB Memory
32 DIMM slots
DDR2 DIMMS
DDR3 DIMMs
Commercial focus
IVE: Dual Gb
Optional: Quad Gb, or 10 Gb
IVE: Quad Gb
Optional: Dual 10 Gb
TPMD
Enhanced TPMD
Guiding Light
Light Path
Comparative Information.
Bandwidth Properties
Power 550
8 Core
@ 5GHz
Power 560
16 Core
@ 3.6GHz
Power 750
32 Core
@ 3.55GHz
Performance* / K BTU
POWER7
Model 755
73
Power 755
DDR3 Memory
System Unit
SAS SFF Bays
Up to 8 disk or SSD
73 / 146 / 300GB @ 15K (up to 2.4TB)
System Unit
Expansion
Integrated Ports
Integrated Ethernet
Cluster
Up to 64 nodes
Ethernet or IB-DDR
Redundant Power
Certifications (SoD)
EnergyScale
4U x 28.8 depth
Up to 8.4 TFlops per Rack
( 10 nodes per Rack )
5.3 / 6.1
RHEL / SLES
Power
Supply 1
Power
Supply 2
Anchor Card
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
SN
SN
SN
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
SN
SN
SN
SN
SN
SN
POWER7
Core
POWER7
Chip
POWER7
Chip
POWER7
Chip
SN
SPCN1
SPCN2
HMC1
HMC2
S1
S2
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
SN
SN
SN
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
SN
SN
SN
GX++ Slot
TPMD
FSP
MUX
SLIM
DVD
8 SFF / SSD
DASD
Op-Panel
Ext SAS
DASD
&
Media
Back
Plane
USB
PCI-X S5
PCI-X S4
PCIe S3
PCIe S2
PCIe S1
SAS
Controller
IO Controller
USB
USB
USB
ENET
PHY
RJ45
RJ45
ENET
PHY
RJ45
RJ45
75
IB-DDR
Interconnect
Scaling
Operating
Systems
AIX 6.1 TL 04 / 05
Linux
HPC Stack
Levels
xCAT v2.3.x
GPFS v3.3.x
PESSL v3.3.x
LL v4.1.x
PE v5.2.x
ESSL
Compilers
GA Levels
XLF v13.1
VAC/C++ v11.1
Latency (cycles/ns)
Bus
Memory Controllers
per chip
Peak Bandwidth
per chip
DRAM Technology
POWER5+ 575
(1.9GHz)
Power 575
(4.7GHz)
Power 755
(3.3GHz)
2 X DRAM Freq
4 X DRAM Freq
6 X DRAM Freq
1 per chip
1 (2 in HE)
25GB/s
34GB/s
68 GB/s
DDR2
DDR2
DDR3
Power 575
Cores/chip
Total cores
32
32
Frequency
3.3 GHz
4.7 GHz
Memory (max)
256 GB
256 GB
Performance /
TFlops
.84
.6
Cooling
Air
Water
Cores/rack
Rack type
320
19
448
24
Power (Watts)
(Linpack)
1650
5400
750
755
Processors
Memory
128GB OR 256GB
4GB & 8GB DIMMS
512GB Max.
4GB, 8GB, 16GB DIMMS
GX slot support
Yes IB clustering
Yes
No
Yes
DASD Backplane
No Split Backplane
Integrated Ethernet
Virtualization
No PowerVM support
DASD / Bays
Internal Tape
No
Yes
Performance Metric
TFLOPS
rPerf
Misc.
No IBM i Support
No H/W Raid Cards
IBM i Support
H/W Raid Cards
Add or Replace
Both
Both
Both
Both
Replace
Both
Replace
Add
Add
Add
Add
Concurrent
Upgrade
No
No
Yes
No
No
Yes
Yes
No
No
Yes
Yes
Customer
Installable
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
80
POWER7
Model 770
Model 780
Power 770
Power 770
Processor Technology
L3 Cache
4U x 32 inches Depth
Yes
Redundant Clock
Yes
Concurrent Service
Yes
System Unit
Single Enclosure
4 Enclosures
Processors
Up to 2 Sockets
8 Sockets
Up to 512 GB
Up to 2 TB
24
1 Slim-line
4 Slim-line
2/1
8/4
6 PCIe
24 PCIe
PCIe bays
GX++ Slots (12X DDR)
Maint Coverage: 9 x 5
Integrated Ethernet
USB
12X I/O Drawers w/ PCI slots
On Chip
Power 780
Power 780
Processor Technology
L3 Cache
Yes
Redundant Clock
Yes
Concurrent Service
Yes
System Unit
Single Enclosure
4 Enclosures
Processors
2 Sockets
8 Sockets
Up to 512 GB
Up to 2 TB
24
PowerCare Support
1 Slim-line
4 Slim-line
2/1
8/4
6 PCIe
24 PCIe
PCIe (CEC)
GX++ Slots (12X DDR)
Integrated Ethernet
USB
12X I/O Drawers w/ PCI slots
On Chip
Maint Coverage
24 X 7
TurboCore
GX
Slots
PCIe
Slots
POWER7
Processor
Chip
16 DIMM slots
TPMD
6 SFF
Bays
FSP
POWER7
Processor
Chip
Interconnect
Fabric
Interconnects
DVD
6 SFF Bays
Op Panel
HMC
HMC
Ports
Ports
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
Two Power
Supplies
SPCN
Ports
IVE
Ports
USB
Ports
Serial
Port
Memory DIMMs
Qty: 4
GX++ (12X)
Power
Socket
Fan
PCIe Slot
Fan
Regulator
Memory DIMMs
Qty: 8
PCIe Slot
PCIe Slot
Fan
PCIe Slot
TPMD
Socket
Fan
Memory DIMMs
Qty: 4
PCIe Slot
PCIe Slot
Socket
Memory
8 SN
Dimms
A/B Buses
A/B Buses
DRAM
DRAM
DRAM
DRAM
SN
SN
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
PWR7
DRAM
DRAM
PWR7
DRAM
DRAM
SN
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
PSI
TPMD
GX++
Busses
PSI
GX++
Busses
I/O
Backplane
IOC2
PCI-X
IVE
PCIe
Buses
P
C
I
e
P
C
I
e
GX++
GX++
Write Cache
SAS
EXP
SAS
EXP
Write Cache
PCIe Buses
P
C
I
e
DRAM
DRAM
PCI-X
P
C
I
e
DRAM
DRAM
IOC2
2 x HMC
DRAM
8 SN
Dimms
SN
CPU CARD
FSP
Card
X Bus
Y Bus
Z Bus
DRAM
P
C
I
e
P
C
I
e
IVE
USB
SATA
Media
DASD Backplane
Serial
Anchor
Card
Ext
SAS
IVE
RAID
RAID
Battery Battery
USB Serial
4 x 1Gb Eth
Cooling Domains
Fans (5)
Air Flow Domain 1
Front
Rear
DDR3
Super
Nova
DDR3
DDR3
DDR3
Feature
Size (4 DIMM card)
4Q10 planned
DDR3
DIMM
Size
Memory
Speed
DDR3
DDR3
DDR3
Max
Memory
32 GB
8 GB
1066 MHz
512 GB
64 GB
16 GB
1066 MHz
1 TB
128 GB
32 GB
800 MHz
2 TB
POWER7
Chip
A
Mem B
Ctrl 1 C
D
D
Mem C
Ctrl 0 B
A
DIMM 1
SN
DIMM 2
SN
DIMM 3
SN
DIMM 4
SN
DIMM 5
SN
DIMM 6
SN
DIMM 7
SN
DIMM 8
SN
Nova
Cntrl
Nova
DRAMs
DRAMs
Nova
Cntrl
Nova
Nova
DDR3
Mem
DDR3 DDR3
DDR3 DDR3
DDR3 DDR3
DDR3 DDR3
DDR3
Nova
DDR3
POWER7
DDR3
Nova
DDR3 DDR3
DDR3 DDR3
DDR3 DDR3
DDR3 DDR3
DDR3 DDR3
DDR3 DDR3
Super
Nova
DDR3 DDR3
DDR3
DDR3
DDR3 DDR3
DDR3 DDR3
DDR3 DDR3
DDR3 DDR3
DDR3
DDR3
DDR3 DDR3
770 & Power 780 support one serial port in the rear of the system.
Connector is a standard 9-pin male D-shell & it supports RS232 interface.
Power 770 & Power 780 is a HMC managed system, this serial port is always
OS controlled and therefore available in any system configuration.
It is support any serial device that has an OS Device Driver.
The FSP virtual console will be on the HMC
AIX and Linux use only, No IBM i
USB Controller
USB
#1803
4x 1Gb Ports
FC #1804
2x 10Gb + 2x 1Gb (RJ-45)
Optical Transceiver ports
FC # 1813
2x 10Gb + 2x 1Gb (RJ-45)
Copper Twinax (Not AS/400 5250 twinax)
OS Support
AIX,
1
FC #3711
2
FC #3712
2
FC #3712
FC #3713
Two cables
2
FC #3712
FC #3713
Two cables
FC #3714
Three cables
CEC Enclosure 1
Drw to Drw
Connection
FSP/ Clock
CEC Enclosure 2
Drw to Drw
Connection
Drw to Drw
Connection
CEC Enclosure 3
CEC Enclosure 4
Rear
Front
2010 IBM Corporation
Enclosure 1
Cable 1
Enclosure 2
Enclosure 3
Cable 2
Enclosure 4
Cable 3
For a Power 780 door with the pretty 780 label, order as feat code of 7014-T42 rack.
SAS
SAS
SAS
SAS
PCIe SAS
SAS / SAS
+ cache
supported
No mixing of SSDs and HDDs with a split domain
No mirroring between SSD drives and HDD drives
supported
No mixing of SSDs and HDDs with a split domain
No mirroring between SSD drives and HDD drives
supported
Can install both SSD and HDD in internal bays
No mixing within a RAID array.
Status
FC 5796
Available
12X
32
FC 5802
Available
12X
16
FC 5877
Available
12X
16
FC 5886
Available
12X
110
7314-G30
Interface
Max
Number
Description
Supported 12X
32
FC 5786
Supported SCSI
60
7031-D24
7031-T24
Supported
60
SCSI
Bandwidth
L1 ( Data )
148.8 GB/sec
L2
148.8 GB/sec
L3
99.2 GB/sec
Memory
4 Nodes
Inter-Node
Buses (4 Nodes)
158.016 GB/sec
Intra-Node
Buses (4 Nodes)
415.744 GB/sec
19.712 GB/sec
78.848 GB/sec
39.424 GB/sec
157.696 GB/sec
Total IO
( 4 Enclosures )
236.544 GB /sec
Bandwidth
L1 ( Data )
185.28 GB/sec
L2
185.28GB/sec
L3
123.52 GB/sec
Memory
4 Nodes
Inter-Node
Buses (4 Nodes)
158.016 GB/sec
Intra-Node
Buses (4 Nodes)
415.744 GB/sec
19.712 GB/sec
78.848 GB/sec
39.424 GB/sec
157.696 GB/sec
Total IO
( 4 Enclosures )
236.544 GB /sec
Bandwidth
L1 ( Data )
198.72 GB/sec
L2
198.72 GB/sec
L3
132.48 GB/sec
Memory
4 Nodes
Inter-Node
Buses (4 Nodes)
158.016 GB/sec
Intra-Node
Buses (4 Nodes)
415.744 GB/sec
19.712 GB/sec
78.848 GB/sec
39.424 GB/sec
157.696 GB/sec
Total IO
( 4 Enclosures )
236.544 GB /sec
PCIe
770
780
770
780
PCIe
PCIe
770
780
PCIe
770
780
770
780
Two PCIe IO Drawers
PCIe
770
780
PCIe
770
780
PCIe
PCIe
PCIe
PCIe
Four PCIe IO Drawers
Up to 8 sockets, Up to 32 Cores
Up to 8 Sockets, Up to 64 cores
Up to 768 GB Memory
DDR2 DIMMS
DDR3 DIMMS
Comparative Information.
rPerf / KBTU
rPerf Performance
Estimated CPW values, not final. Final numbers will be available with announcement.
780
595
POWER6
Processors
12 - 48 / 16 - 64
8 32 / 16 - 64
8 64
( Upgradeable to 256 Cores)
Frequency
3.1 GHz
3.5 GHz ( 6 Core )
3.55 GHz
4.14 Core ( 4 Core )
4.2 GHz
5.0 GHz
21 / 16 GB
32 / 16 GB
64 GB
Nodes
Memory / core
rPerf
493.37 / 579.39
418.64 / 685.09
553
Memory
Bandwidth
1088 GB/sec
1088 GB/sec
1376 GB / sec
IO Bandwidth
236 GB /sec
236 GB/sec
640 GB/sec
9x5
24 x 7
24 x 7
No
Yes
Yes
Warranty
PowerCare
POWER7
Performance
Note:
Go to system sales or PartnerInfo and
download esbmi and select the charts that
are most appropriate for your use.
Due to the constantly changing nature of
benchmark standings, those charts are kept
separate & updated the 2nd of every month.
POWER4 POWER4+
p670
p670
1.5 GHz
1.1 GHz
rPerf: 24.46 rPerf: 46.79
KWatts: 6.71 KWatts: 6.71
6.97
3.64
POWER7
Odds and Ends
750:
Power 755
Power 770 / 780:
PS700
PS701
PS702
HMC Support
HMC V7 R710 is the minimum level for POWER7 support
HMC used to manage any POWER7 processor based server, must
be a CR3 or later model rack-mount HMC or C05 or later deskside
HMC.
POWER7
OS Support
04/2010
AIX 5.3
10/2010
04/2011
10/2011
TL8
TL9
TL10
SP
SP
TL11
TL11 SP
TL12
AIX 6.1
TL1
TL2
TL3
SP
SP
TL4
TL4
SP
TL5
TL6
TL7
SP
Service Pack
POWER7 Support
TL8
TL0
AIX 7.1
Power your planet
TL1
TL2
2010 IBM Corporation
Partition Mobility
POWER6
POWER6+
POWER7
POWER7 Processor
POWER7
Active Memory
Expansion
True
Memory
True
Memory
Expanded
Memory
Expanded
Memory
Expanded
Memory
True
Memory
True
Memory
True
Memory
Expanded
Memory
Expanded
Memory
Expanded
Memory
Effectively up
to 100% more
memory
POWER7 Advantage
Expand memory beyond physical limits
More effective server consolidation
Run more application workload / users per partition
Run more partitions and more workload per server
60-Day Trial
Planning Tool
A. Part of AIX 6.1 TL4
B. Calculates data
compressibility &
estimates CPU
overhead due to Active
Memory Expansion
C. Provides initial
recommendations
3
Deploy into Production
A. One-time, temporarily
enablement
B. Config LPAR based
on planning tool
C. Use AIX tools to
monitor Act Mem Exp
environment
D. Tune based on actual
results
A. Permanently enable
Active Memory
Expansion
B. Deploy workload
into production
C. Continue to monitor
workload using AIX
performance tools
Memory Expansion
Performance
App. Performance
Estimated Results
CPU Utilization
CPU Utilization
Actual Results
Memory Expansion
Time
Memory Expansion
True Memory
Modeled Size
-------------6.75 GB
6.25 GB
5.75 GB
Modeled
Gain
----------------1.25 GB [ 19%]
1.75 GB [ 28%]
2.25 GB [ 39%]
Estimate
----------0.00
0.20
0.35
1.51
5.50 GB
0.58
1.61
5.00 GB
3.00 GB [ 60%]
1.46
True Memory
Modeled Size
-------------6.75 GB
6.25 GB
5.75 GB
5.50 GB
5.00 GB
output
ample
S
Memory
CPU Usage
Modeled
Gain
----------------1.25 GB [ 19%]
1.75 GB [ 28%]
2.25 GB [ 39%]
2.50 GB [ 45%]
3.00 GB [ 60%]
5.5 true
8.0 max
Estimate
----------0.00
0.20
0.35
0.58
1.46
POWER7 Processor
Upgrades
POWER6+ 570/32
4.2 GHz
Power 780
3.8 GHz / 4.1 GHz
POWER6+ 570
9179-MHB
POWER6 570
3.5, 4,2, 4.7 GHz
9117-MMA
Power 770
3.5 GHz
9117-MMB
POWER6+ 570/32
9117-MMA 4.2 GHz
POWER7 780
9179-MHB 3.8 / 4.1 GHz
POWER7 770
9117-MMB 3.5 GHz
POWER6+ 570
9117-MMA 4.4, 5.0 GHz
POWER7 770
POWER6 570
POWER6 570
9406-MMA 4.7 GHz
Power your planet
POWER7 Processor
RAS
Ref: ITIC 2009 Global Server Hardware and Server OS Reliability Survey
Dual Clocks
770/780
Concurrent Add: 770/780
Eliminates Upgrade outages
Concurrent Service{ 770/780
Eliminates Repair Outages
Passive backplane
No active components
First Failure Data Capture
Help eliminates intermittent failures
Processors
Dynamic De-Allocation
Packaging
Instruction Retry
Alternate Processor Recovery
Hypervisor
Mainframe technology
Mobility
Partition Mobility
WPAR Mobility
2010 IBM Corporation
Array error
Error correction (ECC)
Arrays with parity
o Processor restarts
Instruction flow and Data flow Error
Processor restarts
Control Error
Processor restarts
Core
Instruction Fetch
Decode
Execution Units
Core error collection
Load/
Store
System Resiliency
Recovery
Unit
Core restart
OSC0
OSC1
Fabric Interface
Core Recovery
Leverage speculative execution resources to
enable recovery
Error detected in GPRs FPRs VSR, flushed &
retried
Stacked latches to improve SER
Alternate Processor Recovery
Partition isolation for core checkstops
BUF
BUF
BUF
BUF
X8Dimms
IO Hub
PCI
Bridge
PCI Adapter
L3 eDRAM
ECC protected
SUE handling
Purge and Line delete
Spare rows and columns
GX IO Bus
ECC protected
Concurrent add/repair
InfiniBand Interface
Redundant paths
Retry/Freeze behavior options for
Internal I/O Hub Faults
PHB Errors
Memory scrubbing corrects soft single bit errors in background while memory is idle
preventing multiple bit errors.
Memory ECC is able to detect and correct single bit memory errors, which make up the
majority of memory errors. It can also isolate a single Chipkill to a bad DRAM chip.
Memory Chipkill has the ability to correct the single bit errors that standard ECC memory
can correct but also multi-bit (2, 3, 4 bits) memory errors and by doing so it increases server
availability/reliability even further.
Selective Memory Mirroring is where an amount of memory is reserved and sections of the
memory to select for mirroring in the reserved memory are dynamically determined. The
selected sections of the memory contain critical areas. The selected sections of the memory
are mirrored in the reserved memory.
147
POWER7
148
POWER7 Processor
I/O
150
Name
Storage controllers
PCI Ultra Mag Media Controller
PCI-X Ultra RAID Disk Controller
PCI-X Ultra4 RAID Disk Controller
2780 Controller w/ Aux Write Cache
2757 Controller w/ Aux Write Cache
5777 Controller w/ Aux Write Cache
2780 Controller w/ Aux Write Cache
2757 Controller w/ Aux Write Cache
PCI-X Ultra Tape Controller
PCI-X Dual Channel Ultra320 SCSI Adapter
PCI-X Disk Controller-90MB No IOP
PCI-X Disk Controller-1.5GB No IOP
PCI-X EXP24 Ctl-1.5GB No IOP
PCI-X DDR Dual Channel Ultra320 SCSI Adapter
SAS adapter for internal Split DASD option
Fibre Channel controllers
PCI-X Fibre Chan Disk Controller
PCI-X Fibre Channel Tape Controller
PCI-X Fibre Chan Disk Controller
PCI-X Fibre Chan Tape Controller
IXS
PCI Integ xSeries Server
PCI Integ xSeries Server
Ethernet controllers
2749
2757
2780
2780/5708
2757/5708
571E/574F
2780/574F
2757/574F
5702
5702
571B
571E
571F
571A
57BA
2787
5704
280E
280D
4Gb
4Gb
4Gb
4Gb
5774
5774
5774
5774
/
/
/
/
4812-001
4812-001
1981/5718
PCIe - 5769
1982/5719
PCIe - 5772
1984/5707
2849
PCIe - 5768
None
3273
4319
CCIN
2844
2847
2843
None
None
None
6312
None
4758-023
2058-001
2746
5903,
5903,
5903,
5903,
5903,
5903,
5903,
5908
5908
5908
5908
5908
5908
5908
5903, 5908
5903, 5908
5903, 5908
8Gb
8Gb
8Gb
8Gb
5735
5735
5735
5735
6312
IBM
Power Systems
4801
4805
3273
4319
4326
3277
1968
3274
1969
3275
1973
3578
3706
4430
4630
4633
5756
5757
3707
3708
4487
5907
2591
1967
4319
4326
1970
1968
1969
3578
6336
6330-002
6333
6337-002
6337-003
6331-002
No record
63A0
N/A
DVD-RAM
DVD-RAM
IDE Slimline DVD-ROM Drive
IBM 4.7 GB IDE Slimline DVD-RAM Drive
Tape Devices
30GB 1/ 4-Inch Cartridge Tape (System i #4684)
50GB 1/ 4-Inch Cartridge Tape (System i #4687)
36/ 72GB 4mm DAT72 SAS Tape Drive
Diskette Devices
External USB 1.44 MB Diskette Drive
Displays
N/A
None
Summary
POWER7 Processor
POWER7 Servers
Power
Power
Power
Power
Power
750
755
770
780
Blades
Special notices
This document was developed for IBM offerings in the United States as of the date of publication. IBM may not make these offerings available in other
countries, and the information is subject to change without notice. Consult your local IBM business contact for information on the IBM offerings
available in your area.
Information in this document concerning non-IBM products was obtained from the suppliers of these products or other public sources. Questions on
the capabilities of non-IBM products should be addressed to the suppliers of those products.
IBM may have patents or pending patent applications covering subject matter in this document. The furnishing of this document does not give you any
license to these patents. Send license inquires, in writing, to IBM Director of Licensing, IBM Corporation, New Castle Drive, Armonk, NY 10504-1785
USA.
All statements regarding IBM future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.
The information contained in this document has not been submitted to any formal IBM test and is provided "AS IS" with no warranties or guarantees
either expressed or implied.
All examples cited or described in this document are presented as illustrations of the manner in which some IBM products can be used and the results
that may be achieved. Actual environmental costs and performance characteristics will vary depending on individual client configurations and
conditions.
IBM Global Financing offerings are provided through IBM Credit Corporation in the United States and other IBM subsidiaries and divisions worldwide to
qualified commercial and government clients. Rates are based on a client's credit rating, financing terms, offering type, equipment type and options,
and may vary by country. Other restrictions may apply. Rates and offerings are subject to change, extension or withdrawal without notice.
IBM is not responsible for printing errors in this document that result in pricing or information inaccuracies.
All prices shown are IBM's United States suggested list prices and are subject to change without notice; reseller prices may vary.
IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply.
Any performance data contained in this document was determined in a controlled environment. Actual results may vary significantly and are dependent
on many factors including system hardware configuration and software design and configuration. Some measurements quoted in this document may
have been made on development-level systems. There is no guarantee these measurements will be the same on generally-available systems. Some
measurements quoted in this document may have been estimated through extrapolation. Users of this document should verify the applicable data for
their specific environment.
Current: 1Q 2010
Current: 1Q 2010
Current: 1Q 2010
2010 IBM Corporation
Current: 1Q 2010
Current: 1Q 2010