3D Printing
3D Printing
MANUFACTURING (AM) ?
CONVENTIONAL MANUFACTURING
CONCEPTUAL DESIGN
CAD MODELLING
DETAIL DESIGN
ENGINEERING
FEA
ANALYSIS TIME SAVE
PROTOTYPING
TOOLING
RP
PRODUCTION
MARKETING
TIME
Principle
Operation
Construction
Materials
Process parameters
Icing on a cake
Courtesy:- Mr. D. Chandramohan, Dr. K. Marimuthu, Rapid prototyping/rapid tooling – a over view
And its applications in orthopaedics, International Journal of Advanced Engineering Technology
MATERIALS
Most popular material is ABS. ABS stands for
Acrylonitrile Butadiene Styrene.
Infill
Support
Limitations
FDM machines are costly
Because of circular nozzles sharp edges cannot be made easily
Low speed and accuracy
Parts are An-Isotropy in nature (Z direction )
Dimensional accuracy is bad
Surface finish is bad
THE STAIR CASE EFFECT - RESPONSIBLE
FOR DIMENSIONAL INACCURACY AND BAD
SURFACE FINISH
SELECTIVE LASER SINTERING (SLS)
PROCESS (DMLS) (PBF) (EBM)
Selective Laser Sintering is an powder based RP technique which
directly creates a physical model out of a CAD model by sintering
•Thin layers of powders (0.075-0.1 mm thick) are spread across the build area using a
counter-rotating powder levelling roller.
•The part building process takes place inside an enclosed chamber filled with nitrogen gas
(prevents oxidation).
A focussed CO2 laser beam is directed onto the powder bed and is moved using
galvanometers.
Supporting powder remains loose and serves as support for subsequent layers.
After completion a layer, the build platform is lowered by one layer thickness and
a new layer of powder is laid and levelled using the counter rotating roller.
Metals and Composites :- Steel, Ti and alloys, Ni based alloys, aluminium alloys etc.
Fusion Mechanisms :
Chemically induced binding : use of thermally active chemicals. Used for binding
ceramics
Selective Laser Sintering, Selective Laser Melting, Direct Metal Laser Sintering,
Electron Beam Melting etc.. Are the other names for the same technology.
PROCESS PARAMETERS
In PBF, process parameters can be lumped into four categories:
(2) Scan related parameters (scan speed, scan spacing, and scan
pattern)