CN1364251A - Cooling device for electronic components - Google Patents
Cooling device for electronic components Download PDFInfo
- Publication number
- CN1364251A CN1364251A CN 01800534 CN01800534A CN1364251A CN 1364251 A CN1364251 A CN 1364251A CN 01800534 CN01800534 CN 01800534 CN 01800534 A CN01800534 A CN 01800534A CN 1364251 A CN1364251 A CN 1364251A
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- CN
- China
- Prior art keywords
- mentioned
- heat transfer
- transfer medium
- cooling
- heat
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a cooling device for electronic components, especially for cooling microprocessors. The inventive device has at least one passive heat-conducting cooling element (12). At least one part of the passive cooling element (12) is connected to at least one heat transmission medium (20) which is in a solid state of aggregation and is a phase change material (PCM) having a heat receiving capacity that is many times higher compared to water and is configured as a PCM device. The heat transmission medium (20) stores the heat quantity which is produced by charging the electronic component and cannot be received and discharged by the passive cooling element (18) any longer, whereby the solid state of aggregation is maintained. Said medium releases said heat when the electronic component is charged less.
Description
The present invention relates to a kind of electronic component, the cooling device of microprocessor especially, this device has at least one passive heat transfer cooling-part.
Known the electronic component cooling apparatus that many kinds of the above-mentioned types are arranged in the prior art.These devices especially comprise passive heat transfer cooling-part, and these passive heat transfer cooling-parts are especially made of aluminum and be installed on the electronic component, come thus to be in contact with one another with this electronic component effectively.This cooling-part utilizes the mode of bonding agent or specific supporting to come attached on the above-mentioned electronic component.Usually also to there be the active cooling-part of additional fan form to be placed on the above-mentioned passive cooling-part or be combined in this passive cooling-part.
These systems of the prior art all are based on the heat transfer principle by evaporation, condensation, convection current and dissipation, and perhaps they are characterised in that by different materials combination and surface structure with different heat transfer ability and/or thermal resistance and cool off.
Yet the shortcoming of system is when being applied to the stronger electronic component of power in these prior aries, and particularly because more and more higher microprocessor clock frequency, the heat that is produced can sharply increase.Yet because these electronic components are only worked in certain temperature range suitably, too high temperature can make them break down or lose considerable power, therefore, and to the also raising gradually of requirement of corresponding cooling device.Above-mentioned refrigeratory of the prior art no longer can be realized ideal and required cooling degree.
Therefore, the purpose of this invention is to provide a kind of cooling device that is used for cooling electronic components, especially microprocessor, this device has at least one passive heat transfer cooling-part, even and can guarantee electronic component is cooled off fully when having a large amount of heats to gather.
Above-mentioned purpose is to have according to claim 1 the cooling device of feature and realize by a kind of.
Advantageous embodiments has been described in the dependent claims.
Electronic component cooling apparatus of the present invention comprises at least one passive heat transfer cooling-part, and at least a portion of this passive cooling-part is in at least one to be gathered solid-state heat transfer medium and contact.This heat transfer medium is for example much higher than the water phase-change material of a thermal capacity (PCM) in this embodiment.In addition, this heat transfer medium has been designed to a potential thermofor, so that maintain its gather solid-state in, the heat that can not be absorbed and discharge by passive cooling-part more again when load produces on the stored electrons element, load on the above-mentioned electronic component hour, this heat transfer medium discharges above-mentioned heat again.Even also can cool off fully when having a large amount of heats to gather with regard to having guaranteed like this to electronic component, especially microprocessor.Simultaneously, heat transfer medium can absorb the additional heat of temporary transient generation and reply just often in load, when just electronic component produces normal heat once more, discharges this heat.Just can avoid occurring the peak value of heat load thus, when using the traditional cold radiator cooler, this heat load peak value can clearly reduce the especially power of microprocessor of electronic component usually.As a result, cooling device of the present invention allows to increase the power of cooling-part equally.When utilizing cooling device of the present invention to cool off, owing to avoided the infringement of heat load peak value, thereby the mission life of electronic component and further raising of operability.Gather solid-stately owing to will also maintain it as the phase-change material of heat transfer medium when absorbing heat, therefore advantageously avoid because the problem that the phase-change material expansion produces, just the situation with known materials is opposite for this.
In a most preferred embodiment of cooling device of the present invention, above-mentioned heat transfer medium comprises salt or is rich in the salt mixture of organic substance, and the material that comprises the fine metal powder shape, is used to improve heat-transfer capability.Usually, the organic principle of heat transfer medium is a paraffin.This heat transfer medium maintains it equally and gathers solid-stately when absorbing heat, can and/or be installed in the inside and/or the top of above-mentioned cooling-part as a solid body with the shape of fritter or bead like this.So just make and to produce this cooling device economically on the one hand, guaranteed again that on the other hand this cooling device remains on less size.In addition, according to the present invention, may individually heat transfer medium be adjusted to the action required temperature of cooling electronic components equally.This adjustment is to realize by composition kind and the quantity that changes heat transfer medium.Particularly, may adjust the heat that cushions by heat transfer medium equally.In addition, another advantage of this heat transfer medium be nontoxic, can reuse.
In a most preferred embodiment of cooling device of the present invention, above-mentioned passive cooling-part comprises at least one cooling-part initiatively, is a fan sometimes.This can advantageously guarantee further to improve the cooling power of this cooling device.
In another most preferred embodiment of cooling device of the present invention, above-mentioned heat transfer medium is contained in the container of being made by heat-transfer matcrial, and this container contacts with above-mentioned passive cooling-part.With heat transfer medium be placed in the container make can be at above-mentioned passive cooling-part inner or above be easy to replace single heat transfer component.
In another most preferred embodiment of cooling device of the present invention, between a corresponding contact face of the surface of contact of above-mentioned passive cooling-part and electronic component, be provided with a heat transfer paillon foil.This measure is transmitted to passive cooling-part by making best heat from electronic component, thereby has guaranteed the resulting whole cooling power of further this cooling device of raising.
The invention still further relates to a kind of processor with processor socket and at least one cooling device mounted thereto, wherein above-mentioned cooling device comprises at least one passive heat transfer cooling-part, and at least a portion of this passive cooling-part is in at least one to be gathered solid-state heat transfer medium and contact.This heat transfer medium is for example much higher than the water phase-change material of a heat absorption capacity (PCM) in this embodiment.In addition, this heat transfer medium has been designed to a potential thermofor, so that maintaining it gathers solid-state the time, store the heat that can not be absorbed and discharge by passive cooling-part more again when load produces on the processor, load on above-mentioned processor hour, this heat transfer medium discharges above-mentioned heat again.
The invention still further relates to a kind of purposes of heat transfer medium, this heat transfer medium is solid-state for gathering, and is used to cool off microprocessor, and this heat transfer medium is that a heat absorption capacity is for example than the big many phase-change materials (PCM) of water and be designed to a potential thermofor.This heat transfer medium will maintain its gather solid-state in, store the heat that load produced on the microprocessor, the load on above-mentioned microprocessor hour, this heat transfer medium discharges above-mentioned heat again.
The further details of the present invention, feature and beneficial effect can draw from embodiment shown in the drawings.
Fig. 1 is the schematic sectional view of cooling device of the present invention;
Fig. 2 is the schematic plan of cooling device of the present invention shown in Figure 1; With
Fig. 3 is the schematic side elevation of cooling device of the present invention shown in Figure 1.
Fig. 1 is the schematic sectional view that is used for the cooling device 10 of cooling electronic components, especially microprocessor, and this device comprises a passive heat transfer cooling-part 12, and this cooling-part 12 comprises some cooling ribses or blade 14.These cooling ribses or blade 14 are installed on the bottom part 16 of this cooling-part 12.At the opposition side of cooling ribs or blade 14, above-mentioned bottom part 16 be formed with one can with the contacted surface of the electronic component that needs are cooled.
Passive cooling-part 12 is made by aluminum or aluminum alloy, and is generally one piece component.Can find out in the drawings, be provided with some heat transfer mediums 20 between cooling ribs in this cooling-part 12 or the blade 14.Heat transfer medium is in and gathers solid-stately, and forms heat transfer contact with cooling ribs or blade 14, bottom part 16 or cooling-part 12 respectively.In the present embodiment, this heat transfer medium is for example much higher than the water phase-change material PCM of a heat absorption capacity.Because this heat transfer medium is gather solid-state, and in heat absorption, can maintains this and gather solid-stately, therefore needn't make heat transfer medium 20 or cooling-part 12 have the character of sealing.It is just enough that single heat transfer medium 20 is formed in above-mentioned cooling-part 12 inside.This heat transfer medium is designed to the form of a PCM device in addition, so that maintain its gather solid-state in, the heat that can not be absorbed and discharge by passive cooling-part more again when load produces on the stored electrons element, load on the above-mentioned electronic component hour, this heat transfer medium discharges above-mentioned heat again.
Fig. 2 is the schematic plan of cooling device 10 among Fig. 1.This illustrates single heat transfer medium 20 in the cooling ribs of cooling-part 12 or the setting between the blade 14.
Fig. 3 is the schematic side elevation of cooling device 10 among Fig. 1.This illustrates cooling-part 12 and comprises coupling arrangement 22 in bottom part 16 zones and at its place, both sides, is used for cooling device 10 and the electronic component that need be cooled are linked together.In addition, can see that in the embodiment shown, heat transfer medium 20 is arranged to disc-like shape.Yet the size and dimension of this heat transfer medium 20 can be selected arbitrarily.The size and dimension of this heat transfer medium 20 especially will allow to regulate the action required temperature of the electronic component that single need are cooled.
Claims (13)
1. the cooling device of an electronic component, especially microprocessor, this device has at least one passive heat transfer cooling-part (12), it is characterized in that,
At least a portion of this passive cooling-part (12) is with at least one and gathers solid-state heat transfer medium (20) and contact, this heat transfer medium (20) is that a heat absorption capacity is than the big many phase-change materials (PCM) of water and be designed to a potential thermofor, this heat transfer medium (20) is storing electronic component is being loaded and the heat that can not be absorbed and discharge by passive cooling-part (18) again when producing, maintaining it thus gathers solid-state, in the load of above-mentioned electronic component hour, above-mentioned medium discharges above-mentioned heat again.
2. cooling device as claimed in claim 1 is characterized in that, above-mentioned heat transfer medium (20) comprises inorganic salts or is rich in the salt mixture of organic substance, and the material that comprises the fine metal powder shape, is used to improve heat-transfer capability.
3. cooling device as claimed in claim 2 is characterized in that, the organic principle of above-mentioned heat transfer medium (20) is a paraffin.
4. as any one described cooling device in the above-mentioned claim, it is characterized in that above-mentioned heat transfer medium (20) can be adjusted to required operating temperature.
5. any one described cooling device as in the above-mentioned claim is characterized in that, above-mentioned heat transfer medium (20) is with the shape of fritter or bead and/or be installed in the inside and/or the top of above-mentioned cooling-part (12) as a solid body.
6. any one described cooling device as in the above-mentioned claim is characterized in that above-mentioned heat transfer medium (20) is nontoxic and can reuse.
7. as any one described cooling device in the above-mentioned claim, it is characterized in that above-mentioned passive cooling-part (12) is made by aluminum or aluminum alloy.
8. as any one described cooling device in the above-mentioned claim, it is characterized in that, be provided with the cooling-part of an active on the above-mentioned passive cooling-part (12) at least.
9. cooling device as claimed in claim 8 is characterized in that, the cooling-part of above-mentioned active is a fan.
10. any one described cooling device as in the above-mentioned claim is characterized in that above-mentioned heat transfer medium (20) is contained in the container of being made by heat-transfer matcrial, and this container contacts with above-mentioned passive cooling-part (12).
11. as any one described cooling device in the above-mentioned claim, it is characterized in that, between a corresponding contact face of the surface of contact (18) of above-mentioned passive cooling-part (12) and electronic component, be provided with a heat transfer paillon foil.
12. one kind has processor socket and is installed in the processor of the cooling device on this processor with at least one, it is characterized in that, above-mentioned cooling device (10) comprises at least one passive heat transfer cooling-part (12), at least a portion of this passive cooling-part (12) is in at least one to be gathered solid-state heat transfer medium (20) and contacts, this heat transfer medium (20) is heat absorption capacity phase-change material (PCM) more much higher than water and has been designed to a potential thermofor, this heat transfer medium (20) maintain its gather solid-state in, store the heat that can not be absorbed and discharge by passive cooling-part (18) more again when load produces on the processor, load on above-mentioned processor hour, this heat transfer medium discharges above-mentioned heat again.
13. the purposes of a heat transfer medium, this heat transfer medium is for gathering solid-state and being used to cool off microprocessor, this heat transfer medium is that a heat absorption capacity is than the big many phase-change materials (PCM) of water and be designed to a potential thermofor, this heat transfer medium will maintain its gather solid-state in, store the heat that load produced on the microprocessor, load on above-mentioned microprocessor hour, this heat transfer medium discharges above-mentioned heat again.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10012990.0 | 2000-03-16 | ||
| DE2000112990 DE10012990A1 (en) | 2000-03-16 | 2000-03-16 | Cooling device for electronic components has latent heat store for heat from electronic component that can no longer be absorbed by passive cooling element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1364251A true CN1364251A (en) | 2002-08-14 |
Family
ID=7635072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01800534 Pending CN1364251A (en) | 2000-03-16 | 2001-03-08 | Cooling device for electronic components |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1198745A1 (en) |
| JP (1) | JP2003527753A (en) |
| CN (1) | CN1364251A (en) |
| CA (1) | CA2374008A1 (en) |
| DE (1) | DE10012990A1 (en) |
| TW (1) | TW499749B (en) |
| WO (1) | WO2001069360A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7184265B2 (en) | 2003-05-29 | 2007-02-27 | Lg Electronics Inc. | Cooling system for a portable computer |
| US7188484B2 (en) | 2003-06-09 | 2007-03-13 | Lg Electronics Inc. | Heat dissipating structure for mobile device |
| CN102548355A (en) * | 2010-12-31 | 2012-07-04 | 联想(北京)有限公司 | Electronic equipment |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI484089B (en) * | 2012-03-22 | 2015-05-11 | Univ Nat Cheng Kung | Module structure of smart solar window and curtain |
| KR102104919B1 (en) | 2013-02-05 | 2020-04-27 | 삼성전자주식회사 | Semiconductor package and method of manufacturing the same |
| DE102013204473A1 (en) | 2013-03-14 | 2014-09-18 | Robert Bosch Gmbh | Cooling arrangement for a control unit |
| US10597286B2 (en) * | 2017-08-01 | 2020-03-24 | Analog Devices Global | Monolithic phase change heat sink |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9505069D0 (en) * | 1995-03-14 | 1995-05-03 | Barr & Stroud Ltd | Heat sink |
| DE19805930A1 (en) * | 1997-02-13 | 1998-08-20 | Furukawa Electric Co Ltd | Cooling arrangement for electrical component with heat convection line |
-
2000
- 2000-03-16 DE DE2000112990 patent/DE10012990A1/en not_active Withdrawn
-
2001
- 2001-03-08 CA CA002374008A patent/CA2374008A1/en not_active Abandoned
- 2001-03-08 JP JP2001568171A patent/JP2003527753A/en not_active Withdrawn
- 2001-03-08 CN CN 01800534 patent/CN1364251A/en active Pending
- 2001-03-08 WO PCT/EP2001/002631 patent/WO2001069360A1/en not_active Application Discontinuation
- 2001-03-08 EP EP01913851A patent/EP1198745A1/en not_active Withdrawn
- 2001-04-09 TW TW90106088A patent/TW499749B/en not_active IP Right Cessation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7184265B2 (en) | 2003-05-29 | 2007-02-27 | Lg Electronics Inc. | Cooling system for a portable computer |
| US7188484B2 (en) | 2003-06-09 | 2007-03-13 | Lg Electronics Inc. | Heat dissipating structure for mobile device |
| CN100407097C (en) * | 2003-06-09 | 2008-07-30 | Lg电子株式会社 | Heat dissipating structure for mobile device |
| CN102548355A (en) * | 2010-12-31 | 2012-07-04 | 联想(北京)有限公司 | Electronic equipment |
| CN102548355B (en) * | 2010-12-31 | 2015-04-29 | 联想(北京)有限公司 | Electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| DE10012990A1 (en) | 2001-10-11 |
| TW499749B (en) | 2002-08-21 |
| EP1198745A1 (en) | 2002-04-24 |
| CA2374008A1 (en) | 2001-09-20 |
| WO2001069360A1 (en) | 2001-09-20 |
| JP2003527753A (en) | 2003-09-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |